GS832218E-250T_技术文档

GS832218(B/E)/GS832236(B/E)/GS832272(C)

119-, 165-, & 209-Pin BGA

Commercial Temp

Industrial Temp

250 MHz–133 MHz

2M x 18, 1M x 36, 512K x 72

36Mb S/DCD Sync Burst SRAMs

2.5 V or 3.3 V V

DD

2.5 V or 3.3 V I/O

either linear or interleave order with the Linear Burst Order (LBO)

input. The Burst function need not be used. New addresses can be

loaded on every cycle with no degradation of chip performance.

Features

• FT pin for user-configurable flow through or pipeline operation

• Single/Dual Cycle Deselect selectable

• IEEE 1149.1 JTAG-compatible Boundary Scan

• ZQ mode pin for user-selectable high/low output drive

• 2.5 V +10%/–10% core power supply

• 3.3 V +10%/–10% core power supply

• 2.5 V or 3.3 V I/O supply

• LBO pin for Linear or Interleaved Burst mode

• Internal input resistors on mode pins allow floating mode pins

• Default to SCD x18/x36 Interleaved Pipeline mode

• Byte Write (BW) and/or Global Write (GW) operation

• Internal self-timed write cycle

Flow Through/Pipeline Reads

The function of the Data Output register can be controlled by the

user via the FT mode . Holding the FT mode pin low places the

RAM in Flow Through mode, causing output data to bypass the

Data Output Register. Holding FT high places the RAM in

Pipeline mode, activating the rising-edge-triggered Data Output

Register.

SCD and DCD Pipelined Reads

The GS832218/36/72 is a SCD (Single Cycle Deselect) and DCD

(Dual Cycle Deselect) pipelined synchronous SRAM. DCD

SRAMs pipeline disable commands to the same degree as read

commands. SCD SRAMs pipeline deselect commands one stage

less than read commands. SCD RAMs begin turning off their

outputs immediately after the deselect command has been

captured in the input registers. DCD RAMs hold the deselect

command for one full cycle and then begin turning off their

outputs just after the second rising edge of clock. The user may

configure this SRAM for either mode of operation using the SCD

mode input.

• Automatic power-down for portable applications

• JEDEC-standard 119-, 165-, and 209-bump BGA package

• RoHS-compliant packages available

Functional Description

Applications

The GS832218/36/72 is a 37,748,736-bit high performance

synchronous SRAM with a 2-bit burst address counter. Although

of a type originally developed for Level 2 Cache applications

supporting high performance CPUs, the device now finds

application in synchronous SRAM applications, ranging from

DSP main store to networking chip set support.

Byte Write and Global Write

Byte write operation is performed by using Byte Write enable

(BW) input combined with one or more individual byte write

signals (Bx). In addition, Global Write (GW) is available for

writing all bytes at one time, regardless of the Byte Write control

inputs.

Controls

Addresses, data I/Os, chip enable (E1), address burst control

inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,

GW) are synchronous and are controlled by a positive-edge-

triggered clock input (CK). Output enable (G) and power down

control (ZZ) are asynchronous inputs. Burst cycles can be initiated

with either ADSP or ADSC inputs. In Burst mode, subsequent

burst addresses are generated internally and are controlled by

ADV. The burst address counter may be configured to count in

FLXDrive™

The ZQ pin allows selection between high drive strength (ZQ low)

for multi-drop bus applications and normal drive strength (ZQ

floating or high) point-to-point applications. See the Output Driver

Characteristics chart for details.

Parameter Synopsis

-250 -225 -200 -166 -150 -133 Unit

t

_KQ(x18/x36)

2.5

3.0

4.0

2.7

3.0

4.4

3.0

5.0

3.5

6.0

3.8

6.7

4.0

7.5

ns

t

_KQ(x72)

tCycle

Pipeline

3-1-1-1

Curr (x18)

Curr (x36)

Curr (x72)

285

350

440

265

320

410

245

295

370

220

260

320

210 185

240 215

300 265

mA

t_KQ

6.5

7.0

7.5

8.0

8.5

ns

tCycle

Flow

Through

2-1-1-1

Curr (x18)

Curr (x36)

Curr (x72)

205

235

315

195

225

295

185

210

265

175

200

255

165 155

190 175

240 230

mA

Rev: 1.07a 12/2007

1/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

209-Bump BGA—x72 Common I/O—Top View (Package C)

1

2

3

4

5

ADSP

NC

6

ADSC

BW

E1

7

8

9

10

11

A

B

C

D

DQG

A

E2

BG

BD

NC

ADV

A

E3

BB

BE

NC

A

DQB

A

B

C

D

BC

BH

BF

BA

NC

GW

V

SS

NC

G

SS

V

E

F

DQPG

DQC

NC

DQPC

DQC

NC

DQPF

DQF

NC

DQPB

DQF

NC

E

F

DDQ

DD

DDQ

V

ZQ

MCH

MCL

FT

SS

V

G

H

J

G

H

J

DDQ

DD

DDQ

V

SS

V

DDQ

DD

DDQ

V

K

L

CK

NC

K

L

SS

V

DDQ

DQH

DQPD

DQH

DQPH

DQA

DQPA

DQA

DQPE

DDQ

DD

DDQ

V

SS

M

N

P

R

MCL

SCD

ZZ

M

N

P

R

SS

V

DDQ

DD

DDQ

V

SS

V

DDQ

DD

DDQ

V

T

U

V

DQD

NC

A

NC

A

LBO

A

NC

A

NC

A

DQE

T

U

V

SS

NC

A

A1

A0

A

W

TMS

TDI

A

TDO

TCK

W

2

11 x 19 Bump BGA—14 x 22 mm Body—1 mm Bump Pitch

Rev: 1.07a 12/2007

2/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

GS832272 209-Bump BGA Pin Description

Symbol

A0, A1

An

Type

Description

I

Address field LSBs and Address Counter Preset Inputs.

