SP3232EHCY-L [EXAR]
Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, PDSO16, LEAD FREE, PLASTIC, TSSOP-16;
| 型号： | SP3232EHCY-L |
| 厂家： | 
EXAR CORPORATION |
| 描述： | Line Transceiver, 2 Func, 2 Driver, 2 Rcvr, PDSO16, LEAD FREE, PLASTIC, TSSOP-16 光电二极管 |
| 文件： | 总16页 (文件大小：593K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SP3232EH
3.3V, 460 kbps RS-232 Transceiver
FEATURES
■ Meets true EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
■ Interoperable with RS-232 down to a
+2.7V power source
■ Enhanced ESD Specifications:
+15kV Human Body Model
+15kV IEC61000-4-2 Air Discharge
+8kV IEC61000-4-2 Contact Discharge
■ 460kbps Minimum Transmission Rate
■ Ideal for Handheld, Battery Operated
Applications
V
CC
1
2
3
4
5
6
16
15
14
13
12
11
C1+
V+
GND
C1-
T1OUT
SP3232EH
C2+
C2-
V-
R1IN
R1OUT
T1IN
7
8
10
9
T2OUT
R2IN
T2IN
R2OUT
Now Available in Lead Free Packaging
DESCRIPTION
The SP3232EH is a 2 driver / 2 receiver RS-232 transceiver solution intended for portable or
hand-held applications such as notebook or laptop computers. The data transmission rate of
460kbps can meet the demands of high speed RS-232 applications. This device has a high-
efficiency, charge-pump power supply that requires only 0.1µF capacitors in 3.3V operation.
This charge pump allows the SP3232EH device to deliver true RS-232 performance from
a single power supply ranging from +3.0V to +5.5V. The ESD tolerance of the SP3232EH
device exceeds +/-15kV for both Human Body Model and IEC61000-4-2 Air discharge test
methods.
SELECTION TABLE
Power
Supplies
RS-232
RS-232
External
TTL
3-State Pins
# of
Device
Shutdown
No
Drivers Receivers Components
SP3232EH +3.0V to +5.5V
2
2
4
No 16
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
1
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability and cause permanent damage to the
device.
Power Dissipation per package
V
.......................................................-0.3V to +6.0V
V+CC(NOTE 1).......................................-0.3V to +7.0V
V- (NOTE 1)........................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...........................................+13V
ICC (DC VCC or GND current).........................+100mA
16-pin SSOP (derate 9.69mW/oC above +70oC)...............775mW
16-pin PDIP (derate 14.3mW/oC above +70oC)...............1150mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC)........900mW
16-pin TSSOP (derate 10.5mW/oC above +70oC)..............850mW
Input Voltages
TxIN, ...................................................-0.3V to +6.0V
RxIN...................................................................+15V
Output Voltages
TxOUT.............................................................+13.2V
RxOUT, .......................................-0.3V to (VCC +0.3V)
Short-Circuit Duration
TxOUT....................................................Continuous
Storage Temperature......................-65°C to +150°C
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
PARAMETER
MIN.
TYP.
MAX. UNITS CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
mA
no load, VCC = 3.3V,
TAMB = 25oC, TxIN = GND or VCC
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
GND
0.8
V
TxIN
Input Logic Threshold HIGH
Input Logic Threshold HIGH
Input Leakage Current
Output Voltage LOW
2.0
2.4
Vcc
Vcc
+1.0
0.4
V
Vcc = 3.3V
V
Vcc = 5.0V
+0.01
µA
V
TxIN, TAMB = +25oC
IOUT = 1.6mA
IOUT = -1.0mA
Output Voltage HIGH
DRIVER OUTPUTS
VCC -0.6 VCC -0.1
V
Output Voltage Swing
+5.0
+5.4
V
All driver outputs loaded with 3kΩ to
GND, TAMB = +25oC
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.5V with TAMB = TMIN to TMAX
PARAMETER
MIN.
