MPSW56 [FAIRCHILD]

PNP General Purpose Amplifier; PNP通用放大器
MPSW56
型号: MPSW56
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

PNP General Purpose Amplifier
PNP通用放大器

晶体 放大器 晶体管
文件: 总9页 (文件大小:382K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MPSW56  
TO-226  
C
B
E
PNP General Purpose Amplifier  
This device is designed for general purpose medium power  
amplifiers and switches requiring collector currents to 800 mA.  
Sourced from Process 79.  
Absolute Maximum Ratings*  
TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Value  
Units  
VCEO  
VCBO  
VEBO  
IC  
Collector-Emitter Voltage  
80  
80  
V
V
Collector-Base Voltage  
Emitter-Base Voltage  
4.0  
V
Collector Current - Continuous  
Operating and Storage Junction Temperature Range  
1.0  
A
-55 to +150  
°C  
TJ, Tstg  
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.  
NOTES:  
1) These ratings are based on a maximum junction temperature of 150 degrees C.  
2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.  
Thermal Characteristics  
TA = 25°C unless otherwise noted  
Symbol  
Characteristic  
Max  
Units  
MPSW56  
PD  
Total Device Dissipation  
Derate above 25°C  
Thermal Resistance, Junction to Case  
1.0  
8.0  
50  
W
mW/°C  
°C/W  
RθJC  
RθJA  
Thermal Resistance, Junction to Ambient  
125  
°C/W  
*Device mounted on FR-4 PCB 36 mm X 18 mm X 1.5 mm; mounting pad for the collector lead min. 6 cm2.  
MPSW56, Rev  
A
2000 Fairchild Semiconductor Corporation  
PNP General Purpose Amplifier  
(continued)  
Electrical Characteristics  
TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Max  
Units  
OFF CHARACTERISTICS  
V (B R )C E O  
C ollector-Em itter B reakdown  
IC = 1.0 m A , IB = 0  
80  
V
V oltage  
V (B R )C B O  
V (B R )E B O  
IC B O  
C ollector-Base B reakdown V oltage  
80  
V
IC = 100 µA , IE = 0  
IE = 1.0 m A , IC = 0  
V C B = 60 V , IE = 0  
V C E = 60 V  
E m itter-B ase B reakdown V oltage  
C ollector-Cutoff C urrent  
C ollector-Cutoff C urrent  
E m itter-C utoff C urrent  
4.0  
V
0.1  
0.5  
µA  
µA  
µA  
IC E O  
IE B O  
V E B = 3.0 V , IC = 0  
0.10  
ON CHARACTERISTICS*  
hFE  
DC Current Gain  
IC = 50 mA, VCE = 1.0 V  
IC = 250 mA, VCE = 1.0 V  
100  
50  
Collector-Emitter Saturation Voltage IC = 250 mA, IB = 10 mA  
0.5  
1.2  
V
V
VCE(sat)  
VBE(on)  
Base-Emitter On Voltage  
IC = 250 mA, VCE = 5.0 V  
SMALL SIGNAL CHARACTERISTICS  
fT  
Current Gain-Bandwidth Product  
IC = 250 mA, VCE = 5.0 V,  
f = 20 MHz  
VCB = 10 V, IE = 0, f = 1.0 MHz  
50  
MHz  
pF  
Collector-Base Capacitance  
15  
Cob  
*Pulse Test: Pulse Width 300 µs, Duty Cycle 1.0%  
Typical Characteristics  
Typical Pulsed Current Gain  
Collector-Emitter Saturation  
Voltage vs Collector Current  
vs Collector Current  
2
1
200  
= 10  
β
VCE = 1.0 V  
125 °C  
150  
100  
50  
25 °C  
- 40 ºC  
0.1  
25 °C  
125 ºC  
- 40 °C  
0.01  
0
10  
100  
I C - COLLECTOR CURRENT (mA)  
1000  
0.01  
0.02  
0.05  
0.1  
0.5  
1
IC - COLLECTOR CURRENT (mA)  
PNP General Purpose Amplifier  
(continued)  
Typical Characteristics (continued)  
Base-Emitter Saturation  
Voltage vs Collector Current  
Base Emitter ON Voltage vs  
Collector Current  
1
0.8  
0.6  
0.4  
0.2  
= 10  
β
1
0.8  
0.6  
0.4  
- 40 ºC  
- 40 ºC  
25 °C  
25 °C  
125 ºC  
125 ºC  
V CE = 5V  
1
10  
100  
1000  
1
