SP3232EHEP [SIPEX]
3.3V, 460 Kbps RS-232 Transceivers; 3.3V , 460 Kbps的RS- 232收发器型号: | SP3232EHEP |
厂家: | SIPEX CORPORATION |
描述: | 3.3V, 460 Kbps RS-232 Transceivers |
文件: | 总19页 (文件大小:138K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
SP3222EH/3232EH
3.3V, 460 Kbps RS-232Transceivers
FEATURES
■ Meets true EIA/TIA-232-F Standards
from a +3.0V to +5.5V power supply
■ Interoperable with RS-232 down to +2.7V
power source
■ 1µA Low-Power Shutdown with Receivers
Active (SP3222EH)
V
CC
1
2
3
4
5
6
7
16
15
C1+
V+
GND
C1-
14 T1OUT
SP3232EH
C2+
C2-
13
12
11
R1IN
R1OUT
T1IN
■ Enhanced ESD Specifications:
+15kV Human Body Model
V-
+15kV IEC1000-4-2 Air Discharge
+8kV IEC1000-4-2 Contact Discharge
■ 460Kbps Minimum Transmission Rate
■ Ideal for Handheld, Battery Operated
Applications
10
9
T2OUT
R2IN
T2IN
8
R2OUT
Now Available in Lead Free Packaging
DESCRIPTION
The SP3222EH and the 3232EH are 2 driver/2 receiver RS-232 transceiver solutions
intended for portable or hand-held applications such as notebook or palmtop computers.
Their data transmission rate of 460Kbps meeting the demands of high speed RS-232
applications. Both ICS have a high-efficiency, charge-pump power supply that requires only
0.1µFcapacitorsfor3.3Voperation. ThechargepumpallowstheSP3222EHandthe3232EH
series to deliver true RS-232 performance from a single power supply ranging from +3.3V
to +5.0V. The ESD tolerance of the SP3222EH/3232EH devices exceeds +15kV for both
Human Body Model and IEC1000-4-2 Air discharge test methods.
The SP3222EH device has a low-power shutdown mode where the devices' driver outputs
and charge pumps are disabled. During shutdown, the supply current is less than 1µA.
SELECTION TABLE
RS-232
Drivers
RS-232
Receivers Components
External
TTL
3-State
No. of
Pins
MODEL
Power Supplies
Shutdown
+3.0V to +5.5V
+3.0V to +5.5V
2
2
2
2
4
4
Yes
No
Yes
No
18, 20
16
SP3222EH
SP3232EH
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
1
ABSOLUTE MAXIMUM RATINGS
Input Voltages
TxIN, EN .....................................................-0.3V to +6.0V
RxIN.............................................................................±25V
These are stress ratings only and functional operation of the
device at these ratings or any other above those indicated in
the operation sections of the specifications below is not
implied. Exposure to absolute maximum rating conditions
for extended periods of time may affect reliability and cause
permanent damage to the device.
Output Voltages
TxOUT.....................................................................±13.2V
RxOUT..............................................-0.3V to (VCC + 0.3V)
Short-Circuit Duration
TxOUT...............................................................Continuous
VCC................................................................-0.3V to +6.0V
V+ (NOTE 1)................................................-0.3V to +7.0V
V- (NOTE 1)................................................+0.3V to -7.0V
V+ + |V-| (NOTE 1)...................................................+13V
Storage Temperature.................................-65°C to +150°C
Power Dissipation Per Package
20-pin SSOP (derate 9.25mW/oC above +70oC).......750mW
18-pin PDIP (derate 15.2mW/oC above +70oC)......1220mW
18-pin SOIC (derate 15.7mW/oC above +70oC)......1260mW
20-pin TSSOP (derate 11.1mW/oC above +70oC).....890mW
16-pin SSOP (derate 9.69mW/oC above +70oC).......775mW
16-pin PDIP (derate 14.3mW/oC above +70oC)......1150mW