Address Inputs

DQ^A

DQB

DQC

DQD

DQE

DQF

DQG

DQH

I/O

Data Input and Output pins

I

Byte Write Enable for DQA, DQB I/Os; active low

Byte Write Enable for DQC, DQD I/Os; active low

Byte Write Enable for DQE, DQF, DQG, DQH I/Os; active low

No Connect

BA, BB

BC,BD

I

BE, BF, BG,BH

NC

CK

—

I

Clock Input Signal; active high

I

Global Write Enable—Writes all bytes; active low

Chip Enable; active low

GW

I

E1

I

Chip Enable; active low

E3

I

Chip Enable; active high

E²

I

Output Enable; active low

G

I

Burst address counter advance enable; active low

Address Strobe (Processor, Cache Controller); active low

Sleep Mode control; active high

ADV

ADSP, ADSC

ZZ

I

Flow Through or Pipeline mode; active low

Linear Burst Order mode; active low

Single Cycle Deselect/Dual Cycle Deselect Mode Control

Must Connect High

FT

I

LBO

SCD

MCH

MCL

BW

I

Must Connect Low

I

Byte Enable; active low

FLXDrive Output Impedance Control

(Low = Low Impedance [High Drive], High = High Impedance [Low Drive])

ZQ

I

Scan Test Mode Select

Scan Test Data In

Scan Test Data Out

Scan Test Clock

TMS

TDI

O

I

TDO

TCK

Rev: 1.07a 12/2007

3/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

GS832272 209-Bump BGA Pin Description (Continued)

Symbol

Type

Description

Core power supply

V

I

DD

V

I/O and Core Ground

Output driver power supply

SS

V

DDQ

Rev: 1.07a 12/2007

4/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

165-Bump BGA—x18 Commom I/O—Top View (Package E)

1

2

3

4

5

6

7

8

9

10

A

11

A

B

C

D

E

F

NC

A

E1

BB

NC

E3

BW

ADSC

ADV

A

B

C

D

E

F

NC

A

E2

NC

BA

CK

GW

G

ADSP

A

NC

ZQ

NC

DQPA

DQA

ZZ

NC

V

DDQ

SS

DD

SS

DD

DDQ

NC

DQB

MCL

NC

V

NC

G

H

J

NC

G

H

J

FT

NC

DQB

DQPB

NC

V

DQA

NC

A

NC

DDQ

K

L

NC

V

NC

K

L

NC

M

N

P

R

NC

M

N

P

R

SCD

NC

V

NC

TDI

A

NC

V

NC

DDQ

SS

DDQ

A

A1

A0

TDO

TCK

A

LBO

A

TMS

A

11 x 15 Bump BGA—15 mm x 17 mm Body—1.0 mm Bump Pitch

Rev: 1.07a 12/2007

5/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

165-Bump BGA—x36 Common I/O—Top View (Package E)

1

2

3

4

5

6

7

8

9

10

A

11

A

B

C

D

E

F

NC

A

E1

BC

BB

E3

BW

ADSC

ADV

NC

A

B

C

D

E

F

NC

DQPC

DQC

FT

A

E2

BD

BA

CK

GW

G

ADSP

A

NC

DQPB

DQB

ZZ

NC

V

NC

DDQ

SS

DD

SS

DD

DDQ

DQC

MCL

DQD

SCD

NC

V

DQB

ZQ

G

H

J

G

H

J

NC

DQD

DQPD

NC

V

DQA

NC

DQA

DQPA

A

DDQ

K

L

V

K

L

M

N

P

R

M

N

P

R

V

NC

TDI

A

NC

V

SS

DDQ

SS

DDQ

A

A1

A0

TDO

TCK

A

LBO

A

TMS

A

11 x 15 Bump BGA—15 mm x 17 mm Body—1.0 mm Bump Pitch

Rev: 1.07a 12/2007

6/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

GS832218/36 165-Bump BGA Pin Description

Symbol

A0, A1

An

Type

Description

I

Address field LSBs and Address Counter Preset Inputs

Address Inputs

DQ^A

DQB

DQC

DQD

I/O

Data Input and Output pins

BA, BB, BC, BD

I

—

I

Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low (x36 Version)

No Connect

NC

CK

Clock Input Signal; active high

BW

I

Byte Write—Writes all enabled bytes; active low

Global Write Enable—Writes all bytes; active low

Chip Enable; active low

GW

I

E1

I

E3

I

Chip Enable; active low

E²

I

Chip Enable; active high

G

ADV

I

Output Enable; active low

I

Burst address counter advance enable; active l0w

Address Strobe (Processor, Cache Controller); active low

Sleep mode control; active high

ADSC, ADSP

ZZ

I

FT

I

Flow Through or Pipeline mode; active low

Linear Burst Order mode; active low

LBO

I

FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low

Drive])

ZQ

I

Scan Test Mode Select

Scan Test Data In

TMS

TDI

O

I

Scan Test Data Out

TDO

TCK

MCL

SCD

Scan Test Clock

—

I

Must Connect Low

Single Cycle Deselect/Dual Cyle Deselect Mode Control

Core power supply

V

DD

V

I

I/O and Core Ground

SS

V

I

Output driver power supply

DDQ

Rev: 1.07a 12/2007

7/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

119-Bump BGA—x36 Common I/O—Top View

1

2

A

3

A

4

5

A

6

A

7

V

DDQ

A

B

C

D

E

F

ADSP

ADSC

A

B

C

D

E

F

DDQ

NC

A

NC

V

A

DD

V

DQC

DQPC

DQC

ZQ

E1

DQPB

DQB

SS

V

DDQ

G

DDQ

G

H

J

DQC2

BC

ADV

GW

BB

DQB

G

H

J

V

SS

DQC

DQB

SS

V

NC

DDQ

DD

DDQ

DQA

V

K

L

DQD

DQPD

A

CK

SCD

BW

A1

DQA

DQPA

A

K

L

SS

BD

BA

V

DDQ

M

N

P

R

T

M

N

P

R

T

DDQ

SS

V

DQD

NC

DQA

SS

V

A0

DQA

NC

ZZ

SS

V

LBO

A

FT

A

DD

NC

A

TCK

2

A

V

DDQ

U

TMS

TDI

TDO

NC

U

DDQ

7 x 17 Bump BGA—14 x 22 mm Body—1.27 mm Bump Pitch

Rev: 1.07a 12/2007

8/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

119-Bump BGA—x18 Common I/O—Top View

1

2

A

3

A

4

5

A

6

A

7

V

DDQ

A

B

C

D

E

F

ADSP

ADSC

A

B

C

D

E

F

DDQ

NC

A

NC

V

A

DD

V

DQB

NC

DQB

NC

DQB

NC

ZQ

E1

DQPA

NC

DQA

NC

DQA

NC

SS

V

DQA

V

DDQ

G

DDQ

G

H

J

NC

BB

ADV

GW

NC

DQA

G

H

J

V

DQB

NC

SS

V

NC

DDQ

DD

DDQ

DQA

NC

V

K

L

NC

DQB

NC

CK

SCD

BW

A1

NC

DQA

NC

DQA

NC

A

K

L

SS

DQB

NC

BA

V

DDQ

M

N

P

R

T

DQB

NC

M

N

P

R

T

DDQ

SS

V

DQB

NC

SS

V

NC

DQPB

A

A0

DQA

NC

ZZ

SS

V

LBO

A

FT

A

DD

A

TCK

2

A

V

DDQ

U

TMS

TDI

TDO

NC

U

DDQ

7 x 17 Bump BGA—14 x 22 mm Body—1.27 mm Bump Pitch

Rev: 1.07a 12/2007

9/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

GS832218/36 119-Bump BGA Pin Description

Symbol

A0, A1

An

Type

Description

I

Address field LSBs and Address Counter Preset Inputs

Address Inputs

DQ^A

DQB

DQC

DQD

I/O

Data Input and Output pins

BA, BB, BC, BD

I

—

I

Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low

No Connect

NC

CK

Clock Input Signal; active high

BW

I

Byte Write—Writes all enabled bytes; active low

Global Write Enable—Writes all bytes; active low

Chip Enable; active low

GW

I

E1

I

G

ADV

I

Output Enable; active low

I

Burst address counter advance enable; active low

Address Strobe (Processor, Cache Controller); active low

Sleep mode control; active high

ADSP, ADSC

ZZ

I

FT

I

Flow Through or Pipeline mode; active low

Linear Burst Order mode; active low

LBO

I

FLXDrive Output Impedance Control (Low = Low Impedance [High Drive], High = High Impedance [Low

