MMA6260QR2 [FREESCALE]
【1.5g Dual Axis Micromachined Accelerometer; 【 1.5克双轴微机械加速度计
| 型号： | MMA6260QR2 |
| 厂家： | 
Freescale |
| 描述： | 【1.5g Dual Axis Micromachined Accelerometer |
| 文件： | 总11页 (文件大小：276K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: MMA6260Q
Rev 3, 10/2006
Freescale Semiconductor
Technical Data
±1.5g Dual Axis
Micromachined Accelerometer
The MMA6200 series of low cost capacitive micromachined accelerometers
feature signal conditioning, a 1-pole low pass filter and temperature compensa-
tion. Zero-g offset full scale span and filter cut-off are factory set and require no
external devices. A full system self-test capability verifies system functionality.
MMA6260Q
MMA6261Q
MMA6262Q
MMA6263Q
Features
•
•
•
•
•
•
•
•
•
•
High Sensitivity
Low Noise
MMA6260Q Series: X-Y AXIS
SENSITIVITYMICROMACHINED
ACCELEROMETER
Low Power
2.7 V to 3.6 V Operation
6mm x 6mm x 1.98mm QFN
Integral Signal Conditioning with Low Pass Filter
Linear Output
±1.5 g
Ratiometric Performance
Self-Test
Bottom View
Robust Design, High Shocks Survivability
Typical Applications
•
•
•
•
•
•
•
Tilt Monitoring
Position & Motion Sensing
Freefall Detection
Impact Monitoring
16-LEAD
QFN
CASE 1477-02
Appliance Control
Vibration Monitoring and Recording
Smart Portable Electronics
ORDERING INFORMATION
Top View
Bandwidth
Response
IDD
Device Name
Case No.
Package
MMA6260Q
MMA6260QR2
MMA6261Q
50 Hz
50 Hz
1.2 mA
1.2 mA
1.2 mA
1.2 mA
2.2 mA
2.2 mA
2.2 mA
2.2 mA
1477-02
1477-02
1477-02
1477-02
1477-02
1477-02
1477-02
1477-02
QFN-16, Tube
QFN-16,Tape & Reel
QFN-16, Tube
16 15 14 13
NC
ST
12
300 Hz
300 Hz
150 Hz
150 Hz
900 Hz
900 Hz
1
NC
VDD
VSS
2
11 N/C
10 N/C
MMA6261QR2
MMA6262Q
QFN-16,Tape & Reel
QFN-16,Tube
3
4
9
N/C
MMA6262QR2
MMA6263Q
QFN-16,Tape & Reel
QFN-16, Tube
5
6
7
8
MMA6263QR2
QFN-16,Tape & Reel
Figure 1. Pin Connections
© Freescale Semiconductor, Inc., 2006. All rights reserved.
VDD
XOUT
G-Cell
Sensor
X-Temp
Comp
X-Integrator
X-Gain
X-Filter
Control Logic &
EEPROM Trim Circuits
ST
Self Test
Oscillator
Clock Generator
Y-Temp
Comp
YOUT
VSS
Y-Integrator
Y-Gain
Y-Filter
Figure 2. Simplified Accelerometer Functional Block Diagram
Table 1. Maximum Ratings
(Maximum ratings are the limits to which the device can be exposed without causing permanent damage.)
Rating
Maximum Acceleration (all axis)
Symbol
gmax
Value
±2000
Unit
g
Supply Voltage
VDD
–0.3 to +3.6
1.2
V
Drop Test(1)
Ddrop
Tstg
m
Storage Temperature Range
1. Dropped onto concrete surface from any axis.
–40 to +125
°C
ELECTRO STATIC DISCHARGE (ESD)
WARNING: This device is sensitive to electrostatic
discharge.
Although the Freescale accelerometers contain internal
2 kV ESD protection circuitry, extra precaution must be taken
by the user to protect the chip from ESD. A charge of over
2000 volts can accumulate on the human body or associated
test equipment. A charge of this magnitude can alter the
performance or cause failure of the chip. When handling the
accelerometer, proper ESD precautions should be followed
to avoid exposing the device to discharges which may be
detrimental to its performance.
