2SD1559 [HITACHI]

Silicon NPN Triple Diffused; 硅NPN三重扩散
2SD1559
型号: 2SD1559
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

Silicon NPN Triple Diffused
硅NPN三重扩散

文件: 总6页 (文件大小:39K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2SD1559  
Silicon NPN Triple Diffused  
Application  
Low frequency power amplifier complementary pair with 2SB1079  
Outline  
TO-3P  
2
1
1. Base  
2. Collector  
(Flange)  
3 k  
400 Ω  
3. Emitter  
(Typ)  
(Typ)  
1
3
2
3
2SD1559  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Ratings  
Unit  
V
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Collector current  
100  
100  
V
7
V
20  
A
Collector peak current  
Base current  
IC(peak)  
30  
A
IB  
3
A
Collector power dissipation  
Junction temperature  
Storage temperature  
Note: 1. Value at TC = 25°C.  
PC*1  
Tj  
100  
W
°C  
°C  
150  
Tstg  
–55 to +150  
Electrical Characteristics (Ta = 25°C)  
Item  
Symbol Min  
Typ  
Max  
Unit  
Test conditions  
Collector to base breakdown  
voltage  
V(BR)CBO  
100  
100  
100  
7
V
IC = 0.1 mA, IE = 0  
Collector to emitter breakdown V(BR)CEO  
voltage  
V
V
V
IC = 25 mA, RBE = ∞  
IC = 200 mA, RBE = *1  
VEB = 50 mA, IC = 0  
Collector to emitter sustain  
voltage  
VCEO(sus)  
Emitter to base breakdown  
voltage  
V(BR)EBO  
Collector cutoff current  
ICBO  
ICEO  
hFE  
100  
1.0  
µA  
VCB = 100 V, IE = 0  
mA  
VCE = 80 V, RBE = ∞  
VCE = 3 V, IC = 10 A*1  
IC = 10 A, IB = 20 mA*1  
DC current transfer ratio  
1000  
20000  
2.0  
Collector to emitter saturation VCE(sat)1  
voltage  
V
V
V
V
Base to emitter saturatiopn  
voltage  
VBE(sat)1  
2.5  
3.0  
3.5  
Collector to emitter saturation VCE(sat)2  
voltage  
IC = 20 A, IB = 200 mA*1  
Base to emitter saturation  
voltage  
VBE(sat)2  
Turn on time  
ton  
tstg  
tf  
1.0  
9.0  
3.0  
µs  
µs  
µs  
IC = 10 A, IB1 = –IB2 = 20 mA  
Storage time  
Fall time  
Note: 1. Pulse test.  
2
2SD1559  
Maximum Collector Dissipation Curve  
Area of Safe Operation  
120  
80  
iC (peak)  
10 µs  
30  
10  
IC (max)  
3
1
40  
0.3  
0.1  
Ta = 25°C  
1 shot pulse  
1
3
10  
30  
100  
300  
0
50  
100  
150  
Case temperature TC (°C)  
Collector to emitter voltage VCE (V)  
DC Current Transfer Ratio  
vs. Collector Current  
Typical Output Characteristics  
3.5  
20  
16  
12  
8
30,000  
10,000  
3,000  
1,000  
25°C  
1
300  
100  
IB = 0.5 mA  
4
VCE = 3 V  
Pulse  
TC = 25°C  
30  
0.3  
0
1
2
3
4
5
1.0  
3
10  
30  
Collector to emitter voltage VCE (V)  
Collector current IC (A)  
3
2SD1559  
Switching Time vs. Collector Current  
tstg  
Saturation Voltage vs. Collector Current  
10  
10  
200  
500  
3
3
VBE (sat)  
tf  
1.0  
1.0  
ton  
VCE (sat)  
lC/lB = 200  
0.3  
0.1  
0.3  
0.1  
500  
VCC = 30 V  
0.03  
0.01  
0.03  
0.01  
Ta = 25°C  
Pulse  
I
C = 500 IB1 = –500 IB2  
Ta = 25°C  
0.3  
1.0  
3
10  
30  
0.3  
1.0  
3
10  
30  
Collector current IC (A)  
Collector current IC (A)  
Transient Thermal Resistance  
10  
3
0.1 to 100 s  
1.0  
0.3  
0.1  
0.03  
TC = 25°C  
1 shot  
0.01  
0.1  
1.0  
1.0  
10  
10  
100 (s)  
100 (ms)  
0.1  
Time t  
4
Unit: mm  
4.8 ± 0.2  
15.6 ± 0.3  
φ3.2 ± 0.2  
1.5  
1.6  
2.0  
1.4 Max  
2.8  
1.0 ± 0.2  
0.6 ± 0.2  
0.9  
1.0  
3.6  
5.45 ± 0.5  
5.45 ± 0.5  
Hitachi Code  
JEDEC  
TO-3P  
EIAJ  
Conforms  
Weight (reference value) 5.0 g  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

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