DM1AA-SF-PEJ(31) [HRS]
PCB Connector, 9 Contact(s), 1 Row(s), Male, Right Angle, 0.098 inch Pitch, Surface Mount Terminal, Black Insulator, Receptacle;
| 型号： | DM1AA-SF-PEJ(31) |
| 厂家： | 
HRS |
| 描述： | PCB Connector, 9 Contact(s), 1 Row(s), Male, Right Angle, 0.098 inch Pitch, Surface Mount Terminal, Black Insulator, Receptacle PC 连接器 |
| 文件： | 总6页 (文件大小：216K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SD Memory Card Connectors
DM1 Series
Withstands higher force of card insertion.
Card
Standard type
Metal cover extends over the back of the connector.
■Features
Card
1. Withstands higher force of card insertion
Metal cover extends over the back of the connector
allowing it to withstand force of up to 400N (static load)
when dropped or accidentally hit. (Fig.1)
Reverse type
Metal cover extends over the back of the connector.
Fig.1
2. No damage to the card when accidentally
pulled-out
The connectors will release the card when a moderate
pull-out force of about 4N is applied. There will be no
damage to the lock components and all connector
functions will not be affected. (Fig.2)
No damage to the card when
accidentally pulled-out.
3. Accidental card fall-out prevention
Built-in lock feature holds the card securely in place.
(Fig.3)
4. Reliable Card Insertion and Withdrawal
Built-in Push-in / Push-out ejection mechanism assures
simple and reliable card insertion and withdrawal.
5. Designed to accept Secure Digital I/O card
(Built-in Ground Contact)
Fig.2
The connector allows use of various expansion
modules, including the Bluetooth communication
modules.
Accidental card
fall-out prevention
Fig.3
C39
■Product Specifications
Current rating 0.5A DC
Operating humidity range : Relative humidity 95%
max. (No condensation)
Operating temperature range : -25ç to +85ç (Note 1)
Storage temperature range : -40ç to +85ç (Note 2)
Rating
Voltage rating 125V AC
Item
Specification
Conditions
1. Insulation resistance
500V DC
1000Mø min. (Initial value)
2. Withstanding voltage No flashover or insulation breakdown
500V AC / one minute
3. Contact resistance
4. Vibration
100mA DC
100mø max. (Initial value)
No electrical discontinuity of 100ns or more
Frequency : 10 to 55Hz, single amplitude of 0.75mm, 2 hours / 3 axis
Contact resistance : 40mø max. from initial value
Insulation resistance : 100Mø min.
96 hours at temperature of 40
humidity of 90% to 95%
ç
2
ç
and
5. Humidity
Contact resistance : 40mø max. from initial value
Insulation resistance : 100Mø min.
Temperature : -55
+5 to +35
+85
+5 to +35
ç/ ç ç
ç/
ç
ç/
6. Temperature cycle
Duration : 30
5
30
5 (Minutes) 5 cycles
/
/
/
7. Durability (mating/un-mating)
10000 cycles at 400 to 600 cycles per hour
Contact resistance : 40mø max. from initial value
Reflow : At the recommended temperature profile
Manual soldering : 350ç for 3 seconds
8. Resistance to soldering heat No deformation of components affecting performance.
Note1 : Includes temperature rise caused by current flow.
Note2 : The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
■Materials / Finish
Component
Material
Finish
Remarks
Insulator
Heat resistant thermoplastic compound
Color: Black
UL94V-0
Contact area: Gold plating
Termination area: Tinned copper plating
Contacts
Cover
Phosphor bronze
Stainless steel
--------------------
--------------------
--------------------
Termination area: Tinned copper plating
Stainless steel
Piano wire
--------------------
Nickel plating
Others
■Product Number Structure
DM1 AA - SF - PEJ
1
2
3
4
1
2
3
4
Series name
Connector type
: DM1
Terminal type
: AA : Standard receptacle
: B : Reverse receptacle
SF
: Right angle surface mount
DSF : Reverse right angle surface mount
Eject mechanism codes
PEJ : Card Push insert/Push withdraw
C40
■Standard type
BPCB mounting pattern
2 0+0.1
25.4 0.05
22.4 0.05
4.125 0.05
1.7 0.05
15 0.05
P=2.5 0.05
1.35 0.05
2 0+0.1
9-1.1 0.05
1.6 0.05
2
Card detection switch
2
Write protection switch
Part No.
