FAN5346 [FAIRCHILD]

Series Boost LED Driver with PWM Dimming Interface; 系列升压LED驱动器的PWM调光接口
FAN5346
型号: FAN5346
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Series Boost LED Driver with PWM Dimming Interface
系列升压LED驱动器的PWM调光接口

驱动器
文件: 总14页 (文件大小:1788K)
中文:  中文翻译
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June 2012  
FAN5346  
Series Boost LED Driver with PWM Dimming Interface  
Description  
Features  
The FAN5346 is an asynchronous constant-current LED  
.
.
Asynchronous Boost Converter  
Drives LEDs in Series:  
driver that drives LEDs in series to ensure equal brightness  
for all the LEDs. FAN5346S20X has an output voltage of  
20V and can drive up to 5 LEDs in series. FAN5346S30X  
has an output voltage of 30V and up to 8 LEDs in series.  
Optimized for small form-factor applications, the 1.2MHz  
fixed switching frequency allows the use of small inductors  
and capacitors.  
FAN5346S20X: 20V Output  
FAN5346S30X: 30V Output  
.
.
.
.
.
.
.
.
.
.
2.5V to 5.5V Input Voltage Range  
PWM Dimming for LED Brightness Control  
5kHz to 100kHz PWM Dimming Frequency Range  
1.2MHz Fixed Switching Frequency  
Soft-Start Capability  
The FAN5346 uses a PWM dimming control interface to set  
the brightness levels of the LEDs. A PWM signal of 5kHz to  
100kHz is applied to the EN pin.  
For safety, the device features integrated over-voltage, over-  
current, short-circuit detection, and thermal-shutdown  
protections. In addition, input under-voltage lockout  
protection is triggered if the battery voltage is too low.  
Input Under-Voltage Lockout (UVLO)  
Output Over-Voltage Protection (OVP)  
Short-Circuit Detection  
The FAN5346 is available in a 6-lead SSOT23 package. It is  
“green”  
and  
RoHS  
compliant.  
(Please  
see  
Thermal Shutdown (TSD) Protection  
Small Form-Factor 6-Lead SSOT23 Package  
http://www.fairchildsemi.com/company/green/index.html for  
Fairchild’s definition of green).  
Applications  
.
.
.
.
Cellular Mobile Handsets  
Mobile Internet Devices  
Portable Media Players  
PDA, DSC, MP3 Players  
Ordering Information  
Part Number  
FAN5346S20X  
FAN5346S30X  
Output Voltage Option  
Temperature Range  
Package  
20V  
30V  
6-Lead, SuperSOT™-6, JEDEC MO-193,  
1.6mm Wide (MA06A)  
-40 to 85°C  
.
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev.1.0.1  
www.fairchildsemi.com  
Typical Application Diagram  
Figure 1. Typical Application  
Block Diagram  
Figure 2. Functional Block Diagram  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
2
Pin Configuration  
Figure 3. Pin Assignments, Top View  
Pin Definitions  
Pin #  
Name  
Description  
Boost Output Voltage. Output of the boost regulator. Connect the LEDs to this pin. Connect COUT  
(output capacitor) to GND.  
5
VOUT  
1
4
VIN  
EN  
Input Voltage. Connect to the power source and decouple with CIN to GND.  
Enable Brightness Control. Program dimming levels by driving pin with the PWM signal.  
Voltage Feedback. The boost regulator regulates this pin to 0.250V to control the LED string current.  
Tie this pin to a current setting resistor (RSET) between GND and the cathode of the LED string.  
3
FB  
6
2
SW  
Switching node. Tie inductor L1 from VIN to SW pin.  
Ground. Tie directly to a GND plane.  
GND  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable  
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,  
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute  
maximum ratings are stress ratings only.  
Symbol  
Parameter  
Min.  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
-0.3  
Max.  
