H277 [HSMC]
On-chip Hall sensor; 片上霍尔传感器
| 型号： | H277 |
| 厂家： | 
HI-SINCERITY MOCROELECTRONICS |
| 描述： | On-chip Hall sensor |
| 文件： | 总7页 (文件大小：278K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spec. No. : IC200907
Issued Date : 2009.04.03
Revised Date :2009.10.29
Page No. : 1/7
HI-SINCERITY
MICROELECTRONICS CORP.
H277
Complementary Output Hall Effect Sensor IC
General Description
H277 is designed to integrate Hall sensor with output driver together on the
same chip. It is suitable for dual coils brush-less DC motors, dual coils brush-less DC fan, speed measurement,
and revolution counting.
It includes a band-gap reference voltage source, a Hall device, an amplifier, a hysteretic controller and an open-
collector output drive capable of sinking up to 300mA current load. An on-chip protection diode is implemented to
prevent reverse power fault.
H277 has a control circuit to prevent “dead angle” from logic race condition in DC Fan. It has excellent
characteristic of temperature compensation. The internal temperature compensated voltage source can let sensor
to get uniform sensitivity in a wide temperature range.
It is rated for operation over temperature rage from -20oC to +85oC and voltage ranges from 3.0V to 20V.
Features
• On-chip Hall sensor
• 3.0V to 20V operating voltage
• Internal Temperature compensation
• Special design providing logic race condition immunity, shorter switching time, and good switch reliability
• 300mA output sink current
• Internal on-chip protection diode
• SIP-4L Package
Applications
• Dual-coil Brush-less DC Motor
• Dual-coil Brush-less DC Fan
• Revolution Counting
• Speed Measurement
Typical Application Circuit (Brush-Less DC Fan)
Fig.2 H277 Application Circuit
H277
HSMC Product Specification
Spec. No. : IC200907
Issued Date : 2009.04.03
Revised Date :2009.10.29
Page No. : 2/7
HI-SINCERITY
MICROELECTRONICS CORP.
Pin Configuration
Name
VCC
DO
P/I/O
P
Pin No.
Description
1
2
3
4
Power Supply Input
O
Output Pin
Output Pin
Ground
DOB
GND
O
P
Block Diagram
Vcc
Vout1
Vout2
Temperature
Compensation
Voltage
Regulator
GND
Hall
Effect
Sensor
Differential
Amplifier
Hysteresis
Output
Driver
Control
Logic Control
GND
Fig.3 Functional Block Diagram of H277
Absolute Maximum Ratings (Ta=25oC)
Characteristics
Supply Voltage
Symbol
Values
Unit
V
VCC
20
35
Output breakdown Voltage
Magnetic Flux Density
VOUT(breakdown)
V
B
VZ
Unlimited
28
Gauss
V
Output Zener Breakdown
Output ON Current (continuous)
Maximum Output Current
Operating Temperature Range
IC
300
mA
A
ICMAX
TA
1
℃
-20 to +85
TStg
℃
mW
℃
Storage Temperature Range
Package Power Dissipation
Maximum Junction Temperature
-65 to +150
500
PD
TJ
150
H277
HSMC Product Specification
Spec. No. : IC200907
Issued Date : 2009.04.03
Revised Date :2009.10.29
Page No. : 3/7
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics (T=+25℃, VCC=3V~20V)
Characteristic
Supply Voltage
Symbol
VCC
Test Conditions
Min.
Typ.
-
Max.
20
-
Unit
V
3
-
-
-
-
-
-
VCC=3V, IL=100mA
200
300
-
Output Saturation Voltage
VCE(sat)
mV
VCC=14V, IL=300mA
600
2
Output Leakage Current
Supply Current
Icex
Iccq
Tr
Vce=14V, VCC=14V
uA
mA
uS
uS
VCC=20V, Output Open
VCC=14V, RL=400Ω, CL=20pF
VCC=14V, RL=400Ω, CL=20pF
14
1
20
5
Output Rise Time
Output Falling Time
Tf
0.2
1.2
Magnetic Characteristics
Characteristic
Symbol
Min.
-
Max.
