FCD5N60TM [FAIRCHILD]

600V N-Channel MOSFET; 600V N沟道MOSFET
FCD5N60TM
型号: FCD5N60TM
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

600V N-Channel MOSFET
600V N沟道MOSFET

文件: 总9页 (文件大小:961K)
中文:  中文翻译
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July 2006  
TM  
SuperFET  
FCD5N60 / FCU5N60  
600V N-Channel MOSFET  
Features  
Description  
650V @TJ = 150°C  
SuperFETTM is, Farichild’s proprietary, new generation of high  
voltage MOSFET family that is utilizing an advanced charge  
balance mechanism for outstanding low on-resistance and  
lower gate charge performance.  
Typ. Rds(on)=0.81Ω  
Ultra low gate charge (typ. Qg=16nC)  
Low effective output capacitance (typ. Coss.eff=32pF)  
100% avalanche tested  
This advanced technology has been tailored to minimize  
conduction loss, provide superior switching performance, and  
withstand extreme dv/dt rate and higher avalanche energy.  
Consequently, SuperFET is very suitable for various AC/DC  
power conversion in switching mode operation for system  
miniaturization and higher efficiency.  
D
D
G
D-PAK  
FCD Series  
G D S  
I-PAK  
FCU Series  
G
S
S
Absolute Maximum Ratings  
Symbol  
Parameter  
FCD5N60 / FCU5N60  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
600  
V
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
4.6  
2.9  
A
A
(Note 1)  
(Note 2)  
IDM  
Drain Current  
- Pulsed  
A
13.8  
± 30  
2.9  
4.6  
5.4  
20  
VGSS  
EAS  
IAR  
Gate-Source voltage  
V
mJ  
A
Single Pulsed Avalanche Energy  
Avalanche Current  
(Note 1)  
(Note 1)  
(Note 3)  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
mJ  
V/ns  
Power Dissipation  
(TC = 25°C)  
54  
W
- Derate above 25°C  
0.43  
W/°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
300  
°C  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
°C  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
Parameter  
FCD5N60/FCU5N60  
Unit  
°C/W  
°C/W  
RθJC  
RθJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
2.3  
83  
©2006 Fairchild Semiconductor Corporation  
FCD5N60/FCU5N60 Rev. A0  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Device Marking  
FCD5N60  
Device  
FCD5N60TM  
FCD5N60TF  
FCU5N60  
Package  
D-PAK  
Reel Size  
380mm  
380mm  
--  
Tape Width  
Quantity  
2500  
16mm  
16mm  
--  
FCD5N60  
D-PAK  
2000  
FCU5N60  
I-PAK  
70  
Electrical Characteristics  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Conditions  
Min  
Typ Max Units  
Off Characteristics  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0V, ID = 250µA, TJ = 25°C  
VGS = 0V, ID = 250µA, TJ = 150°C  
600  
--  
--  
--  
--  
V
V
650  
BVDSS  
Breakdown Voltage Temperature  
Coefficient  
ID = 250µA, Referenced to 25°C  
--  
--  
0.6  
--  
--  
V/°C  
/
TJ  
BVDS  
Drain-Source Avalanche Breakdown  
Voltage  
VGS = 0V, ID = 4.6A  
700  
V
IDSS  
Zero Gate Voltage Drain Current  
VDS = 600V, VGS = 0V  
VDS = 480V, TC = 125°C  
--  
--  
--  
--  
1
10  
µA  
µA  
IGSSF  
IGSSR  
Gate-Body Leakage Current, Forward  
Gate-Body Leakage Current, Reverse  
VGS = 30V, VDS = 0V  
VGS = -30V, VDS = 0V  
--  
--  
--  
--  
100  
nA  
nA  
-100  
On Characteristics  
VGS(th) Gate Threshold Voltage  
RDS(on)  
VDS = VGS, ID = 250µA  
VGS = 10V, ID = 2.3A  
VDS = 40V, ID = 2.3A  
3.0  
--  
--  
5.0  
0.95  
--  
V
S
Static Drain-Source  
On-Resistance  
0.81  
3.8  
(Note 4)  
gFS  
Forward Transconductance  
--  
Dynamic Characteristics  
Ciss  
Input Capacitance  
VDS = 25V, VGS = 0V,  
f = 1.0MHz  
--  
--  
--  
--  
--  
470  
250  
22  
600  
320  
--  
pF  
pF  
pF  
pF  
pF  
Coss  
Output Capacitance  
Crss  
Reverse Transfer Capacitance  
Output Capacitance  
Coss  
VDS = 480V, VGS = 0V, f = 1.0MHz  
VDS = 0V to 400V, VGS = 0V  
12  
--  
Coss eff.  
