HBD136 [HSMC]
PNP POWER TRANSISTORS; PNP功率晶体管型号: | HBD136 |
厂家: | HI-SINCERITY MOCROELECTRONICS |
描述: | PNP POWER TRANSISTORS |
文件: | 总3页 (文件大小:39K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Spec. No. : Preliminary Data
Issued Date : 2001.08.01
Revised Date : 2001.08.24
Page No. : 1/3
HI-SINCERITY
MICROELECTRONICS CORP.
HBD136
PNP POWER TRANSISTORS
Description
PNP power transistor in a TO-126 plastic package. NPN complements:
HBD135
Features
• High Current (max. 1.5A)
• Low Voltage (max. 80V)
Applications
General purpose power applications, e.g. driver stages in hi-fi amplifiers and television circuits.
Limiting Values
Symbol
Parametor
Conditions
Min.
Max.
Unit
VCBO
VCEO
VEBO
IC
ICM
IBM
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Peak Collector Current
Peak Base Current
Open Emitter
Open Base
Open Collector
-
-
-
-
-
-
-
-45
-45
-5
-1.5
-2
-1
1.2
15
V
V
V
A
A
A
W
W
°C
°C
°C
Ta=25°C
Tc=25°C
-
-
-
PD
Total Dissipation at
-
Tstg
Tj
Tamb
Storage Temperature
Junction Temperature
Operating Ambient Temperature
-65
-
-65
150
150
150
(Tj=25°C, unless otherwise specified)
Electrical Characteristics
Symbol
Parameter
Conditions
Min. Typ. Max. Unit
ICBO
IEBO
Collector Cut-off Current
Emitter Cut-off Current
Collector-Emitter
Saturation Voltage
Base-Emitter Voltage
IE=0, VCB=-30V
IC=0, VEB=-5V
-
-
-
-
-100 nA
-100 nA
*VCE(sat)
*VBE
IC=-500mA, IB=-50mA
-
-
-0.5
V
IC=-500mA, VCE=-2V
VCE=-2V, IC=-5mA
VCE=-2V, IC=-150mA
VCE=-2V, IC=-500mA,
IC=-50mA, VCE=-5V, f=100MHz
-
-
-
-
-
-1
V
40
63
25
-
-
-
hFE
DC Current Gain
250
-
-
-
-
fT
Transition Frequency
DC current gain ratio of
the complementary pairs
230
MHz
*hFE1/hFE2
|IC|=150mA, |VCE|=2V
-
1
1.6
-
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HBD136
HSMC Product Specification
Spec. No. : Preliminary Data
Issued Date : 2001.08.01
Revised Date : 2001.08.24
Page No. : 2/3
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
Saturation Voltage & Collector Current
1000
1000
100
100
CE
hFE @ V =2V
CE(sat)
V
C
B
@ I =10I
10
10
0.1
1
10
100
C
1000
10000
1
10
100
Collector Current-I (mA)
1000
10000
C
Collector Current-I (mA)
ON Voltage & Collector Current
Saturation Voltage & Collector Current
1000
1000
BE(sat)
V
C
B
@ I =10I
BE(on)
V
CE
@ V =2V
100
100
0.1
1
10
100
1000
10000
1
10
100
1000
10000
C
Collector Current-I (mA)
C
Collector Current-I (mA)
Safe Operating Arae
10
1
PT=1mS
PT=100mS
PT=1S
0.1
0.01
1
10
100
1000
Forward Voltage (V)
HBD136
HSMC Product Specification
Spec. No. : Preliminary Data
Issued Date : 2001.08.01
Revised Date : 2001.08.24
Page No. : 3/3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126 Dimension
I
Marking :
D
E
J
K
A
B
M
H
B D
1 3 6
α
3
2
1
3
Control Code
Date Code
Laser Marking
α
4
G
Style : Pin 1.Emitter 2.Collector 3.Base
C
F
L
H
α
1
3-Lead TO-126 Plastic Package
HSMC Package Code : T
α
2
*:Typical
Inches
Millimeters
Inches
Min.
Millimeters
DIM
DIM
Min.
Max.
*3°
Min.
-
Max.
*3°
Max.
0.0319
0.0520
0.1890
0.1050
0.0550
0.0550
*0.0217
0.1520
Min.
0.71
1.22
4.34
2.41
1.14
1.14
-
Max.
0.81
1.32
4.80
2.66
1.39
1.39
*0.55
3.86
-
-
-
-
F
G
H
I
J
K
L
0.0280
0.0480
0.1709
0.0950
0.0450
0.0450
-
α1
α2
α3
α4
A
B
C
D
E
-
*3°
*3°
*3°
*3°
-
*3°
-
*3°
0.1500
0.2752
0.5315
0.2854
0.0374
0.1539
0.2791
0.6102
0.3039
0.0413
3.81
6.99
13.50
7.52
0.95
3.91
7.09
15.50
7.72
1.05
M
0.1378
3.50
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
• Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HBD136
HSMC Product Specification
相关型号:
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