FDP083N15A [FAIRCHILD]

N-Channel PowerTrench® MOSFET 150V, 105A, 8.3m; N沟道MOSFET PowerTrench® 150V , 105A , 8.3米?
FDP083N15A
型号: FDP083N15A
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

N-Channel PowerTrench® MOSFET 150V, 105A, 8.3m
N沟道MOSFET PowerTrench® 150V , 105A , 8.3米?

文件: 总9页 (文件大小:564K)
中文:  中文翻译
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April 2011  
FDP083N15A_F102  
N-Channel PowerTrench MOSFET  
150V, 105A, 8.3m  
®
Features  
Description  
R
= 6.85m( Typ.)@ V = 10V, I = 75A  
This N-Channel MOSFET is produced using Fairchild  
Semi-  
DS(on)  
GS  
D
conductor’s advanced PowerTrench process that has been  
especially tailored to minimize the on-state resistance and yet  
maintain superior switching performance.  
Fast Switching Speed  
Low Gate Charge  
High Performance Trench Technology for Extremely Low  
R
Application  
DS(on)  
DC to DC Converters  
High Power and Current Handling Capability  
RoHS Compliant  
Synchronous Rectification for Server/Telecom PSU  
Battery Charger  
AC motor drives and Uninterruptible Power Supplies  
Off-line UPS  
D
G
TO-220  
G
D
S
S
o
MOSFET Maximum Ratings T = 25 C unless otherwise noted  
C
Symbol  
Parameter  
Ratings  
150  
Units  
V
V
Drain to Source Voltage  
Gate to Source Voltage  
V
V
DSS  
GSS  
±20  
o
- Continuous (T = 25 C, Silicon Limited)  
105  
C
I
I
Drain Current  
A
D
o
- Continuous (T = 100 C, Silicon Limited)  
75  
C
Drain Current  
- Pulsed  
(Note 1)  
(Note 2)  
(Note 3)  
420  
A
mJ  
V/ns  
W
DM  
E
Single Pulsed Avalanche Energy  
Peak Diode Recovery dv/dt  
542  
AS  
dv/dt  
6.0  
o
(T = 25 C)  
231  
C
P
Power Dissipation  
D
o
o
- Derate above 25 C  
1.54  
W/ C  
o
T , T  
Operating and Storage Temperature Range  
-55 to +175  
C
J
STG  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
o
T
300  
C
L
*Package limitation current is 120A.  
Thermal Characteristics  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Ratings  
0.65  
Units  
R
R
θJC  
θJA  
o
C/W  
62.5  
©2011 Fairchild Semiconductor Corporation  
FDP083N15A_F102 Rev. A2  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Description  
Quantity  
FDP083N15A  
FDP083N15A_F102  
TO-220  
F102: Trimmed Leads  
50  
o
Electrical Characteristics T = 25 C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
o
BV  
Drain to Source Breakdown Voltage  
I
I
= 250A, V = 0V, T = 25 C  
150  
-
-
-
-
V
DSS  
D
D
GS  
C
BV  
T  
Breakdown Voltage Temperature  
Coefficient  
o
o
DSS  
= 250A, Referenced to 25 C  
0.08  
V/ C  
J
V
V
V
= 120V, V = 0V  
-
-
-
-
-
-
1
DS  
DS  
GS  
GS  
I
I
Zero Gate Voltage Drain Current  
Gate to Body Leakage Current  
A  
DSS  
GSS  
o
= 120V, T = 150 C  
500  
±100  
C
= ±20V, V = 0V  
nA  
DS  
On Characteristics  
V
Gate Threshold Voltage  
V
V
V
= V , I = 250A  
2.0  
-
4.0  
8.30  
-
V
mꢀ  
S
GS(th)  
GS  
GS  
DS  
DS  
D
R
Static Drain to Source On Resistance  
Forward Transconductance  
= 10V, I = 75A  
-
-
6.85  
139  
DS(on)  
FS  
D
g
= 10V, I = 75A  
(Note 4)  
D
Dynamic Characteristics  
C
C
C
Input Capacitance  
-
-
-
-
-
-
-
-
4645  
1445  
100  
6040  
pF  
pF  
pF  
nC  
nC  
nC  
nC  
iss  
V
= 25V, V = 0V  
GS  
DS  
Output Capacitance  
1880  
oss  
rss  
f = 1MHz  
Reverse Transfer Capacitance  
Total Gate Charge at 10V  
Gate to Source Gate Charge  
Gate Charge Threshold to Plateau  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance(G-S)  
-
84  
-
Q
Q
Q
Q
64.5  
19.1  
8.7  
g(tot)  
gs  
V
V
= 75V, I = 75A  
D
= 10V  
DS  
GS  
-
gs2  
gd  
13.5  
2.5  
-
ESR  
Drain Open, f=1MHz  
-
Switching Characteristics  
t
t
t
t
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
-
-
-
-
22  
58  
61  
26  
54  
126  
132  
62  
ns  
ns  
ns  
ns  
d(on)  
V
V
= 75V, I = 75A  
D
r
DD  