16-pin Wide SOIC (derate 11.2mW/oC above +70oC)....900mW
16-pin TSSOP (derate 10.5mW/oC above +70oC).....850mW
I
CC (DC VCC or GND current).................................+100mA
Electrostatic Discharge
HBM ......................................................................15kV
IEC1000-4-2-AirDischarge....................................15kV
IEC1000-4-2 Direct Contact....................................8kV
NOTE 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX
PARAMETER
MIN
TYP
MAX UNITS
CONDITIONS
DC CHARACTERISTICS
Supply Current
0.3
1.0
1.0
10
mA
no load, TAMB = +25°C,
VCC = +3.3V, TxIN = VCC or GND
Shutdown Supply Current
µA
SHDN=GND, TAMB = +25°C,
VCC=+3.3V, TxIN=VCC or GND
LOGIC INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold LOW
0.8
V
V
TxIN, EN, SHDN, Note 2
Input Logic Threshold HIGH
2.0
2.4
VCC=3.3V, Note 2
VCC=5.0V, Note 2
Input Leakage Current
Output Leakage Current
Output Voltage LOW
Output Voltage HIGH
DRIVER OUTPUTS
Output Voltage Swing
±0.01
±0.05
±1.0
±10
0.4
µA
µA
V
TxIN, EN, SHDN, TAMB = +25°C
receivers disabled
IOUT=1.6mA
VCC-0.6 VCC-0.1
V
IOUT=-1.0mA
±5.0
±5.4
±35
V
3kΩ load to ground at all driver outputs,
TAMB=+25°C
Output Resistance
300
Ω
VCC= V+ = V- = 0V, TOUT = ±2V
Output Short-Circuit Current
Output Leakage Current
±60
±25
mA
µA
VOUT = 0V
VOUT = ±12V, VCC = 0V or 3.0V+5.5V,
drivers disabled
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
2
ELECTRICAL CHARACTERISTICS
Unless otherwise noted, the following specifications apply for VCC = +3.0V to +5.0V with TAMB = TMIN to TMAX
.
PARAMETER
MIN. TYP. MAX. UNITS CONDITIONS
RECEIVER INPUTS
Input Voltage Range
Input Threshold LOW
-15
+15
V
V
0.6
0.8
1.2
1.5
V
V
CC=3.3V
CC=5.0V
Input Threshold HIGH
1.5
1.8
2.4
2.4
V
V
V
CC=3.3V
CC=5.0V
Input Hysteresis
0.3
5
V
Input Resistance
3
7
kΩ
TIMING CHARACTERISTICS
Maximum Data Rate
Driver Propagation Delay
460
Kbps
RL=3kΩ, CL=1000pF, one driver switching
1.0
1.0
µs
µs
t
t
PHL, RL = 3KΩ, CL = 1000pF
PLH, RL = 3KΩ, CL = 1000pF
Receiver Propagation Delay
0.3
0.3
µs
t
PHL, RxIN to RxOUT, CL=150pF
tPLH, RxIN to RxOUT, CL=150pF
Receiver Output Enable Time
Receiver Output Disable Time
Driver Skew
200
200
100
200
60
ns
ns
500
ns
| tPHL - tPLH
| tPHL - tPLH
|
|
Receiver Skew
1000
ns
Transition-Region Slew Rate
V/µs
V
CC = 3.3V, RL = 3KΩ, TAMB = 25oC,
measurements taken from -3.0V to +3.0V
or +3.0V to -3.0V
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
3
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise noted, the following performance characteristics apply for VCC = +3.3V, 460Kbps data rates, all drivers
loaded with 3kΩ, 0.1µF charge pump capacitors, and TAMB = +25°C.
14
12
6
4
2
10
Vout+
Vout-
8
0
0
500
1000
1500
2000
6
4
2
0
-2
-4
-6
+Slew
-Slew
Load Capacitance [pF]
0
500
1000
1500
2000
2330
Load Capacitance [pF]
Figure 1. Transmitter Output Voltage VS. Load
Capacitance for the SP3222EH and the SP3232EH
Figure 2. Slew Rate VS. Load Capacitance for the
SP3222EH and the SP3232EH
40
460Kbps
35
120Kbps
20Kbps
30
25
20
15
10
5
0
0
500 1000 1500 2000 2500 3000
Load Capacitance (pF)
Figure 3. Supply Current VS. Load Capacitance when
Transmitting Data for the SP3222EH and the SP3232EH
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
4
PIN DESCRIPTION
PIN NUMBER
SP3222EH
NAME
FUNCTION
SP3232EH
SSOP/-
TSSOP
DIP/SO
Receiver Enable. Apply logic LOW for normal operation.
Apply Logic HIGH to disable the receiver outputs (high-Z state).
