CB1F-10S-1.5H-TEJL-PA [HRS]

Memory Stick Connectors; 记忆棒连接器


型号：	CB1F-10S-1.5H-TEJL-PA
厂家：	HRS
描述：	Memory Stick Connectors 记忆棒连接器连接器
文件：	总10页 (文件大小：816K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NEW

Memory Stick Connectors

CB1 Series

Card Push Insert/Push Eject

ꢀꢀCard ejection distance of 10 mm

ꢀꢀMounting height of 3.5 mm

ꢀꢀMounting area: Smaller design is 78% of former

size

ꢀOutline

Button Touch Ejection

Receptacle connectors for use with the new generation of

digital media devices requiring “Memory Stick ” type of

consumer removable memory card.

Several variations are available: Miniature, Low Profile and

with or without ejection mechanism.

ꢀFeatures

1. Indication of Incorrect Card Insertion

The connector will not allow the card to be complete

inserted from the wrong end or reversed.

The card will stop about 7mm before complete insertion

position, visually indicating incorrect insertion.

ꢀꢀCard ejection with tactile button operation

ꢀꢀCard ejection distance of 10 mm

ꢀꢀEquipped with card ejection switch

2. Protection of the Contacts

Incorrect insertion of the card will not damage the

contacts. The card can be easily withdrawn and re-

inserted correctly.

3. Excellent Card Handling

The type that is equipped with an ejection mechanism

provides a long ejection of the card which offers excellent

card handling qualities.

Without Card Ejection

*Memory Stick is a registered trademark of the Sony Corporation.

ꢀꢀMiniaturized, low profile design

ꢀꢀImproved installation to the equipment is permitted

using (M1.7) tapping screws

ꢀꢀCan be equipped with an ejection mechanism

depending on the design of the equipment side

portion

Note: Please position the card ejection button at the side of the equipment.

2003.12

ꢀProduct Specifications

Operating humidity range

Relative humidity 96% max.

(No condensation)

Operating temperature range -20 to +85

Current rating 0.5A

ç(Note)

Rating

-40 to +85

Voltage rating 125V AC

Storage temperature range

Item

Specification

Conditions

1. Insulation resistance 1000 M ohms min.

2. Withstanding voltage No flashover or insulation breakdown

500 V DC

500 V AC / one minute

100mA DC

3. Contact resistance

4. Vibration

100 m ohms max.

No electrical discontinuity of 1 µs or more

Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis

96 hours at temperature of 40ç 2ç and humidity

of 90% to 95%

Contact resistance: 40 m ohms max. from initial value

Insulation resistance: 100 M ohms min.

5. Humidity

Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç

Duration: 30/5/30/5(Minutes)

5 cycles

Contact resistance: 40 m ohms max. from initial value

Insulation resistance: 100 M ohms min.

6. Temperature cycle

7. Durability

(mating/unmating)

Contact resistance: 40m ohms max. from initial value 12000 cycles at 400 to 600 cycles per hour

8. Resistance to

soldering heat

No deformation of any component.

No affect on contacts

Reflow: At the recommended temperature profile

Manual soldering: 300

ç for 3 seconds

Note :Includes temperature rise caused by current flow.

ꢀMaterials

Part

Material

Finish

Remarks

Heat resistant glass reinforced

therm oplastic compound

Insulator

Color: Black

UL94V-0

----------

Contact area: Gold plated

Termination area: Tin-Iead plated or

tinned copper plated

Contacts

Phosphor bronze

Contact area: Nickel plating

CB1E,CB1F,CB1G Series is

without the termination area.

Termination area:

Tin-Iead plated or

Metal hold down

Cover

Phosphor bronze or stainless steel

Stainless steel or cupper alloy

tinned copper plated

The CB1E Series has termination

area with tin-lead plated.

----------

Stainless steel

Heat resistant glass reinforced

therm oplastic compound

Eject mechanism components

----------

UL94V-0

ꢀOrdering information

CB 1 E - 10 S - 1.5 H - PEJC -

Series name

Series No.

