HI-3183PJT [HOLTIC]
ARINC 429 DIFFERENTIAL LINE DRIVER; ARINC- 429差分线路驱动器
| 型号： | HI-3183PJT |
| 厂家： | 
HOLT INTEGRATED CIRCUITS |
| 描述： | ARINC 429 DIFFERENTIAL LINE DRIVER |
| 文件： | 总10页 (文件大小：430K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HI-3182, HI-3183, HI-3184, HI-3185
HI-3186, HI-3187, HI-3188
March 2001
GENERAL DESCRIPTION
PIN CONFIGURATION (Top View)
The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and
HI-3188 bus interface products are silicon gate CMOS devices
designed as a line driver in accordance with the ARINC 429 bus
specifications. In addition to being functional upgrades of Holt's
HI-8382 & HI-8383 products, they are also alternate sources for
the HS-3182 ( Intersil/Harris), the RM3182 (Fairchild /Raytheon)
andavarietyof similar DEI/DDC linedriver products.
VREF
1
2
3
4
5
6
7
14 V1
GND (See Note * )
13 CLOCK
12 DATA (B)
11 C B
SYNC
DATA (A)
CA
10 BOUT
Inputs are provided for clocking and synchronization. These
signals are AND'd with the DATA inputs to enhance system
performance and allow the HI-318X series of products to be
used in a variety of applications. Both logic and synchronization
inputs feature built-in 2,000V minimum ESD input protection as
wellasTTL andCMOS compatibility.
AOUT
9
8
+V
-V
GND
HI-3184PS, HI-3185PS, HI-3186PS
& HI-3187PS
The differential outputs of the HI-318X series of products are
independently programmable to either the high speed or low
speedARINC 429output riseandfall timespecificationsthrough
the use of two external capacitors. The output voltage swing is
also adjustable by the application of an external voltage to the
VREF input. Products with 0, 13 or 37.5 ohm resistors in series
with each ARINC output are available. In addition, the HI-3182,
HI-3184 and HI-3187 products also have a fuse in series with
each output.
14 - PIN PLASTIC SMALL OUTLINE (ESOIC) **
Notes: * Pin 2 may be left floating
** Thermally Enhanced SOIC Package
(See Page 5 for additional package pin configurations)
FUNCTION
The HI-318X series of line drivers are intended for use where
logic signals must be converted to ARINC 429 levels such as
when using an ASIC, the HI-8282 ARINC 429 Serial Transmit-
ter/Dual Receiver, theHI-6010 ARINC 429Transmitter/Receiver
or the HI-8783 ARINC Interface Device. Holt products are
readily available for both industrial and military applications.
Please contact the Holt Sales Department for additional
information.
+
ARINC 429 DIFFERENTIAL LINE DRIVER
FEATURES
! Low power CMOS
! TTL and CMOS compatible inputs
! Programmable output voltage swing
! Adjustable ARINC rise and fall times
TRUTH TABLE
SYNC CLOCK DATA(A) DATA(B) AOUT BOUT COMMENTS
X
L
L
X
X
L
X
X
L
0V
0V
0V
0V
0V
0V
NULL
NULL
NULL
LOW
! Plastic 14 & 16-pin thermally enhanced SOIC
packages available
X
H
H
H
H
! Pin-for-Pin alternative for DEI/DDC/Intersil/Fairchild
H
H
H
H
applications
L
H
L
-VREF +VREF
+VREF -VREF
! Operates at data rates up to 100 Kbits
! Overvoltage protection
H
H
HIGH
NULL
H
0V
0V
! Industrial and Military temperature ranges
HOLT INTEGRATED CIRCUITS
1
(DS3182 Rev. B )
03/01
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
FUNCTIONAL DESCRIPTION
The SYNC and CLOCK inputs establish data synchronization
utilizing two AND gates, one for each data input. Each logic
input, including the power enable (STROBE) input, are
TTL/CMOS compatible.
The ARINC outputs can be put in a tri-state mode by applying
a logic high to the STROBE input pin. If this feature is not
being used, the pin should be tied to ground. The STROBE
function is not available in the 14 & 16-pin SOIC package
configurations where the pin is internally connected to
ground.
Figure 1 illustrates a typical ARINC 429 bus application.
Three power supplies are necessary to operate the HI-3182;
typically +15V, -15V and +5V. The chip also works with ±12V
supplies. The +5V supply can also provide a reference
voltage that determines the output voltage swing. The
differential output voltage swing will equal 2VREF. If a value of
VREF other than +5V is needed, a separate +5V power supply
is requ iredforpinV1 .
