LP6872 [FILTRONIC]

0.5W POWER PHEMT; 0.5W功率PHEMT
LP6872
型号: LP6872
厂家: FILTRONIC COMPOUND SEMICONDUCTORS    FILTRONIC COMPOUND SEMICONDUCTORS
描述:

0.5W POWER PHEMT
0.5W功率PHEMT

晶体 晶体管
文件: 总2页 (文件大小:41K)
中文:  中文翻译
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LP 6 8 7 2  
0 .5 W POWER P HEMT  
DRAIN  
BOND  
PAD (2X)  
·
FEATURES  
¨
27 dBm Output Power at 1-dB  
Compression at 18 GHz  
9.5 dB Power Gain at 18 GHz  
55% Power-Added Efficiency  
SOURCE  
BOND  
PAD (2x)  
¨
¨
GATE  
BOND  
PAD (2X)  
DIE SIZE: 14.6X19.7 mils (370x500 mm)  
DIE THICKNESS: 3.0 mils (75 mm)  
BONDING PADS: 1.9X2.4 mils (50x60 mm)  
·
DES CRIP TION AND AP P LICATIONS  
The LP6872 is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs)  
Pseudomorphic High Electron Mobility Transistor (PHEMT), utilizing an Electron-Beam direct-  
write 0.25 mm by 720 mm Schottky barrier gate. The recessed “mushroom” gate structure minimizes  
parasitic gate-source and gate resistances. The epitaxial structure and processing have been  
optimized for reliable high-power applications. The LP6872 also features Si3N4 passivation.  
Typical applications include commercial wireless infrastructure amplifiers, such as SATCOM uplink  
transmitters, PCS/Cellular low-voltage high-efficiency output amplifiers, and medium-haul digital  
radio transmitters.  
·
ELECTRICAL S P ECIFICATIONS @ TAm b ie n t = 2 5 °C  
Parameter  
Symbol  
IDSS  
Test Conditions  
VDS = 2 V; VGS = 0 V  
VDS = 8 V; IDS = 50% IDSS  
VDS = 8 V; IDS = 50% IDSS  
VDS = 8 V; IDS = 50% IDSS  
VDS = 2 V; VGS = 1 V  
VDS = 2 V; VGS = 0 V  
VGS = -5 V  
Min  
180  
25  
Typ  
245  
27  
Max  
Units  
mA  
dBm  
dB  
Saturated Drain-Source Current  
Power at 1-dB Compression  
Power Gain at 1-dB Compression  
Power-Added Efficiency  
Maximum Drain-Source Current  
Transconductance  
260  
P-1dB  
G-1dB  
PAE  
IMAX  
GM  
8
9.5  
55  
%
385  
220  
5
mA  
mS  
mA  
V
175  
Gate-Source Leakage Current  
Pinch-Off Voltage  
IGSO  
40  
VP  
VDS = 2 V; IDS = 4 mA  
IGS = 4 mA  
-0.25  
-10  
-1.2  
-13  
-2.0  
Gate-Source Breakdown  
Voltage Magnitude  
|VBDGS  
|
V
Gate-Drain Breakdown  
Voltage Magnitude  
|VBDGD  
|
IGD = 4 mA  
-10  
-14  
70  
V
Thermal Resistivity  
frequency=18 GHz  
QJC  
°C/W  
P h o n e : (408) 988-1845  
Fa x: (408) 970-9950  
h ttp :// www.filss.com  
Re vis e d : 1/18/01  
Em a il: sales@filss.com  
LP 6 8 7 2  
0 .5 W POWER P HEMT  
·
ABS OLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
Test Conditions  
Min  
Max  
Units  
Drain-Source Voltage  
VDS  
12  
V
TAmbient = 22 ± 3 °C  
Gate-Source Voltage  
Drain-Source Current  
Gate Current  
VGS  
IDS  
-4  
2xIDSS  
35  
V
mA  
mA  
mW  
ºC  
TAmbient = 22 ± 3 °C  
TAmbient = 22 ± 3 °C  
TAmbient = 22 ± 3 °C  
TAmbient = 22 ± 3 °C  
TAmbient = 22 ± 3 °C  
IG  
RF Input Power  
PIN  
300  
Channel Operating Temperature  
Storage Temperature  
Total Power Dissipation  
TCH  
TSTG  
PTOT  
175  
-65  
175  
ºC  
1.76  
W
TAmbient = 22 ± 3 °C  
Notes:  
·
·
Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.  
Power Dissipation defined as: PTOT º (PDC + PIN) – POUT, where  
PDC: DC Bias Power  
PIN: RF Input Power  
POUT: RF Output Power  
·
Absolute Maximum Power Dissipation to be de-rated as follows above 25°C:  
PTOT= 1.76W – (0.0117W/°C) x THS  
where THS = heatsink or ambient temperature.  
·
·
·
HANDLING P RECAUTIONS  
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic  
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and  
testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control  
measures can be found in MIL-STD-1686 and MIL-HDBK-263.  
AS S EMBLY INS TRUCTIONS  
The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage  
temperature should be 280-290°C; maximum time at temperature is one minute. The recommended  
wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm)  
gold wire. Stage temperature should be 250-260°C.  
AP P LICATIONS NOTES & DES IGN DATA  
Applications Notes are available from your local Filtronic Sales Representative or directly from the  
factory. Complete design data, including S-parameters, noise data, and large-signal models are  
available on the Filtronic web site.  
All information and specifications are subject to change without notice.  
P h o n e : (408) 988-1845  
Fa x: (408) 970-9950  
h ttp :// www.filss.com  
Re vis e d : 1/18/01  
Em a il: sales@filss.com  

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