2SC2512 [HITACHI]

Silicon NPN Triple Diffused; 硅NPN三重扩散
2SC2512
型号: 2SC2512
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

Silicon NPN Triple Diffused
硅NPN三重扩散

文件: 总7页 (文件大小:35K)
中文:  中文翻译
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2SC2512  
Silicon NPN Triple Diffused  
Application  
VHF Amplifier  
VHF TV Tuner, Mixer  
Outline  
TO-92 (2)  
1. Base  
2. Emitter  
3. Collector  
3
2
1
2SC2512  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Ratings  
Unit  
V
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Collector current  
30  
20  
V
3
V
50  
mA  
mW  
°C  
°C  
Collector power dissipation  
Junction temperature  
Storage temperature  
PC  
300  
Tj  
150  
Tstg  
–55 to +150  
Electrical Characteristics (Ta = 25°C)  
Item  
Symbol Min  
Typ  
Max  
Unit  
Test conditions  
Collector to base breakdown  
voltage  
V(BR)CBO  
30  
20  
3
V
IC = 10 µA, IE = 0  
Collector to emitter breakdown V(BR)CEO  
voltage  
V
V
IC = 1 mA, RBE = ∞  
IE = 10 µA, IC = 0  
Emitter to base breakdown  
voltage  
V(BR)EBO  
Collector cutoff current  
ICBO  
0.5  
1
µA  
VCB = 10 V, IE = 0  
Collector to emitter saturation VCE(sat)  
voltage  
V
IC = 20 mA, IB = 4 mA  
DC current transfer ratio  
hFE  
30  
VCE = 10 V, IC = 10 mA  
Reverse transfer capacitance Cre  
0.35  
0.45  
pF  
VCB = 10 V, Emitter common,  
f = 1 MHz  
Gain bandwidth product  
Base time constant  
fT  
600  
900  
MHz  
ps  
VCE = 10 V, IC = 10 mA  
rbb’  
CC  
20  
VCB = 10 V, IC = 5 mA,  
f = 31.8 MHz  
Conversion gain  
CG  
NF  
16  
20  
dB  
VCC = 12 V, IC = 2 mA,  
fin = 200 MHz,  
f
f
OSC = 260 MHz,  
out = 60 MHz  
Noise figure  
3.8  
5.5  
dB  
VCC = 12 V, IC = 2 mA,  
OSC = 260 MHz, Rg = 50 ,  
fin = 200 MHz  
f
2
2SC2512  
DC Current Transfer Ratio vs.  
Collector Current  
Maximum Collector Dissipation Curve  
100  
80  
60  
40  
20  
0
300  
200  
100  
VCE = 10 V  
1
2
5
10  
20  
50  
0
50  
100  
150  
Collector Current IC (mA)  
Ambient Temperature Ta (°C)  
Gain Bandwidth Product vs.  
Collector Current  
Reverse Transfer Capacitance vs.  
Collector to Base Voltage  
1,000  
800  
600  
400  
200  
0
5
2
f = 1 MHz  
VCE = 10 V  
Emitter Common  
1.0  
0.5  
0.2  
0.1  
1
2
5
10  
20  
50  
1
2
5
10  
20  
50  
Collector Current IC (mA)  
Collector to Base Voltage VCB (V)  
3
2SC2512  
Conversion Gain vs. Collector Current  
VCC = 12 V  
Noise Figure vs. Collector Current  
VCC = 12 V  
30  
26  
22  
18  
14  
10  
10  
8
f
f
f
osc = 260 MHz (0 dBm)  
in = 200 MHz  
out = 60 MHz  
f
f
osc = 260 MHz (0 dBm)  
in = 200 MHz  
Rg = 50  
Rg = 50 Ω  
6
4
2
0
2
4
6
8
10  
0
1
2
3
4
5
Collector Current IC (mA)  
Collector Current IC (mA)  
Noise Figure, Conversion Gain vs.  
Oscillating Injection Voltage  
10  
8
30  
IC = 2 mA  
V
CC = 12 V  
f
osc = 260 MHz  
fin = 200 MHz  
Rg = 50 Ω  
6
20  
10  
4
NF  
CG  
2
0
–15  
–5  
5
Oscillating Injection Voltage Vinj (dBm)  
4
2SC2512  
Conversion Gain, Noise Figure Test Circuit  
R2  
fOSC Input  
R1 : 330 (1/4 W)  
R2 : 560 (1/4 W)  
VCC  
C1  
Output  
L1 : φ0.8 mm Copper wire with Enamel 8 Turns  
inside dia φ3 mm  
L4  
L5 C8  
L2 C2  
C3  
L2 : φ0.8 mm Copper wire with Enamel 5 Turns  
inside dia φ3 mm  
L3 : φ0.5 mm Copper wire with Enamel 3.5 Turns  
inside dia φ3 mm  
L4 : Outside dia φ5 mm used Ferrite Core, φ0.2 mm  
Copper wire with Enamel 6.5 Turns  
L5 : φ0.2 mm Copper wire with Enamel 13 Turns  
inside dia φ5 mm  
Input  
C6  
C7  
C9  
R1  
L3  
L1  
C5  
C4  
VBB  
Parts Specification  
C1 : 1.5 pF  
C2 : 57 pF  
C3 : 17 pF  
C4 : 1000 pF  
C5 : 2200 pF  
C6 : 22 pF  
C7 : 80 pF  
C8 : 18 pF  
C9 : 20 pF  
5
Unit: mm  
4.8 ± 0.3  
3.8 ± 0.3  
0.60 Max  
0.45 ± 0.1  
0.5  
1.27  
2.54  
Hitachi Code  
JEDEC  
EIAJ  
TO-92 (2)  
Conforms  
Conforms  
Weight (reference value) 0.25 g  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

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