CB1EB-10S-1.5H-PEJC2(52) [HRS]

PCMCIA Connector, 10 Contact(s), 1 Row(s), Female, Right Angle, 0.059 inch Pitch, Surface Mount Terminal, Black Insulator, Receptacle;
CB1EB-10S-1.5H-PEJC2(52)
型号: CB1EB-10S-1.5H-PEJC2(52)
厂家: HRS    HRS
描述:

PCMCIA Connector, 10 Contact(s), 1 Row(s), Female, Right Angle, 0.059 inch Pitch, Surface Mount Terminal, Black Insulator, Receptacle

PC 连接器
文件: 总10页 (文件大小:621K)
中文:  中文翻译
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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
®
Memory Stick Connectors  
CB1 Series  
Card Push Insert/Push Eject  
<CB1G Series>  
Card ejection distance of 10 mm  
Mounting height of 3.5 mm  
Mounting area: Smaller design is 78% of former  
size  
Outline  
Button Touch Ejection  
Receptacle connectors for use with the new generation of  
<CB1F Series>  
®
digital media devices requiring “Memory Stick ” type of  
consumer removable memory card.  
Several variations are available: Miniature, Low Profile and  
with or without ejection mechanism.  
Features  
1. Indication of Incorrect Card Insertion  
The connector will not allow the card to be complete  
inserted from the wrong end or reversed.  
The card will stop about 7mm before complete insertion  
position, visually indicating incorrect insertion.  
Card ejection with tactile button operation  
Card ejection distance of 10 mm  
Equipped with card ejection switch  
2. Protection of the Contacts  
Incorrect insertion of the card will not damage the  
contacts. The card can be easily withdrawn and re-  
inserted correctly.  
3. Excellent Card Handling  
The type that is equipped with an ejection mechanism  
provides a long ejection of the card which offers excellent  
card handling qualities.  
Without Card Ejection  
<CB1D Series>  
*Memory Stick is a registered trademark of the Sony Corporation.  
Miniaturized, low profile design  
Improved installation to the equipment is permitted  
using (M1.7) tapping screws  
Can be equipped with an ejection mechanism  
depending on the design of the equipment side  
portion  
Note: Please position the card ejection button at the side of the equipment.  
C18  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
Product Specifications  
Operating humidity range  
Relative humidity 96% max.  
(No condensation)  
Operating temperature range -20 to +85  
Current rating 0.5A  
ç
ç(Note)  
Rating  
-40 to +85  
Voltage rating 125V AC  
Storage temperature range  
ç
ç
Item  
Specification  
Conditions  
1. Insulation resistance 1000 Mø min.  
2. Withstanding voltage No flashover or insulation breakdown  
500 V DC  
500 V AC / one minute  
100mA DC  
3. Contact resistance  
4. Vibration  
100 mø max.  
No electrical discontinuity of 1 µs or more  
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis  
96 hours at temperature of 40ç 2ç and humidity  
of 90% to 95%  
Contact resistance: 40 mø max. from initial value  
Insulation resistance: 100 Mø min.  
5. Humidity  
Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç  
Duration: 30/5/30/5(Minutes)  
5 cycles  
Contact resistance: 40 mø max. from initial value  
Insulation resistance: 100 Mø min.  
6. Temperature cycle  
7. Durability  
(mating/unmating)  
Contact resistance: 40mø max. from initial value 12000 cycles at 400 to 600 cycles per hour  
8. Resistance to  
soldering heat  
No deformation of any component.  
No affect on contacts  
Reflow: At the recommended temperature profile  
Manual soldering: 300  
ç for 3 seconds  
Note :Includes temperature rise caused by current flow.  
Materials  
Part  
Material  
Finish  
Remarks  
Heat resistant glass reinforced  
therm oplastic compound  
Insulator  
Color: Black  
UL94V-0  
----------  
Contact area: Gold plated  
Termination area: Tin-Iead plated or  
tinned copper plated  
Contacts  
Phosphor bronze  
Contact area: Nickel plating  
CB1E,CB1F,CB1G Series is  
without the termination area.  
Termination area:  
Tin-Iead plated or  
Metal hold down  
Cover  
Phosphor bronze or stainless steel  
Stainless steel or cupper alloy  
tinned copper plated  
The CB1E Series has termination  
area with tin-lead plated.  
----------  
Stainless steel  
Heat resistant glass reinforced  
therm oplastic compound  
Eject mechanism components  
----------  
UL94V-0  
Ordering information  
*
9
CB 1 E - 10 S - 1.5 H - PEJC -  
1
2
3
4
5
6
7
8
Series name  
Series No.  