The ARINC outputs of the HI-3182, HI-3184 and HI-3187 are
protected by internal fuses capable of sinking between 800 -
900 mA forshortperiods oftime(125ms).
+5V
+15V
With the DATA (A) input at a logic high and DATA (B) input at a
logic low, AOUT will switch to the +VREF rail and BOUT will
switch to the -VREF rail (ARINC HIGH state). With both data
input signals at a logic low state, the outputs will both switch to
0V (ARINC NULLstate).
V
REF
OUT
V
1
SYNC
DATA (A)
CLOCK
+V
-V
INPUTS
TO ARINC BUS
B
The driver output impedance, ROUT, is nominally 75, 26 or 0
ohms depending onthe option chosen. The rise andfall times
of the outputs can be calibrated through the selection of two
external capacitor values that a re connected to the CA and C B
input pins. Typical values for high-speed operation
(100KBPS) are CA = CB = 75pF and for low-speed operati on
(12.5to 14KBPS)CA =CB =500pF.
STROBE
GND
DATA (B)
C
C
The CA and CB pins swing between +5V and ground allowing
the switching of capacitor values with an external single-
supply analog switch.
-15V
Figure 1. ARINC 429 BUS APPLICATION
Shorted on
HI-3186, HI-3187, HI-3188
+V
C
REF
A
DATA (A)
CLOCK
SYNC
LEVEL SHIFTER
AND SLOPE
CONTROL (A)
13 W
24.5 W
FA
OUTPUT
DRIVER (A)
C L
R L
LEVEL SHIFTER
AND SLOPE
24.5W
13 W
FB
DATA (B)
CONTROL (B)
OUTPUT
DRIVER (B)
CURRENT
REGULATOR
Shorted on
HI-3183, HI-3186
HI-3187, HI-3188
Shorted on
HI-3183, HI-3185
HI-3186, HI-3188
V1
STROBE
B
-V
GND
C
B
OUT
Figure 2. FUNCTIONAL BLOCK DIAGRAM
HOLT INTEGRATED CIRCUITS
2
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
SYMBOL
VREF
FUNCTION
POWER
INPUT
DESCRIPTION
Reference voltage used to determine the output voltage swing
STROBE
SYNC
DATA (A)
CA
A logic high tri-states the ARINC outputs. Not available in the 14-pin SOIC package (tied to GND internally).
INPUT
Synchronizes data inputs
Data input terminal A
Connection for DATA (A) slew-rate capacitor
ARINC output terminal A
-12V to -15V
INPUT
INPUT
AOUT
OUTPUT
POWER
POWER
POWER
OUTPUT
INPUT
-V
GND
0.0V
+V
+12V to +15V
BOUT
ARINC output terminal B
Connection for DATA (B) slew-rate capacitor
Data input terminal B
Synchronizes data inputs
+5V ±5%
CB
DATA (B)
CLOCK
V1
INPUT
INPUT
POWER
All Voltages referenced to GND, TA = Operating Temperature Range (unless otherwise specified)
PARAMETER
Differential Voltage
Supply Voltage
SYMBOL
CONDITIONS
OPERATING RANGE
MAXIMUM
UNIT
VDIF
Voltage between +V and -V terminals
40
V
+V
-V
V1
+10.8 to +16.5
-10.8 to -16.5
+5 ±10%
V
V
V
+7
Voltage Reference
VREF
For ARINC 429
For Applications other than ARINC
+5 ±5%
0 to 6
6
6
V
V
Input Voltage Range
VIN
> GND -0.3
< V1 +0.3
V
V
Output Short-Circuit Duration
Output Overvoltage Protection
Operating Temperature Range
See Note: 1
See Note: 2
TA
Hi-temp & Military
Industrial
-55 to +125
-40 to +85
°C
°C
Storage Temperature Range
TSTG
Ceramic & Plastic
-65 to +150
°C
Lead Temperature
Soldering, 10 seconds
+275
+175
°C
°C
Junction Temperature
TJ
Note 1. Heatsinking may be required for Output Short Circuit at +125°C and for 100KBPS at +125°C.