10  
100  
1000  
IC - COLLECTOR CURRENT (mA)  
I C - COLLECTOR CURRENT (mA)  
Collector-Base Capacitance  
vs Collector-Base Voltage  
Collector-Cutoff Current  
vs. Ambient Temperature  
40  
30  
20  
10  
0
100  
10  
f = 1.0 MHz  
VCB = 60V  
1
0.1  
0.01  
25  
50  
75  
100  
125  
0
4
8
12  
16  
20  
24  
28  
º
TA- AMBIENT TEMPERATURE ( C)  
V
- COLLECTOR-BASE VOLTAGE (V)  
CB  
Gain Bandwidth Product  
vs Collector Current  
Safe Operating Area TO-226  
10  
250  
200  
150  
100  
50  
VCE = 10V  
1
0.1  
*PULSED  
OPERATION  
T
= 25 °C  
A
LIMIT DETERMINED  
BY BV  
CEO  
0
0.01  
1
10  
100  
1000  
1
10  
100  
IC - COLLECTOR CURRENT (mA)  
V CE - COLLECTOR-EMITTER VOLTAGE (V)  
PNP General Purpose Amplifier  
(continued)  
Typical Characteristics (continued)  
Power Dissipation vs  
Ambient Temperature  
1
0.75  
0.5  
TO-226  
SOT-223  
0.25  
0
0
25  
50  
75  
100  
125  
150  
TEMPERATURE (oC)  
TO-226AE Tape and Reel Data and Package Dimensions  
TO-226AE Packaging  
Configuration: Figur e 1.0  
TAPE and REELOPTION  
FSCINT Label sampl e  
See Fig 2.0 for various  
FAIRCHILD SEMICONDUCTOR CORPORATION  
HTB:B  
Reeling Styles  
LOT:  
QTY:  
CBVK741B019  
10000  
NSID:  
D/C1:  
SPEC:  
PN2222N  
FSCINT  
Label  
SPEC REV:  
QA REV:  
D9842  
B2  
5 Reels per  
Intermediate Box  
(FSCINT)  
Customized  
Label  
F63TNR Label sample  
F63TNR  
Label  
LOT: CBVK741B019  
QTY: 2000  
SPEC:  
FSID: PN222N  
Customized  
Label  
D/C1: D9842  
D/C2:  
QTY1:  
QTY2:  
SPEC REV:  
CPN:  
N/F: F  
(F63TNR)3  
375mm x 267mm x 375mm  
Intermediate Box  
AMMO PACK OPTION  
See Fig 3.0 for2 Ammo  
Pack Options  
TO-226AE TNR/AMMO PACKING INFORMATION  
Packing  
Reel  
Style  
A
Quantity  
2,000  
2,000  
2,000  
2,000  
EOL code  
D26Z  
E
D27Z  
FSCINT  
Label  
Ammo  
M
D74Z  
P
D75Z  
5 Ammo box es per  
Intermediate Box  
327mm x 158mm x 135mm  
Immediate Box  
Unit weight  
Reel weight with components  
Ammo weight with components  
Max quantity per intermediate box = 10,000 units  
= 0.300gm  
=
0.868 kg  
0.880 kg  
Customized  
Label  
=
F63TNR  
Barcode Label  
Customized  
Label  
333mm x 231mm x 183mm  
Intermediate Box  
BULK OPTION  
See Bulk Packing  
Information table  
Anti-static  
Bubble Sheets  
FSCINT Barcode Label  
(TO-226AE) BULK PACKING INFORMATION  
LEADCLIP  
DIMENSION  
EOL CODE  
J18Z  
DESCRIPTION  
TO-18 OPTION STD  
TO-5 OPTION STD  
QUANTITY  
1.0 K / BOX  
1.0 K / BOX  
1.5 K / BOX  
NO LEAD CLIP  
1,500 units per  
EO70 box for  
std option  
114mm x 102mm x 51mm  
EO70 Immediate Box  
J05Z  
NO LEAD CLIP  
NO LEADCLIP  
NO EOL  
CODE  
TO-226 STANDARD  
STRAIGHT  
5 EO70 boxes per  
Intermediate Box  
Customized  
Label  
530mm x 130mm x 83mm  
Intermediate box  
FSCINT Label  
7,500 units maximum  
per intermediate box  
for std option  
October 1999, Rev. A1  
TO-226AE Tape and Reel Data and Package Dimensions, continued  
TO-226AE ReelingStyle  
Configuration: Figure 2.0  
Machine Option“A” (H)  
Machine OptionE” (J)  
Style “A”, D26Z, D70Z (s/h)  
Style “E”, D27Z, D71Z (s/h)  
TO-226AE Radial Ammo Packaging  
Configuration: Figure 3.0  
FIRST WIRE OFF IS EMITTER (ON PKG. 92)  
ADHESIVE TAPE IS ON THE TOP SIDE  
FLAT OF TRANSISTOR IS ON BOTTOM  
FIRST WIRE OFF IS COLLECTOR (ON PKG. 92)  
ADHESIVE TAPE IS ON THE TOP SIDE  
