HD74HC123ARP [HITACHI]

Monostable Multivibrator, HC/UH Series, 2-Func, CMOS, PDSO16, FP-16DN;


型号：	HD74HC123ARP
厂家：	HITACHI SEMICONDUCTOR
描述：	Monostable Multivibrator, HC/UH Series, 2-Func, CMOS, PDSO16, FP-16DN 触发器
文件：	总8页 (文件大小：51K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HD74HC123A

Dual Retriggerable Monostable Multivibrators (with Clear)

Description

This multivibrator features both a negative, A, and a positive, B, transition triggered input, either of which

can be used as an inhibit input. Also included is a clear input that when taken low resets the one shot. The

HD74HC123A can be triggered on the positive transition of the clear while A is held low and B is held

high.

The HD74HC123A is retriggerable. That is it may be triggered repeatedly while their outputs are

generating a pulse and the pulse will be extended.

Pulse width stability over a wide range of temperature. The output pulse equation is simply: t_w= (Rext)

(Cext).

Features

•

High Speed Operation

High Output Current: Fanout of 10 LSTTL Loads

Wide Operating Voltage: V_CC= 2 to 6 V

Low Input Current: 1 µA max

Low Quiescent Supply Current

Function Table

Inputs

Outputs

Clear

Note: External timing capacitance connects between Cext and Rext/Cext.

HD74HC123A

Pin Arrangement

16 V_CC

1Rext

Cext

CLR

1CLR

14 1Cext

13 1Q

12 2Q

CLR

2Cext

11 2CLR

10 2B

2Rext/

Cext

GND

(Top view)

HD74HC123A

DC Characteristics

Ta = –40

Sym- V_CCTa = 25°C

to +85°C

Item

bol

(V) Min Typ Max Min Max Unit Test Conditions

Input voltage

V_IH

2.0 1.5

—

1.5

—

4.5 3.15 —

—

3.15 —

6.0 4.2

—

4.2

—

V_IL

2.0

4.5

6.0

—

0.5

1.35

1.8

—

0.5

1.35

1.8

—

Output voltage

V_OH

2.0 1.9 2.0

4.5 4.4 4.5

6.0 5.9 6.0

4.5 4.18 —

6.0 5.68 —

1.9

4.4

5.9

Vin = V_IHor V_ILI_OH= –20 µA

—

4.13 —

5.63 —

I_OH= –4 mA

I_OH= –5.2 mA

—

V_OL

2.0

4.5

6.0

4.5

6.0

—

0.0 0.1

—

0.1

Vin = V_IHor V_ILI_OL= 20 µA

0.0 0.1

0.1

—

0.26

0.33

I_OL= 4 mA

I_OL= 5.2 mA

0.26

±0.1

130

Input current

Quiescent

supply current Active state

Iin

±1.0 µA

220 µA

220

Vin = V_CCor GND

Standby state

I_CC

Vin = V_CCor

GND

Iout = 0 µA

Rext/Cext = 0.5 V_CC

HD74HC123A

AC Characteristics (C_L= 50 pF, Input t_r= t_f= 6 ns)

Ta = –40 to

+85°C

Ta = 25°C

Symbol V_CC(V) Min Typ Max Min Max Unit Test Conditions

Item

Propagation delay t_PLH

time

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

2.0

4.5

6.0

4.5

—

210 —

265 ns

A, B or Clear to Q

Clear to Q

22 42

—

t_PHL

t_PLH

240 —

300 ns

23 48

—

170 —

215 ns

18 34

—

180 —

225 ns

Clear to Q

16 36

—

190

—

Output rise time

Output fall time

Pulse width

t_TLH

t_THL

t_w

—

150 —

A, B, Clear

—

1.5

Minimum output

pulse width

t_WQ(min)

µs

Cext = 28 pF Rext = 6 kΩ

Rext = 2 kΩ

450 —

380 —

Output pulse width t_WQ

Input capacitance Cin

1.0

—

Cext = 0.1 µF, Rext = 10 kΩ

Caution in use: In order to prevent any malfunctions due to noise, connect a high-frequency performance

capacitor between V_CCand GND, and keep the wiring between the External components

and Cext, Rext/Cext pins as short as possible.

Unit: mm

19.20

20.00 Max

1.3

1.11 Max

7.62

+ 0.13

– 0.05

0.25

2.54 ± 0.25

0.48 ± 0.10

0° – 15°

Hitachi Code

DP-16

JEDEC

EIAJ

Conforms

Weight (reference value) 1.07 g

Unit: mm

10.06

10.5 Max

+ 0.20

7.80

– 0.30

0.80 Max

1.15

0° – 8°

1.27

0.70 ± 0.20

*0.42 ± 0.08

0.40 ± 0.06

0.15

0.12

Hitachi Code

JEDEC

EIAJ

FP-16DA

—

Conforms

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.24 g

Unit: mm

9.9

10.3 Max

1.27

+ 0.10

6.10

– 0.30

1.08

0.635 Max

0° – 8°

+ 0.67

0.60

– 0.20

*0.42 ± 0.08

0.40 ± 0.06

0.15

0.25

Hitachi Code

JEDEC

EIAJ

FP-16DN

Conforms

*Dimension including the plating thickness

Base material dimension

Weight (reference value) 0.15 g

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,

Hitachi bears no responsibility for problems that may arise with third party’s rights, including

intellectual property rights, in connection with use of the information contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you have

received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,

contact Hitachi’s sales office before using the product in an application that demands especially high

quality and reliability or where its failure or malfunction may directly threaten human life or cause risk

of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,

traffic, safety equipment or medical equipment for life support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly

for maximum rating, operating supply voltage range, heat radiation characteristics, installation

conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used

beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable

failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-

safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other

consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without

written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor

products.

Hitachi, Ltd.

Semiconductor & Integrated Circuits.

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109

URL

NorthAmerica

Europe

: http:semiconductor.hitachi.com/

: http://www.hitachi-eu.com/hel/ecg

Asia (Singapore)

Asia (Taiwan)

: http://www.has.hitachi.com.sg/grp3/sicd/index.htm

: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm

Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm

Japan

: http://www.hitachi.co.jp/Sicd/indx.htm

For further information write to:

Hitachi Semiconductor

(America) Inc.

Hitachi Europe GmbH

Hitachi Asia (Hong Kong) Ltd.

Group III (Electronic Components)

7/F., North Tower, World Finance Centre,

Harbour City, Canton Road, Tsim Sha Tsui,

Kowloon, Hong Kong

Tel: <852> (2) 735 9218

Fax: <852> (2) 730 0281

Hitachi Asia Pte. Ltd.

16 Collyer Quay #20-00

Hitachi Tower

Singapore 049318

Tel: 535-2100

Electronic components Group

Dornacher Stra§e 3

D-85622 Feldkirchen, Munich

Germany

Tel: <49> (89) 9 9180-0

Fax: <49> (89) 9 29 30 00

179 East Tasman Drive,

San Jose,CA 95134

Tel: <1> (408) 433-1990

Fax: <1>(408) 433-0223

Fax: 535-1533

Hitachi Asia Ltd.

Taipei Branch Office

3F, Hung Kuo Building. No.167,

Tun-Hwa North Road, Taipei (105)

Tel: <886> (2) 2718-3666

Fax: <886> (2) 2718-8180

Telex: 40815 HITEC HX

Hitachi Europe Ltd.

Electronic Components Group.

Whitebrook Park

Lower Cookham Road

Maidenhead

Berkshire SL6 8YA, United Kingdom

Tel: <44> (1628) 585000

Fax: <44> (1628) 778322

HD74HC123ARP [HITACHI]

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