FSAL200QSCX [FAIRCHILD]
Wide Bandwidth Quad 2:1 Analog Multiplexer / De-multiplexer Switch; 宽带四路2 : 1模拟多路复用器/解复用器开关型号: | FSAL200QSCX |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | Wide Bandwidth Quad 2:1 Analog Multiplexer / De-multiplexer Switch |
文件: | 总11页 (文件大小:254K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
October 2007
FSAL200 — Wide Bandwidth Quad 2:1 Analog
Multiplexer / De-multiplexer Switch
Features
Description
The Fairchild Switch FSAL200 is a rail-to-rail quad 2:1
high-speed CMOS TTL-compatible analog multiplexer /
de-multiplexer switch. The low on resistance of the
switch allows inputs to be connected to outputs without
adding propagation delay or generating additional
ground bounce noise.
Typical 6Ω Switch Connection Between Two Ports
Minimal Propagation Delay Through the Switch
Low ICC
Zero Bounce in Flow-Through Mode
Control Inputs Compatible with TTL Level
Rail-to-Rail Signal Handling
When OE is low, the select pin connects the A Port to
the selected B Port output. When OE is high, the switch
is open and a high-impedance state exists between the
two ports.
Route Communications Signals Include:
-
-
-
-
-
-
-
10/100 Ethernet
100VG—AnyLAN
ATM25
SONET OCI 51.8Mbps
USB1.1
T1/E1
Token Ring 4/16Mbps
Ordering Information
Packing
Method
Part Number
Package Description
16-Lead Thin Shrink Small Outline Package(TSSOP), JEDEC MO-153, 4.4mm Wide
FSAL200MTC
Rails
Tape and
Reel
FSAL200MTCX 16-Lead Thin Shrink Small Outline Package(TSSOP), JEDEC MO-153, 4.4mm Wide
FSAL200QSC
16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide
Rails
Tape and
Reel
FSAL200QSCX 16-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150" Wide
All packages are Pb-free per JEDEC standard J-SDD-020B.
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
Pin Configurations
Figure 1. Analog Symbol
Figure 2. Connection Diagram
Control Input(s)
OE
High
Low
Low
Function
Disconnected
A=B1
X
Low
High
A=B2
Pin Descriptions
Pin Names
Function
Switch Enable
Select Input
Data Ports
OE
S
A, B1, B2
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Min.
-0.5
-0.5
-0.5
Max.
7.0
Unit
V
Symbol
VCC
Parameter
Supply Voltage
VSW
VIN
DC Switch Voltage(1)
DC Input Voltage(1)
0.5
V
7.0
V
IIK
DC Input Diode Current at (IIK) VIN < 0V
DC Output Current
-50
mA
mA
mA
W
IOUT
120
±100
0.5
ICC/IGND
PD
DC VCC or Ground Current
Power Dissipation at 85°C
TSTG
TA
Storage Temperature Range
Ambient Temperature with Power Applied
-65
-40
+150
+85
°C
°C
Note:
1. Input and output negative ratings may be exceeded if input and output diode current ratings are observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VCC
Parameter
Min.
3.0
0
Max.
5.5
VCC
VCC
VCC
+85
10
Unit
V
Supply Voltage
VIN
Control Input Voltage(2)
Switch Input Voltage
Output Voltage
V
VSW
V
VOUT
TA
V
Operating Temperature
-40
0
°C
Control Input VCC=2.3V -3.6V
Control Input VCC=4.5V -5.5V
tr,tf
Input Rise and Fall Time
ns/V
0
5
Thermal Resistance in Still Sir
°C/W
θJA
Note:
2. Control input must be held HIGH or LOW and it must not float.
© 2002 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSAL200 Rev. 1.7.1
3
DC Electrical Characteristics
Typical values are at 25°C unless otherwise specified.
TA=-40°C to +85°C
Symbol
Parameter
Conditions
VCC(V)
Units
Min.
2.0
Typ. Max.
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
3.0 to 3.6
0 to 5.5
4.5 to 5.5
3.0 to 3.6
5.5
VIH
Input Voltage High
V
2.0
-0.5
-0.5
0.8
0.8
100
VIL
IOZ
Input Voltage Low
V
µA
Ω
Off State Leakage Current
Switch On Resistance(3)
0 ≤ VIN ≤ 5.5V
ION=10 -30mA
ON=10 -30mA
6
12
22
±1
±1
RON
I
15
VIN=VCC or GND
VIN=VCC or GND
IIN
Control Input Leakage
µA
µA
V
3.6
Quiescent Supply Current,
All Channels Off
ICC
VIN=VCC or GND, IOUT=0
5.5
1
Analog Signal Range
VCC
0
VCC
IA=-30 mA, VBN=3.15
IA=-10 mA, VBN=2.1
4.5 to 5.5
3.0 to 3.6
0.4
1.0
2.0
3.0
On Resistance Matching
Between Channels(3)(4)
ΔRON
Ω
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
3.0 to 3.6
100
80
IO
Output Current
Bn, Bn, S-0V to 5V
mΑ
A1, B1, B2=0V to 5V
A1, B1, B2=0V to 5V
3
7
RFLAT(ON) On Resistance Flatness(3)(5)
Ω
Notes:
3. Measured by the voltage drop between the A and B pins at the indicated current through the switch. On
resistance is determined by the lower of the voltages on the two (A or B ports).