6.0  
Unit  
V
VIN  
VIN Pin  
VFB, VEN FB, EN Pins  
VIN + 0.3  
22.0  
V
FAN5346S20X  
V
VSW  
VOUT  
ESD  
SW Pin  
FAN5346S30X  
33.0  
V
FAN5346S20X  
22.0  
V
VOUT Pin  
FAN5346S30X  
33.0  
V
Human Body Model per JESD22-A114  
Charged Device Model per JESD22-C101  
1.5  
1.5  
Electrostatic Discharge Protection  
kV  
TJ  
TSTG  
TL  
Junction Temperature  
Storage Temperature  
-40  
-65  
+150  
+150  
+260  
°C  
°C  
°C  
Lead Soldering Temperature, 10 Seconds  
Recommended Operating Conditions  
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating  
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend  
exceeding them or designing to absolute maximum ratings.  
Symbol  
Parameter  
Min.  
2.5  
6.2  
6.2  
5
Max.  
5.5  
Unit  
VIN  
VIN Supply Voltage  
VOUT Voltage(1)  
V
FAN5346S20X  
FAN5346S30X  
18.5  
28.5  
25  
VOUT  
V
IOUT  
TA  
VOUT Load Current  
mA  
°C  
Ambient Temperature  
Junction Temperature  
-40  
-40  
+85  
+125  
TJ  
°C  
Note:  
1. Application should guarantee that minimum and maximum duty cycle fall between 20-85% to meet the specified range.  
Thermal Properties  
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer  
2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature  
TJ(max) at a given ambient temperature TA.  
Symbol  
Parameter  
Typical  
Unit  
Junction-to-Ambient Thermal Resistance, SSOT23-6 Package  
151  
°C/W  
θJA  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
4
Electrical Specifications  
VIN = 2.5V to 5.5V and TA = -40°C to +85°C unless otherwise noted. Typical values are at TA = +25°C and VIN = 3.6V.  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max. Unit  
Power Supplies  
ISD  
Shutdown Supply Current  
EN = GND  
0.30  
300  
2.35  
2.05  
250  
0.90  
μA  
μA  
IQ(ACTIVE) Quiescent Current at ILOAD = 0mA Device Not Switching, No Load  
VIN Rising  
2.10  
1.80  
2.60  
2.30  
VUVLO  
Under-Voltage Lockout Threshold  
V
VIN Falling  
VUVHYST Under-Voltage Lockout Hysteresis  
mV  
EN: Enable Pin  
VIH  
VIL  
HIGH-Level Input Voltage  
LOW-Level Input Voltage  
EN Pull-Down Resistance  
PWM Dimming Frequency(3)  
EN LOW, Shutdown Pulse Width  
1.2  
V
V
0.4  
400  
100  
1
REN  
fPWM  
tSD  
200  
5
300  
kΩ  
kHz  
ms  
VIN = 3.6V; from Falling Edge of EN  
Feedback and Reference  
ILED = 20mA from -40°C to +85°C,  
2.5V VIN 5.5V  
VFB  
Feedback Voltage  
230  
250  
0.1  
270  
1.0  
mV  
IFB  
Feedback Input Current  
VFB = 250mV  
μA  
Power Outputs  
VIN = 3.6V, ISW = 100mA  
600  
650  
RDS(ON)_Q1 Boost Switch On Resistance  
mΩ  
μA  
VIN = 2.5V, ISW = 100mA  
EN = 0, VIN = VSW = VOUT = 5.5V,  
ISW(OFF)  
SW Node Leakage(2)  
0.1  
2.0  
VLED = 0V  
FAN5346S20X: VIN = 3.2V to 4.3V,  
TA =-20°C to +60°C, VF = 3.4V, 4 LEDs  
200  
500  
300  
750  
400  
ILIM-PK  
Boost Switch Peak Current Limit  
mA  
FAN5346S30X  
1000  
Oscillator  
Boost Regulator Switching  
Frequency  
fSW  
0.95  
1.15  
1.35  
MHz  
Output and Protection  
FAN5346S20X  
FAN5346S30X  
FAN5346S20X  
FAN5346S30X  
18.0  
27.5  
20.0  
30.0  
0.8  
21.5  
32.5  
Boost Output Over-Voltage  
Protection  
VOVP  
V
OVP Hysteresis  
1.0  
V
OUT Short-Circuit Detection  
VTLSC  
VTHSC  
VOUT Falling  
VOUT Rising  
VIN – 1.4  
VIN – 1.2  
V
V
Threshold  
VOUT Short-Circuit Detection  
Threshold  
DMAX  
DMIN  
Maximum Boost Duty Cycle(3,4)  
Minimum Boost Duty Cycle(3,4)  
Thermal Shutdown  
85  
%
20  
TTSD  
150  
35  
°C  
°C  
THYS  
Thermal Shutdown Hysteresis  
Notes:  