EN
1
1
-
C1+
V+
Positive terminal of the voltage doubler charge-pump capacitor.
+5.5V generated by the charge pump.
2
3
2
3
1
2
C1-
C2+
C2-
V-
Negative terminal of the voltage doubler charge-pump capacitor.
Positive terminal of the inverting charge-pump capacitor.
Negative terminal of the inverting charge-pump capacitor.
-5.5V generated by the charge pump.
4
4
3
5
5
4
6
6
5
7
7
6
T1OUT RS-232 driver output.
T2OUT RS-232 driver output.
15
8
17
8
14
7
R1IN
R2IN
RS-232 receiver input.
RS-232 receiver input.
14
9
16
9
13
8
R1OUT TTL/CMOS receiver output.
R2OUT TTL/CMOS receiver output.
13
10
12
11
16
17
15
10
13
12
18
19
12
9
T1IN
T2IN
GND
VCC
TTL/CMOS driver input.
11
10
15
16
TTL/CMOS driver input.
Ground.
+3.0V to +5.5V supply voltage
Shutdown Control Input. Drive HIGH for normal device operation.
SHDN Drive LOW to shutdown the drivers (high-Z output) and the
on-board power supply.
18
-
20
-
-
NC
No Connect.
11, 14
Table 1. Device Pin Description
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
5
EN
1
2
3
4
5
6
7
20
19
18
17
16
15
SHDN
EN
1
2
3
4
5
6
7
18
17
16
15
14
13
SHDN
V
CC
C1+
V+
VCC
C1+
V+
GND
GND
C1-
T1OUT
R1IN
C1-
T1OUT
R1IN
SP3222EH
C2+
C2-
V-
SP3222EH
C2+
C2-
V-
R1OUT
R1OUT
14
13
NC
12
11
10
T1IN
T2OUT
R2IN
8
9
T1IN
T2OUT
R2IN
8
9
T2IN
12 T2IN
NC
R2OUT
10
R2OUT
11
DIP/SO
SSOP/TSSOP
Figure 4. Pinout Configurations for the SP3222EH
V
CC
1
2
3
4
5
6
7
16
15
14
C1+
V+
GND
C1-
T1OUT
R1IN
SP3232EH
C2+
C2-
13
12
11
R1OUT
T1IN
V-
10
9
T2OUT
R2IN
T2IN
8
R2OUT
Figure 5. Pinout Configuration for the SP3232EH
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
6
VCC
VCC
+
+
+
+
19
CC
17
CC
0.1µF
0.1µF
C5
C1
0.1µF
0.1µF
C5
C1
V
V
2
3
2
3
C1+
C1+
V+
V-
V+
V-
+
+
+
+
0.1µF
0.1µF
0.1µF
0.1µF
*C3
C4
*C3
C4
4
5
4
5
C1-
C1-
7
C2+
7
C2+
SP3222EH
DIP/SO
SP3222EH
SSOP
TSSOP
+
+
C2
0.1µF
C2
0.1µF
6
6
C2-
C2-
T1OUT
T2OUT
15
8
T1OUT
T2OUT
12 T1IN
11 T2IN
17
8
13 T1IN
12 T2IN
LOGIC
INPUTS
RS-232
OUTPUTS
LOGIC
INPUTS
RS-232
OUTPUTS
14
13
10
R1IN
R1OUT
16
15
10
R1IN
R1OUT
5kΩ
5kΩ
5kΩ
5kΩ
RS-232
INPUTS
LOGIC
OUTPUTS
RS-232
INPUTS
LOGIC
OUTPUTS
R2IN
9
R2OUT
R2IN
9
R2OUT
1 EN
18
1 EN
20
SHDN
SHDN
GND
16
GND
18
*can be returned to
either VCC or GND
*can be returned to
either VCC or GND
Figure 6. SP3222EH Typical Operating Circuits
V
CC
+
16
CC
0.1µF
0.1µF
C5
C1
V
2
1
C1+
V+
V-
+
+
+
+
0.1µF
0.1µF
*C3
C4
3
4
C1-
6
C2+
SP3232EH
C2
0.1µF
5
C2-
T1OUT
T2OUT
14
11 T1IN
LOGIC
RS-232
7
10
12
9
INPUTS
T2IN
OUTPUTS
R1IN 13
R1OUT
R2OUT
5kΩ
5kΩ
RS-232
INPUTS
LOGIC
OUTPUTS
R2IN
8
GND
15
*can be returned to
either VCC or GND
Figure 7. SP3232EH Typical Operating Circuit
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
7
DESCRIPTION
The SP3222EH and SP3232EH are 2-driver/
2-receiver devices ideal for portable or hand-held
applications. The SP3222EH features a 1µA
shutdown mode that reduces power consumption
and extends battery life in portable systems.
