540VG2C [HB]
LED SPECIFICATION; LED规格
| 型号： | 540VG2C |
| 厂家： | 
HB ELECTRONIC COMPONENTS |
| 描述： | LED SPECIFICATION |
| 文件： | 总9页 (文件大小：775K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LED SPECIFICATION
540VG2C
ꢀ Features
ꢁ Single color
ꢁ High bright output
ꢁ Low power consumption
ꢁ High reliability and long life
ꢀ Descriptions：
ꢁ Dice material：GaN CREE
ꢁ Emitting Color：
Super Bright Pure Green
ꢁ Device Outline：
φ5mm Round Type/ 5mm
ꢁ Lens Type：
1. All dimensions are millimeters
2. Tolerance is +/-0.25mm unless otherwise noted
Water Clear
ꢀ Directivity：
0°
1.0
Ta=25° C
30°
IF=20mA
60°
0.5
90°
0
90°
60°
30°
0°
0.5
1.0
Radiation Angle
Page: 1
LED SPECIFICATION
Absolute maximum ratings（Ta = 25℃）
Value
Parameter
Symbol
Test Condition
Unit
Min.
5
Max.
--
Reverse Voltage
Forward Current
VR
IF
IR = 30μA
V
mA
mW
mA
℃
----
----
----
----
-20
-25
30
105
100
+85
+100
Power Dissipation
Pulse Current
Pd
----
Ipeak
Topr
Tstr
Duty=0.1mS，1kHz
Operating Temperature
Storage Temperature
----
----
℃
Electrical and optical characteristics （Ta = 25℃）
Value
Typ.
Parameter
Symbol
Test Condition
Unit
Min.
Max.
30
Forward Voltage
Reverse Current
VF
IR
IF = 20mA
VR = 5V
V9~V11
----
----
----
μA
nm
Dominate Wavelength
Spectral Line half-width
Luminous Intensity
Viewing Angle
λd
IF = 20mA
IF = 20mA
IF = 20mA
IF = 20mA
G12~G14
35
Δλ
IV
----
V,W
2θ1/2
32
40
Deg.
Page: 2
BIN ranking for LEDs
BRIGHTNESS BIN
Bin Code IV(mcd)
Bin Code
IV(mcd) Bin Code
IV(mcd)
390-550
Bin Code IV(mcd)
A
B
C
D
E
F
0-5.0
H
J
K
L
M
N
P
37.2-52.0
52.0-72.8
72.8-102
102-145
145-200
200-280
280-390
Q
R
S
T
U
V
X
4180--5860
5860-8200
8-10cd
5.0-7.0
7.0-9.8
9.8-13.7
13.7-19.0
19.0-26.6
26.6-37.2
550-770
Y
770-1100
1100-1520
1520-2130
2130-3000
3000-4180
Z1
Z2
Z3
Z4
Z5
10-12cd
12-14cd
14-16cd
16-18cd
G
W
WAVELENGTH BIN
Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm)
B1
B2
B3
B4
B5
450-455
455-460
460-465
465-470
470-475
475-480
491-494
494-497
497-500
500-503
503-506
506-509
509-512
512-515
515-518
518-521
521-524
524-527
527-530
530-533
533-536
536-539
539-542
542-545
545-548
YG1
YG2
YG3
YG4
YG5
YG6
YG7
Y1
555-558
558-561
561-564
564-567
567-570
570-573
573-576
582-585
585-588
588-591
591-594
594-597
597-600
600-603
603-606
606-609
609-612
612-615
615-618
618-621
621-624
624-627
627-630
630-633
633-636
BLUE
YELLOW
GREEN
B6
G1
G2
G3
G4
G5
Y2
Y3
Y4
YELLOW
BLUE
GREEN
G6
Y5
G7
YO1
YO2
YO3
YO4
O1
G8
YELLOW
ORANGE
G9
G10
G11
G12
G13
G14
G15
G16
G17
G18
G19
PURE
ORANGE
O2
O3
PURE
GREEN
R1
R2
R3
RED
R4
R5
R6
FORWARD VOLTAGE (VF) BIN
Bin Code
VF (V)
1.6-1.8
1.8-2.0
2.0-2.2
2.2-2.4
Bin Code
VF (V) Bin Code
VF (V)
3.2-3.4
3.4-3.6
3.6-3.8
3.8-4.0
Bin Code VF (V)
V1
V2
V3
V4
V5
V6
V7
V8
2.4-2.6
2.6-2.8
2.8-3.0
3.0-3.2
V9
V13
V14
V15
V16
4.0-4.2
4.2-4.4
4.4-4.6
4.6-4.8
V10
V11
V12
Page: 3
LED SPECIFICATION
Typical electrical/optical characteristic curves：
FORWARD CURRENT Vs
FORWARD VOLTAGE
LUMINOUS INTENSITY Vs.
