UPC8126GR-E1 [ETC]
RF Modulator ; RF调制器\n
| 型号： | UPC8126GR-E1 |
| 厂家： | 
ETC |
| 描述： | RF Modulator
|
| 文件： | 总40页 (文件大小：430K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC8126GR
900 MHz BAND DIRECT QUADRATURE MODULATOR IC
FOR DIGITAL MOBILE COMMUNICATION
DESCRIPTION
The µPC8126GR is a silicon monilithic integrated circuit designed as 900 MHz band direct guadrature modulator
for digital mobile communication systems. This Si-MMIC consists of pre-mixer for RF and IF local oscillator and 900
MHz band guadrature modulator which are packaged in 20 pin SSOP. The device has power save function and can
operate 2.7 V to 3.6 V supply voltage. Therefore, it can contribute to make RF block small, high performance and low
power consumption.
FEATURES
•
•
•
•
•
•
Direct modulation range : 915 MHz to 960 MHz
Pre-mixer for RF and IF local oscillator is incorporated.
External local filter can be applied between pre-mixer output and modulator input port.
Low operation current
: ICC = 35 mA (typ.) @VCC = 3 V
Equipped with power save function.
20 pin SSOP suitable for high density surface mounting.
APPLICATIONS
Digital cellular phones (PDC900 MHz etc.)
•
ORDERING INFORMATION
PART NUMBER
PACKAGE
20 pin plastic SSOP (225 mil)
SUPPLYING FORM
QUANTITY
µPC8126GR-E1
Embossed tape, 12 mm wide.
Pins 1 through 10 are in tape pull-
out direction.
2500 pcs/Reel
To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order: µPC8126GR, Quantity: 20 pcs/Unit)
Caution electro-static sensitive devices.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P11487EJ2V0DS00 (2nd edition)
Date Published October 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
1997, 1999
©
µPC8126GR
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (Top View)
V
CC
1
1
2
20 RF-Loin
19 GND
Lo Pre-mixer
MIXout
GND
Loinb
Loin
3
18 IF-Loin
17 Vps2
4
90 deg.
× 2
Phase Shifter
5
16 GND
(÷2)
V
CC2
6
15 MODout
Vps1
GND
I
7
14
13 GND
12
11 Qb
V
CC
3
8
9
Q
Ib
10
QUADRATURE MODULATOR SERIES PRODUCT
ICC
fLO1in
fMODout RF Mixer
Phase
Part Number
Functions
Package
Application
(mA)
(MHz) (MHz) fRFout (MHz) Shifter
µPC8101GR
µPC8104GR
150 MHz Quad.Mod
15/@2.7 V 100 to 300 50 to 150
External
F/F
20-pin
CT-2 etc.
SSOP (225 mil)
RF Up-Converter + IF
Quad.Mod
28/@3.0 V
100 to 400
900 to 1 900 Doubler
+ F/F
Digital Comm.
µPC8105GR
400 MHz Quad.Mod
16/@3.0 V
100 to 400
External
16-pin
SSOP (225 mil)
µPC8110GR
µPC8125GR
1 GHz Direct Quad.Mod 24/@3.0 V
800 to 1 000
220 to 270
External
20-pin
PDC800 MHz, etc.
PHS
SSOP (225 mil)
RF Up-Converter + IF
Quad.Mod + AGC
36/@3.0 V
1 800 to 2 000
µPC8126GR
µPC8126K
900 MHz Direct Quad.Mod 35/@3.0 V
with Offset-Mixer
915 to 960
889 to 960
915 to 960
889 to 960
PDC800 MHz
28-pin QFN
20-pin
µPC8129GR
×2LO IF Quad. Mod+RF 28/@3.0 V 200 to 800 100 to 400 800 to 1 900
F/F
CR
GSM,
Up-Converter
SSOP (225 mil) DCS1800, etc.
µ
PC8139GR-7JH
Transceiver IC
TX: 32.5
220 to 270
100 to 300
1 800 to 2 000
800 to 1 500
30-pin
PHS
(1.9 GHz Indirect Quad. RX: 4.8
Mod + RX-IF + IF VCO) /@3.0 V
TSSOP (225 mil)
µPC8158K
RF Up-Converter + IF
Quad.Mod + AGC
28/@3.0 V
28-pin QFN
PDC800 M/1.5 G
Remark As for detail information of series products, please refer to each data sheet.
