DM1B-DSF-PEJ [HRS]
SD Memory Card Connectors; SD记忆卡连接器
| 型号： | DM1B-DSF-PEJ |
| 厂家： | 
HRS |
| 描述： | SD Memory Card Connectors |
| 文件： | 总6页 (文件大小：260K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NEW
SD Memory Card Connectors
DM1 Series
Withstands higher force of card insertion.
Card
Standard type
Metal cover extends over the back of the connector.
ꢀFeatures
Card
1. Withstands higher force of card insertion
Metal cover extends over the back of the connector
allowing it to withstand force of up to 400 N (static load)
when dropped or accidentally hit.
Reverse type
Metal cover extends over the back of the connector.
2. No damage to the card when accidentally
pulled-out
The connectors will release the card when a moderate
pull-out force of about 4 N is applied. There will be no
damage to the lock components and all connector
functions will not be affected.
No damage to the card when
accidentally pulled-out.
3. Accidental card fall-out prevention
Built-in lock feature holds the card securely in place.
4. Reliable Card Insertion and Withdrawal
Built-in Push-in / Push-out ejection mechanism assures
simple and reliable card insertion and withdrawal.
5. Designed to accept Secure Digital I/O card
(Built-in Ground Contact)
The connector allows use of various expansion modules,
including the Bluetooth communication modules.
Accidental card
fall-out prevention
ꢀApplications
Notebook PC's, digital cameras, PDA's, audio/video
equipment and other devices utilizing SD I/O cards.
2003.4
1
ꢀProduct Specifications
Current rating 0.5A DC
Operating humidity range : Relative humidity 95%
max. (No condensation)
Operating temperature range:-25ç to +85ç (Note 1)
Storage temperature range:-40ç to +85ç (Note 2)
Rating
Voltage rating 125 V AC
Item
Specification
Conditions
1. Insulation resistance 1000 M ohms min. (Initial value)
2. Withstanding voltage No flashover or insulation breakdown
3. Contact resistance 100 m ohms max. (Initial value)
500 V DC
500 V AC / one minute
100mA DC
4. Vibration
No electrical discontinuity of 100 ns or more
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis
Contact resistance: 40 m ohms max. from initial value
Insulation resistance: 100 M ohms min.
96 hours at temperature of 40
humidity of 90% to 95%
ç
2
ç
and
5. Humidity
Contact resistance: 40 m ohms max. from initial value
Insulation resistance: 100 M ohms min.
Temperature: -55
ç/
+5 to +35
ç/
+85
+5 to +35
ç/ ç ç
ç
6. Temperature cycle
Duration: 30
5
30
5 (Minutes) 5 cycles
/
/
/
7. Durability (mating/un-mating) Contact resistance: 40m ohms max. from initial value
8. Resistance to soldering heat No deformation of components affecting performance.
Note1: Includes temperature rise caused by current flow.
10000 cycles at 400 to 600 cycles per hour
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
Note2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature
Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during
transportation.
ꢀMaterials
Component
Material
Finish
Remarks
Insulator
Heat resistant thermoplastic compound
Color: Black
UL94V-0
Contact area: Gold plating
Termination area: Tinned copper plating
Contacts
Cover
Phosphor bronze
Stainless steel
--------------------
--------------------
--------------------
Termination area: Tinned copper plating
Stainless steel
Piano wire
--------------------
Nickel plating
Others
ꢀOrdering information
DM1 AA - SF - PEJ
1
2
3
4
1
2
3
4
Series name
Connector type
: DM1
Terminal type
: AA : Standard receptacle
: B : Reverse receptacle
SF
: Right angle surface mount
DSF : Reverse right angle surface mount
Eject mechanism codes
PEJ : Card Push insert/Push withdraw
2
ꢀStandard type
BPCB mounting pattern
2 ±+±.1
20.4± ±.±0
22.4± ±.±0
4.120± ±.±0
1.7± ±.±0
10± ±.±0
P=2.0± ±.±0
1.30± ±.±0
2 ±+±.1
9-1.1± ±.±0
1.6± ±.±0
2
Card detection switch
2
Write protection switch
Part number
HRS No.