Its receivers remain active in shutdown mode,
allowing external devices such as modems to be
monitored using only 1µA supply current.
The slew rate of the driver output is internally
limitedtoamaximumof30V/µsinordertomeet
the EIA standards (EIA RS-232D 2.1.7,
Paragraph 5). The transition of the loaded output
from HIGH to LOW also meets the monotonicity
requirements of the standard.
Figure8showsaloopbackcircuitusedtotestthe
RS-232 drivers. Figure 9 shows the test results
of the loopback circuit with all drivers active at
120Kbps and RS-232 loads in parallel with
1000pF capacitors. Figure 10 shows the test
resultswhereonedriverisactiveat460Kbpsand
all drivers are loaded with an RS-232 receiver
in parallel with a 1000pF capacitor.
The SP3222EH/3232EH transceivers meet the
EIA/TIA-232 and V.28/V.24 communication
protocols. They feature Sipex's proprietary
on-board charge pump circuitry that generates
2 x VCC for RS-232 voltage levels from a single
+3.0V to +5.5V power supply. The SP3222EH/
3232EH drivers operate at a minimum data
rate of 460Kbps.
The SP3222EH driver's output stages are
tri-stated in shutdown mode. When the power is
off, the SP3222EH devicepermitstheoutputsto
be driven up to +12V. Because the driver's
inputs do not have pull-up resistors, unused
inputs should be connected to VCC or GND.
THEORY OF OPERATION
The SP3222EH/3232EH are made up of three
basiccircuitblocks: 1. Drivers, 2. Receivers, and 3.
the Sipex proprietary charge pump.
In the shutdown mode, the supply current is less
than 1µA, where SHDN = LOW. When the
SP3222EH device is shut down, the device's
driver outputs are disabled (tri-stated) and the
charge pumps are turned off with V+ pulled
down to VCC and V- pulled to GND. The time
required to exit shutdown is typically 100µs.
SHDNisconnectedtoVCC iftheshutdownmode
is not used. SHDN has no effect on RxOUT or
RxOUTB. Astheybecomeactive, thetwodriver
outputs go to opposite RS-232 levels: one driver
input is HIGH and the other LOW. Note that the
drivers are enabled only when the magnitude of
V- exceeds approximately 3V.
Drivers
The drivers are inverting level transmitters that
convert TTL or CMOS logic levels to +5.0V
EIA/TIA-232 levels inverted relative to the input
logic levels. Typically, the RS-232 output voltage
swing is +5.5V with no load and at least +5V
minimum fully loaded. The driver outputs are
protectedagainstinfiniteshort-circuitstoground
without degradation in reliability. Driver outputs
will meet EIA/TIA-562 levels of +3.7V with
supply voltages as low as 2.7V.
The drivers have a minimum data rate of
460Kbps fully loaded with 3KΩ in parallel with
1000pF, ensuring compatibility with PC-to-PC
communication software.
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
8
V
CC
+
+
0.1µF
0.1µF
C5
C1
V
CC
C1+
V+
V-
+
+
C3
C4
0.1µF
0.1µF
C1-
SP3222EH
SP3232EH
C2+
+
C2
0.1µF
C2-
TxOUT
RxIN
TxIN
LOGIC
INPUTS
RxOUT
EN
LOGIC
OUTPUTS
5kΩ
V
CC
*SHDN
GND
1000pF
* SP3222 only
Figure 8. SP3222EH/3232EH Driver Loopback Test Circuit
T1 IN
T1 IN
T1 OUT
R1 OUT
T1 OUT
R1 OUT
Figure 9. Driver Loopback Test Results at 120Kbps
Figure 10. Driver Loopback Test Results at 460Kbps
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
9
Receivers
In most circumstances, decoupling the power
supply can be achieved adequately using a
0.1µF bypass capacitor at C5 (refer to Figures 6
and 7). In applications that are sensitive to
power-supply noise,VCC and ground can be
decoupled with a capacitor of the same value
as charge-pump capacitor C1. It is always
important to physically locate bypass capacitors
close to the IC.