: CB  
: 1  
: C  
E
1
2
6 Contact pitch : 1.5 mm  
7 Surface mount  
8 Eject mechanism codes:  
3 Ejector type  
PEJC : Card Push insert/Push eject  
With eject mechanism  
Without eject mechanism  
F
EJL : Left button eject  
EJR : Right button eject  
}
G
D
A
9 Suffix  
}
4 Number of contacts : 10  
5 Connector type S : Receptacle  
C19  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
Low Profile, Push Insert-Push Eject  
BPCB mounting pattern  
29.4  
Memory stick card outline  
26.8  
(5.525)  
3.85  
(3.25)  
1.9 0.1  
26.8 0.1  
1.9 0.1  
Part No.  
CL No.  
CB1G-10S-1.5H-PEJC2  
CL689-0037-5  
0.9 0.05  
P=1.5 0.03  
9.3 0.05  
3.5  
0.6  
P=1.5  
13.5  
CONTACT No.1  
9.3  
Button Touch Eject  
27.75  
22.75  
11.975 (5.525)  
BPCB mounting pattern  
Memory stick card outline  
3.85  
(3.25)  
32.5 00.3  
16.5 0.03 11.15 0.03  
1.5 0.03  
Part No.  
CL No.  
CL689-0028-4  
CB1F-10S-1.5H-TEJL-PA  
0.6 0.05  
0.9 0.05  
P=1.5 0.05  
13.5 0.05  
3
0.05  
3.5  
0.6  
CONTACT No.1  
4.2 0.05  
0.4  
3
4.2  
P=1.5  
13.5  
32.5  
37  
11.15  
Ø1.2  
1.5  
16.5  
Without Card Ejection  
BPCB mounting pattern  
24.7  
3.5  
18.7 0.03  
1.05 0.05  
4.15 0.05  
3.55  
4.15  
5.8  
6.95  
CONTACT No.1  
0.6 P=1.5  
13.5  
0.3  
1
0.1  
1 0.1  
P=1.5 0.05  
13.5 0.05  
5.8 0.05  
24.5  
Part No.  
CL No.  
CB1D-10S-1.5H  
CL689-0021-5  
Ø1.2  
4.15  
18.7  
C20  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
Push Insert-Push Eject  
Normal type  
30.4  
BPCB mounting pattern  
26.8  
(5.525)  
Memory stick card outline  
(3.25)  
2.4 0.1  
26.8 0.1  
2.4 0.1  
Part No.  
CL No.  
0.9 0.05  
P=1.5 0.03  
CB1EB-10S-1.5H-PEJC2  
CL689-0026-9  
9.3 0.05  
CONTACT No.1  
(3.5)  
0.6  
P=1.5  
13.5  
9.3  
With "U" cut-out  
30.4  
26.8  
BPCB mounting pattern  
13.4  
(5.525)  
8.85  
3.85  
(3.25)  
Memory stick  
card outline  
2.4 0.1  
2.4 0.1  
26.8 0.1  
Part No.  
CL No.  
CB1EBG-10S-1.5H-PEJC2  
CL689-0034-7  
0.9 0.05  
P=1.5 0.03  
9.3 0.05  
CONTACT No.1  
0.6  
P=1.5  
13.5  
3.5  
9.3  
With square window  
29.4  
26.8  
BPCB mounting pattern  
8.1  
8.3  
(5.525)  
Memory stick  
card outline  
3.85  
(3.25)  
1.9 0.1  
1.9 0.1  
26.8 0.1  
Part No.  
CL No.  
0.9 0.05  
P=1.5 0.03  
CB1EBH-10S-1.5H-PEJC2  
CL689-0035-0  
9.3 0.05  
CONTACT No.1  
0.6  
3.5  
P=1.5  
13.5  
9.3  
C21  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
Left Ejection  
23.1  
21.8  
4.45  
3.65  
Memory stick card outline  
8.75  
16.45  
0.1  
4.05  
Part No.  
CL No.  
CB1C-10S-1.5H-EJL(56) CL689-0006-1-56  
BPCB mounting pattern  
10.5  
Front edge of the printed  
circuit board  
10.5 0.03  
2
0.6  
P=1.5  
13.5  
29.9  
4.55  
CONTACT No.1  
0.9 0.1  
P= 1.5 0.05  
13.5 0.05  
3.2 0.1  
4.55 0.05  
Right Ejection  
23  
21.8  
Memory stick card outline  
9.25  
17.35  
4.4  
4.05  
3.65  
Part No.  
CL No.  