TYP. MAX. UNITS CONDITIONS
DRIVER OUTPUTS (continued)
Output Resistance
300
Ω
mA
µA
VCC = V+ = V- = 0V, VOUT=+2V
Output Short-Circuit Current
Output Leakage Current
RECEIVER INPUTS
+35
+60
+25
VOUT = 0V
VCC = 0V, VOUT = +12V
Input Voltage Range
Input Threshold LOW
Input Threshold LOW
Input Threshold HIGH
Input Threshold HIGH
Input Hysteresis
-15
0.6
0.8
15
V
V
1.2
1.5
1.5
1.8
0.3
5
Vcc = 3.3V
Vcc = 5.0V
Vcc = 3.3V
Vcc = 5.0V
V
2.4
2.4
V
V
V
Input Resistance
3
7
kΩ
TIMING CHARACTERISTICS
Maximum Data Rate
460
kbps
RL = 3kΩ, CL = 1000pF, one
driver switching
Driver Propagation Delay, tPHL
Driver Propagation Delay, tPLH
Receiver Propagation Delay, tPHL
1.0
1.0
0.3
µs
µs
µs
RL = 3kΩ, CL = 1000pF
RL = 3kΩ, CL = 1000pF
Receiver input to Receiver
output, CL = 150pF
Receiver Propagation Delay, tPLH
0.3
µs
Receiver input to Receiver
output, CL = 150pF
Receiver Output Enable Time
Receiver Output Disable Time
Driver Skew
200
200
100
ns
ns
ns
500
| tPHL - tPLH
| tPHL - tPLH
|
|
Receiver Skew
200
60
1000
ns
Transition-Region Slew Rate
V/µs
Vcc = 3.3V, RL = 3kΩ,
CL = 1000pF, TAMB = 25°C,
measurements taken from -3.0V
to +3.0V or +3.0V to -3.0V
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 460kbps data rate, all
drivers loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
14
6
12
4
10
Vout+
Vout-
2
8
6
4
2
0
0
-2
-4
-6
0
500
1000
1500
2000
+Slew
-Slew
0
500
1000
1500
2000
2330
Load Capacitance [pF]
Load Capacitance [pF]
Figure 1. Transmitter Output Voltage vs Load
Figure 2. Slew Rate vs Load Capacitance
Capacitance
40
460Kbps
120Kbps
20Kbps
35
30
25
20
15
10
5
0
0
500 1000 1500 2000 2500 3000
Load Capacitance (pF)
Figure 3. Supply Current VS. Load Capacitance
when Transmitting Data
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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PIN FUNCTION
PIN NUMBER
NAME
FUNCTION
SP3232EH
C1+
V+
Positive terminal of the voltage doubler charge-pump capacitor
+5.5V output generated by the charge pump
Negative terminal of the voltage doubler charge-pump capacitor
Positive terminal of the inverting charge-pump capacitor
Negative terminal of the inverting charge-pump capacitor
-5.5V output generated by the charge pump
RS-232 driver output.
1
2
C1-
3
C2+
C2-
4
5
V-
6
T1OUT
T2OUT
R1IN
R2IN
14
7
RS-232 driver output.
RS-232 receiver input
13
8
RS-232 receiver input
R1OUT TTL/CMOS receiver output
R2OUT TTL/CMOS receiver output
12
9
T1IN
T2IN
GND
VCC
TTL/CMOS driver input
TTL/CMOS driver input
Ground.
11
10
15
16
+3.0V to +5.5V supply voltage
Table 1. Device Pin Description
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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PINOUT
V
CC
1
2
3
4
5
6
16
15
14
13
12
11
C1+
V+
GND
C1-
T1OUT
SP3232EH
C2+
C2-
V-
R1IN
R1OUT
T1IN
7
8
10
9
T2OUT
R2IN
T2IN
R2OUT
Figure 4. Pinout Configuration for the SP3232EH
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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TYPICAL OPERATING CIRCUITS
VCC
+
+
16
0.1µF
0.1µF
C5
C1
VCC
2
1
C1+
V+
V-
+
*C3
C4
0.1µF
0.1µF
3
4
C1-
6
C2+
SP3232EH
+
0.1µF
C2
+
5
C2-
T1OUT
T2OUT
14
11 T1IN
LOGIC
RS-232
7
10
INPUTS
T2IN
OUTPUTS
12
9
R1IN 13
R1OUT
R2OUT
5kΩ
5kΩ
RS-232
INPUTS
LOGIC
OUTPUTS
R2IN
8
GND
15
*can be returned to
either VCC or GND
Figure 5. SP3232EH Typical Operating Circuit
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SP3232EH_102_031413
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DESCRIPTION
The SP3232EH is a 2-driver / 2-receiver
devices ideal for portable or hand-held
applications. The SP3232EH transceiver
meets the EIA/TIA-232 and ITU-TV.28/V.24
communication protocols and can be imple-
mented in battery-powered, portable, or
hand-held applications such as notebook or
palmtop computers. The SP3232EH device
featuresExar'sproprietaryon-boardcharge
pump circuitry that generates ±5.5V for RS-
232 voltage levels from a single +3.0V to
+5.5V power supply. This device is ideal for
+3.3V-only systems, mixed +3.3V to +5.5V
systems, or+5.0V-onlysystemsthatrequire
true RS-232 performance. The SP3232EH
device can operate at a minimum data rate
of 460kbps when fully loaded.
