2SD1974ESUL [HITACHI]

Small Signal Bipolar Transistor, 0.8A I(C), 25V V(BR)CEO, 1-Element, NPN, Silicon, UPAK-3;
2SD1974ESUL
型号: 2SD1974ESUL
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

Small Signal Bipolar Transistor, 0.8A I(C), 25V V(BR)CEO, 1-Element, NPN, Silicon, UPAK-3

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中文:  中文翻译
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2SD1974  
Silicon NPN Epitaxial  
Application  
Low frequency power amplifier  
Outline  
UPAK  
2, 4  
1
2
3
1
ID  
4
1. Base  
2. Collector  
3. Emitter  
4. Collector (Flange)  
3
2SD1974  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Ratings  
Unit  
V
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Collector current  
25  
25  
V
6
V
0.8  
A
Collector peak current  
E to C diode forward current  
Collector power dissipation  
Junction temperature  
Storage temperature  
ic (peak)  
1.5  
A
ID  
0.6  
A
PC*1  
Tj  
1.0  
W
°C  
°C  
150  
Tstg  
–55 to +150  
Note: 1. Value on the alumina ceramic board (12.5 x 20 x 0.7 mm)  
Electrical Characteristics (Ta = 25°C)  
Item  
Symbol Min  
Typ  
Max  
Unit  
Test conditions  
Collector to base breakdown  
voltage  
V(BR)CBO  
25  
25  
25  
6
V
IC = 10 µA, IE = 0  
Collector to emitter breakdown V(BR)CEO  
voltage  
35  
35  
V
V
V
IC = 1 mA, RBE = ∞  
Collector to emitter sustaining VCEO(sus)  
voltage  
IC = 0.8 A, RBE = ,  
L = 20 mH  
Emitter to base breakdown  
voltage  
V(BR)EBO  
IE = 10 µA, IC = 0  
Collector cutoff current  
ICBO  
ICEO  
IEBO  
hFE  
0.2  
µA  
µA  
µA  
VCB = 20 V, IE = 0  
0.5  
VCE = 20 V, RBE = ∞  
Emitter cutoff current  
0.2  
VEB = 5 V, IC = 0  
DC current transfer ratio  
250  
1200  
0.4  
VCE = 2 V, IC = 0.1 A*1  
IC = 0.8 A, IB = 80 mA*1  
Collector to emitter saturation VCE(sat)  
voltage  
V
V
E to C diode forward voltage  
VD  
1.5  
ID = 0.6 A*1  
Notes: 1. Pulse test  
2. Marking is “ES”.  
2
2SD1974  
Area of Safe Operation  
Maximum Collector Dissipation Curve  
10  
1.2  
0.8  
0.4  
3
iC(peak)  
1.0  
IC(max)  
0.3  
0.1  
0.03  
0.01  
Ta = 25°C  
1 Shot Pulse  
0.01 0.3  
1.0  
3
10  
30  
100  
0
50  
100  
150  
Collector to Emitter Voltage VCE (V)  
Ambient Temperature Ta (°C)  
Area of Safe Operation of  
Emitter to Collector Diode  
Typical Output Characteristics  
1.0  
0.8  
0.6  
0.4  
0.2  
10  
Ta = 25°C  
1 Shot Pulse  
8
6
4
2
0
IB = 0  
Ta = 25°C  
0.1  
0.3  
1.0  
3
10  
0
2
4
6
8
10  
Pulse Width PW (ms)  
Collector to Emitter Voltage VCE (V)  
3
2SD1974  
Saturation Voltage vs.  
Collector Current  
Typical Transfer Characteristics  
1.0  
0.8  
0.6  
0.4  
0.2  
10  
IC = 10 IB  
Ta = 25°C  
Pulse  
3
1.0  
0.3  
0.1  
VCE = 2 V  
Ta = 25°C  
Pulse  
0.03  
0.01  
0
0.4  
0.8  
1.2  
1.6  
2.0  
0.001 0.003 0.01 0.03  
0.1 0.3  
1.0  
Base to Emitter Voltage VBE (V)  
Collector Current IC (A)  
DC Current Transfer Ratio vs.  
Collector Current  
Typical Characteristics of  
Emitter to Collector Diode  
10,000  
1.0  
0.8  
0.6  
0.4  
0.2  
VCE = 2 V  
Pulse  
3,000  
1,000  
25  
Ta = 75°C  
–25  
300  
100  
Ta = 25°C  
Pulse  
30  
10  
0.001 0.003 0.01 0.03  
0.1 0.3  
1.0  
0
0.4  
0.8  
1.2  
1.6  
2.0  
Collector Current IC (A)  
Emitter to Collector Forward Voltage VD (V)  
4
2SD1974  
Collector Output Capacitance vs.  
Collector to Base Voltage  
1,000  
Ta = 25°C  
f = 1 MHz  
300  
100  
I
E = 0  
30  
10  
3
1
0.3  
1.0  
3
10  
30  
Collector to Base Voltage VCB (V)  
5
Unit: mm  
4.5 ± 0.1  
1.5 ± 0.1  
0.44 Max  
1.8 Max  
(1.5)  
φ
1
0.53 Max  
0.48 Max  
0.44 Max  
1.5  
1.5  
3.0  
Hitachi Code  
JEDEC  
UPAK  
EIAJ  
Conforms  
Weight (reference value) 0.050 g  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
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Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

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