Effective Output Capacitance  
32  
--  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
VDD = 300V, ID = 4.6A  
RG = 25Ω  
--  
--  
--  
--  
--  
--  
--  
12  
40  
47  
22  
16  
2.8  
7
30  
90  
95  
55  
--  
ns  
ns  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
ns  
(Note 4, 5)  
ns  
Qg  
VDS = 480V, ID = 4.6A  
VGS = 10V  
nC  
nC  
nC  
Qgs  
Qgd  
--  
--  
(Note 4, 5)  
Drain-Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
--  
--  
--  
--  
--  
--  
--  
4.6  
13.8  
1.4  
--  
A
A
ISM  
VSD  
trr  
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0V, IS = 4.6A  
--  
V
VGS = 0V, IS = 4.6A  
295  
2.7  
ns  
µC  
dIF/dt =100A/µs  
(Note 4)  
Qrr  
Reverse Recovery Charge  
--  
NOTES:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature  
2. I = 2.3A, V = 50V, R = 25, Starting T = 25°C  
AS  
DD  
G
J
3. I 4.6A, di/dt 1200A/µs, V BV  
, Starting T = 25°C  
SD  
DD  
DSS  
J
4. Pulse Test: Pulse width 300µs, Duty Cycle 2%  
5. Essentially Independent of Operating Temperature Typical Characteristics  
2
www.fairchildsemi.com  
FCD5N60/FCU5N60 Rev. A0  
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
VGS  
Top :  
15.0 V  
10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
101  
101  
100  
10-1  
Bottom : 5.5 V  
150oC  
25oC  
100  
-55oC  
* Note  
1. VDS = 40V  
* Notes :  
1. 250µs Pulse Test  
2. TC = 25oC  
2. 250µs Pulse Test  
10-1  
2
4
6
8
10  
10-1  
100  
101  
VGS , Gate-Source Voltage [V]  
VDS, Drain-Source Voltage [V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperatue  
3.0  
2.5  
101  
VGS = 10V  
2.0  
1.5  
1.0  
0.5  
150oC  
25oC  
100  
-55oC  
VGS = 20V  
* Note  
1. VDS = 40V  
* Note : TJ = 25oC  
12.5  
2. 250µs Pulse Test  
0.0  
2.5  
5.0  
7.5  
10.0  
15.0  
10-1  
2
4
6
8
10  
ID, Drain Current [A]  
VGS , Gate-Source Voltage [V]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
12  
10  
8
1500  
Ciss = Cgs + Cgd (Cds = shorted)  
VDS = 100V  
Coss = Cds + Cgd  
VDS = 250V  
VDS = 400V  
Crss = Cgd  
*Notes :  
1. VGS = 0 V  
1000  
500  
0
2. f = 1 MHz  
Coss  
6
4
Ciss  
2
Crss  
* Note : ID = 4.6A  
0
0
5
10  
15  
100  
101  
QG, Total Gate Charge [oC]  
VDS, Drain-Source Voltage [V]  
3
www.fairchildsemi.com  
FCD5N60/FCU5N60 Rev. A0  
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
3.0  
2.5  
2.0  
1.5  
1.0  
1.2  
1.1  
1.0  
* Notes :  
0.9  
0.8  
1. VGS = 0 V  
* Notes :  
1. VGS = 10V  
2. ID = 250µA  
0.5  
2. ID = 2.3A  
0.0  
-100  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
5
4
3
2
1
0
102  
101  
100  
10-1  
10-2  
Operation in This Area  
is Limited by R DS(on)  
10 µs  
100 µs  
1 ms  
10 ms  
100 ms  
DC  
* Notes :  
1. TC = 25 o  
C
2. TJ = 150 o  
C
3. Single Pulse  
100  
101  
102  
103  
25  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
VDS, Drain-Source Voltage [V]  
Figure 11. Transient Thermal Response Curve  
D
= 0 . 5  
0 . 2  
0
1
0
*
N
o
.