50
Unit
Grade
Operate Point
H277A
Bop
Gauss
A
Release Point
Brp
Bop
Brp
Bop
Brp
Bop
Brp
-50
-
-
70
-
Gauss
Gauss
Gauss
Gauss
Gauss
Gauss
Gauss
Operate Point
H277B
B
C
D
Release Point
-70
-
Operate Point
H277C
90
-
Release Point
-90
-
Operate Point
H277D
130
-
Release Point
-130
Fig.4 VDO vs. Magnetic Flux Density
Fig.5 VDOB vs. Magnetic Flux Density
H277
HSMC Product Specification
Spec. No. : IC200907
Issued Date : 2009.04.03
Revised Date :2009.10.29
Page No. : 4/7
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Supply Current & Temperature
13.4
13.3
13.2
13.1
13
Test Conditions:
CC
V
=20V
L
Output Open, R =
∞
(Refer to Test Circuit)
12.9
12.8
12.7
12.6
12.5
12.4
0
20
40
60
80
100
120
Temperature (oC)
Fig.6 ICC vs. VCC
Fig.7 ICC vs. TA
Output Saturation Voltage & Loading Current
Hysteresis & Temperature
1600
1400
1200
1000
800
600
400
200
0
80
70
60
50
40
30
20
10
0
Test Conditions:
CC
L
V
=14V, R =400Ω
Test Conditions:
L
C =20pF
(Refer to Test Circuit)
o
CC
A
V
=14V, T =25 C
L
I =300mA~1200mA
300
400
500
600
700
800
900
1000
0
20
40
60
80
100
120
Temperature (oC)
Loading Current (mA)
Fig.8 Vsat vs. IC
Fig.9 Bhys vs. TA
SIP-4L Power Dissipation & Temperature
600
550
500
450
400
350
300
250
200
0
20
40
60
80
100
120
Temperature (oC)
Fig.10 PD vs. TA
H277
HSMC Product Specification
Spec. No. : IC200907
Issued Date : 2009.04.03
Revised Date :2009.10.29
Page No. : 5/7
HI-SINCERITY
MICROELECTRONICS CORP.
Brush-less DC Fan Output Current Curve
Icoil 1
180
12V, 0.24A Brush-Less DC Fan
(Refer to Typical Application Circuit)
Test Conditions:
90
CC
1 2
V
R
=12V, C =C =2.2uF
coil1
coil2
=R =40ohm
0
Icoil 2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Time (uS)
Fig.11 DC FAN Output Curve
Brush-less DC Fan Output Voltage Curve
20
12V, 0.24A Brush-Less DC Fan
(Refer to Typical Application Circuit)
Test Conditions:
18
16
14
12
10
8
Vout 1
CC
1 2
V
=12V, C =C =2.2uF
coil1
coil2
R
=R =40ohm
6
4
2
Vout 2
0
0
2
4
6
8
10
12
14
16
18
20
Time (mS)
Fig.12 DC FAN Output Curve
Test Circuit
Fig.13 Test Circuit
H277
HSMC Product Specification
Spec. No. : IC200907
Issued Date : 2009.04.03
Revised Date :2009.10.29
Page No. : 6/7
HI-SINCERITY
MICROELECTRONICS CORP.
SIP-4L Dimension
DIM
A
B
C
D
E
Min.
5.12
4.10
3.55
0.43
0.35
1.24
3.78
1.32
1.45
0.93
13.00
Max.
5.32
4.30
3.75
0.49
0.41
1.30
3.84
1.52
1.65
1.13
15.50
Marking:
A
B
I
J
a2
a1
C
1
2
3
4
H
F
G
H
I
J
K
D
Note: Green label is used for Pb-free packing
Pin Style: 1.VCC 2.Vout1 3.Vout2 4.GND
Hall Sensor Location:
K
L
a1
a2
2 .0 0m m
3o
5o
5o
7o
1 .2 5m m
F
E
E
To p
G
V iew
*: Typical, Unit: mm
Marking Site
a2
a1
L
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
4-Lead SIP-4L
Plastic Package
HSMC Package Code: AD
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office:
• Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong
Tel: +852-2755-7162 Fax: +852-2755- 7795
AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China
Tel: +86(21) 61637118
Fax: +86(21)61637006
H277
HSMC Product Specification
Spec. No. : IC200907
Issued Date : 2009.04.03
Revised Date :2009.10.29
Page No. : 7/7
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
t
P
Critical Zone
to T
TP
T
L
P
Ramp-up
TL
t
L
Tsmax
Tsmin
t
S
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
Sn-Pb Eutectic Assembly
<3oC/sec
Pb-Free Assembly
<3oC/sec
- Temperature Min (Tsmin
)
100oC
150oC
150oC
200oC
- Temperature Max (Tsmax
- Time (min to max) (ts)
Tsmax to TL
)
60~120 sec
60~180 sec
- Ramp-up Rate
<3oC/sec
<3oC/sec
Time maintained above:
- Temperature (TL)
- Time (tL)
183oC
217oC
60~150 sec
240oC +0/-5oC
60~150 sec
260oC +0/-5oC
Peak Temperature (TP)
Time within 5oC of actual Peak
10~30 sec
20~40 sec
Temperature (tP)
Ramp-down Rate
<6oC/sec
<6oC/sec
Time 25oC to Peak Temperature
<6 minutes
<8 minutes
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Peak temperature
245oC ±5oC
260oC +0/-5oC
Dipping time
5sec ±1sec
5sec ±1sec
Pb-Free devices.
H277
HSMC Product Specification
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