2
Data Sheet P11487EJ2V0DS00
µPC8126GR
APPLICATION EXAMPLE
[PDC800MHz]
SUB ANT
LNA
1st MIX
2nd MIX
SW
TO DEMOD.
MAIN ANT
RSSI OUT
RSSI
1st LO
2nd LO
SW
PLL1 PLL2
SW
I
0°
φ
(÷2)
× 2
Filter
PA
AGC
90° deg.
Q
µPC8126GR
3
Data Sheet P11487EJ2V0DS00
µPC8126GR
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply voltage
SYMBOL
RATING
4.0
UNIT
V
TEST CONDITIONS
VCC
Vps
PD
TA = +25 °C, 1, 6, 14 pin
TA = +25 °C, 7, 17 pin
TA = +85 °C
Power Save Control Voltage
Power Dissipation
4.0
V
430Note 1
−40 to +85
−55 to +150
mW
°C
Operating Ambient Temperature
Storage Temperature
TA
Tstg
°C
Note 1. Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
Supply Voltage
SYMBOL
VCC
MIN.
2.7
TYP.
3.0
MAX.
3.6
UNIT
V
TEST CONDITIONS
Operating Ambient Temperature
Pre-Mix. RF Input Frequency
Pre-Mix. RF Input Power
TA
−25
700
−13
120
+25
+75
1200
−9
C
fRFin
MHz
dBm
MHz
PRFin = −11 dBm
PRFin
fIFin
−11
Pre-Mix. IF Input Frequency
135
270
P (fIFin × 7) ≤ −65 dBc
PIFin = −12 dBm
Pre-Mix. IF Input Power
Pre-Mix. Output Frequency
Modulator Output Frequency
Modulator Lo Input Frequency
Modulator Lo Input Power
I/Q Input Frequency
PIFin
fMIXout
fMODout
fLoin
−14
915
915
−12
−10
960
960
dBm
MHz
MHz
PLoin
fI/Qin
−22.5
−18.5
−14.5
10
dBm
MHz
mVp-p
DC
I/Q Input Amplitude
VI/Qin
500
250
Single ended Input
Differential Input
4
Data Sheet P11487EJ2V0DS00
µPC8126GR
ELECTRICAL CHARACTERISTICS
(TA = +25 °C, VCC1 = VCC2 = VCC3 = 3.0 V, Vps1, Vps2 ≥ 2.2 V Unless Otherwise Specified)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
TEST CONDITIONS
MODULATOR + PRE-MIXER TOTAL (TEST CIRCUIT 1)
Total Circuit Current
ICC (TOTAL)
24
35
0
44
15
mA
No Input signals
Total Circuit Current at Sleep
Mode
ICC (ps) TOTAL
µA
Vps ≤ 0.5 V (Low),
No Input Signals
Modulator Output Power
Local Oscillator Leakage
Image Rejection
PMODout
LoL Note 2
ImR
−12
−9
−6
dBm
dBc
dBc
dBc
dBc
fIFin = 135 MHz, PIFin = −12 dBm
fRFin = 813 MHz, PRFin = −11 dBm
fMODout = 948 MHz + fI/Q
fI/Qin = 2.625 kHz
−35
−40
−45
−30
−30
−30
−65
VI/Qin = 500 mVp-p
(Single ended)
I/Q (DC) = Ib/Qb (DC) = VCC/2
Data Rate: 42 kbps,
RNYQ: α = 0.5
I/Q 3rd Order Intermodulation
fIF-Lo × 7 Harmonics
IM3 (I/Q)
MOD Pattern: All Zero
7fIF-Lo
Rise Time
Fall Time
Tps (RISE)
Tps (FALL)
EVM
3
3
5
5
µs
µs
Vps: Low to High
Vps: High to Low
Power Save
Response Time
Error Vector Magnitude
1.6
3.5
%rms
fIFin = 135 MHz, PIFin = −12 dBm
fRFin = 813 MHz, PRFin = −11 dBm
fMODout = 948 MHz + fI/Q
fI/Qin = 2.625 kHz
VI/Qin = 500 mVp-p
(Single ended)
Adjacent Channel Power
ACP
−65
−60
dBc
I/Q (DC) = Ib/Qb (DC) = VCC/2
Data Rate: 42 kbps,
RNYQ: α = 0.5
(∆f = ±50 kHz)
MOD Pattern: PN9