circuit with all drivers active at 120kbps
with RS-232 loads in parallel with a
1000pF capacitor. Figure 8 shows the
test results where one driver was active
at 460kbps and all drivers loaded with an
RS-232 receiver in parallel with 1000pF
capacitor.Designersshouldconnectunused
inputs to Vcc or GND.
Receivers
The Receivers convert EIA/TIA-232 levels
to TTL or CMOS logic output levels. Since
receiver input is usually from a transmission
line where long cable lengths and system
interference can degrade the signal, the
inputs have a typical hysteresis margin of
300mV. This ensures that the receiver is
virtuallyimmunetonoisytransmissionlines.
Should an input be left unconnected, an
internal 5kΩ pulldown resistor to ground
will commit the output of the receiver to a
HIGH state.
THEORY OF OPERATION
The SP3232EH is made up of three basic
circuit blocks:
1. Drivers
2. Receivers
3. The Exar proprietary charge pump
Charge Pump
The charge pump is an Exar-patended
design (U.S. 5,306,954) and uses a unique
approach compared to older less-efficient
designs. The charge pump still requires four
external capacitors, but uses a four-phase
voltage shifting technique to attain sym-
metrical 5.5V power supplies. The internal
power supply consists of a regulated dual
charge pump that provides output voltages
of +/-5.5V regardless of the input voltage
(Vcc) over the +3.0V to +5.5V range.
Drivers
The drivers are inverting level transmitters
that convert TTL or CMOS logic levels to
+5.0V EIA/TIA-232 levels with an inverted
sense relative to the input logic levels.
Typically, the RS-232 output voltage swing
is +5.4V with no load and +5V minimum fully
loaded. The driver outputs are protected
against infinite short-circuits to ground with-
out degradation in reliability. Driver outputs
will meet EIA/TIA-562 levels of +/-3.7V with
supply voltages as low as 2.7V.
In most circumstances, decoupling the
power supply can be achieved adequately
using a 0.1µF bypass capacitor at C5 (refer
to figure 5)
In applications that are sensitive to power-
supply noise, decouple Vcc to ground with a
capacitorofthesamevalueascharge-pump
capacitor C1. Physically connect bypass
capacitors as close to the IC as possible.
The drivers have a minimum data rate of
460kbps fully loaded with 3kΩ in parallel
with 1000pF, ensuring compatibility with
PC-to-PC communication software.
Figure 6 shows a loopback test circuit
used to test the RS-232 Drivers. Figure
7 shows the test results of the loopback
The charge pump operates in a discontinu-
ous mode using an internal oscillator. If the
output voltages are less than a magnitude
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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DESCRIPTION
of 5.5V, the charge pump is enabled. If the
outputvoltages exceedamagnitudeof5.5V,
the charge pump is disabled. This oscillator
controls the four phases of the voltage shift-
ing. A description of each phase follows.
V
CC
+
+
0.1µF
0.1µF
C5
C1
V
CC
C1+
V+
V-
+
+
C3
C4
0.1µF
0.1µF
C1-
C2+
Phase 1
+
SP3232EH
C2
0.1µF
— VSS charge storage — During this phase
oftheclockcycle,thepositivesideofcapaci-
tors C1 and C2 are initially charged to VCC.
Cl+ is then switched to GND and the charge
in C1– is transferred to C –. Since C2+ is con-
nected to V , the volta2ge potential across
capacitor C2CCis now 2 times VCC.
C2-
TxOUT
TxIN
LOGIC
INPUTS
RxIN
RxOUT
LOGIC
OUTPUTS
5kΩ
GND
Phase 2
— V transfer — Phase two of the clock
connSeSctsthenegativeterminalofC totheVSS
storagecapacitorandthepositivet2erminalof
C2 to GND. This transfers a negative gener-
ated voltage to C3. This generated voltage is
regulated to a minimum voltage of -5.5V.