CB1C-10S-1.5H-EJR(59) CL689-0007-4-59  
10.5  
BPCB mounting pattern  
Front edge of the printed  
circuit board  
2
0.6  
P=1.5  
13.5  
31.2  
4.55  
10.5 0.03  
CONTACT No.1  
0.9 0.1  
P=1.5 0.05  
13.5 0.05  
3.2 0.1  
4.55 0.05  
C22  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
With flange, for screw attachment  
33.45  
BPCB mounting pattern  
16.5  
13.5  
P=1.5  
30.05 0.05  
4.725  
1.7  
30.05  
26.3  
4.725 0.05  
16.5 0.05  
13.5 0.05  
P=1.5 0.05  
5.25  
0.6  
CONTACT No.1  
0.9 0.05  
2.75 0.1  
Part No.  
CL No.  
CB1A-10S-1.5H(57)  
CL689-0001-8-57  
2
5.3  
19.25  
3.8 0.1  
Ø2  
Without flange  
16.5  
13.5  
BPCB mounting pattern  
P=1.5  
16.5 0.05  
13.5 0.05  
P=1.5 0.05  
26.3  
0.6  
5.25  
CONTACT No.1  
0.9 0.05  
2.75 0.1  
Part No.  
CL No.  
CL689-0002-0-57  
CB1AA-10S-1.5H(57)  
2
5.3  
3.8 0.1  
26.7  
19.25  
Ø2  
BMemory Stick card insertion direction  
B
Memory Stick fully inserted dimensions  
4.4  
21.45  
1.35  
2.8  
C23  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
Packaging specification (Tray packaging)  
Part Number: CB1G-10S-1.5H-PEJC2(1 tray: 40 pieces)  
Part Number: CB1F-10S-1.5H-TEJL-PA(1 tray: 20 pieces)  
0
0
330-1  
330-1  
320 0.5  
320 0.5  
195 0.3  
43 0.2  
252 0.3  
P=36 0.2  
100 0.2  
P=65 0.2  
A
A
A
40PICS  
PS  
A
Part Number: CB1D-10S-1.5H(1 tray: 50 pieces)  
Part Number: CB1EB*-10S-1.5H-PEJC2(1 tray: 25 pieces)  
0
330 -1  
0
330-1  
320 0.5  
320 0.5  
A
32.25 0.2  
255.5 0.3  
P=36.5 0.2  
220 0.3  
A
55 0.2  
P=55 0.2  
B
B
Part Number: CB1C-10S-1.5H-EJL(56)(1 tray: 20 pieces)  
Part Number: CB1C-10S-1.5H-EJR(59)(1 tray: 20 pieces)  
330-01  
320 0.5  
253.2 0.3  
330-01  
320 0.5  
222 0.3  
B
33.4 0.2  
A
P=63.3 0.2  
P=74 0.2  
55 0.2  
B
A
CB1C(L1)  
2 0 P I C S  
Part Number: CB1A*-10S-1.5H(57)(1 tray: 50 pieces)  
0
330 -1  
320 0.5  
276.5 0.3  
21.75 0.2  
P=39.5 0.2  
C
C
C24  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
BUsage Precautions  
1.Care should be taken to correctly insert/withdraw the Memory Stick® card. Following correct insertion/withdrawal procedures  
will prevent device or connector damage.  
When handling the CB1C series connectors, hold it in the areas indicated by the arrows, as illustrated below.  
CB1A Series  
CB1C Series  
Contacts  
Recommended  
holding area  
Recommended  
holding area  
Contacts, metal hold-down and  
ejection components areas  
Metal hold-down  
2.Follow the recommended insertion angles, as illustrated below.  
<
>
Memory Stick Allowable Insertion Angles  
CB1A Series  
CB1C Series  
Outline of the Memory  
Stick card  
Outline of the Memory  
Stick card  
Initial insertion  
(15 mm max.)  
Complete insertion  
(from 15 mm to full insertion)  
C25  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
3.When inserting or withdrawing cards from the CB1C Series, the side contacts on both sides will protrude outward  
by 0.6 mm. Care should be taken that they will not be restricted or touch other components.  
side contact  
(0.6)  
4. Application of an excessive external force to the push rod may prevent the ejection or insertion of the card.  
Do not apply any load in a direction other than the push direction.  
Do not twist or bend !  
Do not pull !  
Push direction  
Push rod  
C26  
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.  
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.  
Recommended Temperature Profile  
300ç  
IR Reflow Conditions  
Preheating : 150ç 30 to 90 sec.  
240ç max.  
220ç  
Soldering : 235 5ç 10 sec. max.  
220ç min. 10 to 20 sec.  
200ç  
150ç  
100ç  
Soldering  
Preheating  
0ç  
0S  
50S  
100S  
150S  
200S  
<
>
Recommended Conditions  
Reflow system : IR reflow  
Solder  
: Paste type 63 Sn/37 Pb (Flux content 9 wt%)  
: Glass epoxy 60mm x 100mm x 1.6 mm  
Test board  
Metal mask thickness  
Recommended temperature.  
The temperature may be slightly changed according to the solder paste type and volume used.  
: 0.15 mm  
C27  

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