Port Current-7pin
Port Current-17pin
Ips (7 pin)
620
400
µA
µA
No Input Signals
No Input Signals
Ips (17 pin)
Note 2. fLoL = fIFin + fRFin
5
Data Sheet P11487EJ2V0DS00
µPC8126GR
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25 °C, VCC1 = VCC2 = VCC3 = 3.0 V, Vps1, Vps2 ≥ 2.2 V Unless Otherwise Specified)
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
TEST CONDITIONS
MODULATOR (TEST CIRCUIT 1)
Modulator Circuit Current
ICC (MOD)
27.5
0
34
10
mA
No Input Signals
Modulator Circuit Current at
Sleep Mode
ICC (ps) (MOD)
µA
Vps ≤ 0.5 V (Low),
No Input Signals
Input Impedance I and Q Port
Modulator Output Port VSWR
PRE-MIXER (TEST CIRUCIT 2)
Pre-Mixer Circuit Current
ZI/Qin
90
180
kΩ
fI/Q = DC to 10 MHz
fMODout = 948 MHz
VSWR (MOD)
1.5 : 1
−
ICC (MIX)
7.5
0
10
5
mA
No Input Signals
Pre-Mixer Circuit Current at
Sleep Mode
ICC (ps) (MIX)
µA
Vps ≤ 0.5 V (Low),
No Input Signals
Pre-Mixer Conversion Gain
CG (MIX)
Pout (MIX)
−5
−3
−1
dB
fRFin = 813 MHz, PRFin = −11 dBm
fIFin = 135 MHz, PIFin = −12 dBm
fMIXout = 948 MHz
Pre-Mixer Output Power
−17
−15
−13
dBm
6
Data Sheet P11487EJ2V0DS00
µPC8126GR
PIN EXPLANATIONS
Pin
Pin
Supply
Vol. (V)
Symbol
No.
Description
Equivalent Circuit
Vol. (V)
@3 V
1
VCC1
2.7 to 3.6
−
Supply voltage pin for the premixer.
An internal regulator helps keep the
device stable against temperature or
VCC variation.
(Pre-Mixer)
2
2
Pre-Mixout
2.7 to 3.6
−
Output from the pre-Mixer. This pin
is designed as pen collector. Due to
the high impedance output, this pin
should be externally equipped with
LC matching circuit to next stage.
3
GND
0
−
Ground pin for the modulator.
Connect to the ground with minimum
inductance.
(Modulator)
Track length should be kept as short
as possible.
4
5
LOinb
LOin
−
−
2.6
2.6
Bypass of Lo input for modulator.
This pin is grounded through around
33 pF capacitor.
5
4
Lo input for the phase shifter.
Connect around 300 Ω between pin
4 and 5 to match to 50 Ω by LC.
6
7
VCC2
2.7 to 3.6
−
−
Supply voltage pin for the phase
shifter and IQ Mixer. An internal
regulator helps keep the device
stable against temperature or VCC
variation.
VPS1
VPS
Power save control pin for the
modulator can control On/Sleep
state with bias as follows.
(Modulator)
7
VPS (V)
2.2 to 3.6
0 to 0.5
STATE
ON (Active Mode)
OFF (Sleep Mode)
8
GND
0
−
Ground pin for the modulator.
Connect to the ground with minimum
inductance.
(Modulator)
Track length should be kept as short
as possible.
7
Data Sheet P11487EJ2V0DS00
µPC8126GR
PIN EXPLANATIONS
Pin
Pin
Supply
Vol. (V)
Symbol
No.
Description
Equivalent Circuit
Vol. (V)
@3 V
9
I
VCC/2
−
Input for I signal.