Drive])

ZQ

I

SCD

TMS

TDI

I

Single Cycle Deselect/Dual Cyle Deselect Mode Control

Scan Test Mode Select

Scan Test Data In

I

O

I

Scan Test Data Out

TDO

TCK

Scan Test Clock

V

I

Core power supply

DD

V

I

I/O and Core Ground

SS

V

I

I/O and Core Ground

SS

V

I

Output driver power supply

DDQ

Rev: 1.07a 12/2007

10/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

GS832218/36 Block Diagram

Register

A0–An

D

Q

A0

A1

A0

A1

D0

D1

Q0

Q1

Counter

Load

A

LBO

ADV

Memory

Array

CK

ADSC

ADSP

Q

D

Register

GW

BW

BA

D

Q

36

Register

D

Q

BB

BC

BD

4

Register

D

Q

Register

D

Q

Register

36

D

Q

36

Register

D

E1

Q

Register

D

Q

FT

G

36

SCD

Power Down

Control

DQx1–DQx9

ZZ

Note: Only x36 version shown for simplicity.

Rev: 1.07a 12/2007

11/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Mode Pin Functions

Mode Name

Name

State

Function

L

Linear Burst

Interleaved Burst

Flow Through

Pipeline

Burst Order Control

Output Register Control

LBO

H

L

H or NC

L or NC

H

FT

Active

Power Down Control

ZZ

Standby, I = I

DD SB

L

Dual Cycle Deselect

Single Cycle Deselect

Single/Dual Cycle Deselect Control

SCD

ZQ

H or NC

L

High Drive (Low Impedance)

Low Drive (High Impedance)

FLXDrive Output Impedance Control

H or NC

Note:

There are pull-up devices on the ZQ, SCD, and FT pins and a pull-down device on the ZZ pin, so those input pins can be unconnected and the

chip will operate in the default states as specified in the above tables.

Burst Counter Sequences

Linear Burst Sequence

A[1:0] A[1:0] A[1:0] A[1:0]

Interleaved Burst Sequence

A[1:0] A[1:0] A[1:0] A[1:0]

1st address

2nd address

3rd address

4th address

00

01

10

11

01

10

11

00

10

11

00

01

11

00

01

10

1st address

2nd address

3rd address

4th address

00

01

10

11

01

00

11

10

11

00

01

11

10

01

00

Note:

The burst counter wraps to initial state on the 5th clock.

Note:

The burst counter wraps to initial state on the 5th clock.

BPR 1999.05.18

Rev: 1.07a 12/2007

12/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Byte Write Truth Table

Function

Read

GW

BW

H

L

BA

X

BB

X

BC

X

BD

X

Notes

1

H

L

Write No Bytes

Write byte a

Write byte b

Write byte c

Write byte d

Write all bytes

H

L

H

L

H

L

H

L

1

L

2, 3

L

H

L

2, 3

L

H

L

2, 3, 4

L

H

L

X

Notes:

1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs, BA, BB, BC and/or BD.

2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes.

3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.

4. Bytes “C” and “D” are only available on the x32 and x36 versions.

Rev: 1.07a 12/2007

13/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Synchronous Truth Table

Operation

State

Diagram E1

Key

Address

Used

3

E2

E3

ADSP ADSC ADV

W

DQ

Deselect Cycle, Power Down

Read Cycle, Begin Burst

None

X

L

H

L

X

L

H

X

H

X

L

X

L

X

L

X

F

T

F

T

F

T

High-Z

None

X

L

X

L

High-Z

None

X

L

High-Z

None

X

H

X

L

High-Z

External

X

L

Q

D

Q

D

Q

D

Read Cycle, Begin Burst

Write Cycle, Begin Burst

Read Cycle, Continue Burst

Write Cycle, Continue Burst

Read Cycle, Suspend Burst

Write Cycle, Suspend Burst

R

L

X

H

X

H

X

H

X

H

L

X

H

X

H

X

H

X

H

X

W

CR

CW

L

H

Current

H

Write Cycle, Suspend Burst

Notes:

1. X = Don’t Care, H = High, L = Low

2. E = T (True) if E²= 1 and E3 = 0; E = F (False) if E2 = 0 or E3 = 1

3. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding.

4. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown

as “Q” in the Truth Table above).

5. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish

basic synchronous or synchronous burst operations and may be avoided for simplicity.

6. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above.

7. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.

Rev: 1.07a 12/2007

14/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Simplified State Diagram

X

Deselect

W

R

W

R

X

R

X

First Write

First Read

CW

CR

W

R

X

Burst Write

X

Burst Read

CR

CW

CR

Notes:

1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low.

2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and

that ADSP is tied high and ADSC is tied low.

3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs and

assumes ADSP is tied high and ADV is tied low.

Rev: 1.07a 12/2007

15/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Simplified State Diagram with G

X

Deselect

W

R

W

R

X

W

R

X

First Write

First Read

CR

CW

CR

W

R

W

X

Burst Write

X

Burst Read

CR

CW

CR

Notes:

1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G.

2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing

through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles.

3. Transitions shown in grey tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet

Data Input Set Up Time.

Rev: 1.07a 12/2007

16/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Absolute Maximum Ratings

(All voltages reference to V

)

SS

Symbol

Description

Value

Unit

V

Voltage on V Pins

–0.5 to 4.6

DD

V

Voltage in V

Pins

DDQ

–0.5 to 4.6

V

DDQ

V

–0.5 to V

+0.5 (≤ 4.6 V max.)

DDQ

Voltage on I/O Pins

Voltage on Other Input Pins

Input Current on Any Pin

Output Current on Any I/O Pin

Package Power Dissipation

Storage Temperature

V

I/O

V

–0.5 to V +0.5 (≤ 4.6 V max.)

V

IN

DD

I

+/–20

mA

W

IN

I

OUT

P

1.5

D

o

T

–55 to 125

C

STG

o

T

Temperature Under Bias

C

BIAS

Note:

Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended

Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of

this component.

Power Supply Voltage Ranges

Parameter

Symbol

Min.

3.0

Typ.

3.3

Max.

