2SJ130S [HITACHI]
Silicon P-Channel MOS FET; 硅P沟道MOS场效应管
| 型号： | 2SJ130S |
| 厂家： | 
HITACHI SEMICONDUCTOR |
| 描述： | Silicon P-Channel MOS FET |
| 文件： | 总8页 (文件大小：50K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2SJ130(L), 2SJ130(S)
Silicon P-Channel MOS FET
Application
High speed power switching
Features
•
•
•
•
•
Low on-resistance
High speed switching
Low drive current
No secondary breakdown
Suitable for switching regulator, DC-DC converter and ultrasonic power oscillators
Outline
DPAK-1
4
4
1
2
3
1
2
3
D
1. Gate
G
2. Drain
3. Source
4. Drain
S
2SJ130(L), 2SJ130(S)
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
VDSS
VGSS
ID
Ratings
Unit
V
Drain to source voltage
Gate to source voltage
Drain current
–300
±20
V
–1
A
Drain peak current
ID(pulse)
–2
A
Body to drain diode reverse drain current
Channel dissipation
Channel temperature
Storage temperature
Note: 1. Value at TC = 25°C
IDR
–1
A
Pch*1
Tch
20
W
°C
°C
150
Tstg
–55 to +150
Electrical Characteristics (Ta = 25°C)
Item
Symbol Min
Typ
Max
Unit
Test conditions
Drain to source breakdown
voltage
V(BR)DSS –300
—
—
V
ID = –10 mA, VGS = 0
Gate to source breakdown
voltage
V(BR)GSS ±20
—
—
V
IG = ±100 µA, VDS = 0
Gate to source leak current
IGSS
—
—
—
—
6.0
±10
–100
–4.0
8.5
µA
µA
V
VGS = ±16 V, VDS = 0
Zero gate voltage drain current IDSS
—
VDS = –240 V, VGS = 0
ID = –1 mA, VDS = –10 V
ID = –0.5 A, VGS = –10 V*1
Gate to source cutoff voltage
VGS(off)
–2.0
—
Static drain to source on state RDS(on)
resistance
Ω
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
|yfs|
Ciss
Coss
Crss
td(on)
tr
0.25
—
0.4
235
65
—
—
—
—
—
—
—
—
—
S
ID = –0.5 A, VDS = –20 V*1
VDS = –10 V, VGS = 0,
f = 1 MHz
pF
pF
pF
ns
ns
ns
ns
V
—
—
16
—
10
ID = –0.5 A, VGS = –10 V,
—
25
RL = 60 Ω
Turn-off delay time
Fall time
td(off)
tf
—
35
—
45
Body to drain diode forward
voltage
VDF
—
–0.9
IF = –1 A, VGS = 0
Body to drain diode reverse
recovery time
trr
—
200
—
ns
IF = –1 A, VGS = 0,
diF/dt = 50 A/µs
Note: 1. Pulse test
2
2SJ130(L), 2SJ130(S)
Power vs. Temperature Derating
Maximum Safe Operation Area
30
20
10
–5
10 µs
–2
–1.0
–0.5
–0.2
–0.1
Operation in this area
is limited by RDS (on)
Ta = 25°C
–0.05
0
50
100
150
–5 –10 –20
–50 –100 –200 –500
Drain to Source Voltage VDS (V)
Case Temperature TC (°C)
Typical Output Characteristics
–10 V
Typical Transfer Characteristics
–25°C
–2.0
–2.0
–1.6
–15 V
–7 V
TC = 25°C
–6 V
–1.6
–1.2
–0.8
–0.4
75°C
VDS = –20 V
Pulse Test
Pulse Test
–1.2
–0.8
–0.4
–5 V
VGS = –4 V
0
–10
–20
–30
–40
–50
0
–2
–6
–8
–10
–4
Drain to Source Voltage VDS (V)
Gate to Source Voltage VGS (V)
3
Static Drain to Source on State Resistance
Drain to Source Saturation Voltage VDS (on) (V)
RDS (on) (Ω)
Static Drain to Source on State Resistance
Forward Transfer Admittance yfs (S)
RDS (on) (Ω)
Forward Transfer Admittance yfs (S)
RDrain to Source VDS (V)
Gate to Source Voltage VGS (V)
Switching Time t (ns)
Capacitance C (pF)
2SJ130(L), 2SJ130(S)
Reverse Drain Current vs.
Source To Drain Voltage
–2.0
–1.6
–1.2
–0.8
–0.4
0
VGS = 0
Pulse Test
–5 V, –10 V
–0.4
VGS = 0, 10 V
–0.8 –1.2 –1.6
0
–2.0
Source to Drain Voltage VSD (V)
Normalized Transient Thermal Impedance vs. Pulse Width
3
TC = 25°C
D = 1
1.0
0.5
0.3
0.2
θch–c (t) = γS (t) · θch–c
θch–c = 6.25°C/W, TC = 25°C
0.1
0.1
0.05
PDM
0.02
PW
D =
0.03
0.01
T
PW
T
0.01
10 µ
100 µ
1 m
10 m
100 m
1
10
Pulse Width PW (s)
Waveforms
Switching Time Test Circuit
Vin Monitor
Vin
10%
Vout Monitor
90%
90%
D.U.T
RL
90%
50 Ω
Vout
td (on)
10%
tf
10%
tr
VDD
.
Vin
–10 V
=
. –30 V
td (off)
6
Unit: mm
6.5 ± 0.5
5.4 ± 0.5
2.3 ± 0.2
0.55 ± 0.1
1.2 ± 0.3
1.15 ± 0.1
0.8 ± 0.1
0.55 ± 0.1
2.29 ± 0.5
2.29 ± 0.5
Hitachi Code
JEDEC
DPAK (L)-(1)
—
EIAJ
Conforms
Weight (reference value) 0.42 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
: http:semiconductor.hitachi.com/
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore)
Asia (Taiwan)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
Hitachi Europe GmbH
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Telex: 40815 HITEC HX
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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