2. SW leakage current includes the leakage current of two internal switches; SW to GND and SW to VOUT  
3. Not tested in production; guaranteed by design.  
.
4. Application should guarantee that minimum and maximum duty cycle fall between 20-85% to meet the specified range.  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
5
Typical Characteristics  
VIN = 3.6V, TA = 25°C, ILED = 25mA, L = 10µH, COUT = 1.0µF, and CIN = 10.0µF.  
Figure 4. 3 LEDs: Efficiency vs. LED Current  
vs. Input Voltage  
Figure 5. 4 LEDs: Efficiency vs. LED Current  
vs. Input Voltage  
Figure 6. 5 LEDs: Efficiency vs. LED Current  
vs. Input Voltage  
Figure 7. 6 LEDs: Efficiency vs. LED Current  
vs. Input Voltage  
Figure 8. 7 LEDs: Efficiency vs. LED Current  
vs. Input Voltage  
Figure 9. 8 LEDs: Efficiency vs. LED Current  
vs. Input Voltage  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
6
Typical Characteristics  
VIN = 3.6V, TA = 25°C, ILED = 25mA, L = 10µH, COUT = 1.0µF, and CIN = 10.0µF.  
Figure 10. Efficiency vs. Input Voltage vs. Temperature  
for 5 LEDs in Series  
Figure 11. Efficiency vs. Input Voltage vs. Temperature  
for 7 LEDs in Series  
Figure 12. Delta of VFB Over Input Voltage and  
Temperature for 7 LEDs with L=10µH and COUT=1.0µF  
Figure 13. Frequency vs. Input Voltage vs. Temperature  
7 LEDs  
L = 10µH  
5 LEDs  
L = 10µH  
COUT = 1.0µF  
C
OUT = 1.0µF  
ILED = 25mA  
ILED = 25mA  
Figure 14. OVP vs. Input Voltage: FAN5346S20X  
Figure 15. OVP vs. Input Voltage: FAN5346S30X  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
7
Typical Characteristics  
VIN = 3.6V, TA = 25°C, ILED = 25mA, L = 10µH, COUT = 1.0µF, and CIN = 10.0µF.  
Figure 16. Shutdown Current vs. Input Voltage  
Figure 17. Quiescent Current vs. Input Voltage  
Figure 18. LED Current vs. Duty Cycle, fPWM = 20kHz  
Figure 19. Line Transient Response for 5 LEDs  
Figure 20. Line Transient Response for 6 LEDs  
Figure 21. Line Transient Response for 7 LEDs  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
8
Typical Characteristics  
VIN = 3.6V, TA = 25°C, ILED = 25mA, L = 10µH, COUT = 1.0µF, and CIN = 10.0µF.  
