2SK1337 [HITACHI]

Silicon N-Channel MOS FET; 硅N沟道MOS FET
2SK1337
型号: 2SK1337
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

Silicon N-Channel MOS FET
硅N沟道MOS FET

晶体 小信号场效应晶体管
文件: 总8页 (文件大小:43K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2SK1337  
Silicon N-Channel MOS FET  
Application  
High speed power switching  
Features  
Low on-resistance  
High speed switching  
Low drive current  
4 V gate drive device  
Can be driven from 5 V source  
Suitable for motor drive, DC-DC converter, power switch and solenoid drive  
Outline  
TO-92  
3
2
1
D
1. Source  
2. Drain  
3. Gate  
G
S
2SK1337  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VDSS  
Ratings  
100  
Unit  
V
Drain to source voltage  
Gate to source voltage  
Drain current  
VGSS  
±20  
V
ID  
0.3  
A
1
Drain peak current  
ID(pulse)  
IDR  
*
1.2  
A
Body to drain diode reverse drain current  
Channel dissipation  
0.3  
A
Pch  
Tch  
Tstg  
400  
mW  
°C  
°C  
Channel temperature  
Storage temperature  
Note: 1. PW 10 µs, duty cycle 1%  
150  
–55 to +150  
Electrical Characteristics (Ta = 25°C)  
Item  
Symbol Min  
Typ  
Max  
Unit  
Test conditions  
Drain to source breakdown  
voltage  
V(BR)DSS 100  
V
ID = 10 mA, VGS = 0  
Gate to source breakdown  
voltage  
V(BR)GSS ±20  
V
IG = ±100 µA, VDS = 0  
Gate to source leak current  
IGSS  
1.0  
3.5  
±10  
50  
µA  
µA  
V
VGS = ±16 V, VDS = 0  
VDS = 80 V, VGS = 0  
Zero gate voltage drain current IDSS  
Gate to source cutoff voltage  
VGS(off)  
2.0  
4.5  
ID = 1 mA, VDS = 10 V  
ID = 0.2 A, VGS = 10 V *1  
Static drain to source on state RDS(on)  
resistance  
0.22  
4.0  
0.35  
35  
14  
3.5  
2
6.5  
ID = 0.2 A, VGS = 4 V *1  
ID = 0.2 A, VDS = 10 V *1  
VDS = 10 V, VGS = 0,  
f = 1 MHz  
Forward transfer admittance  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
|yfs|  
Ciss  
Coss  
Crss  
td(on)  
tr  
S
pF  
pF  
pF  
ns  
ns  
ns  
ns  
V
ID = 0.2 A, VGS = 10 V,  
4
RL = 150 Ω  
Turn-off delay time  
Fall time  
td(off)  
tf  
17  
15  
0.9  
Body to drain diode forward  
voltage  
VDF  
IF = 0.3 A, VGS = 0  
Body to drain diode reverse  
recovery time  
trr  
80  
ns  
IF = 0.3 A, VGS = 0,  
diF/dt = 50 A/µs  
Note: 1. Pulse test  
2
2SK1337  
Maximum Safe Operation Area  
Power vs. Temperature Derating  
5
600  
400  
200  
2
1
0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
Ta = 25°C  
0.005  
0.1 0.3  
1
3
10  
30  
100  
0
50  
100  
150  
Drain to Source Voltage VDS (V)  
Ambient Temperature Ta (°C)  
Typical Transfer Characteristics  
VDS = 10 V  
Typical Output Characteristics  
1.0  
1.0  
10 V  
Pulse Test  
5 V  
Pulse Test  
–25°C  
TC = 25°C  
75°C  
VGS = 4 V  
0.8  
0.6  
0.4  
0.2  
0.8  
0.6  
0.4  
0.2  
3.5 V  
3 V  
2.5 V  
0
4
8
12  
16  
20  
0
2
4
6
8
10  
