1MBI1200U4C-120 [FUJI]

IGBT MODULE; IGBT模块
1MBI1200U4C-120
型号: 1MBI1200U4C-120
厂家: FUJI ELECTRIC    FUJI ELECTRIC
描述:

IGBT MODULE
IGBT模块

晶体 晶体管 双极性晶体管 栅 局域网
文件: 总6页 (文件大小:449K)
中文:  中文翻译
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1MBI1200U4C-120  
IGBT MODULE (U series)  
IGBT Modules  
1200V / 1200A / 1 in one package  
Features  
High speed switching  
Voltage drive  
Low Inductance module structure  
Applications  
Inverter for Motor Drive  
AC and DC Servo Drive Amplifier  
Uninterruptible Power Supply  
Industrial machines, such as Welding machines  
Maximum Ratings and Characteristics  
Absolute Maximum Ratings (at Tc=25°C unless otherwise specified)  
Items  
Symbols  
Conditions  
Maximum ratings  
Units  
Collector-Emitter voltage  
Gate-Emitter voltage  
V
CES  
1200  
±20  
V
V
VGES  
Tc=25°C  
Tc=80°C  
Tc=25°C  
Tc=80°C  
1600  
1200  
3200  
2400  
1200  
2400  
7350  
150  
Ic  
Continuous  
1ms  
Collector current  
Ic pulse  
A
-Ic  
-Ic pulse  
Pc  
Tj  
Tstg  
1ms  
1 device  
Collector power dissipation  
Junction temperature  
Storage temperature  
W
°C  
°C  
-40 to +125  
2500  
5.75  
Isolation voltage Between terminal and copper base (*1) Viso  
Mounting (*2)  
AC : 1min.  
VAC  
Screw torque  
Main Terminals (*2)  
Sense Terminals (*2)  
10  
2.5  
N·m  
Note *1: All terminals should be connected together when isolation test will be done.  
Note *2: Recommendable value : Mounting : 4.25-5.75 N·m (M6), Main Terminal : 8-10 N·m (M8), Sense Terminal : 1.7-2.5 N·m (M4)  
Electrical characteristics (at Tj= 25°C unless otherwise specified)  
Characteristics  
Items  
Symbols  
Conditions  
Units  
min.  
typ.  
-
max.  
1.0  
Zero gate voltage collector current  
Gate-Emitter leakage current  
Gate-Emitter threshold voltage  
I
I
CES  
GES  
V
V
V
GE = 0V, VCE = 1200V  
CE = 0V, VGE = ±20V  
-
-
mA  
nA  
V
-
2400  
V
GE (th)  
CE = 20V, I  
C
= 1200mA  
5.5  
-
6.5  
7.5  
2.25  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
2.08  
2.28  
1.90  
2.10  
135  
0.90  
0.50  
0.80  
0.20  
1.83  
1.93  
1.65  
1.75  
0.35  
0.15  
V
CE (sat)  
(main terminal)  
-
V
GE = 15V  
= 1200A  
Collector-Emitter saturation voltage  
V
I
C
-
2.05  
V
CE (sat)  
(chip)  
Cies  
ton  
tr  
toff  
tf  
-
-
-
-
-
-
Input capacitance  
Turn-on time  
V
GE = 0V, VCE = 10V, f = 1MHz  
-
-
-
-
-
-
-
-
-
-
-
nF  
µs  
V
V
CC = 600V, I  
GE = ±15V, Tj = 125°C  
C
= 1200A  
R
gon = 2Ω, Rgoff = 1Ω  
Turn-off time  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
2.00  
V
F
(main terminal)  
-
V
GE = 0V  
Forward on voltage  
V
I
F
= 1200A  
1.80  
V
F
(chip)  
-
-
-
Reverse recovery time  
Lead resistance, terminal-chip  
trr  
R lead  
I
F
= 1200A  
µs  
mΩ  
Thermal resistance characteristics  
Items  
Characteristics  
Symbols Conditions  
Units  
min.  
typ.  
max.  
IGBT  
Rth(j-c)  
-
-
-
-
-
0.017  
0.030  
-
Thermal resistance (1device)  
FWD  
°C/W  
Contact thermal resistance (1device)  
Rth(c-f)  
with Thermal Compound (*3)  
0.006  
Note *3: This is the value which is defined mounting on the additional cooling fin with thermal compound.  
1
1MBI1200U4C-120  
IGBT Modules  
Characteristics (Representative)  
Collector current vs. Collector-Emitter voltage (typ.)  
Tj=25°C ,chip  
Collector current vs. Collector-Emitter voltage (typ.)  
Tj= 125°C, chip  
2800  
2400  
2000  
1600  
1200  
800  
2800  
2400  
2000  
1600  
1200  
800  
VGE=20V 15V  
VGE=20 15V  
12V  
12V  
10V  
8V  
10V  
8V  
400  
400  
0
0
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
Collector-Emitter voltage : VCE [V]  
Collector-Emitter voltage : VCE [V]  
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)  
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)  
Tj=25°C ,chip  
VGE=+15V,chip  
10  
2800  
Tj=25°C  
Tj=125°C  
2400  
2000  
1600  
1200  
800  
400  
0
8
6
4
Ic=2400A  
2
0
Ic=1200A  
Ic=600A  
5
10  
15  
20  
25  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
Gate - Emitter voltage : VGE [ V ]  
Collector-Emitter voltage : VCE [V]  
Dynamic Gate charge (typ.)  
Tj= 25°C  
Capacitance vs. Collector-Emitter voltage (typ.)  
VGE=0V, f= 1MHz, Tj= 25°C  
1000  
1000  
800  
600  
400  
200  
0
25  
20  
15  
10  
5
Cies  
VGE  
100  
10  
1
VCE  
Cres  
Coes  
0
0
1000 2000 3000 4000 5000 6000  
0
10  
20  
30  
Collector-Emitter voltage : VCE [V]  
Gate charge : Qg [ nC ]  
2
1MBI1200U4C-120  
IGBT Modules  
Switching time vs. Gate resistance (typ.)  
Vcc=600V, Ic=1200A,VGE=±15V, Tj=125°C  
Switching time vs. Collector current (typ.)  
Vcc=600V, VGE=±15V, Rgon=2Ω, Rgoff=1Ω, Tj=125°C  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
ton  
ton  
toff  
tr  
tr  
toff  
tf  
tf  
16  
0
2
4
6
8
10  
12  
14  
18  
0
400  
800  
1200  
1600  
2000  
Gate resistance : Rg [ Ω ]  
Collector current : Ic [ A ]  
Switching loss vs. Gate resistance (typ.)  