The receivers convert EIA/TIA-232 levels to
TTL or CMOS logic output levels. The
SP3222EH receivers have an inverting tri-state
output.Receiver outputs (RxOUT) are tri-stated
when the enable control EN = HIGH. In the
shutdown mode, the receivers can be active or
inactive. EN has no effect on TxOUT. The truth
table logic of the SP3222EH driver and receiver
outputs can be found in Table 2.
The charge pump operates in a discontinuous
mode using an internal oscillator. If the output
voltage is less than 5.5V, the charge pump is
enabled. If the output voltage exceeds 5.5V,
the charge pump is disabled. An oscillator
controls the four phases of the voltage shifting.
A description of each phase follows.
Since receiver input is usually from a transmis-
sion line where long cable lengths and system
interference can degrade the signal and inject
noise, the inputs have a typical hysteresis margin
of 300mV. Should an input be left unconnected,
a 5kΩ pulldown resistor to ground forces the
output of the receiver HIGH.
Phase 1: VSS Charge Storage (Figure 12)
Duringthisphaseoftheclockcycle, thepositive
side of capacitors C1 and C2 are charged to VCC.
Cl+ is then switched to GND and the charge in
C1– is transferred to C2–. Since C2+ is connected
to VCC, the voltage potential across capacitor C2
is now 2 times VCC.
Charge Pump
The Sipex patented charge pump (5,306,954)
uses a four–phase voltage shifting technique to
attain symmetrical 5.5V power supplies and
requires four external capacitors. The internal
powersupplyconsistsofaregulateddualcharge
pump that provides an output voltage of 5.5V
regardless of the input voltage (VCC) over the
+3.0V to +5.5V range.
Phase 2: VSS Transfer (Figure 13)
Phase two of the clock connects the negative
terminal of C2 to the VSS storage capacitor and
the positive terminal of C2 to GND. This
transfers a negative generated voltage to C3.
This generated voltage is regulated to a
minimum voltage of -5.5V. Simultaneous with
the transfer of the voltage to C3, the positive side
of capacitor C1 is switched to VCC and the
negative side is connected to GND.
SHDN
EN
0
TxOUT
Tri-state
Tri-state
Active
RxOUT
Active
Phase 3: VDD Charge Storage (Figure 15)
The third phase of the clock is identical to the
first phase — the charge transferred in C1
produces –VCC in the negative terminal of C1,
whichisappliedtothenegativesideofcapacitor
C2. Since C2+ is at VCC, the voltage potential
across C2 is 2 times VCC.
0
0
1
1
1
Tri-state
Active
0
1
Active
Tri-state
Table 2. Truth Table Logic for Shutdown and Enable
Control
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
10
discharge it to an integrated circuit. The
simulation is performed by using a test model as
shown in Figure 17. This method will test the
IC’s capability to withstand an ESD transient
during normal handling such as in manufacturing
areas where the ICs tend to be handled
frequently.
Phase 4: VDD Transfer (Figure 16)
The fourth phase of the clock connects the
negative terminal of C2 to GND, and transfers
this positive generated voltage across C2 to C4,
the VDD storage capacitor. This voltage is
regulated to +5.5V. At this voltage, the internal
oscillator is disabled. Simultaneous with the
transfer of the voltage to C4, the positive side of
capacitor C1 is switched to VCC and the negative
side is connected to GND, allowing the charge
pump cycle to repeat. The charge pump cycle
will continue as long as the operational
conditions for the internal oscillator are present.
The IEC-1000-4-2, formerly IEC801-2, is
used for testing ESD on equipment and
systems. For system manufacturers, they must
guarantee a certain amount of ESD protection
since the system itself is exposed to the outside
environment and human presence. The premise
with IEC1000-4-2 is that the system is required
towithstandanamountofstaticelectricitywhen
ESD is applied to points and surfaces of the
equipment that are accessible to personnel
during normal usage. In many cases, the RS232
transceiver IC receives most of the ESD current
when the ESD source is applied to the connector
pins. ThetestcircuitforIEC1000-4-2is shownon
Figure 18. There are two methods within
IEC1000-4-2, theAirDischargemethodandthe
Contact Discharge method.
