ICS840002AG-01LFT [IDT]

Clock Generator, 175MHz, PDSO16, 4.40 X 5 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-16;
ICS840002AG-01LFT
型号: ICS840002AG-01LFT
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

Clock Generator, 175MHz, PDSO16, 4.40 X 5 MM, 0.92 MM HEIGHT, ROHS COMPLIANT, MO-153, TSSOP-16

时钟 光电二极管 外围集成电路 晶体
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中文:  中文翻译
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®
ICS840002-01  
FemtoClock , Crystal-to-LVCMOS/LVTTL  
Frequency Synthesizer  
DATA SHEET  
General Description  
Features  
The ICS840002-01 is a two output LVCMOS/LVTTL Synthesizer  
optimized to generate Ethernet reference clock frequencies. Using a  
25MHz 18pF parallel resonant crystal, the following frequencies can  
be generated based on the two frequency select pins (F_SEL[1:0]):  
156.25MHz, 125MHz, and 62.5MHz. The ICS840002-01 uses IDT’s  
3RD generation low phase noise VCO technology and can achieve  
1ps or lower typical random rms phase jitter, easily meeting Ethernet  
jitter requirements. The ICS840002-01 is packaged in a small 16-pin  
TSSOP package.  
Two LVCMOS/LVTTL outputs@ 3.3V,  
17typical output impedance  
Selectable crystal oscillator interface or LVCMOS/LVTTL  
single-ended TEST_CLK  
Output frequency range: 56MHz to 175MHz  
VCO range: 560MHz to 700MHz  
Output skew: 12ps (maximum)  
RMS phase jitter at 156.25MHz, (1.875MHz to 20MHz):  
0.47ps (typical)  
Phase Noise:  
Offset  
Noise Power  
100Hz.................-97.4 dBc/Hz  
1kHz...................-120.2 dBc/Hz  
10kHz.................-127.6 dBc/Hz  
100kHz...............-126.1 dBc/Hz  
Full 3.3V or mixed 3.3V core/2.5V output supply modes  
-30°C to 85°C ambient operating temperature  
Available in both standard (RoHS 5) and lead-free (RoHS 6)  
packages  
Frequency Select Function Table  
Inputs  
F_SEL1  
F_SEL0  
M Divider Value  
N Divider Value  
Output Frequency (25MHz Ref.)  
0
0
1
1
0
1
0
1
25  
25  
25  
25  
4
5
156.25  
125  
10  
5
62.5  
125  
Pin Assignment  
Block Diagram  
F_SEL1  
GND  
GND  
Q0  
F_SEL0  
nXTAL_SEL  
TEST_CLK  
OE  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
Pullup  
OE  
2
Pullup:Pullup  
F_SEL1:0  
MR  
Q1  
Pulldown  
nPLL_SEL  
nPLL_SEL  
VDDA  
VDDO  
10 XTAL_IN  
XTAL_OUT  
Pulldown  
nXTAL_SEL  
9
VDD  
XTAL_IN  
ICS840002-01  
F_SEL1:0  
N
0
Q0  
Q1  
OSC  
1
0
16-Lead TSSOP  
4.4mm x 5.0mm x 0.925mm  
package body  
XTAL_OUT  
TEST_CLK  
0 0 ÷4  
0 1 ÷5  
1 0 ÷10  
1 1 ÷5  
Phase  
Detector  
Pulldown  
1
VCO  
G Package  
Top View  
M = ÷25 (fixed)  
Pulldown  
MR  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
1
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Table 1. Pin Descriptions  
Number  
Name  
Type  
Description  
1
F_SEL0  
Input  
Input  
Input  
Input  
Pullup  
Pulldown  
Pulldown  
Pullup  
Frequency select pin. LVCMOS/LVTTL interface levels.  
Selects between crystal or TEST_CLK inputs as the PLL reference  
source. When HIGH, selects TEST_CLK. When LOW, selects XTAL  
inputs. LVCMOS/LVTTL interface levels.  
2
3
4
nXTAL_SEL  
TEST_CLK  
OE  
Single-ended test clock input. LVCMOS/LVTTL interface levels.  
Output enable. When logic HIGH, the outputs are active.  
When LOW, the outputs are in high-impedance state.  
LVCMOS/LVTTL interface levels.  
Active High Master Reset. When logic HIGH, the internal dividers  
are reset causing the active outputs to go low. When Logic LOW,  
the internal dividers and the outputs are enabled. LVCMOS/LVTTL  
5
6
MR  
Input  
Input  
Pulldown  
Pulldown  
interface levels.  