Vcc=600V, Ic=1200A,VGE=±15V, Tj=125°C  
Switching loss vs. Collector current (typ.)  
Vcc=600V, VGE=±15V, Rgon=2Ω, Rgoff=1Ω, Tj=125°C  
400  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
Eon  
350  
300  
250  
200  
150  
100  
50  
Eoff  
Eon  
Eoff  
Err  
Err  
0
0
2
4
6
8
10  
12  
14  
16  
18  
0
400  
800  
1200  
1600  
2000  
Collector current : Ic [ A ] , Forward current : IF [ A ]  
Gate resistance : Rg [ Ω ]  
Reverse bias safe operating area (max.)  
± VGE=15V ,Tj = 125°C / chip  
2800  
2400  
2000  
1600  
1200  
800  
400  
0
0
200  
400  
600  
800 1000 1200 1400  
Collector - Emitter voltage : VCE [ V ]  
3
1MBI1200U4C-120  
IGBT Modules  
Reverse recovery characteristics (typ.)  
Vcc=600V, VGE=±15V, Rgon=2Ω, Tj=125°C  
Forward current vs. Forward on voltage (typ.)  
chip  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
2800  
2400  
2000  
1600  
1200  
800  
Tj=25°C Tj=125°C  
Irr  
trr  
400  
0
0
400  
800  
1200  
1600  
2000  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
Forward current : IF [ A ]  
Forward on voltage : VF [ V ]  
Transient thermal resistance (max.)  
0.100  
0.010  
0.001  
FWD  
IGBT  
0.001  
0.010  
0.100  
1.000  
Pulse width : Pw [ sec ]  
4
1MBI1200U4C-120  
IGBT Modules  
Outline Drawings, mm  
Equivalent Circuit Schematic  
C
C
sense collector  
C
gate  
G
E
sense emitter  
E
E
5
1MBI1200U4C-120  
IGBT Modules  
WARNING  
1. This Catalog contains the product specifications, characteristics, data, materials, and structures as of October 2008.  
The contents are subject to change without notice for specification changes or other reasons. When using a product listed in this  
Catalog, be sure to obtain the latest specifications.  
2. All applications described in this Catalog exemplify the use of Fuji's products for your reference only. No right or license, either  
express or implied, under any patent, copyright, trade secret or other intellectual property right owned by Fuji Electric Device  
Technology Co., Ltd. is (or shall be deemed) granted. Fuji Electric Device Technology Co., Ltd. makes no representation or  
warranty, whether express or implied, relating to the infringement or alleged infringement of other's intellectual property rights which  
may arise from the use of the applications described herein.  
3. Although Fuji Electric Device Technology Co., Ltd. is enhancing product quality and reliability, a small percentage of semiconductor  
products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take  
adequate safety measures to prevent the equipment from causing a physical injury, fire, or other problem if any of the products  
become faulty. It is recommended to make your design fail-safe, flame retardant, and free of malfunction.  
4. The products introduced in this Catalog are intended for use in the following electronic and electrical equipment which has  
normal reliability requirements.  
• Computers  
• Machine tools  
• OA equipment  
• Audiovisual equipment  
• Communications equipment (terminal devices)  
• Electrical home appliances • Personal equipment  
• Measurement equipment  
• Industrial robots etc.  
5. If you need to use a product in this Catalog for equipment requiring higher reliability than normal, such as for the equipment listed  
below, it is imperative to contact Fuji Electric Device Technology Co., Ltd. to obtain prior approval. When using these products for  
such equipment, take adequate measures such as a backup system to prevent the equipment from malfunctioning even if a Fuji's  
product incorporated in the equipment becomes faulty.  
• Transportation equipment (mounted on cars and ships)  
• Traffic-signal control equipment  
• Trunk communications equipment  
• Gas leakage detectors with an auto-shut-off feature  
• Emergency equipment for responding to disasters and anti-burglary devices  
• Medical equipment  
• Safety devices  
6. Do not use products in this Catalog for the equipment requiring strict reliability such as the following and equivalents to strategic  
equipment (without limitation).  
• Space equipment  
• Aeronautic equipment  
• Nuclear control equipment  
• Submarine repeater equipment  
7. Copyright ©1996-2008 by Fuji Electric Device Technology Co., Ltd. All rights reserved.  
No part of this Catalog may be reproduced in any form or by any means without the express permission of Fuji Electric Device  
Technology Co., Ltd.  
8. If you have any question about any portion in this Catalog, ask Fuji Electric Device Technology Co., Ltd. or its sales agents before  
using the product.  
Neither Fuji Electric Device Technology Co., Ltd. nor its agents shall be liable for any injury caused by any use of the products not in  
accordance with instructions set forth herein.  
6

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