3.6

Unit

Notes

V

3.3 V Supply Voltage

2.5 V Supply Voltage

V

DD3

V

2.3

2.5

2.7

DD2

3.3 V V

I/O Supply Voltage

V

3.0

3.3

3.6

DDQ

DDQ3

2.5 V V

I/O Supply Voltage

V

2.3

2.5

2.7

DDQ2

Notes:

1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-

tions quoted are evaluated for worst case in the temperature range marked on the device.

2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.

DDn

Rev: 1.07a 12/2007

17/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

V

Range Logic Levels

Parameter

DDQ3

Symbol

Min.

2.0

Typ.

—

Max.

Unit

Notes

V

Input High Voltage

V

+ 0.3

DD

V

1

DD

IH

V

Input Low Voltage

V

–0.3

2.0

—

0.8

+ 0.3

1

DD

IL

V

I/O Input High Voltage

I/O Input Low Voltage

V

—

1,3

DDQ

IHQ

DDQ

V

–0.3

—

0.8

DDQ

ILQ

Notes:

1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-

tions quoted are evaluated for worst case in the temperature range marked on the device.

2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.

DDn

3.

V

(max) is voltage on V

pins plus 0.3 V.

DDQ

IHQ

V

Range Logic Levels

Parameter

DDQ2

Symbol

Min.

Typ.

—

Max.

Unit

Notes

V

Input High Voltage

V

0.6*V

V

+ 0.3

DD

V

1

DD

IH

DD

V

Input Low Voltage

V

0.3*V

DD

–0.3

—

1

DD

IL

V

I/O Input High Voltage

I/O Input Low Voltage

V

0.6*V

V

+ 0.3

DDQ

—

1,3

DDQ

IHQ

DD

V

0.3*V

DD

–0.3

—

DDQ

ILQ

Notes:

1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-

tions quoted are evaluated for worst case in the temperature range marked on the device.

2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.

DDn

3.

V

(max) is voltage on V

pins plus 0.3 V.

DDQ

IHQ

Recommended Operating Temperatures

Parameter

Symbol

Min.

0

Typ.

25

Max.

70

Unit

°C

Notes

T

Ambient Temperature (Commercial Range Versions)

2

A

T

Ambient Temperature (Industrial Range Versions)

–40

25

85

°C

A

Notes:

1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-

tions quoted are evaluated for worst case in the temperature range marked on the device.

2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.

DDn

Rev: 1.07a 12/2007

18/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Undershoot Measurement and Timing

Overshoot Measurement and Timing

V

IH

20% tKC

V

+ 2.0 V

50%

DD

V

SS

50%

V

DD

V

– 2.0 V

SS

20% tKC

V

IL

Capacitance

o

(T = 25 C, f = 1 MHZ, V = 2.5 V)

A

DD

Parameter

Symbol

Test conditions

Typ.

Max.

Unit

pF

C

V

= 0 V

Input Capacitance

4

6

5

7

IN

C

V

OUT

= 0 V

Input/Output Capacitance

pF

I/O

Note:

These parameters are sample tested.

AC Test Conditions

Parameter

Conditions

V

– 0.2 V

Input high level

Input low level

DD

0.2 V

1 V/ns

Input slew rate

V

/2

Input reference level

DDQ

V

/2

Output reference level

Output load

Fig. 1

Notes:

1. Include scope and jig capacitance.

2. Test conditions as specified with output loading as shown in Fig. 1

unless otherwise noted.

3. Device is deselected as defined by the Truth Table.

Output Load 1

DQ

*

50Ω

30pF

V

DDQ/2

* Distributed Test Jig Capacitance

Rev: 1.07a 12/2007

19/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

DC Electrical Characteristics

Parameter

Symbol

Test Conditions

Min

Max

Input Leakage Current

(except mode pins)

I

V = 0 to V

IN DD

–2 uA

2 uA

IL

V

≥ V ≥ V

IN

–1 uA

1 uA

100 uA

DD

IH

I

ZZ Input Current

IN1

0 V ≤ V ≤ V

IN

V

≥ V ≥ V

IN

–100 uA

–1 uA

1 uA

DD

IL

I

FT, SCD, ZQ Input Current

IN2

0 V ≤ V ≤ V

IN

I

Output Disable, V

= 0 to V

Output Leakage Current (x36/x72)

Output Leakage Current (x18)

Output High Voltage

–1 uA

1.7 V

2.4 V

—

1 uA

—

OL

OUT

DDQ

DD

I

OL

V

I

= –8 mA, V

= 2.375 V

= 3.135 V

OH2

OH

V

Output High Voltage

—

OH3

V

I

= 8 mA

OL

Output Low Voltage

0.4 V

OL

Rev: 1.07a 12/2007

20/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Rev: 1.07a 12/2007

21/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

AC Electrical Characteristics

-250

-225

-200

-166

-150

-133

Parameter

Symbol

Unit

Min Max Min Max Min Max Min Max Min Max Min Max

Clock Cycle Time

tKC

tKQ

4.0

—

2.5

3.0

—

6.5

—

4.4

—

2.7

3.0

—

7.0

—

5.0

—

3.0

—

7.5

—

6.0

—

3.5

—

8.0

—

6.7

—

3.8

—

8.5

—

7.5

—

4.0

—

8.5

—

ns

Clock to Output Valid (x18/x36)

Clock to Output Valid (x72)

tKQ

—

Clock to Output Invalid

tKQX

1.5

1.2

0.2

6.5

—

1.5

1.3

0.3

7.0

—

1.5

1.4

0.4

7.5

—

1.5

0.5

8.0

—

1.5

0.5

8.5

—

1.5

0.5

8.5

—

Pipeline

tLZ¹

tS

Clock to Output in Low-Z

Setup time

Hold time

tH

Clock Cycle Time

Clock to Output Valid

tKC

tKQ

tKQX

Clock to Output Invalid

3.0

1.5

0.5

1.3

3.0

1.5

0.5

1.3

3.0

1.5

0.5

1.3

3.0

1.5

0.5

1.3

3.0

1.5

0.5

1.5

3.0

1.5

0.5

1.7

Flow

Through

tLZ¹

tS

Clock to Output in Low-Z

Setup time

Hold time

tH

Clock HIGH Time

tKH

Clock LOW Time

tKL

1.5

—

1.5

—

1.5

—

1.5

—

1.7

1.5

—

2

—

ns

Clock to Output in

High-Z (x18/x36)

tHZ¹

2.5

2.7

3.0

1.5

3.0

Clock to Output in

High-Z (x72)

tHZ¹

tOE

1.5

—

3.0

2.5

3.0

1.5

—

3.0

2.7

3.0

1.5

—

3.0

1.5

—

3.0

3.5

1.5

—

3.0

3.8

1.5

—

3.0

4.0

ns

G to Output Valid

(x18/x36)

G to Output Valid

(x72)

tOLZ¹

tOHZ¹

tZZS²

tZZH²

tZZR

G to output in Low-Z

G to output in High-Z (x18/x36)

G to output in High-Z (x72)

ZZ setup time

0

—

5

—

2.5

3.0

—

0

—

5

—

2.7

3.0

—

0

—

5

—

3.0

—

0

—

5

—

3.0

—

0

—

5

—

3.0

—

0

—

5

—

3.0

—

ns

ZZ hold time

1

ZZ recovery

20

Notes:

1. These parameters are sampled and are not 100% tested.

2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold

times as specified above.