Since both V+ and V– are separately generated
from VCC; in a no–load condition V+ and V– will
besymmetrical. Olderchargepumpapproaches
that generate V– from V+ will show a decrease in
the magnitude of V– compared to V+ due to the
inherent inefficiencies in the design.
The charge pump clock rate typically operates
at 250kHz. The external capacitors can be as low
as 0.1µF with a 16V breakdown voltage rating.
ESD Tolerance
With the Air Discharge Method, an ESD
voltage is applied to the equipment under
test (EUT) through air. This simulates an
electrically charged person ready to connect a
cable onto the rear of the system. The high
energy potential on the person discharges
through an arcing path to the rear panel of the
system before he or she touches the system.
This energy, whether discharged directly or
through air, is predominantly a function of the
discharge current rather than the discharge
voltage. Variables with an air discharge such
as approach speed of the object carrying the
ESD potential to the system and humidity will
tendtochangethedischargecurrent. Forexample,
the rise time of the discharge current varies
with the approach speed.
The SP3222EH/3232EH series incorporates
ruggedized ESD cells on all driver output
and receiver input pins. The improved ESD
tolerance is at least ±15kV without damage or
latch-up.
Three methods of ESD testing are performed:
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
The Human Body Model has been the generally
accepted ESD testing method for semiconduc-
tors. ThismethodisalsospecifiedinMIL-STD-
883,Method3015.7forESDtesting.Thepremise
of this ESD test is to simulate the human body’s
potential to store electro-static energy and
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
11
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
–
+
–
C
C
2
1
–
SS
C
–5V
–5V
3
Figure 12. Charge Pump — Phase 1
V
= +5V
CC
C
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
+
–
C
C
2
1
–
–
SS
C
–10V
3
Figure 13. Charge Pump — Phase 2
[
T
]
+6V
a) C2+
T
T
GND
1
2
GND
b) C2-
-6V
Ch1 2.00V Ch2 2.00V M 1.00µs Ch1 5.48V
Figure 14. Charge Pump Waveforms
V
= +5V
CC
C
+5V
4
+
–
+
V
V
Storage Capacitor
Storage Capacitor
DD
+
+
–
C
C
2
1
–
–
SS
C
–5V
–5V
3
Figure 15. Charge Pump — Phase 3
V
= +5V
CC
C
+
+10V
+
4
–
+
V
Storage Capacitor
Storage Capacitor
DD
SS
+
C
C
2
1
–
–
–
V
C
3
Figure 16. Charge Pump — Phase 4
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
12
R
R
S
S
R
R
C
C
SW2
SW2
SW1
SW1
Device
Under
Test
DC Power
Source
C
C
S
S
Figure 17. ESD Test Circuit for Human Body Model
The Contact Discharge Method applies the ESD
current directly to the EUT. This method was
devised to reduce the unpredictability of the
ESD arc. The discharge current rise time is
constant since the energy is directly transferred
without the air-gap arc. In situations such as
hand held systems, the ESD charge can be
directly discharged to the equipment from a
person already holding the equipment. The
current is transferred on to the keypad or the
serial port of the equipment directly and then
travels through the PCB and finally to the IC.
The circuit models in Figures 17 and 18
represent the typical ESD testing circuits used
forallthreemethods. TheCS isinitiallycharged
with the DC power supply when the first
switch (SW1) is on. Now that the capacitor is
charged, the second switch (SW2) is on while
SW1 switches off. The voltage stored in the
capacitor is then applied through RS, the current
limiting resistor, onto the device under test
(DUT). In ESD tests, the SW2 switch is pulsed
so that the device under test receives a duration
of voltage.
Contact-Discharge Module
Contact-Discharge Module
R
R
R
R
S
S
R
R
V
V
C
C
SW2
SW2
SW1
SW1
Device
Under
Test
DC Power
Source
C
C
S
S
R
R
and R add up to 330Ω for IEC1000-4-2.
and R add up to 330Ω for IEC1000-4-2.
S
S
V
V
Figure 18. ESD Test Circuit for IEC1000-4-2
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
13
For the Human Body Model, the current
limiting resistor (RS) and the source capacitor
(CS) are 1.5kΩ an 100pF, respectively. For
IEC-1000-4-2, the current limiting resistor (RS)
andthesourcecapacitor(CS)are330Ωan150pF,
respectively.