Note 2. The fuses used for Output Overvoltage Protection may be blown by the presence of a voltage at either output that is greater
than ±12.0V with respect to GND. (HI-3182, 3184 & 3187 only)
NOTE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These a re stress ratings
only. Functional operation of the device at these or any other conditions above those indicated in the operational se ctions of the specifications
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
HOLT INTEGRATED CIRCUITS
3
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
+V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
Supply Current +V (Operating)
SYMBOL
CONDITION
(0 - 100KBPS)
MIN TYP MAX UNITS
ICCOP (+V)
ICCOP (-V)
ICCOP (V1 )
No Load
No Load
No Load
+16
500
150
-80
1.0
mA
mA
µA
mA
mA
mA
mA
mA
µA
µA
V
Supply Current -V (Operating)
Supply Current V1 (Operating)
Supply Current VREF (Operating)
Supply Current +V (During Short Circuit Test)
Supply Current -V (During Short Circuit Test)
Output Short Circuit Current (Output High)
Output Short Circuit Current (Output Low)
Input Current (Input High)
(0 - 100KBPS)
(0 - 100KBPS)
-16
-1.0
-150
+80
ICCOP (VREF) No Load, VREF = 5V (0 - 100KBPS)
ISC (+V)
ISC (-V)
IOHSC
IOLSC
IIH
Short to Ground (See Note: 1)
Short to Ground (See Note: 1)
Short to Ground VMIN =0 (See Note: 2)
Short to Ground VMIN =0 (See Note: 2)
Input Current (Input Low)
IIL
-1.0
2.0
Input Voltage High
VIH
Input Voltage Low
VIL
0.5
V
Output Voltage High (Output to Ground)
VOH
No Load
No Load
(0 -100KBPS)
(0 -100KBPS)
(0-100KBPS)
+VREF
-.25
+VREF
+.25
V
Output Voltage Low (Output to Ground)
VOL
-VREF
-.25
-VREF
+.25
V
Output Voltage Null
Input Capacitance
VNULL
C IN
No Load
-250
+250
mV
pF
See Note 1
15
Note 1. Not tested, but characterized at initial device design and after major process and/or design change which affects this parameter.
Note 2. Interchangeability of force and sense is acceptable.
+V = +15V, -V = -15V, V1 = VREF = +5.0V, TA = Operating Temperature Range (unless otherwise specified).
PARAMETER
Rise Time (AOUT, BOUT)
SYMBOL
tR
CONDITION
MIN TYP MAX UNITS
CA = C B = 75pF
See Figure 3.
See Figure 3.
See Figure 3.
See Figure 3.
1.0
1.0
2.0
2.0
3.0
3.0
µs
µs
µs
µs
Fall Time (AOUT, BOUT)
tF
CA = C B = 75pF
CA = C B = 75pF
CA = C B = 75pF
Propagtion Delay Input to Output
Propagtion Delay Input to Output
tPLH
tPHL
2.0V
50%
0.5V
2.0V
0.5V
DATA (A) 0V
50%
DATA (B) 0V
VREF
ADJUST
BY C A
+4.75V to +5.25V
AOUT 0V
ADJUST
BY C A
-VREF
+VREF
-4.75V to -5.25V
+4.75V to +5.25V
ADJUST
BY C B
tPHL
50%
tPLH
BOUT 0V
ADJUST
BY C B
50%
-VREF
-4.75V to -5.25V
+9.5V to +10.5V
HIGH
2VREF
tR
NULL
LOW
DIFFERENTIAL
OUTPUT 0V
(AOUT - BOUT)
-9.5V to -10.5V
-2VREF
tF
NOTE: OUTPUTS UNLOADED
Figure 3. SWITCHING WAVEFORMS
HOLT INTEGRATED CIRCUITS
4
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
ADDITIONAL PIN CONFIGURATIONS (See page 1 for 14-Pin Small Outline SOIC)
HI-3182PS, HI-3183PS, HI-3188PS
VREF - 1
GND (See Note * ) - 2
SYNC - 3
16 - V1
4
3 2 1 28 27 26
15 - N/C
14 - CLOCK
13 - DATA(B)
12 - C B
HI-3182PJ 245
5
6
N/C
DATA (A)
N/C
CLOCK
N/C
DATA (B)
C B
N/C
N/C
16 - PIN
PLASTIC
SMALL
OUTLINE
(ESOIC)**
HI-3183PJ 23
7
DATA(A) - 4
CA - 5
22
N/C
C A
N/C
N/C
8
28 - PIN
PLASTIC
PLCC
21
9
AOUT - 6
11 - BOUT
10 - N/C
9 - +V
20
10
11
-V - 7
19
N/C
GND - 8
12 13 14 15 16 17 18
Notes: * Pin 2 may be left floating
** Thermally Enhanced SOIC package
4
3
2
1 28 27 26
29 28 27 26 25 24 23 22 21
N/C
DATA (A)
N/C
5
25 CLOCK
24 N/C
23 DATA (B)
22 C B
CLOCK 30
V1 31
20
19
18
17
16
15
14
N/C
N/C
+V
GND
N/C
-V
HI-3182CL
HI-3183CL
6
7
8
9
HI-3182CR
HI-3183CR
N/C 32
VREF
