FAN5350MPX [FAIRCHILD]
3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging; 3MHz的,在芯片规模和MLP封装600mA降压DC- DC转换器![FAN5350MPX](http://pdffile.icpdf.com/pdf1/p00112/img/icpdf/FAN5350_608574_icpdf.jpg)
型号: | FAN5350MPX |
厂家: | ![]() |
描述: | 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging |
文件: | 总15页 (文件大小:479K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
July 2007
FAN5350
3MHz, 600mA Step-Down DC-DC Converter in
Chip-Scale and MLP Packaging
Features
Description
The FAN5350 is a step-down switching voltage regulator
that delivers a fixed 1.82V from an input voltage supply
of 2.7V to 5.5V. Using a proprietary architecture with
synchronous rectification, the FAN5350 is capable of
delivering 600mA at over 90% efficiency, while
maintaining a very high efficiency of over 80% at load
currents as low as 1mA. The regulator operates at a
nominal fixed frequency of 3MHz at full load, which
reduces the value of the external components to 1µH for
the output inductor and 4.7µF for the output capacitor.
3MHz Fixed-Frequency Operation
16µA Typical Quiescent Current
600mA Output Current Capability
2.7V to 5.5V Input Voltage Range
1.82V Fixed Output Voltage
Synchronous Operation
Power-Save Mode
At moderate and light loads, pulse frequency modulation
is used to operate the device in power-save mode with a
typical quiescent current of 16µA. Even with such a low
quiescent current, the part exhibits excellent transient
response during large load swings. At higher loads, the
system automatically switches to fixed-frequency
control, operating at 3MHz. In shutdown mode, the
supply current drops below 1µA, reducing power
consumption.
Soft-Start Capability
Input Under-Voltage Lockout (UVLO)
Thermal Shutdown and Overload Protection
6-Lead 3 x 3mm MLP
5-Bump 1 x 1.37mm WLCSP
Applications
The FAN5350 is available in a 6-lead Molded Leadless
Package (MLP) and a 5-bump Wafer Level Chip Scale
Package (WLCSP).
Cell Phones, Smart-Phones
Pocket PCs
WLAN DC-DC Converter Modules
PDA, DSC, PMP, and MP3 Players
Portable Hard Disk Drives
Ordering Information
Operating
Temperature Range
Part Number Pb-Free
Package
Packing Method
FAN5350UCX
FAN5350MPX
Yes
Yes
-40°C to 85°C
-40°C to 85°C
WLCSP-5 1x1.37mm
MLP-6 3 x 3mm
Tape and Reel(1)
Tape and Reel(1)
Note:
1. Please refer to tape and reel specifications on www.fairchildsemi.com; http://www.fairchildsemi.com/packaging.
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
Typical Applications
4.7µF
VIN
CIN
PGND
VIN
1
2
3
6
5
4
VIN
4.7µF
CIN
VIN
GND
A1 A3
P1
(GND)
AGND
FB
SW
EN
L1
B2
SW
FB
VOUT
1µH
EN
C1
C3
4.7µF
COUT
L1
VOUT
COUT
1µΗ
4.7µF
Figure 1. WLCSP (top view)
Figure 2. MLP (top view)
Block Diagram
VIN
Current Limit
Bias
EN
1.8V
Reference
+
-
SW
Modulator
Logic
Driver
FB
3MHz OSC
Zero Crossing
GND
Figure 3. Block Diagram
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
2
Pin Configurations
A1 A3
A3 A1
B2
VIN
GND
SW
GND
SW
VIN
B2
EN C1 C3 FB
FB C3 C1 EN
Figure 4. WLCSP - Bumps Facing Down
Figure 5. WLCSP - Bumps Facing Up
PGND
AGND
FB
1
2
3
6
5
4
VIN
SW
EN
P1
(GND)
Figure 6. 3x3mm MLP - Leads Facing Down
Pin Definitions
WLCSP
Pin #
A1
Name Description
VIN
Power Supply Input.