30A
15A
0A
The higher CS value and lower RS value in the
IEC1000-4-2 model are more stringent than the
Human Body Model. The larger storage
capacitor injects a higher voltage to the test
point when SW2 is switched on. The lower
current limiting resistor increases the current
t=0ns
t=30ns
t ■
charge onto the test point.
Figure 19. ESD Test Waveform for IEC1000-4-2
Device Pin
Tested
Human Body
Model
IEC1000-4-2
Air Discharge Direct Contact
Level
Driver Outputs
Receiver Inputs
±15kV
±15kV
±15kV
±15kV
±8kV
±8kV
4
4
Table 3. Transceiver ESD Tolerance Levels
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
14
PACKAGE: PLASTIC SHRINK
SMALL OUTLINE
(SSOP)
E
H
D
A
Ø
A1
L
e
B
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
16–PIN
24–PIN
20–PIN
28–PIN
0.068/0.078
(1.73/1.99)
0.068/0.078
(1.73/1.99)
A
A1
B
D
E
0.068/0.078
(1.73/1.99)
0.068/0.078
(1.73/1.99)
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
0.002/0.008
(0.05/0.21)
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
0.010/0.015
(0.25/0.38)
0.239/0.249
(6.07/6.33)
0.317/0.328
(8.07/8.33)
0.278/0.289
(7.07/7.33)
0.397/0.407
(10.07/10.33)
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
0.205/0.212
(5.20/5.38)
0.0256 BSC
(0.65 BSC)
0.0256 BSC
(0.65 BSC)
e
0.0256 BSC
(0.65 BSC)
0.0256 BSC
(0.65 BSC)
0.301/0.311
(7.65/7.90)
0.301/0.311
(7.65/7.90)
H
L
0.301/0.311
(7.65/7.90)
0.301/0.311
(7.65/7.90)
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
0.022/0.037
(0.55/0.95)
0°/8°
(0°/8°)
0°/8°
(0°/8°)
Ø
0°/8°
(0°/8°)
0°/8°
(0°/8°)
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
15
PACKAGE: PLASTIC
DUAL–IN–LINE
(NARROW)
E1
E
D1 = 0.005" min.
(0.127 min.)
A1 = 0.015" min.
(0.381min.)
D
A = 0.210" max.
(5.334 max).
C
A2
Ø
L
B1
B
e
= 0.300 BSC
(7.620 BSC)
e = 0.100 BSC
(2.540 BSC)
A
ALTERNATE
END PINS
(BOTH ENDS)
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
16–PIN
18–PIN
0.115/0.195
(2.921/4.953)
0.115/0.195
(2.921/4.953)
A2
0.014/0.022
(0.356/0.559)
0.014/0.022
(0.356/0.559)
B
0.045/0.070
0.045/0.070
B1
C
(1.143/1.778)
(1.143/1.778)
0.008/0.014
(0.203/0.356)
0.008/0.014
(0.203/0.356)
0.780/0.800
0.880/0.920
D
(19.812/20.320) (22.352/23.368)
0.300/0.325
(7.620/8.255)
0.300/0.325
(7.620/8.255)
E
0.240/0.280
0.240/0.280
E1
L
(6.096/7.112)
(6.096/7.112)
0.115/0.150
(2.921/3.810)
0.115/0.150
(2.921/3.810)
0°/ 15°
(0°/15°)
0°/ 15°
(0°/15°)
Ø
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
16
PACKAGE: PLASTIC
SMALL OUTLINE (SOIC)
E
H
D
A
Ø
A1
L
e
B
DIMENSIONS (Inches)
Minimum/Maximum
(mm)
16–PIN
18–PIN
A
A1
B
D
E
0.090/0.104
(2.29/2.649)
0.090/0.104
(2.29/2.649))
0.004/0.012
(0.102/0.300) (0.102/0.300)
0.004/0.012
0.013/0.020
(0.330/0.508) (0.330/0.508)
0.013/0.020
0.398/0.413
(10.10/10.49) (11.35/11.74)
0.447/0.463
0.291/0.299 0.291/0.299
(7.402/7.600) (7.402/7.600)
e
0.050 BSC
(1.270 BSC)
0.050 BSC
(1.270 BSC)
H
L
0.394/0.419
0.394/0.419
(10.00/10.64) (10.00/10.64)
0.016/0.050
(0.406/1.270) (0.406/1.270)
0.016/0.050
Ø
0°/8°
(0°/8°)
0°/8°
(0°/8°)
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
17
PACKAGE: PLASTIC THIN SMALL
OUTLINE
(TSSOP)
E2
E
D
A
Ø
A1
L
e
B
DIMENSIONS
in inches (mm)
16–PIN
20–PIN
Minimum/Maximum
- /0.043
(- /1.10)
- /0.043
(- /1.10)
A
0.002/0.006
(0.05/0.15)
0.002/0.006
(0.05/0.15)
A1
B
0.007/0.012
(0.19/0.30)
0.007/0.012
(0.19/0.30)
0.193/0.201
(4.90/5.10)
0.252/0.260
(6.40/6.60)
D
0.169/0.177
(4.30/4.50)
0.169/0.177
(4.30/4.50)
E
0.026 BSC
(0.65 BSC)
0.026 BSC
(0.65 BSC)
e
0.126 BSC
(3.20 BSC)
0.126 BSC
(3.20 BSC)
E2
L
0.020/0.030
(0.50/0.75)
0.020/0.030
(0.50/0.75)
0°/8°
0°/8°
Ø
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
18
ORDERING INFORMATION
Package Type
Part Number
Temperature Range