MMA6260Q
Sensors
2
Freescale Semiconductor
Table 2. Operating Characteristics
Unless otherwise noted: –20°C < TA < 85°C, 3.0 V < VDD < 3.6 V, Acceleration = 0g, Loaded output (1)
Characteristic
Symbol
Min
Typ
Max
Unit
Operating Range(2)
Supply Voltage(3)
Supply Current
VDD
2.7
3.3
3.6
V
MMA6260Q, MMA6261Q
IDD
IDD
TA
—
—
1.2
2.2
—
1.5
3.0
+85
—
mA
mA
°C
g
MMA6262Q, MMA6263Q
Operating Temperature Range
Acceleration Range
Output Signal
–20
—
gFS
1.5
Zero g (TA = 25°C, VDD = 3.3 V)(4)
VOFF
VOFF, TA
S
1.485
—
1.65
2.0
1.815
—
V
Zero g
mg/°C
mV/g
%/°C
Sensitivity (TA = 25°C, VDD = 3.3 V)
Sensitivity
740
—
800
860
—
S, TA
0.015
Bandwidth Response
MMA6260Q
f_3dB
f_3dB
—
—
50
300
150
900
—
—
—
Hz
Hz
MMA6261Q
MMA6262Q
f_3dB
—
—
Hz
MMA6263Q
f_3dB
—
—
Hz
Nonlinearity
NLOUT
–1.0
+1.0
% FSO
Noise
MMA6260Q RMS (0.1 Hz – 1 kHz)
MMA6261Q RMS (0.1 Hz – 1 kHz)
MMA6262Q RMS (0.1 Hz – 1 kHz)
MMA6263Q RMS (0.1 Hz – 1 kHz)
Power Spectral Density RMS (0.1 Hz – 1 kHz)
MMA6260Q, MMA6261Q
MMA6262Q, MMA6263Q
Self-Test
nRMS
nRMS
nRMS
nRMS
—
—
—
—
1.8
3.5
1.3
2.5
—
—
—
—
mVrms
nPSD
nPSD
—
—
300
200
—
—
ug/√Hz
Output Response
VST
VIL
0.9 VDD
—
—
—
VDD
0.3 VDD
VDD
V
V
Input Low
Input High
VIH
RPO
tST
0.7 VDD
43
—
V
Pull-Down Resistance(5)
Response Time(6)
57
2.0
71
kΩ
ms
—
—
Output Stage Performance
Full-Scale Output Range (IOUT = 200 µA)
Capacitive Load Drive(7)
Output Impedance
VFSO
CL
VSS +0.25
—
—
50
VDD –0.25
100
V
pF
Ω
—
—
ZO
300
Power-Up Response Time
MMA6260Q
tRESPONSE
tRESPONSE
tRESPONSE
tRESPONSE
—
—
—
—
14
2.0
4.0
0.7
—
—
—
—
ms
ms
ms
ms
MMA6261Q
MMA6262Q
MMA6263Q
Mechanical Characteristics
Transverse Sensitivity(8)
VZX
,
,
–5.0
—
+5.0
% FSO
YX ZY
1. For a loaded output, the measurements are observed after an RC filter consisting of a 1.0 kΩ resistor and a 0.1 µF capacitor to ground.
2. These limits define the range of operation for which the part will meet specification.
3. Within the supply range of 2.7 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device
may operate as a linear device but is not guaranteed to be in calibration.
4. The device can measure both + and – acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output
will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2.
5. The digital input pin has an internal pull-down resistance to prevent inadvertent self-test initiation due to external board level leakages.
6. Time for the output to reach 90% of its final value after a self-test is initiated.
7. Preserves phase margin (60°) to guarantee output amplifier stability.
8. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity.
MMA6260Q
Sensors
Freescale Semiconductor
3
PRINCIPLE OF OPERATION
The Freescale accelerometer is a surface-micromachined
SPECIAL FEATURES
integrated-circuit accelerometer.
The device consists of a surface micromachined
capacitive sensing cell (g-cell) and a signal conditioning ASIC
contained in a single integrated circuit package. The sensing
element is sealed hermetically at the wafer level using a bulk
micromachined cap wafer.
The g-cell is a mechanical structure formed from
semiconductor materials (polysilicon) using semiconductor
processes (masking and etching). It can be modeled as a set
of beams attached to a movable central mass that moves
between fixed beams. The movable beams can be deflected
from their rest position by subjecting the system to an
acceleration (Figure 3).
As the beams attached to the central mass move, the
distance from them to the fixed beams on one side will
increase by the same amount that the distance to the fixed
beams on the other side decreases. The change in distance
is a measure of acceleration.
The g-cell plates form two back-to-back capacitors
(Figure 4). As the center plate moves with acceleration, the
distance between the plates changes and each capacitor's
value will change, (C = Aε/D). Where A is the area of the
plate, ε is the dielectric constant, and D is the distance
between the plates.
Filtering
These Freescale accelerometers contain an onboard
single-pole switched capacitor filter. Because the filter is
realized using switched capacitor techniques, there is no
requirement for external passive components (resistors and
capacitors) to set the cut-off frequency.
Self-Test
The sensor provides a self-test feature allowing the
verification of the mechanical and electrical integrity of the
accelerometer at any time before or after installation. A fourth
plate is used in the g-cell as a self-test plate. When a logic
high input to the self-test pin is applied, a calibrated potential
is applied across the self-test plate and the moveable plate.
The resulting electrostatic force (Fe = 1/2 AV2/d2) causes the
center plate to deflect. The resultant deflection is measured
by the accelerometer's ASIC and a proportional output
voltage results. This procedure assures both the mechanical
(g-cell) and electronic sections of the accelerometer are
functioning.
Freescale accelerometers include fault detection circuitry
and a fault latch. Parity of the EEPROM bits becomes odd in
number.