Drain to Source Voltage VDS (V)  
Gate to Source Voltage VGS (V)  
3
2SK1337  
Static Drain to Source on State  
Resistance vs. Drain Current  
Drain to Source Saturation Voltage  
vs. Gate to Source Voltage  
50  
5
4
3
2
1
Pulse Test  
Pulse Test  
20  
10  
VGS = 4 V  
5
ID = 0.5 A  
10 V  
2
1
0.2 A  
0.1 A  
0.5  
0
2
4
6
8
10  
0.02 0.05 0.1 0.2  
0.5  
1
2
Gate to Source Voltage VGS (V)  
Drain Current ID (A)  
Static Drain to Source on State  
Resistance vs. Temperature  
Forward Transfer Admittance  
vs. Drain Current  
10  
5
ID = 0.5 A  
Pulse Test  
VDS = 10 V  
Pulse Test  
0.2 A  
0.1 A  
8
6
4
2
2
1
0.2 A  
0.1 A  
TC = –25°C  
25°C  
VGS = 4 V  
75°C  
0.5  
0.5 A  
VGS = 10 V  
0.2  
0.1  
0
–40  
0.05  
0
40  
80  
120  
160  
0.02 0.05 0.1 0.2  
0.5  
1
2
Case Temperature TC (°C)  
Drain Current ID (A)  
4
2SK1337  
Typical Capacitance vs.  
Drain to Source Voltage  
Body to Drain Diode Reverse  
Recovery Time  
500  
1,000  
VGS = 0  
f = 1 MHz  
di/dt = 50 A/µs, Ta = 25°C  
V
GS = 0  
200  
100  
50  
100  
10  
1
Ciss  
Coss  
20  
10  
Crss  
5
0
10  
20  
30  
40  
50  
0.02 0.05 0.1 0.2  
0.5  
1
2
Drain to Source Voltage VDS (V)  
Reverse Drain Current IDR (A)  
Switching Characteristics  
Dynamic Input Characteristics  
50  
20  
200  
160  
120  
80  
VDD = 25 V  
50 V  
td (off)  
20  
10  
16  
12  
8
80 V  
tf  
VGS  
5
tr  
VDS  
td (on)  
ID = 0.3 A  
2
1
VDD = 80 V  
40  
4
0
VGS = 10 V VDD = 30 V  
PW = 2 µs, duty < 0.1%  
50 V  
25 V  
0.5  
0
0.02 0.05 0.1 0.2  
0.5  
1
2
0
0.8  
1.6  
2.4  
3.2  
4.0  
Drain Current ID (A)  
Gate Charge Qg (nc)  
5
2SK1337  
Reverse Drain Current vs.  
Source to Drain Voltage  
1.0  
0.8  
0.6  
0.4  
0.2  
Pulse Test  
VDD = 10 V  
5 V  
VGS = 0, –5 V  
0
0.4  
0.8  
1.2  
1.6  
2.0  
Source to Drain Voltage VSD (V)  
6
Unit: mm  
4.8 ± 0.3  
3.8 ± 0.3  
0.60 Max  
0.5 ± 0.1  
0.5  
1.27  
2.54  
Hitachi Code  
JEDEC  
EIAJ  
TO-92 (1)  
Conforms  
Conforms  
Weight (reference value) 0.25 g  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

相关型号:

2SK1337RF

0.3A, 100V, 6.5ohm, N-CHANNEL, Si, POWER, MOSFET, TO-92
RENESAS

2SK1337RR

0.3A, 100V, 6.5ohm, N-CHANNEL, Si, POWER, MOSFET, TO-92
RENESAS

2SK1337TZ

Small Signal Field-Effect Transistor, 0.3A I(D), 100V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-92
HITACHI

2SK1337TZ

0.3 A, 100 V, 6.5 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-92
RENESAS

2SK1337TZ-E

Silicon N Channel MOS FET
RENESAS

2SK1338

Silicon N-Channel MOS FET
HITACHI

2SK1338

Silicon N Channel MOS FET
RENESAS

2SK1338-E

Silicon N Channel MOS FET
RENESAS

2SK1339

Silicon N-Channel MOS FET
HITACHI

2SK1339

Silicon N Channel MOS FET
RENESAS

2SK1339-E

Silicon N Channel MOS FET
RENESAS

2SK134

LOW FREQUENCY POWER AMPLIFIER
HITACHI