HRS No.
DM1AA-SF-PEJ(82)
609-0004-8 82
2 0+0.1
1.2 0.05
1
C
L
1
1
28
13.2
9.75
8.05
No.4
No.5
2.9
No.6
No.7
No.8
t=0.2,W=0.6
No.2
15
No.3
5.625
P2.5
No.1
No.9
1
C
L
1
C
L
24.15 (Card slot dimension)
1
C indicates the center line of card slot.
1
L
Card detection switch
Write protection switch
When card is inserted
When card When card When card
is ejected is inserted is ejected
1
C
L
WRITE PROTECT WRITE ENABLE
2-Ø1.2
22.4
OPEN
CLOSE
OPEN
OPEN
CLOSE
Weight:2.2g
BCard insertion/withdrawal dimensions
SD Card
SD Card
SD Card
Card pushed-in for insertion
Card fully inserted
Card ejected
(Card ejected dimension)
C41
■Reverse type
BPCB mounting pattern
9.47 0.05
12.8 0.05
11.2 0.05
9.75 0.05
8.05 0.05
12.5 0.05
0.8 0.05
1.4 0.05
P=2.5 0.05
1.25 0.05
5.625 0.05
CARD DETECT
COMMON FOR CD & WP
A
A
8-1.1 0.05
5.62
3
2.03 0.05
12.57 0.05
11.23 0.05
14.13 0.05
11.93 0.05
WP
Part No.
HRS No.
14.25 0.05
DM1B-DSF-PEJ(82)
609-0003-5 82
C
B
3
Center of Card dimension
A(5:1)
B(5:1)
C(5:1)
1.2 +0 0.1(Land)
1.2 +0 0.1(Land)
0.8 0+0.1(Through hole)
1.2 +0 0.1(Land)
0.8 0+0.1(Through hole)
0.8 0+0.1(Through hole)
2
2
8.63
2
18.68
16.85
2
2
6.95
7.65
5.62
2
1
C
L
28
No.5 No.4
No.3
No.2
No.1
No.6
No.7
No.8
(14.35)
1
C
L
2.9
No.9
1
C
L
(0.25)
C indicates the center line of the card slot.
indicates the dimension of DIP terminals.
1
2
L
SD Card
Card detection switch
Write protection switch
When card is ejected
WRITE PROTECT WRITE ENABLE
When card
is ejected
When card
is ejected
When card
is ejected
1
C
L
OPEN
CLOSE
OPEN
OPEN
CLOSE
Weight:2.1g
C42
BPackaging specifications
●Embossed Carrier Tape Dimensions (Standard type) 450 pcs/reel
4.35 0.3
3.4 0.3
36 0.1
4
0.1
2
0.15
Unreeling direction
●Embossed Carrier Tape Dimensions(Reverse type) 450 pcs/reel
4
0.1
36 0.1
4.6 0.3
3.4 0.3
2
0.15
Unreeling direction
●Reel dimensions
Unreeling direction
D
End section
Mounting section(450)
Lead section (400mm min.)
Blank section(160mm min.)
Blank section (100mm min.)
Top cover tape
Embossed carrier tape
C43
BRecommended Temperature Profile
HRS test condition
Solder method
Environment
(ç)
Peak : 250ç MAX
: Reflow, IR/hot air
: Room air
250
230ç min.
50
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
200
seconds
200ç
Soldering
150
Part Number:M705-GRN360-K2-V)
150ç
Test board
Metal mask
: Glass epoxy 60mm∞100mm∞1.0mm thick
: 0.15mm thick
90 to 120 seconds
100
Preheating
Number of reflow cycles : 2cycles max.
50
The temperature profiles shown are based on the above
conditions.
Time (Seconds)
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
C44
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