Simultaneous with the transfer of the volt-
age to C3, the positive side of capacitor C1
is switched to VCC and the negative side is
connected to GND.
1000pF
Figure 6. SP3232EH Driver Loopback Test Circuit
Phase 3
— VDD charge storage — The third phase of
the clock is identical to the first phase — the
charge transferred in C1 produces –VCC in
the negative terminal of C , which is applied
to the negative side of ca1pacitor C2. Since
C + is at V , the voltage potential across C2
is22 timesCVCCC.
Figure 7. Loopback Test results at 120kbps
Phase 4
— V transfer — The fourth phase of
the cDloDck connects the negative terminal
of C2 to GND, and transfers this positive
generated voltage across C2 to C4, the
VDD storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the in-
ternal oscillator is disabled. Simultaneous
with the transfer of the voltage to C4, the
positive side of capacitor C is switched
to V and the negative1 side is con-
nectCeCd to GND, allowing the charge
pump cycle to begin again. The charge
pump cycle will continue as long as the
operational conditions for the internal
oscillator are present.
T1 IN
T1 OUT
R1 OUT
Figure 8. Loopback Test results at 460kbps
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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DESCRIPTION
Since both V+ and V– are separately gen-
erated from VCC, in a no–load condition V+
and V– will be symmetrical. Older charge
pump approaches that generate V– from
V+ will show a decrease in the magnitude
of V– compared to V+ due to the inherent
inefficiencies in the design.
The clock rate for the charge pump typi-
cally operates at greater than 250kHz. The
external capacitors can be as low as 0.1µF
with a 16V breakdown voltage rating.
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 9. Charge Pump — Phase 1
V
CC
= +5V
C
4
+
–
V
V
Storage Capacitor
DD
+
–
+
–
C
1
C
2
+
–
Storage Capacitor
SS
C
3
-5.5V
Figure 10. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
T
GND
GND
1
2
b) C2-
-6V
Ch1 2.00V Ch2 2.00V M 1.00ms Ch1 5.48V
Figure 11. Charge Pump Waveforms
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SP3232EH_102_031413
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DESCRIPTION
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 12. Charge Pump — Phase 3
V
CC
= +5V
+5.5V
+
C
4
+
–
+
V
Storage Capacitor
DD
+
–
C
1
C
2
–
–
V
SS
Storage Capacitor
C
3
Figure 13. Charge Pump — Phase 4
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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DESCRIPTION
ESD TOLERANCE
thesystemisrequiredtowithstandanamount
of static electricity when ESD is applied to
points and surfaces of the equipment that
are accessible to personnel during normal
The SP3232EH device incorporates
ruggedized ESD cells on all driver out-
put and receiver input pins. The ESD
structure is improved over our previous
family for more rugged applications and
environments sensitive to electro-static
discharges and associated transients. The
improved ESD tolerance is at least +15kV
without damage nor latch-up.
usage. The transceiver IC receives most
of the ESD current when the ESD source is
appliedtotheconnectorpins. Thetestcircuit
for IEC61000-4-2 is shown on Figure 15.
TherearetwomethodswithinIEC61000-4-2,
the Air Discharge method and the Contact
Discharge method.
With the Air Discharge Method, an ESD
voltage is applied to the equipment under
test (EUT) through air. This simulates an
electricallychargedpersonreadytoconnect
a cable onto the rear of the system only to
findanunpleasantzapjustbeforetheperson
touches the back panel. The high energy
potential on the person discharges through
anarcingpathtotherearpanelofthesystem
before he or she even touches the system.
This energy, whether discharged directly or
throughair,ispredominantlyafunctionofthe
discharge current rather than the discharge
voltage. Variableswithanairdischargesuch
asapproachspeedoftheobjectcarryingthe
ESD potential to the system and humidity
will tend to change the discharge current.
For example, the rise time of the discharge
current varies with the approach speed.