A3
GND
Ground Pin. Signal and power ground for the part.
Enable Pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled
when >1.2V. Do not leave this pin floating.
C1
EN
C3
B2
FB
Feedback Analog Input. Connect directly to the output capacitor.
SW
Switching Node. Connection to the internal PFET switch and NFET synchronous rectifier.
MLP
Pin #
Name Description
Power Ground Pin. Power stage ground. Connect PGND and AGND together via the board
ground plane.
1
PGND
2
3
AGND
FB
Analog Ground Pin. Signal ground for the part.
Feedback Analog Input. Connect directly to the output capacitor.
Enable Pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled
when >1.2V. Do not leave this pin floating.
4
EN
5
6
SW
VIN
Switching Node. Connection to the internal PFET switch and NFET synchronous rectifier.
Power Supply Input.
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
3
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
-0.3
-0.3
-40
Max.
6.0
Unit
V
Input Voltage with respect to GND
VIN
Voltage on any other pin with respect to GND
Junction Temperature
VIN
V
TJ
TSTG
TL
150
150
260
°C
°C
°C
kV
kV
V
Storage Temperature
-65
Lead Temperature (Soldering 10 Seconds)
Human Body Model
4.5
1.5
200
ESD
Electrostatic Discharge Protection Level
Charged Device Model
Machine Model
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VCC
IOUT
L
Parameter
Min.
2.7
0
Typ.
Max.
5.5
Unit
V
Supply Voltage Range
Output Current
600
mA
µH
µF
µF
°C
Inductor
0.7
3.3
3.3
-40
-40
1.0
4.7
4.7
3.0
CIN
Input Capacitor
12.0
12.0
+85
+125
COUT
TA
Output Capacitor
Operating Ambient Temperature
Operating Junction Temperature
TJ
°C
Thermal Properties
Symbol
Parameter
Min.
Typ.
Max.
Units
Junction-to-Ambient Thermal Resistance(2)
Junction-to-Ambient Thermal Resistance(2)
°C/W
°C/W
180
49
ΘJA_WLCSP
ΘJA_MLP
Note:
2. Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with
four-layer 1s2p boards in accordance to JESD51- JEDEC standard. Special attention must be paid not to exceed
junction temperature TJ(max) at a given ambient temperate TA.
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
4
Electrical Characteristics
Minimum and maximum values are at VIN = 2.7V to 5.5V, TA = -40°C to +85°C, CIN = COUT = 4.7µF, L = 1µH, unless
otherwise noted. Typical values are at TA = 25°C, VIN =3.6V.
Symbol
Parameter
Conditions
Min.
Typ.
Max. Units
Power Supplies
Device is not switching, EN=VIN
Device is switching, EN=VIN
VIN = 3.6V, EN = GND
Rising Edge
16
18
µA
IQ
Quiescent Current
25
µA
µA
I(SD)
Shutdown Supply Current
0.05
1.00
2.1
1.8
1.75
1.2
VUVLO
Under-Voltage Lockout Threshold
V
Falling Edge
1.95
V(ENH)
V(ENL)
Enable HIGH-Level Input Voltage
Enable LOW-Level Input Voltage
Enable Input Leakage Current
V
V
0.4
I(EN)
EN = VIN or GND
0.01
3.0
1.00
µA
Oscillator
f0SC
Oscillator Frequency
2.5
3.5
MHz
Regulation
ILOAD = 0 to 600mA
CCM
1.775
1.784
1.820
1.820
1.865
1.856
300
V
V
VO
Output Voltage Accuracy
tSS
Soft-Start
EN = 0 -> 1
µs
Output Driver
PMOS On Resistance
VIN = VGS = 3.6V
VIN = VGS = 3.6V
Open-Loop(3)
CCM Only
180
170
800
150
20
mΩ
mΩ
mA
°C
RDS(on)
NMOS On Resistance
PMOS Peak Current Limit
Thermal Shutdown
ILIM
650
900
TTSD
THYS
Thermal Shutdown Hysteresis
°C
Note:
3. The Electrical Characteristics table reflects open-loop data. Refer to Operation Description and Typical
Characteristic for closed-loop data.