Rev: 1.07a 12/2007

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Pipeline Mode Timing (SCD)

Begin

Read A Cont

Single Read

Cont

Deselect Write B Read C Read C+1 Read C+2 Read C+3 Cont

Deselect

Single Write

tKL

Burst Read

tKH

tKC

CK

ADSP

tS

tH

ADSC initiated read

ADSC

ADV

tS

tH

A

B

C

A0–An

GW

tS

tH

BW

tS

Ba–Bd

E1

tS

Deselected with E1

tH

E1 masks ADSP

tH

E2 and E3 only sampled with ADSP and ADSC

E2

E3

G

tS

D(B)

tKQ

tKQX

tHZ

tOE

tOHZ

Q(A)

tH

tLZ

Q(C)

Q(C+1)

Q(C+2) Q(C+3)

DQa–DQd

Rev: 1.07a 12/2007

23/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Flow Through Mode Timing (SCD)

Begin

Read A Cont

tKH

Cont

Write B Read C Read C+1 Read C+2 Read C+3 Read C Cont

Deselect

tKL

tKC

CK

Fixed High

ADSP

tS

tH

tS

tH

ADSC initiated read

ADSC

ADV

A0–An

GW

tS

tH

tS

tH

A

B

C

tS

tH

tS

tH

BW

tS

tH

Ba–Bd

E1

tS

Deselected with E1

tH

E2 and E3 only sampled with ADSC

E2

tS

tH

E3

G

tH

tS

tKQ

tLZ

tHZ

tOE

tOHZ

D(B)

tKQX

Q(A)

Q(C)

Q(C+1)

Q(C+2)

Q(C+3)

Q(C)

DQa–DQd

Rev: 1.07a 12/2007

24/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Pipeline Mode Timing (DCD)

Begin

Read A Cont

Deselect Deselect Write B Read C Read C+1 Read C+2 Read C+3 Cont

tKL

Deselect Deselect

tKH

tKC

CK

ADSP

tS

ADSC initiated read

tH

ADSC

ADV

tS

tH

A

B

C

Ao–An

GW

tS

tH

BW

tS

Ba–Bd

E1

tS

Deselected with E1

tH

E2 and E3 only sampled with ADSC

tH

E2

E3

G

tS

D(B)

tKQ

tHZ

tOE

tOHZ

Q(A)

tH

tLZ

tKQX

Hi-Z

Q(C)

Q(C+1)

Q(C+2)

Q(C+3)

DQa–DQd

Rev: 1.07a 12/2007

25/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Flow Through Mode Timing (DCD)

Begin

Read A Cont

tKH

Deselect Write B

tKC

Read C Read C+1 Read C+2 Read C+3 Read C Deselect

tKL

CK

Fixed High

ADSP

tS

tH

tS

tH

ADSC initiated read

ADSC

ADV

Ao–An

GW

tH

tS

tH

tS

tH

A

B

C

tS

tH

tS

tH

BW

tH

tS

Ba–Bd

E1

tS

Deselected with E1

tH

E1 masks ADSP

tS

tH

E2 and E3 only sampled with ADSP and ADSC

E1 masks ADSP

E2

tS

tH

E3

G

tH

tS

tOE

tKQ

tKQX

tHZ

tOHZ

D(B)

tLZ

Q(A)

Q(C)

Q(C+1)

Q(C+2)

Q(C+3)

Q(C)

DQa–DQd

Rev: 1.07a 12/2007

26/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Sleep Mode

During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high,

the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to

low, the SRAM operates normally after ZZ recovery time.

Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to I 2. The duration of

SB

Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become

disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.

When the ZZ pin is driven high, I 2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending

SB

operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated

until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands

may be applied while the SRAM is recovering from Sleep mode.

Sleep Mode Timing

tKH

tKC

tKL

CK

Setup

Hold

ADSP

ADSC

tZZR

tZZS

tZZH

ZZ

Application Tips

Single and Dual Cycle Deselect

SCD devices (like this one) force the use of “dummy read cycles” (read cycles that are launched normally, but that are ended with

the output drivers inactive) in a fully synchronous environment. Dummy read cycles waste performance, but their use usually

assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs do not waste

bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at

bank address boundary crossings), but greater care must be exercised to avoid excessive bus contention.

JTAG Port Operation

Overview

The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan

interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with V . The JTAG output

DD

drivers are powered by V

.

DDQ

Disabling the JTAG Port

It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless

clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG

Port unused, TCK, TDI, and TMS may be left floating or tied to either V or V . TDO should be left unconnected.

DD

SS

Rev: 1.07a 12/2007

27/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

JTAG Pin Descriptions

Pin Name

I/O

Description

Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate

from the falling edge of TCK.

TCK

Test Clock

In

The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP

TMS

TDI

Test Mode Select

Test Data In

In controller state machine. An undriven TMS input will produce the same result as a logic one input

level.

The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers

placed between TDI and TDO. The register placed between TDI and TDO is determined by the

In state of the TAP Controller state machine and the instruction that is currently loaded in the TAP

Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce

the same result as a logic one input level.

Output that is active depending on the state of the TAP state machine. Output changes in

Out response to the falling edge of TCK. This is the output side of the serial registers placed between

TDI and TDO.

TDO

Test Data Out

Note:

This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is

held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up.

JTAG Port Registers

Overview

The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s

and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the

rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the

TDI and TDO pins.

Instruction Register

The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or

the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the

TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the

controller is placed in Test-Logic-Reset state.

Bypass Register

The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through

the RAM’s JTAG Port to another device in the scan chain with as little delay as possible.

Boundary Scan Register

The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins.

The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The

Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the

device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan

Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in

Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z,

SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.

Rev: 1.07a 12/2007

28/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

JTAG TAP Block Diagram

·

Boundary Scan Register

·

0

Bypass Register

2

1 0

Instruction Register

TDI

TDO

ID Code Register

31 30 29

2 1

0

·

· · ·

Control Signals

Test Access Port (TAP) Controller

TMS

TCK

Identification (ID) Register

The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in

Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM.

It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the

controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.

ID Register Contents TBD for this part.