t e  
Z
s
:
1
( t )  
C
=
a
2
. 3 o C / W  
M
a
x .  
θ
J
0 . 1  
2
3
.
D
T
u
t y  
F
c
t o r ,  
D
=
t 1 / t 2  
Z ( t )  
θ J C  
0 . 0 5  
.
-
T
=
P
*
J
M
C
D
M
- 1  
0 . 0 2  
0 . 0 1  
1
0
PDM  
t1  
s i n g l e p u l s e  
t2  
- 2  
1
0
- 5  
- 4  
- 3  
- 2  
- 1  
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1 0  
t 1  
,
S q u a r e  
W
a v e P u l s e  
D u r a t i o n [ s e c ]  
4
www.fairchildsemi.com  
FCD5N60/FCU5N60 Rev. A0  
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
5
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FCD5N60/FCU5N60 Rev. A0  
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
6
www.fairchildsemi.com  
FCD5N60/FCU5N60 Rev. A0  
Mechanical Dimensions  
D-PAK  
Dimensions in Millimeters  
7
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FCD5N60/FCU5N60 Rev. A0  
Package Dimensions (Continued)  
I-PAK  
Dimensions in Millimeters  
8
www.fairchildsemi.com  
FCD5N60/FCU5N60 Rev. A0  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not  
intended to be an exhaustive list of all such trademarks.  
ACEx™  
FACT Quiet Series™  
GlobalOptoisolator™  
GTO™  
OCX™  
OCXPro™  
SILENT SWITCHER®  
SMART START™  
SPM™  
UniFET™  
UltraFET®  
VCX™  
ActiveArray™  
Bottomless™  
Build it Now™  
CoolFET™  
CROSSVOLT™  
DOME™  
OPTOLOGIC®  
OPTOPLANAR™  
PACMAN™  
POP™  
HiSeC™  
Stealth™  
Wire™  
I2C™  
SuperFET™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
TCM™  
TinyBoost™  
TinyBuck™  
TinyPWM™  
TinyPower™  
TinyLogic®  
TINYOPTO™  
TruTranslation™  
UHC™  
i-Lo™  
ImpliedDisconnect™  
IntelliMAX™  
ISOPLANAR™  
LittleFET™  
MICROCOUPLER™  
MicroFET™  
MicroPak™  
MICROWIRE™  
MSX™  
MSXPro™  
Power247™  
PowerEdge™  
PowerSaver™  
PowerTrench®  
QFET®  
EcoSPARK™  
E2CMOS™  
EnSigna™  
FACT™  
FAST®  
FASTr™  
FPS™  
FRFET™  
QS™  
QT Optoelectronics™  
Quiet Series™  
RapidConfigure™  
RapidConnect™  
µSerDes™  
Across the board. Around the world.™  
The Power Franchise®  
ScalarPump™  
Programmable Active Droop™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO  
IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE  
OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE  
RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS,  
SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT  
THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or systems which,  
(a) are intended for surgical implant into the body, or (b) support  
or sustain life, or (c) whose failure to perform when properly used  
in accordance with instructions for use provided in the labeling,  
can be reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life support device  
or system whose failure to perform can be reasonably expected  
to cause the failure of the life support device or system, or to  
affect its safety or effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or In  
Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. I20  
9
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FCD5N60/FCU5N60 Rev. A0  

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