4. ΔRON = RON maximum – RON minimum measured at identical VCC, temperature, and voltage levels.
5. Flatness is defined as the difference between the maximum and minimum value of on resistance over the
specified range of conditions.
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
4
AC Electrical Characteristics
Typical values are at 25°C unless otherwise specified.
Symbol
Parameter
Conditions
VBn=3V
VCC(V)
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
3.0 to 3.6
5.0
Min.
Typ.
10
28
5
Max.
20
Units
Figure
Figure 3
Figure 4
Figure 3
Figure 4
tON
Turn-On Time
ns
VBn=1.5V
VBn-3V
40
10
tOFF
Turn-Off Time
ns
pC
dB
VBn=1.5V
4
20
7
CL=0.1nF,VGEN=0
Charge
Injection
Q
Figure 5
Figure 6
Figure 7
Figure 9
Figure 9
RGEN=0Ω
3.3
3
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
3.0 to 3.6
-55
-75
-70
-75
137
110
2
RL=100Ω ,f=30MHz
RL=50Ω, f=1MHz
RL=100Ω ,f=30MHz
RL=50Ω, f=1MHz
RL=100Ω
OIRR
Off Isolation
Crosstalk
Xtalk
BW
dB
MHz
%
-3db
Bandwidth
RL=50Ω
D
ΔRON/RL
RL=100Ω
3
Notes:
6. Guaranteed by design.
7. Off Isolation =20 log10 [VA / VBn].
Capacitance
TA=+25°C, f=1MHz. Capacitance is characterized, but not tested in production.
Symbol
Parameter
Conditions
VCC=0V
VCC=5.0V and 3.0V
CC=5.0V and 3.0V
Typ.
2.3
8
Units
Figure
CIN
Control Pin Input Capacitance
B Port Off Capacitance
A Port Off Capacitance
Channel On Capacitance
pF
pF
pF
Figure 10
Figure 10
Figure 7
CIO-B
CON
V
13
VCC=5.0V and 3.0V
15
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
5
AC Loadings and Waveforms
Figure 3. AC Waveforms
Figure 4. ton, toff Loading
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
6
AC Loadings and Waveforms (Continued)
Figure 5.
Charge Injection Test
Figure 6. Off Isolation
Figure 7. Channel On Capacitance
Figure 8. Crosstalk
Figure 9. Bandwidth
Figure 10. Channel Off Capacitance
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
7
Physical Dimensions
LAND PATTERN
TOP VIEW
RECOMMENDATION
END VIEW
SIDE VIEW
DETAIL A
Figure 11. 16-lead, Quarter Size Outline Package (QSOP), JEDEC MO-137. 0.150” wide
Click here for tape and reel specifications, available at:
http://www.fairchildsemi.com/products/analog/pdf/qsop16_tr.pdf
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
8
Physical Dimensions (Continued)
5.00±0.10
4.55
5.90
4.45 7.35
0.65
4.4±0.1
1.45
5.00
0.11
12°
MTC16rev4
Figure 12. 16-lead, Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm wide
Click here for tape and reel specifications, available at:
http://www.fairchildsemi.com/products/analog/pdf/tssop16_tr.pdf
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
9
TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx®
Power247®
Green FPS™
Green FPS™ e-Series™
GTO™
i-Lo™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
SuperSOT™-8
POWEREDGE®
Power-SPM™
PowerTrench®
Programmable Active Droop™
QFET®
Build it Now™
CorePLUS™
CROSSVOLT™
CTL™
SyncFET™
The Power Franchise®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
μSerDes™
UHC®
Current Transfer Logic™
EcoSPARK®
QS™
®
QT Optoelectronics™
Quiet Series™
RapidConfigure™
SMART START™
SPM®
STEALTH™
SuperFET™
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
MicroPak™
MillerDrive™
Motion-SPM™
OPTOLOGIC®
FAST®
OPTOPLANAR®
FastvCore™
®
SuperSOT™-3
SuperSOT™-6
UniFET™
VCX™
FPS™
FRFET®
PDP-SPM™
Power220®
Global Power ResourceSM
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support,
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Preliminary
First Production
Full Production
Not In Production
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Obsolete
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I31
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
10
© 2002 Fairchild Semiconductor Corporation
FSAL200 Rev. 1.7.1
www.fairchildsemi.com
11
相关型号:
FSAM08D9002
Through Beam Photoelectric Sensor, 3mm Min, 3mm Max, Cylindrical, Board Mount, THROUGH BEAM SENSOR
IVO
FSAM08D9002/S35
Through Beam Photoelectric Sensor, 3mm Min, 3mm Max, Cylindrical, Board Mount, THROUGH BEAM SENSOR
IVO
©2020 ICPDF网 联系我们和版权申明