This input impedance is 180 kΩ.
In case of that I/Q input signals are
single ended, amplitude of the signal
is 500 mVp-p max.
Note 3
10
Ib
VCC/2
−
Input for I signal.
This input impedance is 180 kΩ.
In case of that I/Q input signals are
single ended, VCC/2 biased DC
signal should be input.
9
10
In case of that I/Q input signals are
differential, amplitude of the signal is
250m Vp-p; max.
Note 3
11
Qb
VCC/2
−
Input for Q signal.
This input impedance is 180 kΩ.
In case of that I/Q input signals are
single ended, VCC/2 biased DC
signal should be input.
In case of that I/Q input signals are
differential, amplitude of the signal is
250 mVp-p max.
Note 3
11
12
12
13
14
15
Q
VCC/2
−
−
Input for Q signal.
This input impedance is 180 kΩ.
In case of that I/Q input signals are
single ended, amplitude of the signal
is 500 mVp-p max.
Note 3
GND
0
2.7 to 3.6
−
Ground pin for the modulator.
(Modulator)
Connect to the ground with minimum
inductance.
Track length should be kept as short
as possible.
VCC3
−
Supply voltage pin for the output
buffer amplifier of modulator.
An internal regulator helps keep the
device stable against temperature or
VCC variation.
MODout
1.6
Output pin from the modulator.
This is emitter follower output.
So this output impedance is low.
15
16
GND
0
−
Ground pin for the modulator.
Connect to the ground with minimum
inductance.
(Modulator)
Track length should be kept as short
as possible.
8
Data Sheet P11487EJ2V0DS00
µPC8126GR
PIN EXPLANATIONS
Pin
Pin
Supply
Vol. (V)
Symbol
No.
Description
Equivalent Circuit
Vol. (V)
@3 V
17
VPS2
VPS
−
Power save control pin can control
the On/Sleep state with bias as
follows.
(Pre-Mix.)
17
VPS (V)
2.2 to 3.6
0 to 0.5
STATE
ON (Active Mode)
OFF (Sleep Mode)
18
IF-Loin
−
1.3
IF input pin for the pre-Mixer.
This pin is biased internally.
Capacitor should be connected in
series, and grounded through 51 Ω.
18
19
20
GND
0
−
Ground pin for modulator.
Connect to the ground with minimum
inductance.
(Pre-Mix.)
Track length should be kept as short
as possible.
RF-Loin
−
2.3
RF input pin for the pre-Mixer.
This pin is biased internally.
Capacitor should be connected in
series, and grounded through 51 Ω.
20
Note 3
Relations between amplitude and VCC/2 bias of input signal are following.
I/Q input signal (mVp-p)
I/Q DC Voltage (V)
Supply Voltage (V)
Single ended iinput
Differential input
I = Ib = Q = Qb
VCC/2 = I = Ib = Q = Qb
VCC
I = Q
2.7 to 3.6
1.35 to 1.8
≤ 500
≤ 250
9
Data Sheet P11487EJ2V0DS00
µPC8126GR
EXPLANATION OF INTERNAL FUNCTION
BLOCK
90 °
FUNCTION/OPERATION
BLOCK DIAGRAM
from LOin
Input signal from LO is send to digital circuit of
T-type flip-flop through frequency doubler.
Output signal from T-type F/F is changed to
same frequency as LO input and that have
quadrature phase shift, 0 °, 90 °, 180 °, 270 °.
These circuits have function of self phase
correction to make correctly quadrature signals.
PHASE
SHIFTER
× 2
÷ 2 F/F
BUFFER
AMP.
Buffer amplifiers for each phase signals to send
to each mixers.
MIXER
Each signals from buffer amp. are quadrature
modulated with two double-balanced mixers.
High accurate phase and amplitude inputs are
realized to good performance for image
rejection.