FORWARD CURRENT
50
40
2.5
2.0
1.5
1.0
30
20
10
0
0.5
0
2.0 2.4 2.8 3.2 3.6
Forward Voltage(V)
4.0
0
10
20
30
40
50
IF-Forward Current (mA)
LUMINOUS INTENSITY Vs.
AMBIENT TEMPERATURE
FORWARD CURRENT
DERATING CURVE
2.5
2.0
50
40
30
1.5
1.0
20
10
0.5
0
0
100
0
20
80
40
60
-40 -20
0
20
40
60
80
100
Ambient Temperature TA (℃)
Ambient Temperature TA (℃)
100
75
50
25
0
550
650
700
400
450
500
600
Wavelength λ(nm)
Page: 4
LED LAMP APPLICATION
ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
base of the package
DIP
Bath temperature: 260±5℃
SOLDERING
Immersion time: with 5 sec
y Using soldering flux,” RESIN FLUX”
is recommended.
y During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
emperature at tip of iron: 260℃ or lower (To prevent heat from being
Soldering time: within 5 sec. transferred directly to the lead, hold
IRON
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
ꢀ
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
ꢀ
Lead wries
Leave
a
slight
clearance
(Fig.2)
Page : 5
LED LAMP APPLICATION
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid steering the leads (See Fig.3).
ꢀ
PC board
（Fig.）3
jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
yLED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective
components including the LED should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the
shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
Page : 6
LED LAMP APPLICATION
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.6
Fig.5
yFORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending
should be performed with base fixed means of a jig or pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
Page : 7
LED LAMP APPLICATION
yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK！
1Kg
Fig.10
yHANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care
when handling.
yCHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be sued.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
ADAPTABILITY
Freon TE
Chlorothene
Isopropyl Alcohol
Thinner
Acetone
Trichloroethylene
⊙
╳
⊙
╳
╳
╳
NOTE: Influences of ultrasonic cleaning of the LED
resin body differ depending on such factors
as the oscillator output, size of the PC board
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed after confirming there is no problem by
conducting a test under practical.
⊙--Usable
╳--Do not use.
Page : 8
LED LAMP PASSED TESTS
Experiment Item:
Test Condition
Item
Reference Standard
Lamp & IR
Ta： 25±5℃
IF= 20mA RH：＜=60%RH
DYNAMIC:100mA 1ms 1/10 duty
①
MIL-STD-750：1026
MIL-STD-883：1005
JIS C 7021：B-1
OPERATION LIFE
STATIC STATE: IF＝20mA
②
TEST TIME:
168HRS（-24HRS，+24HRS）
500HRS（-24HRS，+24HRS）
1000HRS（-24HRS，+72HRS）
HIGH
TEMPERATURE
HIGH HUMIDITY
STORAGE
Ta： 65℃±5℃
RH： 90〜95%RH
TEST TIME：240HRS±2HRS
MIL-STD-202：103B
JIS C 7021 ：B-1
MIL-STD-202：107D
MIL-STD-750：1051
MIL-STD-883：1010
JIS C 7021 ：A-4
105℃〜25℃〜-55℃〜25℃
TEMPERATURE
CYCLING
30min 5min
30min 5min
10CYCLES
105℃±5℃〜-55℃±5℃
10min 10min
10CYCLES
MIL-STD-202：107D
MIL-STD-750：1051
MIL-SYD-883：1011
THERMAL SHOCK
MIL-STD-202：210A
MIL-STD-750-2031
JIS C 7021：A-1
MIL-STD-202：208D
MIL-STD-750：2026
MIL-STD-883：2003
JIS C 7021 ：A-2
SOLDER
RESISTANCE
T，sol：260℃±5℃
DWELL TIME：10±lsec
SOLDERABILITY
T，sol：230℃±5℃
DWELL TIME：5±lsec
Drive Method
Circuit model A
Circuit model B
Page : 9
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
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