Figure 22. Startup Waveform for Switch Voltage, Inductor  
Current, VFB, and EN for 5 LEDs  
Figure 23. Steady-State Waveform for VOUT  
Switch Voltage, and Inductor Current for 5 LEDs  
,
Figure 24. Startup Waveform for Switch Voltage, Inductor  
Current, VFB, and EN for 6 LEDs  
Figure 25. Steady-State Waveform for VOUT  
Switch Voltage, and Inductor Current for 6 LEDs  
,
Figure 26. Startup Waveform for Switch Voltage, Inductor  
Current, VFB, and EN for 7 LEDs  
Figure 27. Steady-State Waveform for VOUT  
Switch Voltage, and Inductor Current for 7 LEDs  
,
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5346 • Rev. 1.0.1  
9
Circuit Description  
Overview  
The FAN5346 is an inductive current-mode boost serial  
LED driver that achieves LED current regulation by  
maintaining 0.250V across the RSET resistor. The current  
through the LED string (ILED) is given by:  
0.250  
ILED  
=
(1)  
RSET  
The voltage VOUT is determined by the sum of the forward  
voltages across each LED, plus the voltage across RSET  
which is always 250mV.  
,
Driving Eight LEDs in Series  
Figure 28. Block Diagram of FB and EN Circuit for  
PWM Dimming  
FAN5346S30X can drive 8 LEDs in series, but the minimum  
input voltage (VIN) must be greater than or equal to 2.9V,  
while the forward voltage of the white LED should be less  
than or equal to 3.2V, and the maximum LED current  
cannot exceed 20mA to maintain stable operation.  
Over-Current and Short-Circuit Detection  
The boost regulator employs a cycle-by-cycle peak inductor  
current limit of 300mA (typical) and 750mA (typical) for  
FAN5346S20X and FAN5346S30X, respectively.  
UVLO and Soft-Start  
If EN has been LOW for more than 1ms, the IC may  
initiate a “cold start” soft-start cycle when EN rises,  
provided VIN is above the UVLO threshold.  
Over-Voltage / Open-Circuit Protection  
If the LED string is an open circuit, FB remains at 0V and the  
output voltage continues to increase in the absence of an over-  
voltage protection (OVP) circuit. The FAN5346S20X OVP  
circuit disables the boost regulator when VOUT exceeds 20V  
and continues to keep the regulator off until VOUT drops below  
19V. For FAN5346S30X, the OVP is 30V and it turns back on  
when VOUT is below 29V  
PWM Dimming  
The FAN5346 uses a PWM signal to directly modulate  
output current in the LED string to vary the perceived LED  
brightness. When the EN pin is held HIGH, the FB voltage  
is 250mV. This voltage is reduced when a PWM signal is  
applied to the EN pin, thereby enabling the LEDs to be  
dimmed. The FB voltage is given by the equation:  
Thermal Shutdown  
When the die temperature exceeds 150°C, a reset occurs and  
remains in effect until the die cools to 115°C; at which time, the  
circuit is allowed to begin the soft-start sequence.  
(2)  
VFB = DutyCycle× 250mV  
where DutyCycle = the duty cycle of the PWM signal  
and 250mV is the internal reference voltage.  
Figure 28 illustrates how the FAN5346 divides the internal  
250mV reference voltage at the duty cycle of the PWM  
signal. A low-pass filter filters the PWM signal, which then  
is input into the error amplifier as the reference voltage for  
the FB pin.  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
10  
Application Information  
The reference schematic diagram is shown in Figure 29.  
FAN5346 is able to drive up to eight LEDs with input voltage  
equal to or greater than 2.9V (VIN 2.9V). However, the  
number of LEDs that can be used FAN5346 depends on  
forward voltage. It is recommended that the forward voltage  
(VF) of the white LED be no greater than 3.2V and the  
maximum LED current be 20mA. FAN5345 can be also used  
as a boost convertor by connect the VOUT point to the load  
directly. The return trace of the load should also return to  
GND through a sense resistor (R1).  
Figure 29. Reference Application Schematic Diagram  
Component Placement and PCB Recommendations  
Input Capacitor and Return Trace  
FAN5346 switches at 1.2MHz to boost the output voltage.  
Component placement and PCB layout need to be carefully  
taken into consideration to ensure stable output and to  
prevent generation of noise. Figure 30 is a portion of the  
evaluation board layout. The critical layout elements are: the  
L1, CIN, CIN return trace, COUT, and the COUT return trace.  