I
Ib
Qb
Q
ADDER
Output signals from each mixers are added with
adder and send to final amplifier.
to MODout
10
Data Sheet P11487EJ2V0DS00
µPC8126GR
STANDARD TYPICAL CHARACTERISTICS Modulator+Pre-Mixer Total
Test Circuit 2, TA = +25 °C, VCC1 = VCC2 = VCC3 = 3.0 V, Vps1 = Vps2 = 3.0 V,
I/Q (DC) = Ib/Qb (DC) = VCC/2, VI/Qin = 420 mVp-p (Differential Input), fI/Qin = 2.625 kHz,
fIFin = 135 MHz, PIFin = −12 dBm, fRFin = 813 MHz, PRFin = −11 dBm, fMODout = 948 MHz + fI/Qin,
Data Rate = 42 kbps, RNYQ : α = 0.5,
MOD Pattern : All Zero, Unless Otherwise Specified
I
CC (TOTAL) vs VCC
50
40
30
20
10
No input signal
T
T
T
A
A
A
= +80 °C
= +25 °C
= –30 °C
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VCC - Supply Voltage - V
I
CC (TOTAL) vs Vps
50
40
30
20
10
No input signal
T
T
T
A
A
A
= +80 °C
= +25 °C
= –30 °C
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Vps - Power Save Control Voltage - V
11
Data Sheet P11487EJ2V0DS00
µPC8126GR
PMODout vs VI/Qin
PMODout vs VI/Qin
(at T
A
= –30 °C)
(at T = +25 °C)
A
VCC = 3.6 V
VCC = 3.0 V
VCC = 2.7 V
VCC = 3.6 V
VCC = 3.0 V
VCC = 2.7 V
0
–5
0
–5
–10
–15
–20
–25
–10
–15
–20
–25
10 20
50 100 200 5001000
10 20
50 100 200 5001000
VI/Qin - I/Q Input Amplitude - mVP-P
VI/Qin - I/Q Input Amplitude - mVP-P
PMODout vs VI/Qin
(at T = +80 °C)
A
V
V
V
CC = 3.6 V
CC = 3.0 V
CC = 2.7 V
0
–5
–10
–15
–20
–25
10 20
50 100 200 5001000
VI/Qin - I/Q Input Amplitude - mVP-P
12
Data Sheet P11487EJ2V0DS00
µPC8126GR
LoL, ImR, IM3I/Q vs VI/Qin
LoL, ImR, IM3I/Q vs VI/Qin
(at T = +25 °C)
(at T
A
= –30 °C)
A
–25
–30
–35
–40
–45
–50
–25
–30
–35
–40
–45
–50
IM
3
(I/Q)
LoL
LoL
IM
2
(I/Q)
IM3 (I/Q)
ImR
ImR
10 20
50 100 200 5001000
10 20
50 100 200 5001000
VI/Qin - I/Q Input Amplitude - mVP-P
VI/Qin - I/Q Input Amplitude - mVP-P
LoL, ImR, IM3I/Q vs VI/Qin
(at T = +80 °C)
A
–25
–30
–35
–40
–45
–50
LoL
IM
3
(I/Q)
ImR
10 20
50 100 200 5001000
VI/Qin - I/Q Input Amplitude - mVP-P
13
Data Sheet P11487EJ2V0DS00
µPC8126GR
PMODout, LoL, ImR, IM3I/Q vs fLoin
PMODout, LoL, ImR, IM3I/Q vs fLoin
PMODout, LoL, ImR, IM3I/Q vs fLoin
(at VCC = 2.7 V, T
A
= –30 °C)
(at VCC = 3.0 V, T
A
= –30 °C)
(at VCC = 3.6 V, T
A
= –30 °C)
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
P
MODout
P
MODout
P
MODout
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
LoL
LoL
LoL
IM
3
(I/Q)
IM
3
(I/Q)j
IM
3
(I/Q)
ImR
IM
2
(I/Q)
ImR
ImR
IM2(I/Q)
IM2 (iI/Q)
900
950
1000
900
950
1000
900
950
1000
f
Loin - Lo Input Frequency - MHz
f