There are different methods of ESD testing
applied:
a) MIL-STD-883, Method 3015.7
b) IEC61000-4-2 Air-Discharge
c) IEC61000-4-2 Direct Contact
The Human Body Model has been the
generally accepted ESD testing method
for semi-conductors. This method is also
specified in MIL-STD-883, Method 3015.7
forESDtesting.ThepremiseofthisESDtest
is to simulate the human body’s potential to
store electro-static energy and discharge it
to an integrated circuit. The simulation is
performed by using a test model as shown
in Figure 14. This method will test the IC’s
capability to withstand an ESD transient
during normal handling such as in manu-
facturing areas where the IC's tend to be
handled frequently.
The Contact Discharge Method applies the
ESDcurrentdirectlytotheEUT. Thismethod
was devised to reduce the unpredictability
of the ESD arc. The discharge current rise
time is constant since the energy is directly
transferred without the air-gap arc. In situ-
ations such as hand held systems, the ESD
charge can be directly discharged to the
The IEC-61000-4-2, formerly IEC801-2, is
generallyusedfortestingESDonequipment
and systems. For system manufacturers,
theymustguaranteeacertainamountofESD
protection since the system itself is exposed
totheoutsideenvironmentandhumanpres-
ence. ThepremisewithIEC61000-4-2isthat
R
S
R
C
SW1
SW2
Device
C
DC Power
Source
S
Under
Test
Figure 14. ESD Test Circuit for Human Body Model
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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DESCRIPTION
Contact-Discharge Model
R
R
R
V
C
S
SW1
SW2
Device
Under
Test
C
DC Power
Source
S
and
add up to 330Ω for IEC61000-4-2.
R
V
R
S
Figure 15. ESD Test Circuit for IEC61000-4-2
equipment from a person already holding
the equipment. The current is transferred
on to the keypad or the serial port of the
equipment directly and then travels through
the PCB and finally to the IC.
The higher CS value and lower R value in
the IEC61000-4-2 model are moreSstringent
than the Human Body Model. The larger
storage capacitor injects a higher voltage
to the test point when SW2 is switched on.
The lower current limiting resistor increases
the current charge onto the test point.
The circuit models in Figures 14 and 15 rep-
resentthetypicalESDtestingcircuitusedfor
allthreemethods. TheCS isinitiallycharged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor
is charged, the second switch (SW2) is on
while SW1 switches off. The voltage stored
in the capacitor is then applied through R ,
the current limiting resistor, onto the devicSe
under test (DUT). In ESD tests, the SW2
switch is pulsed so that the device under
test receives a duration of voltage.
30A
15A
0A
For the Human Body Model, the current
limitingresistor(RS)andthesourcecapacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-61000-4-2, the current limiting resistor
(R ) and the source capacitor (CS) are 330Ω
anS150pF, respectively.
t = 0ns
t = 30ns
t →
Figure 16. ESD Test Waveform for IEC61000-4-2
DEVICE PIN
TESTED
HUMAN BODY
MODEL
IEC61000-4-2
Air Discharge Direct Contact
Level
Driver Outputs
Receiver Inputs
+15kV
+15kV
+15kV
+15kV
+8kV
+8kV
4
4
Table 2. Transceiver ESD Tolerance Levels
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
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PACKAGE: 16 PIN TSSOP
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SP3232EH_102_031413
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ORDERING INFORMATION
Part Number
Temp. Range
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
Package
SP3232EHCY-L
SP3232EHCY-L/TR
SP3232EHEY-L
SP3232EHEY-L/TR
16 Pin TSSOP
16 Pin TSSOP
16 Pin TSSOP
16 Pin TSSOP
Note: "/TR" is for tape and Reel option. "-L" is for lead free packaging
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SP3232EH_102_031413
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REVISION HISTORY
DATE
REVISION DESCRIPTION
01/18/06
01/06/11
--
Legacy Sipex Datasheet
1.0.0
Convert to Exar Format, Remove EOL device SP3222EH,
update ordering information and change revision to 1.0.0.
06/07/11
03/14/13
1.0.1
1.0.2
Remove obsolete devices per PDN 110510-01.
Correct type error to RX input voltage ABS Maximum Rating
and TX transition region slew rate condition.
Notice
EXAR Corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reli-
ability. EXAR Corporation assumes no representation that the circuits are free of patent infringement. Charts and schedules contained herein are
only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully
checked; no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for
use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been
minimized ; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances.
Copyright 2013 EXAR Corporation
Datasheet March 2013
For technical questions please email Exar's Serial Technical Support group at: serialtechsupport@exar.com
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
SP3232EH_102_031413
16
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