STROBE
SYNC
1
2
3
4
N/C
28 - PIN
CERAMIC
LCC
32 - PIN
CERQUAD
C A
21
N/C
N/C 10
N/C 11
20
19
N/C
N/C
N/C
N/C
5
6
7 8 9 10 11 12 13
12 13 14 15 16 17 18
VREF 1
STROBE 2
SYNC 3
DATA(A) 4
CA 5
16 V1
15 N/C
HI-3182CD
HI-3183CD
14 CLOCK
13 DATA(B)
12 CB
16 - PIN
CERAMIC
DIP
AOUT 6
-V 7
11 BOUT
10 N/C
GND 8
9 +V
HOLT INTEGRATED CIRCUITS
5
HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187, HI-3188
ORDERING INFORMATION
PART
NUMBER
PACKAGE
DESCRIPTION
TEMPERATURE
RANGE
OUTPUT SERIES
RESISTANCE FUSE
BURN
IN
LEAD
FINISH
FLOW
HI-3182CDI 16 PIN CERAMIC SIDE BRAZED DIP
HI-3182CDT 16 PIN CERAMIC SIDE BRAZED DIP
HI-3182CDM 16 PIN CERAMIC SIDE BRAZED DIP
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
37.5
37.5
37.5
YES
YES
YES
I
NO
NO
GOLD
GOLD
T
M
YES SOLDER
HI-3182CLI 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C
HI-3182CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C
HI-3182CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C
37.5
37.5
37.5
YES
YES
YES
I
NO
NO
GOLD
GOLD
T
M
YES SOLDER
HI-3182CRI 32 PIN J-LEAD CERQUAD
HI-3182CRT 32 PIN J-LEAD CERQUAD
-40°C TO +85°C
-55°C TO +125°C
37.5
37.5
YES
YES
I
NO SOLDER
NO SOLDER
T
HI-3182PJI 28 PIN PLASTIC J -LEAD PLCC
HI-3182PJT 28 PIN PLASTIC J -LEAD PLCC
-40°C TO +85°C
-55°C TO +125°C
37.5
37.5
YES
YES
I
NO SOLDER
NO SOLDER
T
HI-3182PSI 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)
HI-3182PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
37.5
37.5
YES
YES
I
NO SOLDER
NO SOLDER
T
HI-3183CDI 16 PIN CERAMIC SIDE BRAZED DIP
HI-3183CDT 16 PIN CERAMIC SIDE BRAZED DIP
HI-3183CDM 16 PIN CERAMIC SIDE BRAZED DIP
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
13
13
13
NO
NO
NO
I
NO
NO
GOLD
GOLD
T
M
YES SOLDER
HI-3183CLI 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C
HI-3183CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C
HI-3183CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C
13
13
13
NO
NO
NO
I
NO
NO
GOLD
GOLD
T
M
YES SOLDER
HI-3183CRI 32 PIN J-LEAD CERQUAD
HI-3183CRT 32 PIN J-LEAD CERQUAD
-40°C TO +85°C
-55°C TO +125°C
13
13
NO
NO
I
NO SOLDER
NO SOLDER
T
HI-3183PJI 28 PIN PLASTIC J -LEAD PLCC
HI-3183PJT 28 PIN PLASTIC J -LEAD PLCC
-40°C TO +85°C
-55°C TO +125°C
13
13
NO
NO
I
NO SOLDER
NO SOLDER
T
HI-3183PSI 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)
HI-3183PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
13
13
NO
NO
I
NO SOLDER
NO SOLDER
T
HI-3184PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
HI-3184PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
37.5
37.5
YES
YES
I
NO SOLDER
NO SOLDER
T
HI-3185PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
HI-3185PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
37.5
37.5
NO
NO
I
NO SOLDER
NO SOLDER
T
HI-3186PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
HI-3186PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
0
0
NO
NO
I
NO SOLDER
NO SOLDER
T
HI-3187PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
HI-3187PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
0
0
YES
YES
I
NO SOLDER
NO SOLDER
T
HI-3188PSI 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
HI-3188PST 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC)
-40°C TO +85°C
-55°C TO +125°C
0
0
NO
NO
I
NO SOLDER
NO SOLDER
T
Legend: ESOIC - Thermally Enhanced Small Outline Package (SOIC w/built-in heat sink)
NB
WB
- Narrow Body
- Wide Body
HOLT INTEGRATED CIRCUITS
6
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
14-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
Package Type: 14HNE
.00865 ± .00115
(.220 ± .029)
.280 TYP.
(7.112) TYP.
.3406 ± .0039
(8.651 ± .099)
.110 TYP.