The input capacitor is the first priority in a switching buck or  
boost regulator PCB layout. A stable input source (VIN)  
enables a switching regulator to deliver its best performance.  
During the regulator’s operation, it is switching at a high  
frequency, which makes the load of CIN change dynamically  
since it is trying to make the input source vary at the same  
switching frequency as the regulator. To ensure a stable  
input source, CIN needs to hold enough energy to minimize  
the variation at the input pin of the regulator. For CIN to have  
a fast response of charge / discharge, the trace from CIN to  
the input pin of the regulator and the return trace from GND  
of the regulator to CIN should be as short and wide as  
possible to minimize trace resistance, inductance, and  
capacitance. During operation, the current flow from CIN  
through the regulator to the load and back to CIN contains  
high-frequency variation due to switching. Trace resistance  
reduces the overall efficiency due to I2R loss. Even a small  
trace inductance could effectively yield ground variation to  
add noise on VOUT. The input capacitor should be placed  
close to the VIN and GND pins of the regulator and traces  
should be as short as possible. Avoid routing the return trace  
through different layers because vias have strong inductance  
effect at high frequencies. If routing to other PCB layers is  
unavoidable, place vias next to the VIN and GND pins of the  
regulator to minimize the trace distance.  
Output Capacitor and Return Trace  
The output capacitor serves the same purpose as the input  
capacitor, but also maintains a stable output voltage. As  
explained above, the current travels to the load and back to  
the COUT GND terminal. COUT should be placed close to the  
VOUT pin. The traces of COUT to L1, VOUT, and the return  
Figure 30. Reference PCB Layout  
© 2011 Fairchild Semiconductor Corporation  
www.fairchildsemi.com  
FAN5346 • Rev. 1.0.1  
11  
trace from load to COUT should be as short and wide as  
possible to minimize trace resistance and inductance. To  
minimize noise coupling to load, a small-value capacitor can  
be placed between VOUT and COUT to route high-frequency  
noise back to GND before it gets to the load.  
noise is coupled into the FB pin, it causes unstable operation  
of the switching regulator, which affects application  
performance. The return trace from the sense resistor to the  
FB pin should be short and away from any fast-switching  
signal traces. The ground plane under the return trace is not  
necessary. If the ground plane under the return trace is  
noisy; but not the same ground plane as the regulator; the  
noise could be coupled into the FB pin through PCB parasitic  
capacitance, yielding noisy output.  
Inductor  
Inductor (L1) should be placed as close to the regulator as  
possible to minimize trace resistance and inductance for the  
reasons explained above.  
As shown in Figure 30; CIN, COUT, and L1 are all placed next  
to the regulator. All traces are on the same layer to minimize  
trace resistance and inductance. Total PCB area, not  
Sense Resistor  
The sense resistor provides a feedback signal for the  
regulator to control output voltage. A long trace from the  
sense resistor to the FB pin couples noise into the FB pin. If  
including the sense resistor, is 67.2mm2 (7.47mm  
8.99mm).  
x
Table 1. Recommended External Components  
Inductor (L)  
Part Number  
LQH43MN100K03  
Manufacturer  
Murata  
TDK  
NLCV32T-100K-PFR  
VLF3010AT-100MR49-1  
DEM2810C 1224-AS-H-100M  
10.0µH  
TDK  
TOKO  
Minimum COUT  
1.0µF  
CV105X5R105K25AT  
AVX / Kyocera  
Murata  
Minimum CIN  
10.0µF  
GRM21BR71A106KE51L  
Schottky Diode  
N/A  
RBS520S30  
RB520S-30  
Fairchild Semiconductor  
Rohm  
N/A  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
12  
Physical Dimensions  
Figure 31. 6-Lead, SuperSOT™-6, JEDEC MO-193, 1.6mm Wide  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without  
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most  
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty  
therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
13  
© 2011 Fairchild Semiconductor Corporation  
FAN5346 • Rev. 1.0.1  
www.fairchildsemi.com  
14  

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