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
5
Operation Description
The FAN5350 is a step-down switching voltage regulator
that delivers a fixed 1.82V from an input voltage supply of
2.7V to 5.5V. Using a proprietary architecture with
synchronous rectification, the FAN5350 is capable of
delivering 600mA at over 90% efficiency, while
maintaining a light load efficiency of over 80% at load
currents as low as 1mA. The regulator operates at a
nominal frequency of 3MHz at full load, which reduces the
value of the external components to 1µH for the output
inductor and 4.7µF for the output capacitor.
Enable and Soft Start
Maintaining the EN pin LOW keeps the FAN5350 in
non-switching mode in which all circuits are off and the
part draws ~50nA of current. Increasing EN above its
threshold voltage activates the part and starts the soft-
start cycle. During soft start, the current limit is
increased in discrete steps so that the inductor current is
increased in a controlled manner. This minimizes any
large surge currents on the input and prevents any
overshoot of the output voltage.
Control Scheme
The FAN5350 uses a proprietary non-linear, fixed-
frequency PWM modulator to deliver a fast load
Under-Voltage Lockout
When EN is high, the under-voltage lock-out keeps the
part from operating until the input supply voltage rises
high enough to properly operate. This ensures no
misbehavior of the regulator during start-up or shutdown.
transient response, while maintaining
a
constant
switching frequency over a wide range of operating
conditions. The regulator performance is independent of
the output capacitor ESR, allowing for the use of
ceramic output capacitors. Although this type of
operation normally results in a switching frequency that
varies with input voltage and load current, an internal
frequency loop holds the switching frequency constant
over a large range of input voltages and load currents.
Current Limiting
A heavy load or short circuit on the output causes the
current in the inductor to increase until a maximum
current threshold is reached in the high-side switch.
Upon reaching this point, the high-side switch turns off,
preventing high currents from causing damage.
For very light loads, the FAN5350 operates in
discontinuous current (DCM) single-pulse PFM mode,
which produces low output ripple compared with other
PFM architectures. Transition between PWM and PFM
is seamless, with a glitch of less than 14mV at VOUT
during the transition between DCM and CCM modes.
The peak current limit shown in Figure 16, ILIM(PK) is
slightly higher than the open-loop tested current limit,
I
LIM(OL), in the Electrical Characteristics table. This is
primarily due to the effect of propagation delays of the
IC current limit comparator.
Combined with exceptional transient response
characteristics, the very low quiescent current of the
controller (<16µA) maintains high efficiency, even at
very light loads, while preserving fast transient response
for applications requiring very tight output regulation.
Thermal Shutdown
When the die temperature increases, due to a high load
condition and/or a high ambient temperature, the output
switching is disabled until the temperature on the die
has fallen sufficiently. The junction temperature at which
the thermal shutdown activates is nominally 150°C with
a 20°C hysteresis.
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
6
Applications Information
Selecting the Inductor
The output inductor must meet both the required
inductance and the energy handling capability of the
application.
The increased RMS current produces higher losses
through the RDS(ON) of the IC MOSFETs as well as the
inductor ESR.
Increasing the inductor value produces lower RMS
currents, but degrades transient response. For a given
physical inductor size, increased inductance usually
results in an inductor with lower saturation current.
The inductor value affects the average current limit, the
PWM-to-PFM transition point, the output voltage ripple,
and the efficiency.
Table 1 shows the effects of inductance higher or lower
than the recommended 1μH on regulator performance.
The ripple current (∆I) of the regulator is:
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
VOUT
V
− VOUT
L • FSW
IN
Output Capacitor
ΔI ≈
•
EQ. 1
V
IN
Table 2 suggests 0603 capacitors. 0805 capacitors may
further improve performance in that the effective
capacitance is higher and ESL is lower than 0603. This
improves the transient response and output ripple.