Loin - Lo Input Frequency - MHz
fLoin - Lo Input Frequency - MHz
P
MODout, LoL, ImR, IM3I/Q vs fLoin
PMODout, LoL, ImR, IM3I/Q vs fLoin
PMODout, LoL, ImR, IM3I/Q vs fLoin
(at VCC = 2.7 V, T
A
= +25 °C)
(at VCC = 3.0 V, T
A
= +25 °C)
(at VCC =3.6 V, T
A
= +25 °C)
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
P
MODout
P
MODout
P
MODout
–10
–15
–10
–15
–10
LoL
LoL
IM
2
iI/Q
j
–15
–20
–25
–30
LoL
–20
ImR
–20
–25
–30
IM
3
j
ImR
iI/Q
IM
3
j
iI/Q
IM
3 iI/Q j
ImR
–25
IM
2
iI/Q
j
IM
2 iI/Q j
–30
900
950
1000
900
950
1000
900
950
1000
f
Loin - Lo Input Frequency - MHz
f
Loin - Lo Input Frequency - MHz
fLoin - Lo Input Frequency - MHz
14
Data Sheet P11487EJ2V0DS00
µPC8126GR
PMODout, LoL, ImR, IM3I/Q vs fLoin
PMODout, LoL, ImR, IM3I/Q vs fLoin
PMODout, LoL, ImR, IM3I/Q vs fLoin
(at VCC = 2.7 V, T
A
= +80 °C)
(at VCC = 3.0 V, T
A
= +80 °C)
(at VCC = 3.6 V, T
A
= +80 °C)
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
–30
–5
P
MODout
P
MODout
P
MODout
–10
–15
–10
–15
–20
–25
–35
–40
–45
–50
–55
–10
–15
–20
LoL
LoL
LoL
ImR
IM
2 (I/Q)
ImR
ImR
–20
IM
2
(I/Q)
IM
IM
2
(I/Q)
–25
–25
3
(I/Q)
IM
3
(I/Q)
IM
3
(I/Q)
–30
–30
–30
900
950
1000
900
950
1000
900
950
1000
f
Loin - Lo Input Frequency - MHz
f
Loin - Lo Input Frequency - MHz
f
Loin - Lo Input Frequency - MHz
PMODout, LoL, ImR, IM3I/Q vs PIF-Loin
P
MODout, LoL, ImR, IM3I/Q vs PIF-Loin
P
MODout, LoL, ImR, IM3I/Q vs PIF-Loin
(at VCC = 2.7 V, T
A
= –30 °C)
–5
(at VCC = 3.0 V, T
A
= –30 °C)
–5
(at VCC = 3.6 V, T
A
= –30 °C)
–5
–30
–30
–30
PMODout
PMODout
PMODout
–35
–40
–45
–50
–55
–10
–15
–35
–40
–45
–50
–55
–10
–15
–35
–40
–45
–50
–55
–10
LoL
LoL
LoL
IM
–15
IM
2 (I/Q)
2
(I/Q)
IM
3 (I/Q)
IM
3
(I/Q)
IM
3
(I/Q)
–20
–20
–20
ImR
ImR
ImR
–25
–30
–25
–25
–30
IM
2 (I/Q)
–30
7
–17
–12
7
–17
–12
–17
–12
7
PIF-Loin Pre-Mix. IF Input Power - dBm
PIF-Loin Pre-Mix. IF Input Power - dBm
PIF-Loin Pre-Mix. IF Input Power - dBm
15
Data Sheet P11487EJ2V0DS00
µPC8126GR
P
MODout, LoL, ImR, IM3I/Q vs PIF-Loin
PMODout, LoL, ImR, IM3I/Q vs PIF-Loin
PMODout, LoL, ImR, IM3I/Q vs PIF-Loin
(at VCC = 2.7 V, T
A
= +25 °C)
(at VCC =3.0 V, T
A
= +25 °C)
(at VCC =3.6 V, T = +25 °C)
A
–30
–5
–30
–5
–30
–5
PMODout
PMODout
PMODout
–35
–40
–45
–50
–55
–10
–15
–20
–25
–35
–40
–45
–50
–55
–10
–15
–20
–25
–35
–40
–45
–50
–55
–10
–15
–20
–25
–30
LoL
LoL
LoL
IM3(I/Q)
ImR
ImR
IM3(I/Q)
ImR
IM3(I/Q)
IM2(I/Q)
IM2(I/Q)
IM2 (I/Q)
–30
–30
–7
–17
–12
–7
–17
–12
–17
–12
–7
P
IF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
P
