HBD237 [HSMC]

NPN EPITAXIAL PLANAR TRANSISTOR; NPN外延平面晶体管
HBD237
型号: HBD237
厂家: HI-SINCERITY MOCROELECTRONICS    HI-SINCERITY MOCROELECTRONICS
描述:

NPN EPITAXIAL PLANAR TRANSISTOR
NPN外延平面晶体管

晶体 晶体管 局域网
文件: 总2页 (文件大小:27K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Spec. No. : HE6622-A  
Issued Date : 1994.09.08  
Revised Date : 2000.10.01  
Page No. : 1/2  
HI-SINCERITY  
MICROELECTRONICS CORP.  
HBD237  
NPN EPITAXIAL PLANAR TRANSISTOR  
Description  
The HBD237 is designed for medium power linear and switching  
applications.  
(Ta=25°C)  
Absolute Maximum Ratings  
Maximum Temperatures  
Storage Temperature............................................................................................ -50 ~ +150 °C  
Junction Temperature ................................................................................... +150 °C Maximum  
Maximum Power Dissipation  
Total Power Dissipation (Tc=25°C) .................................................................................... 25 W  
Maximum Voltages and Currents  
BVCBO Collector to Base Voltage.................................................................................... 100 V  
BVCEO Collector to Emitter Voltage................................................................................... 80 V  
BVEBO Emitter to Base Voltage........................................................................................... 5 V  
BVCER Emitter to Base Voltage....................................................................................... 100 V  
IC Collector Current.............................................................................................................. 2 A  
IC Collector Current (Pulse).................................................................................................. 6 A  
(Ta=25°C)  
Electrical Characteristics  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Test Conditions  
BVCBO  
*BVCEO  
BVEBO  
ICBO  
100  
80  
5
-
-
-
-
40  
25  
3
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
uA  
mA  
V
IC=1mA  
IC=100mA  
IE=100uA  
VCB=100V  
VBE=5V  
IC=1A, IB=0.1A  
IC=1A, VCE=2V  
IC=150mA, VCE=2V  
IC=1A, VCE=2V  
VCE=10V, IC=250mA, f=100MHz  
100  
1
0.6  
1.3  
-
IEBO  
*VCE(sat)  
*VBE(on)  
*hFE1  
V
*hFE2  
-
-
fT  
MHz  
*Pulse Test : Pulse Width 380us, Duty Cycle2%  
HSMC Product Specification  
Spec. No. : HE6622-A  
Issued Date : 1994.09.08  
Revised Date : 2000.10.01  
Page No. : 2/2  
HI-SINCERITY  
MICROELECTRONICS CORP.  
TO-126ML Dimension  
Marking :  
HSMC Logo  
Part Number  
Date Code  
Product Series  
Rank  
A
B
D
F
O
H
Ink Marking  
E
3
2
1
C
N
Style : Pin 1.Emitter 2.Collector 3.Base  
I
G
J
M
L
K
3-Lead TO-126ML Plastic Package  
HSMC Package Code : D  
*:Typical  
Inches  
Millimeters  
Min.  
Inches  
Max.  
Millimeters  
DIM  
DIM  
Min.  
Max.  
Max.  
3.70  
0.69  
1.12  
1.52  
3.12  
2.12  
1.25  
1.42  
Min.  
-
Min.  
Max.  
*4.56  
0.84  
15.00  
7.62  
3.75  
4.12  
2.14  
A
B
C
D
E
F
0.1356  
0.0170  
0.0344  
0.0501  
0.1131  
0.0737  
0.0294  
0.0462  
0.1457  
0.0272  
0.0444  
0.0601  
0.1231  
0.0837  
0.0494  
0.0562  
3.44  
0.43  
0.87  
1.27  
2.87  
1.87  
0.74  
1.17  
I
*0.1795  
0.0331  
0.5906  
0.3003  
0.1478  
0.1625  
0.0842  
-
J
0.0268  
0.5512  
0.2903  
0.1378  
0.1525  
0.0740  
0.68  
14.00  
7.37  
3.50  
3.87  
1.88  
K
L
M
N
O
G
H
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.  
2.Controlling dimension : millimeters.  
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.  
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.  
Material :  
Lead : 42 Alloy ; solder plating  
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0  
Important Notice:  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.  
HSMC reserves the right to make changes to its products without notice.  
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.  
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.  
Head Office And Factory :  
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.  
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454  
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5983621~5 Fax : 886-3-5982931  
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C  
Tel : 886-3-5977061 Fax : 886-3-5979220  
HSMC Product Specification  

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