The maximum average load current, IMAX(LOAD) is related
to the peak current limit, ILIM(PK) (see figure 17) by the
ripple current:
Increasing COUT has no effect on loop stability and can
therefore be increased to reduce output voltage ripple or
to improve transient response. Output voltage ripple,
∆VOUT, is:
ΔI
2
EQ. 2
IMAX(LOAD) = ILIM(PK)
−
The transition between PFM and PWM operation is
determined by the point at which the inductor valley
current crosses zero. The regulator DC current when the
inductor current crosses zero, IDCM, is:
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
1
ΔVOUT = ΔI•
+ ESR
EQ. 5
8 • COUT •FSW
ΔI
2
IDCM
=
EQ. 3
Input Capacitor
The 4.7μF ceramic input capacitor should be placed as
close as possible between the VIN pin and GND to
minimize the parasitic inductance. If a long wire is used
to bring power to the IC, additional “bulk” capacitance
(electrolytic or tantalum) should be placed between CIN
and the power source lead to reduce ringing that can
occur between the inductance of the power source leads
and CIN.
The FAN5350 is optimized for operation with L=1μH, but
is stable with inductances ranging from 700nH to 3.0μH.
The inductor should be rated to maintain at least 80% of
its value at ILIM(PK)
.
Efficiency is affected by the inductor DCR and
inductance value. Decreasing the inductor value for a
given physical size typically decreases the DCR; but
since ∆I increases, the RMS current increases, as do
the core and skin effect losses.
ΔI2
12
2
EQ. 4
IRMS
=
IOUT(DC)
+
Inductor Value
Increase
IMAX(LOAD) EQ. 2
Increase
ILIM(PK)
Decrease
Increase
∆VOUT EQ. 5
Decrease
Increase
Transient Response
Degraded
Decrease
Decrease
Improved
Table 1. Effects of changes in inductor value (from 1µH recommended value) on regulator performance
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
7
PCB Layout Guidelines
For the bill of materials of the FAN5350 evaluation
board, see Table 1. There are only three external
components: the inductor and the input and output
capacitors. For any buck switcher IC, including the
FAN5350, it is always important to place a low-ESR
input capacitor very close to the IC, as shown in Figure
7. That ensures good input decoupling, which helps
reduce the noise appearing at the output terminals and
ensures that the control sections of the IC do not
behave erratically due to excessive noise. This reduces
switching cycle jitter and ensures good overall
performance. It is not considered critical to place either
the inductor or the output capacitor very close to the IC.
There is some flexibility in moving these two
components further away from the IC.
Description
Qty.
Ref.
Vendor
TOKO
Part Number
1117AS-1R2M
1.2μH, 1.8A, 55mΩ
Inductor
1
L1
FDK
MIPSA2520D1R0
CBC3225T15MR
GRM39 X5R 475K 6.3
FAN5350UCX
1.3μH, 1.2A, 90mΩ
1.5μH, 1.3A
Taiyo Yuden
MURATA
Fairchild
Any
2
1
1
CIN,COUT
U1
Capacitor 4.7μF, ±10%, 6.3V, X5R, 0603
IC DC/DC Regulator in CSP, 5 bumps
Load Resistor (Optional)
RLOAD
Table 2. FAN5350 Evaluation Board Bill of Materials (optional parts are installed by request only)
Feedback Loop
One key advantage of the non-linear architecture is that
there is no traditional feedback loop. The loop response
to changes in VOUT is essentially instantaneous, which
explains its extraordinary transient response. The
absence of a traditional, high-gain compensated linear
loop means that the FAN5350 is inherently stable over a
wide range of LOUT and COUT
.
LOUT can be reduced further for a given application,
provided it is confirmed that the calculated peak current
for the required maximum load current is less than the
minimum of the closed-loop current limit. The advantage
is that this generally leads to improved transient
response, since a small inductance allows for a much
faster increase in current to cope with any sudden load
demand.
