HZM27WATL [HITACHI]
暂无描述;
| 型号： | HZM27WATL |
| 厂家： | 
HITACHI SEMICONDUCTOR |
| 描述： | 暂无描述 瞬态抑制器 二极管 齐纳二极管 测试 光电二极管 |
| 文件： | 总5页 (文件大小：31K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HZM27FA
Silicon Epitaxial Planar Zener Diode for Surge Absorb
ADE-208-443A(Z)
Rev 1
September 1996
Features
•
•
HZM27FA has four devices, and can absorb external + and -surge.
MPAK Package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No.
Laser Mark
Package Code
HZM27FA
27A
MPAK-5
Outline
2
1
5
1 Cathode
2 Cathode
3 Cathode
4 Anode
4
3
5 Cathode
(Top View)
HZM27FA
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Value
200
Unit
mW
°C
*1
Power dissipation
Junction temperature
Storage temperature
Pd
Tj
150
Tstg
-55 to +150
°C
Note 1. Four device total, With P.C board.
Electrical Characteristics (Ta = 25°C) *1
Item
Symbol Min
Typ Max Unit Test Condition
Zener voltage
Reverse current
Capacitance
VZ
IR
25.10 — 28.90 V IZ = 2 mA, 40ms pulse
—
—
—
30
—
(27)*3
2
µA
VR = 21V
C
—
70
—
pF
Ω
VR = 0V, f = 1 MHz
IZ = 2 mA
Dynamic resistance r d
ESD-Capability
—
—
—
kV
C =150pF, R = 330 Ω, Both forward and
*2
reverse direction 10 pulse
Notes 1. Per one device.
2. Failure criterion ; IR>2 µA at VR = 21V.
3. Reference only.
2
HZM27FA
Main Characteristic
10-3
10-4
10-5
10-6
10-7
10-8
10-9
10-10
10-11
0
5
10
15
25
30
20
Zener Voltage Vz (V)
Fig.1 Zener current Vs. Zener voltage
250
200
1.0mm
Cu Foil
Printed circuit board
×
×
25 62 1.6t mm
Material:
150
100
Glass Epoxy Resin+Cu Foil
50
0
200
50
Ambient Temperature Ta (°C)
100
150
0
Fig.2 Power Dissipation Vs. Ambient Temperature
3
HZM27FA
Package Dimensions
Unit : mm
(0.95)
2
(0.95)
1
0.4±0.1
0.4±0.1
Laser Mark
0.16
0 to 0.15
27A
1 Cathode
5
4
3
2 Cathode
3 Cathode
4 Anode
0.4±0.1
0.4±0.1
1.9
2.9±0.2
5 Cathode
Hitachi Code
JEDEC Code
EIAJ Code
MPAK-5
—
—
Weight (g)
0.013
4
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
: http:semiconductor.hitachi.com/
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore)
Asia (Taiwan)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
Hitachi Europe GmbH
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Telex: 40815 HITEC HX
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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