HBD136 [HSMC]

PNP POWER TRANSISTORS; PNP功率晶体管
HBD136
型号: HBD136
厂家: HI-SINCERITY MOCROELECTRONICS    HI-SINCERITY MOCROELECTRONICS
描述:

PNP POWER TRANSISTORS
PNP功率晶体管

晶体 晶体管
文件: 总3页 (文件大小:39K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : Preliminary Data  
Issued Date : 2001.08.01  
Revised Date : 2001.08.24  
Page No. : 1/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
HBD136  
PNP POWER TRANSISTORS  
Description  
PNP power transistor in a TO-126 plastic package. NPN complements:  
HBD135  
Features  
High Current (max. 1.5A)  
Low Voltage (max. 80V)  
Applications  
General purpose power applications, e.g. driver stages in hi-fi amplifiers and television circuits.  
Limiting Values  
Symbol  
Parametor  
Conditions  
Min.  
Max.  
Unit  
VCBO  
VCEO  
VEBO  
IC  
ICM  
IBM  
Collector-Base Voltage  
Collector-Emitter Voltage  
Emitter-Base Voltage  
Collector Current (DC)  
Peak Collector Current  
Peak Base Current  
Open Emitter  
Open Base  
Open Collector  
-
-
-
-
-
-
-
-45  
-45  
-5  
-1.5  
-2  
-1  
1.2  
15  
V
V
V
A
A
A
W
W
°C  
°C  
°C  
Ta=25°C  
Tc=25°C  
-
-
-
PD  
Total Dissipation at  
-
Tstg  
Tj  
Tamb  
Storage Temperature  
Junction Temperature  
Operating Ambient Temperature  
-65  
-
-65  
150  
150  
150  
(Tj=25°C, unless otherwise specified)  
Electrical Characteristics  
Symbol  
Parameter  
Conditions  
Min. Typ. Max. Unit  
ICBO  
IEBO  
Collector Cut-off Current  
Emitter Cut-off Current  
Collector-Emitter  
Saturation Voltage  
Base-Emitter Voltage  
IE=0, VCB=-30V  
IC=0, VEB=-5V  
-
-
-
-
-100 nA  
-100 nA  
*VCE(sat)  
*VBE  
IC=-500mA, IB=-50mA  
-
-
-0.5  
V
IC=-500mA, VCE=-2V  
VCE=-2V, IC=-5mA  
VCE=-2V, IC=-150mA  
VCE=-2V, IC=-500mA,  
IC=-50mA, VCE=-5V, f=100MHz  
-
-
-
-
-
-1  
V
40  
63  
25  
-
-
-
hFE  
DC Current Gain  
250  
-
-
-
-
fT  
Transition Frequency  
DC current gain ratio of  
the complementary pairs  
230  
MHz  
*hFE1/hFE2  
|IC|=150mA, |VCE|=2V  
-
1
1.6  
-
*Pulse Test : Pulse Width 380us, Duty Cycle2%  
HBD136  
HSMC Product Specification  
Spec. No. : Preliminary Data  
Issued Date : 2001.08.01  
Revised Date : 2001.08.24  
Page No. : 2/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
Characteristics Curve  
Current Gain & Collector Current  
Saturation Voltage & Collector Current  
1000  
1000  
100  
100  
CE  
hFE @ V =2V  
CE(sat)  
V
C
B
@ I =10I  
10  
10  
0.1  
1
10  
100  
C
1000  
10000  
1
10  
100  
Collector Current-I (mA)  
1000  
10000  
C
Collector Current-I (mA)  
ON Voltage & Collector Current  
Saturation Voltage & Collector Current  
1000  
1000  
BE(sat)  
V
C
B
@ I =10I  
BE(on)  
V
CE  
@ V =2V  
100  
100  
0.1  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
C
Collector Current-I (mA)  
C
Collector Current-I (mA)  
Safe Operating Arae  
10  
1
PT=1mS  
PT=100mS  
PT=1S  
0.1  
0.01  
1
10  
100  
1000  
Forward Voltage (V)  
HBD136  
HSMC Product Specification  
Spec. No. : Preliminary Data  
Issued Date : 2001.08.01  
Revised Date : 2001.08.24  
Page No. : 3/3  
HI-SINCERITY  
MICROELECTRONICS CORP.  
TO-126 Dimension  
I
Marking :  
D
E
J
K
A
B
M
H
B D  
1 3 6  
α
3
2
1
3
Control Code  
Date Code  
Laser Marking  
α
4
G
Style : Pin 1.Emitter 2.Collector 3.Base  
C
F
L
H
α
1
3-Lead TO-126 Plastic Package  
HSMC Package Code : T  
α
2
*:Typical  
Inches  
Millimeters  
Inches  
Min.  
Millimeters  
DIM  
DIM  
Min.  
Max.  
*3°  
Min.  
-
Max.  
*3°  
Max.  
0.0319  
0.0520  
0.1890  
0.1050  
0.0550  
0.0550  
*0.0217  
0.1520  
Min.  
0.71  
1.22  
4.34  
2.41  
1.14  
1.14  
-
Max.  
0.81  
1.32  
4.80  
2.66  
1.39  
1.39  
*0.55  
3.86  
-
-
-
-
F
G
H
I
J
K
L
0.0280  
0.0480  
0.1709  
0.0950  
0.0450  
0.0450  
-
α1  
α2  
α3  
α4  
A
B
C
D
E
-
*3°  
*3°  
*3°  
*3°  
-
*3°  
-
*3°  
0.1500  
0.2752  
0.5315  
0.2854  
0.0374  
0.1539  
0.2791  
0.6102  
0.3039  
0.0413  
3.81  
6.99  
13.50  
7.52  
0.95  
3.91  
7.09  
15.50  
7.72  
1.05  
M
0.1378  
3.50  
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.  
2.Controlling dimension : millimeters.  
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.  
Material :  
Lead : 42 Alloy ; solder plating  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
HSMC reserves the right to make changes to its products without notice.  
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory :  
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454  
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5983621~5 Fax : 886-3-5982931  
HBD136  
HSMC Product Specification  

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