Rev: 1.07a 12/2007

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

ID Register Contents

Die

Revision

Code

GSI Technology

JEDEC Vendor

Configuration

ID Code

I/O

Not Used

Bit # 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

0

1

x72

x36

x32

x18

x16

X

0

X

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

0 1 1 0 1 1 0 0 1

X

0

Tap Controller Instruction Set

Overview

There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific

(Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be

implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load

address, data or control signals into the RAM or to preload the I/O buffers.

When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01.

When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired

instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the

TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this

device is listed in the following table.

Rev: 1.07a 12/2007

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Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

JTAG Tap Controller State Diagram

Test Logic Reset

1

0

1

Run Test Idle

Select DR

Select IR

0

1

Capture DR

Capture IR

0

Shift DR

Shift IR

0

1

Exit1 DR

Exit1 IR

0

Pause DR

Pause IR

0

1

Exit2 DR

Exit2 IR

1

Update DR

Update IR

1

0

1

0

Instruction Descriptions

BYPASS

When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This

occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facili-

tate testing of other devices in the scan path.

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is

loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and

I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and

are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because

the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents

while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will

not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the

TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP

operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then

places the boundary scan register between the TDI and TDO pins.

EXTEST

EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with

all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is

still determined by its input pins.

Rev: 1.07a 12/2007

31/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command.

Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output

drivers on the falling edge of TCK when the controller is in the Update-IR state.

Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruc-

tion is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not asso-

ciated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR

state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associ-

ated.

IDCODE

The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and

places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction

loaded in at power up and any time the controller is placed in the Test-Logic-Reset state.

SAMPLE-Z

If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (high-

Z) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR

state.

RFU

These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.

JTAG TAP Instruction Set Summary

Instruction

EXTEST

Code

000

Description

Notes

1

Places the Boundary Scan Register between TDI and TDO.

Preloads ID Register and places it between TDI and TDO.

IDCODE

001

1, 2

Captures I/O ring contents. Places the Boundary Scan Register between TDI and

SAMPLE-Z

010

011

TDO.

1

Forces all RAM output drivers to High-Z.

Do not use this instruction; Reserved for Future Use.

Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.

RFU

SAMPLE/

PRELOAD

Captures I/O ring contents. Places the Boundary Scan Register between TDI and

TDO.

100

101

110

111

1

GSI

GSI private instruction.

Do not use this instruction; Reserved for Future Use.

Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.

RFU

BYPASS

Places Bypass Register between TDI and TDO.

Notes:

1. Instruction codes expressed in binary, MSB on left, LSB on right.

2. Default instruction automatically loaded at power-up and in test-logic-reset state.

Rev: 1.07a 12/2007

32/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

JTAG Port Recommended Operating Conditions and DC Characteristics

Parameter

Symbol

Min.

Max.

Unit Notes

V

0.6 * V

V

+0.3

DD

1.8 V Test Port Input High Voltage

1.8 V Test Port Input Low Voltage

TMS, TCK and TDI Input Leakage Current

TDO Output Leakage Current

Test Port Output High Voltage

Test Port Output Low Voltage

V

1

IHJ

DD

V

0.3 * V

1

–0.3

–300

–1

ILJ

DD

I

uA

V

2

INHJ

I

100

1

3

INLJ

I

–1

4

OLJ

V

1.7

—

5, 6

5, 7

5, 8

5, 9

OHJ

V

—

0.4

—

V

OLJ

V

– 100 mV

DDQ

Test Port Output CMOS High

V

OHJC

V

Test Port Output CMOS Low

—

100 mV

V

OLJC

Notes:

1. Input Under/overshoot voltage must be –1 V > Vi < V

+1 V not to exceed 2.9 V maximum, with a pulse width not to exceed 20% tTKC.

DDn

2.

V

≤ V ≤ V

ILJ

IN

DDn

ILJn

3. 0 V ≤ V ≤ V

IN

4. Output Disable, V

= 0 to V

DDn

OUT

5. The TDO output driver is served by the V

supply.

DDQ

6.

7.

8.

9.

I

= –4 mA

OHJ

= + 4 mA

OLJ

= –100 uA

= +100 uA

OHJC

Rev: 1.07a 12/2007

33/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

JTAG Port Recommended Operating Conditions and DC Characteristics

Parameter

Symbol

Min.

2.0

Max.

Unit Notes

V

+0.3

DD3

3.3 V Test Port Input High Voltage

3.3 V Test Port Input Low Voltage

2.5 V Test Port Input High Voltage

2.5 V Test Port Input Low Voltage

TMS, TCK and TDI Input Leakage Current

TDO Output Leakage Current

V

1

IHJ3

V

–0.3

0.8

+0.3

ILJ3

V

0.6 * V

V

1

IHJ2

DD2

V

0.3 * V

1

–0.3

–300

–1

V

1

ILJ2

DD2

I

uA

V

2

INHJ

I

100

1

3

INLJ

I

–1

4

OLJ

V

Test Port Output High Voltage

1.7

—

5, 6

5, 7

5, 8

5, 9

OHJ

V

Test Port Output Low Voltage

—

0.4

V

OLJ

V

– 100 mV

DDQ

Test Port Output CMOS High

—

V

OHJC

V

Test Port Output CMOS Low

—

100 mV

V

OLJC

Notes:

1. Input Under/overshoot voltage must be –2 V > Vi < V

+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.

DDn

2.

V

≤ V ≤ V

ILJ

IN

DDn

3. 0 V ≤ V ≤ V

IN

ILJn

4. Output Disable, V

= 0 to V

DDn

OUT

5. The TDO output driver is served by the V

supply.

DDQ

6.

7.

8.

9.

I

= –4 mA

OHJ

= + 4 mA

OLJ

= –100 uA

= +100 uA

OHJC

OLJC

JTAG Port AC Test Conditions

Parameter

Conditions

JTAG Port AC Test Load

V

– 0.2 V

Input high level

Input low level

DQ

DD

0.2 V

1 V/ns

*

50Ω

Input slew rate

30pF

V

/2

Input reference level

DDQ

V

/2

DDQ

/2

Output reference level

DDQ

* Distributed Test Jig Capacitance

Notes:

1. Include scope and jig capacitance.

2. Test conditions as shown unless otherwise noted.

Rev: 1.07a 12/2007

34/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

JTAG Port Timing Diagram

tTKC

tTKH

tTKL

TCK

TDI

tTH

tTS

TMS

TDO

tTKQ

tTH

tTS

Parallel SRAM input

JTAG Port AC Electrical Characteristics

Parameter

Symbol

tTKC

tTKQ

tTKH

tTKL

tTS

Min

Max

—

Unit

TCK Cycle Time

50

—

ns

TCK Low to TDO Valid

TCK High Pulse Width

TCK Low Pulse Width

TDI & TMS Set Up Time

TDI & TMS Hold Time

20

—

20

10

—

tTH

—

Boundary Scan (BSDL Files)

For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications

Engineering Department at: apps@gsitechnology.com.