PLL Bypass. When LOW, the output is driven from the VCO output. When  
HIGH, the PLL is bypassed and the output frequency = reference clock  
frequency/N output divider. LVCMOS/LVTTL interface levels.  
nPLL_SEL  
7
8
VDDA  
VDD  
Power  
Power  
Analog supply pin.  
Core supply pin.  
9,  
10  
XTAL_OUT  
XTAL_IN  
Crystal oscillator interface. XTAL_IN is the input, XTAL_OUT is the  
output.  
Input  
11  
VDDO  
Power  
Output  
Power  
Input  
Output supply pin.  
12, 13  
14, 15  
16  
Single-ended clock outputs. LVCMOS/LVTTL interface levels.  
Power supply ground.  
Q1, Q0  
GND  
F_SEL1  
Pullup  
Frequency select pin. LVCMOS/LVTTL interface levels.  
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
Table 2. Pin Characteristics  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
Input Capacitance  
4
CPD  
Power Dissipation Capacitance  
Input Pullup Resistor  
Input Pulldown Resistor  
8
pF  
RPULLUP  
RPULLDOWN  
51  
51  
17  
21  
k  
k  
V
DDO = 3.3V 5ꢀ  
14  
16  
21  
25  
ROUT  
Output Impedance  
VDDO = 2.5V 5ꢀ  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
2
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.  
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond  
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VDD  
4.6V  
Inputs, VI  
XTAL_IN  
0V to VDD  
Other Inputs  
-0.5V to VDD + 0.5V  
Outputs, VO  
-0.5V to VDDO + 0.5V  
89C/W (0 lfpm)  
-65C to 150C  
Package Thermal Impedance, JA  
Storage Temperature, TSTG  
DC Electrical Characteristics  
Table 3A. Power Supply DC Characteristics, VDD = VDDA = 3.3V 5ꢀ, VDDO = 3.3V 5ꢀ or 2.5V 5ꢀ, TA = -30°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum Units  
VDD  
Core Supply Voltage  
3.465  
3.465  
3.465  
2.625  
100  
V
V
VDDA  
Analog Supply Voltage  
3.135  
3.3  
3.135  
3.3  
V
VDDO  
Output Supply Voltage  
2.375  
2.5  
V
IDD  
Power Supply Current  
Analog Supply Current  
Output Supply Current  
mA  
mA  
mA  
IDDA  
IDDO  
12  
5
Table 3B. LVCMOS/LVTTL DC Characteristics, VDD = VDDA = 3.3V 5ꢀ, VDDO = 3.3V 5ꢀ or 2.5V 5ꢀ, TA = -30°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
Typical  
Maximum Units  
VIH  
VIL  
Input High Voltage  
Input Low Voltage  
2
VDD + 0.3  
V
V
-0.3  
0.8  
5
OE, F_SEL0, F_SEL1  
V
DD = VIN = 3.465V or 2.625V  
µA  
Input  
High Current  
IIH  
MR, TEST_CLK,  
nXTAL_SEL, nPLL_SEL  
VDD = VIN =3.465V or 2.625V  
150  
µA  
µA  
µA  
VDD = 3.465V or 2.625V,  
VIN = 0V  
OE, F_SEL0, F_SEL1  
-150  
-5  
Input  
IIL  
Low Current  
MR, TEST_CLK,  
VDD = 3.465V or 2.625V,  
nXTAL_SEL, nPLL_SEL  
VIN = 0V  
VDDO = 3.3V 5ꢀ  
VDDO = 2.5V 5ꢀ  
2.6  
1.8  
V
V
V
VOH  
VOL  
Output High Voltage; NOTE 1  
Output Low Voltage; NOTE 1  
VDDO = 3.3V 5ꢀ or 2.5V 5ꢀ  
0.5  
NOTE 1: Outputs terminated with 50to VDDO/2. See Parameter Measurement Information section, Output Load Test Circuit diagrams.  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
3
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Table 4. Crystal Characteristics  
Parameter  
Test Conditions  
Minimum  
Typical  
Fundamental  
25  
Maximum  
Units  
Mode of Oscillation  
Frequency  
MHz  
Equivalent Series Resistance (ESR)  
Shunt Capacitance (CO)  
Drive Level  
50  
7
pF  
1
mW  
NOTE: Characterized using an 18pF parallel resonant crystal.  