: CB

: 1

: C

6 Contact pitch : 1.5 mm

7 Surface mount

8 Eject mechanism codes:

3 Ejector type

PEJC : Card Push insert/Push eject

With eject mechanism

Without eject mechanism

EJL : Left button eject

EJR : Right button eject

}

9 Suffix

}

4 Number of contacts : 10

5 Connector type S : Receptacle

ꢀLow Profile, Push Insert-Push Eject

BPCB mounting pattern

29.4

Memory stick card outline

26.8

(5.525)

3.85

(3.25)

1.9 0.1

26.8 0.1

1.9 0.1

Part No.

CL No.

CB1G-10S-1.5H-PEJC2

CL689-0037-5

0.9 0.05

P=1.5 0.03

9.3 0.05

3.5

0.6

P=1.5

13.5

CONTACT No.1

9.3

ꢀButton Touch Eject

27.75

22.75

11.975 (5.525)

BPCB mounting pattern

Memory stick card outline

3.85

(3.25)

32.5 00.3

16.5 0.03 11.15 0.03

1.5 0.03

Part No.

CL No.

CL689-0028-4

CB1F-10S-1.5H-TEJL-PA

0.6 0.05

0.9 0.05

P=1.5 0.05

13.5 0.05

0.05

3.5

0.6

CONTACT No.1

4.2 0.05

0.4

4.2

P=1.5

13.5

32.5

11.15

Ø1.2

1.5

16.5

ꢀWithout Card Ejection

BPCB mounting pattern

24.7

3.5

18.7 0.03

1.05 0.05

4.15 0.05

3.55

4.15

5.8

6.95

CONTACT No.1

0.6 P=1.5

13.5

0.3

0.1

1 0.1

P=1.5 0.05

13.5 0.05

5.8 0.05

24.5

Part No.

CL No.

CB1D-10S-1.5H

CL689-0021-5

Ø1.2

4.15

18.7

ꢀPush Insert-Push Eject

ꢀꢀNormal type

30.4

26.8

BPCB mounting pattern

(5.525)

Memory stick card outline

(3.25)

2.4 0.1

26.8 0.1

2.4 0.1

Part No.

CL No.

0.9 0.05

P=1.5 0.03

CB1EB-10S-1.5H-PEJC2

CL689-0026-9

9.3 0.05

CONTACT No.1

(3.5)

0.6

P=1.5

13.5

9.3

ꢀꢀWith "U" cut-out

30.4

26.8

BPCB mounting pattern

13.4

(5.525)

8.85

3.85

(3.25)

Memory stick

card outline

2.4 0.1

26.8 0.1

Part No.

CL No.

CB1EBG-10S-1.5H-PEJC2

CL689-0034-7

0.9 0.05

P=1.5 0.03

9.3 0.05

CONTACT No.1

0.6

P=1.5

13.5

3.5

9.3

ꢀꢀWith square window

29.4

26.8

BPCB mounting pattern

8.1

8.3

(5.525)

Memory stick

card outline

3.85

(3.25)

1.9 0.1

26.8 0.1

Part No.

CL No.

0.9 0.05

P=1.5 0.03

CB1EBH-10S-1.5H-PEJC2

CL689-0035-0

9.3 0.05

CONTACT No.1

0.6

3.5

P=1.5

13.5

9.3

ꢀLeft Ejection

23.1

21.8

4.45

3.65

Memory stick card outline

8.75

16.45

0.1

4.05

Part No.

CL No.

CB1C-10S-1.5H-EJL(56) CL689-0006-1-56

BPCB mounting pattern

10.5

Front edge of the printed

circuit board

10.5 0.03

0.6

P=1.5

13.5

29.9

4.55

CONTACT No.1

0.9 0.1

P= 1.5 0.05

13.5 0.05

3.2 0.1

4.55 0.05

ꢀRight Ejection

21.8

Memory stick card outline

9.25

17.35

4.4

4.05

3.65

Part No.

CL No.

CB1C-10S-1.5H-EJR(59) CL689-0007-4-59

10.5

BPCB mounting pattern

Front edge of the printed

circuit board

0.6

P=1.5

13.5

31.2

4.55

10.5 0.03

CONTACT No.1

0.9 0.1

P=1.5 0.05

13.5 0.05

3.2 0.1

4.55 0.05

ꢀWith flange, for screw attachment

33.45

16.5

13.5

P=1.5

BPCB mounting pattern

30.05 0.05

4.725

1.7

30.05

4.725 0.05

16.5 0.05

13.5 0.05

P=1.5 0.05

26.3

5.25

0.6

CONTACT No.1

0.9 0.05

2.75 0.1

Part No.