The ASIC uses switched capacitor techniques to measure
the g-cell capacitors and extract the acceleration data from
the difference between the two capacitors. The ASIC also
signal conditions and filters (switched capacitor) the signal,
providing a high level output voltage that is ratiometric and
proportional to acceleration.
Self-test is disabled when EEPROM parity error occurs.
Ratiometricity
Ratiometricity simply means the output offset voltage and
sensitivity will scale linearly with applied supply voltage. That
is, as supply voltage is increased, the sensitivity and offset
increase linearly; as supply voltage decreases, offset and
sensitivity decrease linearly. This is a key feature when
interfacing to a microcontroller or an A/D converter because
it provides system level cancellation of supply induced errors
in the analog to digital conversion process.
Acceleration
Figure 3. Transducer
Physical Model
Figure 4. Equivalent
Circuit Model
MMA6260Q
Sensors
4
Freescale Semiconductor
BASIC CONNECTIONS
PCB Layout
Pinout Description
Top View
P0
ST
XOUT
R
A/D IN
16 15 14 13
0.1 µF
0.1 µF
1 kΩ
C
C
NC
VSS
ST
12
1
YOUT
VSS
R
A/D IN
0.1 µF
C
NC
VDD
VSS
2
3
4
11 N/C
10 N/C
1 kΩ
VDD
C
0.1 µF
VDD
9
N/C
VRH
5
6
7
8
C
0.1 µF
Power Supply
Figure 4. Pinout Description
Pin
Figure 6. Recommend PCB Layout for Interfacing
Accelerometer to Microcontroller
Pin No.
Description
Name
NOTES:
1, 5 – 7, 13, 16
N/C
No internal connection.
Leave unconnected.
1. Use 0.1 µF capacitor on VDD to decouple the power
source.
14
15
YOUT
XOUT
Output voltage of the accelerometer.
Y Direction.
2. Physical coupling distance of the accelerometer to the
microcontroller should be minimal.
Output voltage of the accelerometer.
X Direction.
3. Flag underneath package is connected to ground.
3
4
VDD
VSS
N/C
Power supply input.
4. Place a ground plane beneath the accelerometer to
reduce noise, the ground plane should be attached to
all of the open ended terminals shown in Figure 6.
The power supply ground.
2, 8 – 11
Used for factory trim.
Leave unconnected.
5. Use an RC filter with 1.0 kΩ and 0.1 µF on the outputs
of the accelerometer to minimize clock noise (from the
switched capacitor filter circuit).
12
ST
Logic input pin used to initiate
self-test.
6. PCB layout of power and ground should not couple
power supply noise.
7. Accelerometer and microcontroller should not be a
high current path.
VDD
MMA6260Q
Series
8. A/D sampling rate and any external power supply
switching frequency should be selected such that they
do not interfere with the internal accelerometer
1 kΩ
3
14
15
VDD
YOUT
X Output
Signal
sampling frequency (16 kHz for Low IDD and 52 kHz for
0.1 µF
0.1 µF
Standard IDD for the sampling frequency). This will
prevent aliasing errors.
4
VSS
1 kΩ
9. PCB layout should not run traces or vias under the
QFN part. This could lead to ground shorting to the
accelerometer flag.
XOUT
Y Output
Signal
12
Logic
Input
ST
0.1 µF
Figure 5. Accelerometer with Recommended
Connection Diagram
MMA6260Q
Sensors
Freescale Semiconductor
5
DYNAMIC ACCELERATION
Top View
+Y
16 15 14 13
1
2
12
11
+X
–X
3
4
10
9
5
6
7
8
–Y
16-Pin QFN Package
STATIC ACCELERATION
Top View
Direction of Earth’s gravity field(1)
XOUT
YOUT
@ 0g =
1.65 V
.85 V
@
-1g = 0
XOUT @ -1g = 0.85 V
XOUT @ +1g = 2.45 V
Y
OUT @ 0g = 1.65 V
Y
OUT @ 0g = 1.65 V
XOUT @ 0g = 1.65 V
OUT @ +1g = 2.45 V
Y
1. When positioned as shown, the Earth’s gravity will result in a positive 1g output.
MMA6260Q
Sensors
Freescale Semiconductor
6
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package.
With the correct footprint, the packages will self-align when
subjected to a solder reflow process. It is always
6.0
0.55
4.25
12
9
recommended to design boards with a solder mask layer to
avoid bridging and shorting between solder pads.
1.00
1
4
Flag
Pin 1 ID (non metallic)
Solder areas
Non-Solder areas
MMA6260Q
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1477-02
ISSUE B
16-LEAD QFN
MMA6260Q
Sensors
Freescale Semiconductor
8
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1477-02
ISSUE B
16-LEAD QFN
MMA6260Q
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1477-02
ISSUE B
16-LEAD QFN
MMA6260Q
Sensors
Freescale Semiconductor
10
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MMA6260Q
Rev. 3
10/2006
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