DM1AA-SF-PEJ(21)
6±9-±±±4-8-21
2 ±+±.1
1.2± ±.±0
1
C
L
1
1
28
13.2
9.70
8.±0
No.4
No.0
2.9
No.6
No.7
No.8
t=±.2,W=±.6
No.2
10
No.3
0.620
P2.0
No.1
No.9
1
C
L
1
C
L
24.10 (Card slot dimension)
1
C indicates the center line of card slot.
1
L
Card detection switch
Write protection switch
When card is inserted
When card When card When card
is ejected is inserted is ejected
1
C
L
WRITE PROTECT WRITE ENABLE
2-Ø1.2
22.4
OPEN
CLOSE
OPEN
OPEN
CLOSE
Weight:2.2g
BCard insertion/withdrawal dimensions
SD Card
SD Card
SD Card
Card pushed-in for insertion
Card fully inserted
Card ejected
(Card ejected dimension)
3
ꢀReverse type
BPCB mounting pattern
9.47 0.05
12.8 0.05
11.2 0.05
9.75 0.05
8.05 0.05
12.5 0.05
0.8 0.05
1.4 0.05
P=2.5 0.05
1.25 0.05
5.625 0.05
CARD DETECT
COMMON FOR CD & WP
A
A
8-1.1 0.05
5.62
3
2.03 0.05
12.57 0.05
11.23 0.05
14.13 0.05
11.93 0.05
WP
Part number
HRS No.
14.25 0.05
DM1B-DSF-PEJ
609-0003-5
C
B
3
Center of Card dimension
A(5:1)
B(5:1)
C(5:1)
1.2 +0 0.1(Land)
1.2 +0 0.1(Land)
0.8 0+0.1(Through hole)
1.2 +0 0.1(Land)
0.8 0+0.1(Through hole)
0.8 0+0.1(Through hole)
2
2
8.63
2
18.68
16.85
2
2
6.95
7.65
5.62
2
1
C
L
28
No.5 No.4
No.3
No.2
No.1
No.6
No.7
No.8
(14.35)
1
C
L
2.9
No.9
1
C
L
(0.25)
C indicates the center line of the card slot.
indicates the dimension of DIP terminals.
1
2
L
SD Card
Card detection switch
Write protection switch
When card is ejected
WRITE PROTECT WRITE ENABLE
When card
is ejected
When card
is ejected
When card
is ejected
1
C
L
OPEN
CLOSE
OPEN
OPEN
CLOSE
Weight:2.1g
4
BPackaging specifications
ꢀEmbossed Carrier Tape Dimensions (Standard type) 450 pieces per reel
4.35 0.3
3.4 0.3
36 0.1
4
0.1
2
0.15
Unreeling direction
ꢀEmbossed Carrier Tape Dimensions(Reverse type) 450 pieces per reel
4
0.1
36 0.1
4.6 0.3
3.4 0.3
2
0.15
Unreeling direction
ꢀReel dimensions
Unreeling direction
D
End section
Mounting section(450)
Lead section (400mm min.)
Blank section(160mm min.)
Blank section (100mm min.)
Top cover tape
Embossed carrier tape
5
ꢀRecommended Temperature Profile
300ç
IR Reflow Conditions
Preheating: 150ç
Soldering : 235 5ç 10 sec. Max.
Soldering : 220ç 10 to 20 sec.
30 to 90 sec.
MAX240ç
220ç
200ç
150ç
100ç
Soldering
Preheating
0ç
0S
50S
100S
150S
200S
Recommended Conditions
Reflow system
: IR reflow
Solder
: Paste type 63 Sn/37 Pb(Flux content 9 wt%)
: Glass epoxy 60mm x 100mm x 1.6 mm thick
Test board
Metal mask thickness: 0.15 mm
Recommended temperature profile.
The temperature may be slightly changed according to the solder paste type and thickness.
6
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