The inductor can be increased to 2.2µH; but, for the
same reason, the transient response gets slightly
degraded. In that case, increasing the output capacitor
to 10µF helps significantly.
Figure 7. The FAN5350 Evaluation Board PCB (CSP)
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
8
Typical Performance Characteristics
VIN = 3.6V, TA = 25°C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified.
1850
24
22
20
18
1840
DCM spreading
+85°C
1830
1820
1810
CCM
+25°C
16
14
-40°C
1800
1790
12
10
0
100
200
300
400
500
600
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Battery Voltage (V)
Load Current (mA)
Figure 8. Quiescent Current vs. Battery Voltage
Figure 9. Load Regulation, Increasing Load
600
600
500
400
85°C CCM border
-30°C CCM border
500
400
300
200
100
0
Continuous Conduction Mode
Hysteresis
Switching mode
changes at these
borders
300
200
100
0
85°C DCM border
-30°C DCMborder
Discontinuous Conduction Mode
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Battery Voltage (V)
Battery Voltage (V)
Figure 10. Switch Mode Operating Areas
Figure 11. Switch Mode Over Temperature
2.00
1835
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
1830
1825
V
IN=2.7V
VIN=5.5V
VIN=2.7V
1820
1815
VIN=3.6V
VIN=5.5V
VIN=3.6V
1810
1805
ILOAD=300mA
60 80
1800
-40
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
-20
0
20
40
Load Current (A)
Ambient Temperature (°C)
Figure 12. DC Current Voltage Output Characteristics
Figure 13. Output Voltage vs. Temperature
© 2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5350 Rev. 1.0.1
9
Typical Performance Characteristics (Continued)
VIN = 3.6V, TA = 25°C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified.
100
95
90
85
80
75
100
95
90
85
80
75
VIN=2.5V
VIN=2.7V
VIN=3.3V
VIN=3.6V
VIN=4.2V
VIN=5V
-40°C
+85°C
+25°C
70
65
60
VIN=5.5V
0.001
0.010
0.100
1.000
0.001
0.010
0.100
1.000
Load Current (A)
Load Current (A)
Figure 14. Power Efficiency vs. Load Current
Figure 15. Power Efficiency Over Temperature Range
1.3
250
200
VIN=5.5V
1.2
1.1
150
+85°C
1.0
VIN=3.6V
100
0.9
+25°C
50
0.8
VIN=2.7V
-40°C
0
2.5
0.7
3.0
3.5
4.0
4.5
5.0
5.5
-40
-20
0
20
40
60
80
Battery Voltage (V)
Ambient Temperature (°C)
Figure 16. PMOS Current Limit in Closed Loop
Figure 17. Shutdown Supply Current vs.
Battery Voltage
85dB
3.3
250mA Load
3.2
3.1
3.0
2.9
2.8
2.7
-40°C
+25°C
5dB
/div
+85°C
2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
35dB
1Hz
10Hz
100Hz
1kHz
10kHz
Battery Voltage (V)
Figure 18. Power Supply Rejection Ratio in CCM
Figure 19. Switching Frequency in CCM
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
10
Typical Performance Characteristics (Continued)
VIN = 3.6V, TA = 25°C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified.
IL, 0.5A / div.
IL, 0.5A / div.
V
OUT, 0.5V / div.
V
OUT, 0.5V / div.
EN, 5.0V / div.
EN, 5.0V / div.
H scale: 20µs / div.
Figure 20. Start-Up, Full Load
H scale: 10µs / div.
Figure 21. Start-Up, No Load
V
OUT(ac), 20mV / div.
V
OUT(ac), 20mV / div.
ILOAD, 0.5A / div.
ILOAD, 0.5A / div.
H scale: 1µs / div.
Figure 22. Fast Load Transient, No Load to Full Load
H scale: 1µs / div.