FLAT OF TRANSISTOR IS ON TOP  
ORDER STYLE  
D74Z (M)  
ORDER STYLE  
D75Z (P)  
FIRST WIRE OFF IS EMITTER  
FIRST WIRE OFF IS COLLECTOR  
ADHESIVE TAPE IS ON BOTTOM SIDE  
FLAT OF TRANSISTOR IS ON BOTTOM  
ADHESIVE TAPE IS ON BOTTOM SIDE  
FLAT OF TRANSISTOR IS ON TOP  
October 1999, Rev. A1  
TO-226AE Tape and Reel Data and Package Dimensions, continued  
TO-226AE TapeandReel Taping  
Dimension Configuration:  
Figur e 4.0  
Hd  
P
Pd  
b
Hb  
W1  
d
S
L
H1  
HO  
L1  
WO  
t
W2  
W
t1  
P1 F1  
P2  
DO  
ITEM DESCRIPTION  
SYMBOL  
DIMENSION  
b
0.098 (max)  
Base of Package to Lead Bend  
Component Height  
PO  
Hb  
1.078 (+/- 0.050)  
User DirectionofFeed  
HO  
H1  
Pd  
Hd  
P
0.630 (+/- 0.020)  
0.748 (+/- 0.020)  
0.040 (max)  
Lead Clinch Height  
Component Base Height  
Component Alignment ( side/side )  
Component Alignment ( front/back )  
Component Pitch  
0.031 (max)  
0.500 (+/- 0.020)  
0.500 (+/- 0.008)  
0.150 (+0.009, -0.010)  
0.247 (+/- 0.007)  
0.104 (+/- 0 .010)  
0.018 (+0.002, -0.003)  
0.429 (max)  
PO  
P1  
P2  
F1/F2  
d
Feed Hole Pitch  
Hole Center to First Lead  
Hole Center to Component Center  
Lead Spread  
Lead Thickness  
L
Cut Lead Length  
L1  
t
0.209 (+0.051, -0.052)  
0.032 (+/- 0.006)  
0.021 (+/- 0.006)  
0.708 (+0.020, -0.019)  
0.236 (+/- 0.012)  
0.035 (max)  
Taped Lead Lengt h  
Taped Lead Thic kness  
Carrier Tape Thickness  
Carrier Tape Width  
t1  
TO-226AE Reel  
Configuration:  
W
Figur e 5.0  
Hold - down Tape Width  
Hold - down Tape position  
Feed Hole Position  
WO  
W1  
W2  
DO  
S
0.360 (+/- 0.025)  
0.157 (+0.008, -0.007)  
0.004 (max)  
Sprocket Hole Diameter  
Lead Spring Out  
Note : All dimensions are in inches.  
ELECTROSTATIC  
SENSITIVE DEVICES  
D4  
D1  
ITEM DESCRIPTION  
SYMBOL MINIMUM  
MAXIMUM  
D2  
Reel Diameter  
D1  
D2  
D2  
D3  
D4  
W1  
W2  
W3  
13.975  
1.160  
0.650  
3.100  
2.700  
0.370  
1.630  
14.025  
1.200  
0.700  
3.300  
3.100  
0.570  
1.690  
2.090  
F63TNR Label  
Arbor Hole Diameter (Standard)  
(Small Hole)  
Customized Label  
Core Diameter  
Hub Recess Inner Diameter  
Hub Recess Depth  
Flange to Flange Inner Width  
Hub to Hub Center Width  
W1  
W3  
W2  
Note: All dimensions are inches  
D3  
October 1999, Rev. A1  
TO-226AE Tape and Reel Data and Package Dimensions, continued  
TO-226AE (FS PKG Code 95, 99)  
1:1  
Scale 1:1 on letter size paper  
Dimensions shown below are in:  
inches [millimeters]  
Part Weight per unit (gram): 0.300  
S4.704.32;  
S1.521.02;  
2° TYP  
S7.737.10;  
S7.877.37;  
2° TYP  
S1.651.27;  
0.51  
S0.76–  
0.36;  
S15.61–14.47;  
S0.510.36;  
S0.480.30;  
S1.401.14;  
S1.401.14;  
99 95  
S4.453.81;  
1
2
3
E
B
C
E
C
B
5° TYP  
1
2
3
TO-226AE (95,99)  
For leadformed option ordering,  
refer to Tape & Reel data information.  
S2.412.13;  
October 1999, Rev. A1  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
ACEx™  
CoolFET™  
ISOPLANAR™  
MICROWIRE™  
POP™  
PowerTrench  
QFET™  
SyncFET™  
TinyLogic™  
UHC™  
CROSSVOLT™  
E2CMOSTM  
VCX™  
FACT™  
FACT Quiet Series™  
QS™  
FAST®  
Quiet Series™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
FASTr™  
GTO™  
HiSeC™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD  
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. D  

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