AC Electrical Characteristics  
Table 5A. AC Characteristics, VDD = VDDA = VDDO = 3.3V 5ꢀ, TA = -30°C to 85°C  
Symbol Parameter  
Test Conditions  
F_SEL[1:0] = 00  
Minimum  
140  
Typical  
Maximum  
175  
Units  
MHz  
MHz  
MHz  
ps  
fOUT  
Output Frequency  
F_SEL[1:0] = 01 or 11  
F_SEL[1:0] = 10  
112  
140  
56  
70  
tsk(o)  
tjit(Ø)  
Output Skew; NOTE 1, 2  
12  
156.25MHz, (1.875MHz - 20MHz)  
125MHz, (1.875MHz - 20MHz)  
62.5MHz, (1.875MHz - 20MHz)  
20ꢀ to 80ꢀ  
0.47  
0.57  
0.51  
ps  
RMS Phase Jitter, Random;  
NOTE 3  
ps  
ps  
tR / tF  
odc  
Output Rise/Fall Time  
Output Duty Cycle  
200  
46  
700  
54  
ps  
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is  
mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium  
has been reached under these conditions.  
NOTE 1: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.  
NOTE 3: Refer to Phase Noise Plot.  
Table 5B. AC Characteristics, VDD = VDDA = 3.3V 5ꢀ, VDDO = 2.5V 5ꢀ, TA = -30°C to 85°C  
Symbol Parameter  
Test Conditions  
F_SEL[1:0] = 00  
Minimum  
140  
Typical  
Maximum  
175  
Units  
MHz  
MHz  
MHz  
ps  
fOUT  
Output Frequency  
F_SEL[1:0] = 01 or 11  
F_SEL[1:0] = 10  
112  
140  
56  
70  
tsk(o)  
tjit(Ø)  
Output Skew; NOTE 1, 2  
12  
156.25MHz, (1.875MHz - 20MHz)  
125MHz, (1.875MHz - 20MHz)  
62.5MHz, (1.875MHz - 20MHz)  
20ꢀ to 80ꢀ  
0.47  
0.55  
0.49  
ps  
RMS Phase Jitter, Random;  
NOTE 3  
ps  
ps  
tR / tF  
odc  
Output Rise/Fall Time  
Output Duty Cycle  
200  
46  
700  
54  
ps  
fOUT = 125MHz  
47  
53  
For NOTES, see Table 5A above.  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
4
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Typical Phase Noise at 62.5MHz (3.3V)  
1Gb Ethernet Filter  
62.5MHz  
RMS Phase Jitter (Random)  
1.875MHz to 20MHz = 0.51ps (typical)  
Raw Phase Noise Data  
Phase Noise Result by adding a  
1Gb Ethernet filter to raw data  
Offset Frequency (Hz)  
Typical Phase Noise at 156.25MHz (3.3V)  
10Gb Ethernet Filter  
156.25MHz  
RMS Phase Jitter (Random)  
1.875MHz to 20MHz = 0.47ps (typical)  
Raw Phase Noise Data  
Phase Noise Result by adding a  
10Gb Ethernet filter to raw data  
Offset Frequency (Hz)  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
5
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Parameter Measurement Information  
2.05V 5ꢀ  
1.25V 5ꢀ  
1.65V 5ꢀ  
SCOPE  
SCOPE  
V
V
V
DD,  
V
DD,  
DDA,  
V
DDA  
V
Qx  
DDO  
DDO  
Qx  
LVCMOS  
GND  
GND  
VDDO  
2
-1.65V 5ꢀ  
-1.25V 5ꢀ  
3.3V Core/3.3V Output Load AC Test Circuit  
3.3V Core/2.5V Output Load AC Test Circuit  
Phase Noise Plot  
VDDO  
Qx  
Qy  
2
Phase Noise Mask  
VDDO  
2
tsk(o)  
Offset Frequency  
f1  
f2  
RMS Jitter = Area Under the Masked Phase Noise Plot  
RMS Phase Jitter  
Output Skew  
VDDO  
2
Q[0:1]  
80ꢀ  
tF  
80ꢀ  
tR  
tPW  
tPERIOD  
20ꢀ  
20ꢀ  
Q[0:1]  
tPW  
x 100ꢀ  
odc =  
tPERIOD  
Output Skew  
Output Duty Cycle/Pulse Width/Period  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
6
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Applications Information  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
Crystal Inputs  
LVCMOS Outputs  
For applications not requiring the use of the crystal oscillator input,  
both XTAL_IN and XTAL_OUT can be left floating. Though not  
required, but for additional protection, a 1kresistor can be tied from  
XTAL_IN to ground.  
All unused LVCMOS outputs can be left floating. We recommend that  
there is no trace attached.  
TEST_CLK Input  
For applications not requiring the use of the test clock, it can be left  
floating. Though not required, but for additional protection, a 1k  
resistor can be tied from the TEST_CLK to ground.  