Figure 23. Fast Load Transient, Full Load to No Load
VSW, 5V / div.
VSW, 5V / div.
V
OUT(ac), 20mV / div.
VOUT(ac), 20mV / div.
I
LOAD = 600mA
ILOAD = 300mA
ILOAD = 50mA
I
LOAD = 1mA
H scale: 20µs / div.
H scale: 20µs / div.
Figure 24. Fast Load Transient in CCM
Figure 25. Fast Load Transient in DCM
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
11
Typical Performance Characteristics (Continued)
VIN = 3.6V, TA = 25°C, VEN = VIN, according to the circuit in Figure 1 or Figure 2, unless otherwise specified.
VSW, 2V / div.
VSW, 5V / div.
VOUT(ac), 20mV / div.
VOUT(ac), 20mV / div.
ILOAD, 0.2A / div.
I
LOAD = 300mA
LOAD = 20mA
I
H scale: 20µs / div.
Figure 26. Fast Load Transient DCM – CCM – DCM
H scale: 2ms / div.
Figure 27. Slow Load Transient DCM – CCM – DCM
VOUT(ac), 20mV / div.
VOUT(ac), 20mV / div.
VIN = 3.6V
VIN = 3.6V
V
IN = 3.0V
VIN = 3.0V
H scale: 10µs / div.
H scale: 10µs / div.
Figure 28. Line Transient, 600mV, 50mA Load
Figure 29. Line Transient, 600mV, 50mA Load
VOUT(ac), 10mV / div.
VIN = 3.6V
VIN = 3.0V
ILOAD = 350mA
ILOAD = 100mA
H scale: 5µs / div.
Figure 30. Combined Line (600mV) and Load (100mA to 350mA) Transient Response
VSW, 2V / div.
VSW, 2V / div.
IL = 0.2A / div.
IL = 0.1A / div.
OUT(ac), 20mV / div.
V
V
OUT(ac), 20mV / div.
H scale: 1µs / div.
H scale: 200µs / div.
Figure 32. Typical Waveforms in CCM, 150mA Load
Figure 31. Typical Waveforms in DCM, 50mA Load
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
12
Physical Dimensions
Dimensions are in millimeters unless otherwise noted.
Figure 33. 6-Lead Molded Leadless Package (MLP)
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
13
Physical Dimensions (Continued)
Dimensions are in millimeters unless otherwise noted.
F
BALL A1
INDEX AREA
A
E
(0.50)
(0.866)
(Ø0.25)
Cu PAD
B
D
0.03 C
A1
2X
(Ø0.35)
SOLDER MASK
OPENING
F
(0.433)
0.03 C
2X
RECOMMENDED LAND PATTERN (NSMD)
TOP VIEW
0.332±0.018
0.06 C
E
0.625 MAX
0.250±0.025
0.05 C
D
C
SEATING PLANE
SIDE VIEWS
(X)+/-.018
F
A. NO JEDEC REGISTRATION APPLIES
B. DIMENSIONS ARE IN MILLIMETERS.
0.005
C A B
0.50
5 X Ø0.315 +/- .025
0.50
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
C
D
E
F
DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
PACKAGE TYPICAL HEIGHT IS 582 MICRONS
+/- 43 MICRONS (539-625 MICRONS)
FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
B
A
0.433
1 2 3
BOTTOM VIEW
(Y)+/-.018
F
G. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6
SAC405 ALLOY
H. DRAWING FILENAME: MKT-UC005AArev3
Product Specific Dimensions
Product
D
E
X
Y
FAN5350UCX
1.370 +/- 0.030
1.000 +/- 0.030
0.270
0.272
Figure 34. 5-Bump Wafer-Level Chip-Scale Package (WLCSP)
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
14
© 2007 Fairchild Semiconductor Corporation
FAN5350 Rev. 1.0.1
www.fairchildsemi.com
15
相关型号:
©2020 ICPDF网 联系我们和版权申明