CL No.

CB1A-10S-1.5H(57)

CL689-0001-8-57

5.3

19.25

3.8 0.1

Ø2

ꢀWithout flange

16.5

13.5

BPCB mounting pattern

P=1.5

16.5 0.05

13.5 0.05

P=1.5 0.05

26.3

0.6

5.25

CONTACT No.1

0.9 0.05

2.75 0.1

Part No.

CL No.

CL689-0002-0-57

CB1AA-10S-1.5H(57)

5.3

3.8 0.1

26.7

19.25

Ø2

BMemory Stick card insertion direction

Memory Stick fully inserted dimensions

4.4

21.45

1.35

2.8

ꢀPackaging specification (Tray packaging)

ꢀꢀPart Number: CB1G-10S-1.5H-PEJC2(1 tray: 40 pieces)

ꢀꢀPart Number: CB1F-10S-1.5H-TEJL-PA(1 tray: 20 pieces)

330_-1

320 0.5

195 0.3

43 0.2

252 0.3

P=36 0.2

100 0.2

P=65 0.2

40PICS

ꢀꢀPart Number: CB1D-10S-1.5H(1 tray: 50 pieces)

ꢀꢀPart Number: CB1EB*-10S-1.5H-PEJC2(1 tray: 25 pieces)

330 _-1

330_-1

320 0.5

32.25 0.2

255.5 0.3

P=36.5 0.2

220 0.3

55 0.2

P=55 0.2

ꢀꢀPart Number: CB1C-10S-1.5H-EJL(56)(1 tray: 20 pieces)

ꢀꢀPart Number: CB1C-10S-1.5H-EJR(59)(1 tray: 20 pieces)

330_-⁰₁

320 0.5

253.2 0.3

330_-⁰₁

320 0.5

222 0.3

33.4 0.2

P=63.3 0.2

P=74 0.2

55 0.2

CB1C(L1)

2 0 P I C S

ꢀꢀPart Number: CB1A*-10S-1.5H(57)(1 tray: 50 pieces)

330 _-1

320 0.5

276.5 0.3

21.75 0.2

P=39.5 0.2

BUsage Precautions

1.Care should be taken to correctly insert/withdraw the Memory Stick^®card. Following correct insertion/withdrawal procedures

will prevent device or connector damage.

When handling the CB1C series connectors, hold it in the areas indicated by the arrows, as illustrated below.

CB1A Series

CB1C Series

Contacts

Recommended

holding area

Recommended

holding area

Contacts, metal hold-down and

ejection components areas

Metal hold-down

2.Follow the recommended insertion angles, as illustrated below.

Memory Stick Allowable Insertion Angles

CB1A Series

CB1C Series

Outline of the Memory

Stick card

Outline of the Memory

Stick card

Initial insertion

(15 mm max.)

Complete insertion

(from 15 mm to full insertion)

3.When inserting or withdrawing cards from the CB1C Series, the side contacts on both sides will protrude outward

by 0.6 mm. Care should be taken that they will not be restricted or touch other components.

side contact

(0.6)

4. Application of an excessive external force to the push rod may prevent the ejection or insertion of the card.

Do not apply any load in a direction other than the push direction.

Do not twist or bend !

Do not pull !

Push direction

Push rod

ꢀRecommended Temperature Profile

300ç

IR Reflow Conditions

Preheating : 150ç 30 to 90 sec.

Soldering : 235 5ç 10 sec. max.

220ç min. 10 to 20 sec.

240ç max.

220ç

200ç

Soldering

150ç

Preheating

100ç

0ç

50S

100S

150S

200S

Recommended Conditions

Reflow system : IR reflow

Solder

: Paste type 63 Sn/37 Pb (Flux content 9 wt%)

: Glass epoxy 60mm x 100mm x 1.6 mm

Test board

Metal mask thickness

Recommended temperature.

The temperature may be slightly changed according to the solder paste type and volume used.

: 0.15 mm

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