Rev: 1.07a 12/2007

35/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

209 BGA Package Drawing (Package C)

14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array

C A1

A

Side View

D

aaa

D1

e

Bottom View

∅b

e

Symbol

Min

—

Typ

—

Max

1.70

0.60

0.70

0.38

22.1

Units

mm

Symbol

Min

—

Typ

Max

—

Units

mm

A

A1

∅b

c

D1

E

18.0 (BSC)

14.0

0.40

0.50

0.31

21.9

0.50

0.60

0.36

22.0

13.9

—

14.1

—

E1

e

10.0 (BSC)

1.00 (BSC)

0.15

—

D

aaa

—

Rev 1.0

Rev: 1.07a 12/2007

36/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Package Dimensions—119-Bump FPBGA (Package B, Variation 2)

TOP VIEW

BOTTOM VIEW

A1

S

Ø0.10

C

S

Ø0.30 C A

B

Ø0.60~0.90 (119x)

1

2

3

4

5

6

7

6

5

4 3

2

1

A

B

C

D

E

F

A

B

C

D

E

F

G

H

J

G

H

J

K

L

M

N

P

R

T

U

K

L

M

N

P

R

T

U

B

1.27

7.62

14±0.10

A

0.20(4x)

SEATING PLANE

C

Rev: 1.07a 12/2007

37/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Package Dimensions—165-Bump FPBGA (Package E; Variation 1)

A1

1

TOP VIEW

BOTTOM VIEW

A1

M

Ø0.10

Ø0.25 C AB

C

Ø0.44~0.64(165x)

2

3 4 5 6 7 8 9 10 11

11 10 9 8 7 6 5 4 3 2 1

A

B

C

D

E

F

A

B

C

D

E

F

G

H

I

G

H

J

K

L

M

N

P

K

L

M

N

P

R

A

1.0

10.0

1.0

15±0.05

B

0.20(4x)

SEATING PLANE

C

Rev: 1.07a 12/2007

38/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Ordering Information for GSI Synchronous Burst RAMs

2

Speed

3

1

Org

Type

Package

T

Part Number

A

(MHz/ns)

2M x 18

1M x 36

GS832218B-250

GS832218B-225

GS832218B-200

GS832218B-166

GS832218B-150

GS832218B-133

GS832218E-250

GS832218E-225

GS832218E-200

GS832218E-166

GS832218E-150

GS832218E-133

GS832236B-250

GS832236B-225

GS832236B-200

GS832236B-166

GS832236B-150

GS832236B-133

GS832236E-250

GS832236E-225

GS832236E-200

GS832236E-166

GS832236E-150

DCD Pipeline/Flow Through

SCD/DCD Pipeline/Flow Through

119 BGA (var.2)

165 BGA (var.1)

119 BGA (var.2)

165 BGA (var.1)

250/6.5

225/7

C

200/7.5

166/8

150/8.5

133/8.5

250/6.5

225/7

200/7.5

166/8

150/8.5

133/8.5

250/6.5

225/7

200/7.5

166/8

150/8.5

133/8.5

250/6.5

225/7

200/7.5

166/8

150/8.5

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218B-150IB.

2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each

device is Pipeline/Flow Through mode-selectable by the user.

3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are

covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.

Rev: 1.07a 12/2007

39/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Ordering Information for GSI Synchronous Burst RAMs (Continued)

2

Speed

3

1

Org

Type

Package

T

Part Number

A

(MHz/ns)

133/8.5

250/6.5

225/7

1M x 36

512K x 72

2M x 18

1M x 36

GS832236E-133

GS832272C-250

GS832272C-225

GS832272C-200

GS832272C-166

GS832272C-150

GS832272C-133

GS832218B-250I

GS832218B-225I

GS832218B-200I

GS832218B-166I

GS832218B-150I

GS832218B-133I

GS832218E-250I

GS832218E-225I

GS832218E-200I

GS832218E-166I

GS832218E-150I

GS832218E-133I

GS832236B-250I

GS832236B-225I

GS832236B-200I

GS832236B-166I

GS832236B-150I

GS832236B-133I

SCD/DCD Pipeline/Flow Through

DCD Pipeline/Flow Through

165 BGA (var.1)

209 BGA

C

I

209 BGA

200/7.5

166/8

209 BGA

150/8.5

133/8.5

250/6.5

225/7

209 BGA

119 BGA (var.2)

165 BGA (var.1)

119 BGA (var.2)

DCD Pipeline/Flow Through

I

DCD Pipeline/Flow Through

200/7.5

166/8

I

DCD Pipeline/Flow Through

I

DCD Pipeline/Flow Through

150/8.5

133/8.5

250/6.5

225/7

I

DCD Pipeline/Flow Through

I

DCD Pipeline/Flow Through

I

DCD Pipeline/Flow Through

I

DCD Pipeline/Flow Through

200/7.5

166/8

I

DCD Pipeline/Flow Through

I

DCD Pipeline/Flow Through

150/8.5

133/8.5

250/6.5

225/7

I

DCD Pipeline/Flow Through

I

SCD/DCD Pipeline/Flow Through

I

200/7.5

166/8

I

150/8.5

133/8.5

I

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218B-150IB.

2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each

device is Pipeline/Flow Through mode-selectable by the user.

3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are

covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.

Rev: 1.07a 12/2007

40/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Ordering Information for GSI Synchronous Burst RAMs (Continued)

2

Speed

3

1

Org

Type

Package

T

Part Number

A

(MHz/ns)

250/6.5

225/7

1M x 36

GS832236E-250I

GS832236E-225I

GS832236E-200I

GS832236E-166I

GS832236E-150I

GS832236E-133I

GS832272C-250I

GS832272C-225I

GS832272C-200I

GS832272C-166I

GS832272C-150I

GS832272C-133I

SCD/DCD Pipeline/Flow Through

165 BGA (var.1)

209 BGA

I

1M x 36

200/7.5

166/8

1M x 36

150/8.5

133/8.5

250/6.5

225/7

1M x 36

512K x 72

209 BGA

200/7.5

166/8

209 BGA

150/8.5

133/8.5

209 BGA

RoHS-compliant 119 BGA

(var.2)

2M x 18

GS832218GB-250

GS832218GB-225

GS832218GB-200

GS832218GB-166

GS832218GB-150

GS832218GB-133

GS832218GE-250

GS832218GE-225

DCD Pipeline/Flow Through

250/6.5

225/7

C

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 119 BGA

(var.2)

200/7.5

166/8

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 119 BGA

(var.2)

150/8.5

133/8.5

250/6.5

225/7

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218B-150IB.

2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each

device is Pipeline/Flow Through mode-selectable by the user.

3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are

covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.