LVCMOS Control Pins  
All control pins have internal pullups or pulldowns; additional  
resistance is not required but can be added for additional protection.  
A 1kresistor can be used.  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
7
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Overdriving the XTAL Interface  
The XTAL_IN input can accept a single-ended LVCMOS signal  
through an AC coupling capacitor. A general interface diagram is  
shown in Figure 1A. The XTAL_OUT pin can be left floating. The  
maximum amplitude of the input signal should not exceed 2V and the  
input edge rate can be as slow as 10ns. This configuration requires  
that the output impedance of the driver (Ro) plus the series  
resistance (Rs) equals the transmission line impedance. In addition,  
matched termination at the crystal input will attenuate the signal in  
half. This can be done in one of two ways. First, R1 and R2 in parallel  
should equal the transmission line impedance. For most 50  
applications, R1 and R2 can be 100. This can also be  
accomplished by removing R1 and making R2 50. By overdriving  
the crystal oscillator, the device will be functional, but note, the device  
performance is guaranteed by using a quartz crystal.  
VCC  
XTAL_OUT  
R1  
100  
C1  
Rs  
Zo = 50 ohms  
Ro  
XTAL_IN  
.1uf  
R2  
100  
Zo = Ro + Rs  
LVCMOS Driver  
Figure 1A. General Diagram for LVCMOS Driver to XTAL Input Interface  
XTAL_OUT  
C2  
Zo = 50 ohms  
XTAL_I N  
.1uf  
Zo = 50 ohms  
R1  
50  
R2  
50  
LVPECL Driver  
R3  
50  
Figure 1B. General Diagram for LVPECL Driver to XTAL Input Interface  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
8
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Layout Guideline  
Figure 2 shows a schematic example of the ICS840002-01  
application schematic. In this example, the device is operated at VDD  
= VDDA = VDDO = 3.3V. The 18pF parallel resonant 25MHz crystal is  
used. The load capacitance C1 = 22pF and C2 = 22pF are  
recommended for frequency accuracy. Depending on the parasitic of  
the printed circuit board layout, these values might require a slight  
adjustment to optimize the frequency accuracy. Crystals with other  
load capacitance specifications can be used. This will required  
adjusting C1 and C2.  
0.1uF capacitor in each power pin filter should be placed on the  
device side of the PCB and the other components can be placed on  
the opposite side.  
Power supply filter recommendations are a general guideline to be  
used for reducing external noise from coupling into the devices. The  
filter performance is designed for wide range of noise frequencies.  
This low-pass filter starts to attenuate noise at approximately 10kHz.  
If a specific frequency noise component is known, such as switching  
power supply frequencies, it is recommended that component values  
be adjusted and if required, additional filtering be added. Additionally,  
good general design practices for power plane voltage stability  
suggests adding bulk capacitances in the local area of all devices.  
As with any high speed analog circuitry, the power supply pins are  
vulnerable to noise. To achieve optimum jitter performance, power  
supply isolation is required. The ICS840002-01 provides separate  
power supplies to isolate from coupling into the internal PLL.  
The schematic example focuses on functional connections and is not  
configuration specific. Refer to the pin description and functional  
tables in the datasheet to ensure the logic control inputs are properly  
set.  
In order to achieve the best possible filtering, it is recommended that  
the placement of the filter components be on the device side of the  
PCB as close to the power pins as possible. If space is limited, the  
Logic Control Input Examples  
3.3V  
Set Logic  
Input to  
'1'  
Set Logic  
Input to  
'0'  
BLM18BB221SN1  
VDD  
VDD  
VDD  
1
2
R1  
33  
Zo = 50 Ohm  
RU1  
1K  
RU2  
Not Install  
C6  
Ferrite Bead  
C7  
10uF  
0.1uF  
To Logic  
Input  
pins  
To Logic  
Input  
pins  
U1  
LVCMOS  
RD1  
Not Install  
RD2  
1K  
1
16  
FSEL0  
FSEL1  
GND  
GND  
Q0  
Q1  
2
3
4
5
6
7
8
15  
14  
13  
12  
11  
10  
9
XTAL_SEL  
TEST_CLK  
OE  
MR  
nPLL_SEL  
VDDA  
VDDO  
VDDO  
VDDO  
XTAL_IN  
XTAL_OUT  
VDD  
VDDA  
R3  
VDD  
R2  
10  
C3  
10uF  
100  
C4  
0.1u  
C5  
0.1u  
Zo = 50 Ohm  
R4  
100  
XTAL_IN  
X1  
If not using the crystal input, it can be left floating.  
For additional protection the XTAL_IN pin can be  
tied to ground.  