(2.794) TYP.
Bottom
View
.236 ± .008
(6.00 ± .20)
.1535 ± .0035
(3.899 ± .089)
Top View
Heat sink stud
on bottom of
package
Detail A
.0165 ± .0035
(.419 ± ..089)
.061 ± .007
(1.549 ± .178)
0° to 8°
.0069 ± .0029
(.175 ± .074)
Detail A
.033 ± .017
(.838 ± .432)
.050 ± .010
(1.270 ± .254)
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
Package Type: 16HNE
.00865 ± .00115
(.220 ± .029)
.280 TYP.
(7.112) TYP.
.3898 ± .0039
(9.901 ± .099)
.110 TYP.
(2.794) TYP.
Bottom
View
.236 ± .008
(6.00 ± .20)
.1535 ± .0035
(3.899 ± .089)
Top View
Heat sink stud
on bottom of
package
Detail A
.0165 ± .0035
(.419 ± ..089)
.061 ± .007
(1.549 ± .178)
0° to 8°
.0069 ± .0029
(.175 ± .074)
Detail A
.033 ± .017
(.838 ± .432)
.050 ± .010
(1.270 ± .254)
HOLT INTEGRATED CIRCUITS
7
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB
(Wide Body, Thermally Enhanced)
Package Type: 16HWE
.0105 ± .0015
(.2667 ± .0381)
.240 ± .010
(6.096 ± .254)
.405 ± .008
(10.287 ± .203)
.4065 ± .0125
(10.325 ± .318)
.295 ± .004
(7.493 ± .102)
.190 ± .010
(4.826 ± .254)
Bottom
View
Top View
Heat sink stud
on bottom of
package
Detail A
.090 ± .010
(2.286 ± .254)
.0025 ± .0015
(.0635 ± .0381)
0° to 8°
.050 ± .010
(1.270 ± .254)
.0165 ± .0035
(.4191 ± .0889)
.033 ± .017
(.838 ± .432)
Detail A
16-PIN CERAMIC SIDE-BRAZED DIP
Package Type: 16C
.810 MAX
(20.574 MAX)
.295 ± .010
(7.493 ± .254)
.050 ± .005
(1.270 ± .127)
PIN 1
.200 MAX
(5.080 MAX)
.035 ± .010
(.889 ± .254)
BASE
PLANE
.010 ± .002
.125 MIN
(3.175 MIN )
(.254 ± .051)
SEATING
PLANE
.018 ± .002
.100 BSC
.300 ± .010
(.457 ± .051)
(2.540 BSC)
(7.620 ± .254)
HOLT INTEGRATED CIRCUITS
8
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
28-PIN PLASTIC PLCC
Package Type: 28J
PIN NO. 1 IDENT
PIN NO. 1
.045 x 45°
.045 x 45°
.050 ± .005
(1.27 ± .127)
.453 ± .003
(11.506 ± .076)
SQ.
.490 ± .005
(12.446 ± .127)
SQ.
.031 ± .005
(.787 ± .127)
.017 ± .004
(.432 ± .102)
SEE DETAIL
A
.009
.011
.015 ± .002
(.381 ± .051)
.173 ± .008
(4.394 ± .203)
.020 MIN
(.508 MIN )
.025
.045
DETAIL A
R
.410 ± .020
(10.414 ± .508)
28-PIN CERAMIC LEADLESS CHIP CARRIER
Package Type: 28S
.080 ± .020
(2.032 ± .508)
.020 INDEX
(.508 INDEX)
PIN 1
PIN 1
.050 ± .005
(1.270 ± .127)
.451 ± .009
(11.455 ± .229)
SQ.
.050 BSC
(1.270 BSC)
.008R ± .006
(.203R ± .152)
.025 ± .003
(.635 ± .076)
.040 x 45° 3PLS
(1.016 x 45° 3PLS)
HOLT INTEGRATED CIRCUITS
9
HI-318X PACKAGE DIMENSIONS
inches (millimeters)
32-PIN J-LEAD CERQUAD
Package Type: 32U
31
32
1
.450 ± .008
(11.430 ± .203)
.420 ± .012
.488 ± .008
(10.668 ± .305)
(12.395 ± .203)
2
.588 ± .008
(14.935 ± .203)
.550 ± .009
(13.970 ± .229)
.190 MAX.
(4.826) MAX.
.040 TYP.
(1.016) TYP.
.083 ± .009
(2.108 ± .229)
.019 ± .003
(.483 ± .076)
.050 TYP.
(1.270) TYP.
.520 ± .012
(13.208 ± .305)
HOLT INTEGRATED CIRCUITS
10
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