Rev: 1.07a 12/2007

41/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Ordering Information for GSI Synchronous Burst RAMs (Continued)

2

Speed

3

1

Org

Type

Package

T

Part Number

A

(MHz/ns)

RoHS-compliant 165 BGA

(var.1)

2M x 18

1M x 36

GS832218GE-200

GS832218GE-166

GS832218GE-150

GS832218GE-133

GS832236GB-250

GS832236GB-225

GS832236GB-200

GS832236GB-166

GS832236GB-150

GS832236GB-133

GS832236GE-250

GS832236GE-225

GS832236GE-200

GS832236GE-166

GS832236GE-150

DCD Pipeline/Flow Through

200/7.5

C

RoHS-compliant 165 BGA

(var.1)

166/8

150/8.5

133/8.5

250/6.5

225/7

RoHS-compliant 165 BGA

(var.1)

DCD Pipeline/Flow Through

RoHS-compliant 165 BGA

(var.1)

DCD Pipeline/Flow Through

RoHS-compliant 119 BGA

(var.2)

SCD/DCD Pipeline/Flow Through

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 119 BGA

(var.2)

200/7.5

166/8

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 119 BGA

(var.2)

150/8.5

133/8.5

250/6.5

225/7

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

200/7.5

166/8

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

150/8.5

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218B-150IB.

2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each

device is Pipeline/Flow Through mode-selectable by the user.

3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are

covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.

Rev: 1.07a 12/2007

42/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Ordering Information for GSI Synchronous Burst RAMs (Continued)

2

Speed

3

1

Org

Type

Package

T

Part Number

A

(MHz/ns)

RoHS-compliant 165 BGA

(var.1)

1M x 36

GS832236GE-133

SCD/DCD Pipeline/Flow Through

133/8.5

C

512K x 72

GS832272GC-250

GS832272GC-225

GS832272GC-200

GS832272GC-166

GS832272GC-150

GS832272GC-133

SCD/DCD Pipeline/Flow Through

RoHS-compliant 209 BGA

250/6.5

225/7

C

200/7.5

166/8

150/8.5

133/8.5

RoHS-compliant 119 BGA

(var.2)

2M x 18

GS832218GB-250I

GS832218GB-225I

GS832218GB-200I

GS832218GB-166I

GS832218GB-150I

GS832218GB-133I

GS832218GE-250I

GS832218GE-225I

GS832218GE-200I

GS832218GE-166I

DCD Pipeline/Flow Through

250/6.5

225/7

I

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 119 BGA

(var.2)

200/7.5

166/8

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 119 BGA

(var.2)

150/8.5

133/8.5

250/6.5

225/7

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

200/7.5

166/8

RoHS-compliant 165 BGA

(var.1)

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218B-150IB.

2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each

device is Pipeline/Flow Through mode-selectable by the user.

3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are

covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.

Rev: 1.07a 12/2007

43/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Ordering Information for GSI Synchronous Burst RAMs (Continued)

2

Speed

3

1

Org

Type

Package

T

Part Number

A

(MHz/ns)

RoHS-compliant 165 BGA

(var.1)

2M x 18

1M x 36

GS832218GE-150I

GS832218GE-133I

GS832236GB-250I

GS832236GB-225I

GS832236GB-200I

GS832236GB-166I

GS832236GB-150I

GS832236GB-133I

GS832236GE-250I

GS832236GE-225I

GS832236GE-200I

GS832236GE-166I

GS832236GE-150I

DCD Pipeline/Flow Through

150/8.5

I

RoHS-compliant 165 BGA

(var.1)

133/8.5

250/6.5

225/7

RoHS-compliant 119 BGA

(var.2)

SCD/DCD Pipeline/Flow Through

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 119 BGA

(var.2)

200/7.5

166/8

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 119 BGA

(var.2)

150/8.5

133/8.5

250/6.5

225/7

RoHS-compliant 119 BGA

(var.2)

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

200/7.5

166/8

RoHS-compliant 165 BGA

(var.1)

RoHS-compliant 165 BGA

(var.1)

150/8.5

RoHS-compliant 165 BGA

(var.1)

1M x 36

GS832236GE-133I

GS832272GC-250I

SCD/DCD Pipeline/Flow Through

133/8.5

250/6.5

I

512K x 72

RoHS-compliant 209 BGA

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218B-150IB.

2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each

device is Pipeline/Flow Through mode-selectable by the user.

3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are

covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.

Rev: 1.07a 12/2007

44/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

Ordering Information for GSI Synchronous Burst RAMs (Continued)

2

Speed

3

1

Org

Type

Package

T

Part Number

A

(MHz/ns)

512K x 72

GS832272GC-225I

GS832272GC-200I

GS832272GC-166I

GS832272GC-150I

GS832272GC-133I

SCD/DCD Pipeline/Flow Through

RoHS-compliant 209 BGA

225/7

I

200/7.5

166/8

150/8.5

133/8.5

Notes:

1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS832218B-150IB.

2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each

device is Pipeline/Flow Through mode-selectable by the user.

3. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.

A

4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are

covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.

Rev: 1.07a 12/2007

45/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS832218(B/E)/GS832236(B/E)/GS832272(C)

36Mb Sync SRAM Data Sheet Revision History

DS/DateRev. Code: Old;

New

Types of Changes

Format or Content

Page;Revisions;Reason

• Creation of new datasheet

832218_r1

• Added 165-BGA package

• Updated all power numbers on page 1 and page 26

• Updated AC Characteristics table

• Removed all references to parity

• Updated tables on page 23

• Updated FT power numbers

832218_r1; 832218_r1_01

Content

• Updated Absolute Maximum Ratings table

• Corrected Capacitance table

• Updated tKQ (PL) numbers in table on page 1

• Updated DC Electrical Characteristics table

• Removed Output Load 2 diagram on page 15

• Updated standby current numbers in Operating Currents table

• Updated timing diagrams

• Removed erroneous overbars from address pins on the x18

165 BGA pinout

• Corrected thickness of “E” package to 1.4 mm

832218_r1_01;

832218_r1_02

Content

• Added Thermal Characteristics table to datasheet

• Basic format updating

832218_r1_02;

832218_r1_03

Content/Format

• Removed erroneous parity references from block diagrams

• Removed Thermal Characteristics table from Abs Max section

and added specific thermal tables for each mechanical

drawing

832218_r1_03;

832218_r1_04

Content/Format

• Basic format update

• Updated format

• Added missing tH (Pipeline) in AC Characteristics table

832218_r1_04;

832218_r1_05

Content/Format

• Corrected note 1 on table on page 33

• Corrected mechanical drawings

832218_r1_05;

832218_r1_06

• RoHS-compliant information added

• (Rev. 1.07a: Removed Preliminary banner due to production

status)

832218_r1_06;

832218_r1_07

Content

Rev: 1.07a 12/2007

46/46

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.


型号：	GS832218E-250T
厂家：	GSI TECHNOLOGY
描述：	Cache SRAM, 2MX18, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 时钟静态存储器内存集成电路
文件：	总46页 (文件大小：3069K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

GS832218E-250T [GSI]

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