18pF  
LVCMOS  
C1  
22pF  
25MHz  
XTAL_OUT  
Optional Termination  
C2  
22pF  
Unused output can be left floating. There should  
no trace attached to unused output. Device  
characterized with all outputs terminated.  
3.3V  
BLM18BB221SN2  
1
2
VDDO  
Ferrite Bead  
C9  
C8  
0.1uF  
C10  
0.1u  
10uF  
Figure 2. ICS840002-01 Application Schematic Example  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
9
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Reliability Information  
Table 6. JA vs. Air Flow Table for a 16 Lead TSSOP  
JA by Velocity  
Linear Feet per Minute  
0
200  
500  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
137.1°C/W  
89.0°C/W  
118.2°C/W  
81.8°C/W  
106.8°C/W  
78.1°C/W  
Transistor Count  
The transistor count for ICS840002-01 is: 3085  
Package Outline and Package Dimensions  
Package Outline - G Suffix for 16 Lead TSSOP  
Table 7. Package Dimensions for 16 Lead TSSOP  
All Dimensions in Millimeters  
Symbol  
Minimum  
Maximum  
N
A
16  
1.20  
0.15  
1.05  
0.30  
0.20  
5.10  
A1  
A2  
b
0.5  
0.80  
0.19  
0.09  
4.90  
c
D
E
6.40 Basic  
E1  
e
4.30  
4.50  
0.65 Basic  
L
0.45  
0°  
0.75  
8°  
aaa  
0.10  
Reference Document: JEDEC Publication 95, MO-153  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
10  
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Ordering Information  
Table 8. Ordering Information  
Part/Order Number  
840002AG-01  
840002AG-01T  
840002AG-01LF  
840002AG-01LFT  
Marking  
Package  
16 Lead TSSOP  
16 Lead TSSOP  
Shipping Packaging  
Tube  
Temperature  
-30C to 85C  
-30C to 85C  
-30C to 85C  
-30C to 85C  
40002A01  
40002A01  
0002A01L  
0002A01L  
Tape & Reel  
Tube  
Tape & Reel  
“Lead-Free”, 16 Lead TSSOP  
“Lead-Free”, 16 Lead TSSOP  
NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
11  
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
Revision History Sheet  
Rev  
Table  
Page  
Description of Change  
Date  
1
Features Section - corrected the integration range from 1.875MHz - 175MHz to 1.875MHz -  
20MHz in the RMS phase jitter bullet.  
T4  
T8  
4
8
Crystal Characteristics Table - added Drive Level.  
B
1/13/06  
Added Recommendations for Unused Input and Output Pins.  
Ordering Information Table - corrected standard marking and  
added Lead-Free part number, marking and note.  
11  
T5A  
T5B  
4
4
3.3V AC Characteristics Table - added thermal note.  
3.3V/2.5V AC Characteristics Table -corrected FOUT from 56MHz min - 68MHz max to  
56MHz min - 70MHz max.  
7
7
8
Deleted Power Supply Filtering Techniques section, added to schematic layout.  
Deleted Crystal Input Interface section.  
C
D
2/3/11  
T6  
T8  
Added Overdriving the XTAL Interface section.  
9
11  
Updated Layout Guideline and diagram.  
Ordering Information Table - deleted “ICS” prefix in Part/Order Number column.  
Converted datasheet format.  
T5B  
T8  
4
AC Characteristics Table - updated odc to include spec at 125MHz.  
2/29/12  
9/28/12  
11  
Ordering Information Table - corrected Package column to replace LQFP with TSSOP.  
D
D
5A, 5B  
8
4
AC Table; fOUT = F_SEL[1:0] = 01 or 11, F_SEL[1:0] = 10  
Deleted Quantity from Tape and Reel  
11  
ICS840002AG-01 REVISION D SEPTEMBER 28, 2012  
12  
©2012 Integrated Device Technology, Inc.  
ICS840002-01 Data Sheet  
FEMTOCLOCK®, CRYSTAL-TO-LVCMOS/LVTTL FREQUENCY SYNTHESIZER  
We’ve Got Your Timing Solution  
6024 Silver Creek Valley Road Sales  
Technical Support  
netcom@idt.com  
800-345-7015 (inside USA)  
+408-284-8200 (outside USA) +480-763-2056  
Fax: 408-284-2775  
San Jose, California 95138  
www.IDT.com/go/contactIDT  
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document,  
including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not  
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the  
suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any  
license under intellectual property rights of IDT or any third parties.  
IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to signif-  
icantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third  
party owners.  
Copyright 2012. All rights reserved.  

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