SP3222EHCA .......................................... 0˚C to +70˚C .......................................... 20-Pin SSOP
SP3222EHCA/TR .................................... 0˚C to +70˚C .......................................... 20-Pin SSOP
SP3222EHEA ......................................... -40˚C to +85˚C ........................................ 20-Pin SSOP
SP3222EHEA/TR.................................... -40˚C to +85˚C ........................................ 20-Pin SSOP
SP3222EHCP .......................................... 0˚C to +70˚C ............................................ 18-Pin PDIP
SP3222EHEP ......................................... -40˚C to +85˚C .......................................... 18-Pin PDIP
SP3222EHCT .......................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC
SP3222EHCT/TR ..................................... 0˚C to +70˚C ........................................ 18-Pin WSOIC
SP3222EHET.......................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC
SP3222EHET/TR .................................... -40˚C to +85˚C ...................................... 18-Pin WSOIC
SP3222EHCY .......................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP
SP3222EHCY/TR .................................... 0˚C to +70˚C ........................................ 20-Pin TSSOP
SP3222EHEY ......................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP
SP3222EHEY/TR.................................... -40˚C to +85˚C ...................................... 20-Pin TSSOP
SP3232EHCA .......................................... 0˚C to +70˚C .......................................... 16-Pin SSOP
SP3232EHCA/TR .................................... 0˚C to +70˚C .......................................... 16-Pin SSOP
SP3232EHEA ......................................... -40˚C to +85˚C ........................................ 16-Pin SSOP
SP3232EHEA/TR.................................... -40˚C to +85˚C ........................................ 16-Pin SSOP
SP3232EHCP .......................................... 0˚C to +70˚C ............................................ 16-Pin PDIP
SP3232EHEP ......................................... -40˚C to +85˚C .......................................... 16-Pin PDIP
SP3232EHCT .......................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC
SP3232EHCT/TR ..................................... 0˚C to +70˚C ........................................ 16-Pin WSOIC
SP3232EHET.......................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC
SP3232EHET/TR .................................... -40˚C to +85˚C ...................................... 16-Pin WSOIC
SP3232EHCY .......................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP
SP3232EHCY/TR .................................... 0˚C to +70˚C ........................................ 16-Pin TSSOP
SP3232EHEY ......................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP
SP3232EHEY/TR.................................... -40˚C to +85˚C ...................................... 16-Pin TSSOP
Available in lead free packaging. To order add "-L" suffix to part number.
Example: SP3232EHEY/TR = standard; SP3232EHEY-L/TR = lead free
/TR = Tape and Reel
Pack quantity is 1,500 for WSOIC, SSOP and TSSOP.
Corporation
ANALOG EXCELLENCE
Sipex Corporation
Headquarters and
Sales Office
233 South Hillview Drive
Milpitas, CA 95035
TEL: (408) 934-7500
FAX: (408) 935-7600
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the
application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.
Date: 06/22/04
SP3222EH/3232EH 3.3V, 460 Kbps RS-232 Transceivers
© Copyright 2004 Sipex Corporation
19
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