GS  
= 10V, R  
= 4.7ꢀ  
GEN  
d(off)  
f
Drain-Source Diode Characteristics  
I
I
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
-
-
-
-
-
-
-
105  
420  
1.25  
-
A
A
S
SM  
V
t
Drain to Source Diode Forward Voltage  
Reverse Recovery Time  
V
= 0V, I = 75A  
-
V
SD  
GS  
SD  
96  
268  
ns  
nC  
V
= 0V, I = 75A, V = 120V  
rr  
GS  
SD  
DD  
dI /dt = 100A/s  
Q
Reverse Recovery Charge  
-
F
rr  
Notes:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature  
2. Starting T = 25°C, L = 3 mH, I = 19 A  
J
SD  
3. I ≤ꢃ75A, di/dt 200A/s, V BV  
, Starting T = 25°C  
J
SD  
DD  
DSS  
4. Pulse Test: Pulse width 300s, Duty Cycle 2%  
5. Essentially Independent of Operating Temperature Typical Characteristics  
www.fairchildsemi.com  
FDP083N15A_F102 Rev. A2  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
500  
300  
VGS = 10.0V  
8.0V  
6.5V  
6.0V  
5.5V  
5.0V  
100  
175oC  
100  
25oC  
10  
-55oC  
*Notes:  
1. 250s Pulse Test  
2. TC = 25oC  
*Notes:  
1. VDS = 10V  
2. 250s Pulse Test  
10  
0.1  
1
1
10  
2
3
4
5
6
VDS, Drain-Source Voltage[V]  
VGS, Gate-Source Voltage[V]  
Figure 3. On-Resistance Variation vs.  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperature  
Drain Current and Gate Voltage  
14  
12  
10  
8
500  
100  
175oC  
25oC  
VGS = 10V  
10  
VGS = 20V  
6
*Notes:  
1. VGS = 0V  
*Note: TC = 25oC  
2. 250s Pulse Test  
4
1
0.0  
0
100  
200  
300  
400  
0.5  
1.0  
1.5  
ID, Drain Current [A]  
VSD, Body Diode Forward Voltage [V]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
10000  
10  
Ciss  
VDS = 30V  
VDS = 75V  
VDS = 120V  
Coss  
8
6
4
2
0
1000  
Crss  
*Note:  
1. VGS = 0V  
2. f = 1MHz  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
100  
50  
= C + C  
ds  
= C  
gd  
oss  
rss  
gd  
*Note: ID = 75A  
50  
0.1  
1
10  
30  
0
25  
75  
VDS, Drain-Source Voltage [V]  
Qg, Total Gate Charge [nC]  
www.fairchildsemi.com  
FDP083N15A_F102 Rev. A2  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
1.10  
1.05  
1.00  
3.0  
2.5  
2.0  
1.5  
1.0  
0.95  
*Notes:  
1. VGS = 0V  
*Notes:  
1. VGS = 10V  
0.5  
2. ID = 250A  
2. ID = 75A  
0.90  
-100  
0.0  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150 200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
1000  
120  
100  
80  
60  
40  
20  
0
10s  
100s  
100  
1ms  
10ms  
10  
Operation in This Area  
DC  
is Limited by R DS(on)  
*Notes:  
1
1. TC = 25oC  
2. TJ = 175oC  
3. Single Pulse  
0.1  
0.1  
1
10  
100 300  
25  
50  
75  
100  
125  
150  
175  
TC, Case Temperature [oC]  
VDS, Drain-Source Voltage [V]  
Figure 11. Unclamped Inductive Switching  
Capability  
50  
If R = 0  
tAV = (L)(IAS)/(1.3*RATED BVDSS-VDD)  
If R = 0  
tAV = (L/R)In[(IAS*R)/(1.3*RATED BVDSS-VDD)+1]  
STARTING TJ = 25oC  
10  
STARTING TJ = 150oC  
1
0.001 0.01  
tAV, TIME IN AVALANCHE (ms)  
0.1  
1
10  
100  
1000  
www.fairchildsemi.com  
FDP083N15A_F102 Rev. A2  
4
Typical Performance Characteristics  
Figure 12. Transient Thermal Response Curve  
1
0.1  
0.5  
0.2  
0.1  
PDM  
0.05  
0.02  
t1  
t2  
0.01  
0.01  
0.001  
*Notes:  
Single pulse  
1. ZθJC(t) = 0.65oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
Rectangular Pulse Duration [sec]  
FDP083N15A_F102 Rev. A2  
5
www.fairchildsemi.com  
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
www.fairchildsemi.com  
FDP083N15A_F102 Rev. A2  
6
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
www.fairchildsemi.com  
FDP083N15A_F102 Rev. A2  
7
Mechanical Dimensions  
TO-220  
(F102: Trimmed Leads)  
Dimensions in Millimeters  
www.fairchildsemi.com  
FDP083N15A_F102 Rev. A2  
8
TRADEMARKS  
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not  
intended to be an exhaustive list of all such trademarks.  
AccuPower™  
Auto-SPM™  
AX-CAP™*  
Build it Now™  
CorePLUS™  
CorePOWER™  
CROSSVOLT™  
CTL™  
F-PFS™  
Power-SPM™  
PowerTrench®  
PowerXS™  
The Power Franchise®  
FRFET®  
The Right Technology for Your Success™  
Global Power ResourceSM  
Green FPS™  
Green FPS™ e-Series™  
Gmax™  
GTO™  
IntelliMAX™  
®
Programmable Active Droop™  
QFET®  
TinyBoost™  
TinyBuck™  
QS™  
Quiet Series™  
TinyCalc™  
RapidConfigure™  
TinyLogic®  
Current Transfer Logic™  
DEUXPEED®  
Dual Cool™  
EcoSPARK®  
EfficentMax™  
ESBC™  
ISOPLANAR™  
MegaBuck™  
MICROCOUPLER™  
MicroFET™  
TINYOPTO™  
TinyPower™  
TinyPWM™  
TinyWire™  
TriFault Detect™  
TRUECURRENT®*  
SerDes™  
Saving our world, 1mW/W/kW at a time™  
SignalWise™  
SmartMax™  
MicroPak™  
MicroPak2™  
MillerDrive™  
MotionMax™  
Motion-SPM™  
mWSaver™  
SMART START™  
SPM®  
®
STEALTH™  
SuperFET®  
Fairchild®  
Fairchild Semiconductor®  
FACT Quiet Series™  
FACT®  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SupreMOS®  
SyncFET™  
Sync-Lock™  
UHC®  
Ultra FRFET™  
UniFET™  
VCX™  
VisualMax™  
XS™  
OptiHiT™  
OPTOLOGIC®  
OPTOPLANAR®  
®
FAST®  
FastvCore™  
FETBench™  
FlashWriter®  
FPS™  
*
®*  
PDP SPM™  
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY  
PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY  
THEREIN, WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used here in:  
1. Life support devices or systems are devices or systems which, (a) are  
intended for surgical implant into the body or (b) support or sustain life,  
and (c) whose failure to perform when properly used in accordance with  
instructions for use provided in the labeling, can be reasonably  
expected to result in a significant injury of the user.  
2. A critical component in any component of a life support, device, or  
system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or  
effectiveness.  
ANTI-COUNTERFEITING POLICY  
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,  
www.Fairchildsemi.com, under Sales Support.  
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their  
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PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Datasheet contains the design specifications for product development. Specifications  
may change in any manner without notice.  
Advance Information  
Formative / In Design  
Datasheet contains preliminary data; supplementary data will be published at a later  
date. Fairchild Semiconductor reserves the right to make changes at any time without  
notice to improve design.  
Preliminary  
First Production  
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to  
make changes at any time without notice to improve the design.  
No Identification Needed  
Obsolete  
Full Production  
Datasheet contains specifications on a product that is discontinued by Fairchild  
Semiconductor. The datasheet is for reference information only.  
Not In Production  
Rev. I53  
FDP083N15A_F102 Rev. A2  
9
www.fairchildsemi.com  

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