MODout, LoL, ImR, IM3I/Q vs PIF-Loin
PMODout, LoL, ImR, IM3I/Q vs PIF-Loin
PMODout, LoL, ImR, IM3I/Q vs PIF-Loin
(at VCC = 2.7 V, T
A
= +80 °C)
(at VCC =3.0 V, T
A
= +80 °C)
(at VCC =3.6 V, T
A
= +80 °C)
–30
–5
–30
–5
–30
–5
PMODout
PMODout
P
MODout
–35
–40
–45
–50
–55
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–10
–15
–20
LoL
LoL
LoL
ImR
IM2 (I/Q)
ImR
ImR
IM2 (I/Q)
IM2 (I/Q)
IM3 (I/Q)
–25
IM3 (I/Q)
IM3 (I/Q)
–30
–17
–12
–7
–17
–12
–7
–17
–12
–7
P
IF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
16
Data Sheet P11487EJ2V0DS00
µPC8126GR
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
(at VCC = 2.7 V, T
A
= –30 °C)
(at VCC = 3.0 V, T
A
= –30 °C)
(at VCC = 3.6 V, T
A
= –30 °C)
–30
–5
–30
–5
–30
–5
PMODout
PMODout
PMODout
–35
–40
–45
–50
–55
–10
–15
–35
–40
–45
–50
–55
–10
–15
–35
–40
–45
–50
–55
–10
–15
LoL
LoL
LoL
IM2 (I/Q)
IM3 (I/Q)
IM2 (I/Q)
IM3 (I/Q)
IM3 (I/Q)
ImR
–20
–25
–30
–20
–25
–30
–20
–25
–30
ImR
ImR
IM2 (I/Q)
–15
–11
–7
–15
–11
–7
–15
–11
–7
PRF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
(at VCC = 2.7 V, T
A
= +25 °C)
(at VCC = 3.0 V, T
A
= +25 °C)
(at VCC = 3.6 V, T
A
= +25 °C)
–30
–5
–30
–5
–30
–5
PMODout
PMODout
PMODout
–35
–40
–45
–50
–55
–10
–15
–20
–35
–40
–45
–50
–55
–10
–15
–20
–25
–35
–40
–45
–50
–55
–10
–15
–20
–25
–30
LoL
LoL
LoL
ImR
IM3 (I/Q)
IM3 (I/Q)
IM3 (I/Q)
ImR
ImR
IM2 (I/Q)
–25
IM2 (I/Q)
IM2 (I/Q)
–30
–30
–7
–15
–11
–7
–15
–11
–15
–11
–7
PRF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
17
Data Sheet P11487EJ2V0DS00
µPC8126GR
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
PMODout, LoL, ImR, IM3I/Q vs PRF-Loin
(at VCC = 2.7 V, T
A
= +80 °C)
(at VCC = 3.0 V, T
A
= +80 °C)
(at VCC = 3.6 V, T
A
= +80 °C)
–30
–5
–30
–5
–30
–5
PMODout
PMODout
P
MODout
–35
–40
–45
–50
–55
–10
–35
–40
–45
–50
–55
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–10
–15
–20
–25
–30
LoL
LoL
LoL
ImR
–15
–20
–25
–30
IM2 (I/Q)
ImR
ImR
IM2 (I/Q)
IM3 (I/Q)
IM3 (I/Q)
IM2 (I/Q)
IM3 (I/Q)
–15
–11
–7
–15
–11
–7
–15
–11
–7
P
RF-Loin - Pre-Mix. RF Input Power - dBm
P
RF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
18
Data Sheet P11487EJ2V0DS00
µPC8126GR
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
(at VCC = 2.7 V, TA = –30 °C)
(at VCC = 3.0 V, TA = –30 °C)
(at VCC = 3.6 V, TA = –30 °C)
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
P
MODout
P
MODout
P
MODout
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
LoL
LoL
LoL
IM2 (I/Q)
IM3 (I/Q)
ImR
IM3 (I/Q)
IM3 (I/Q)
IM2 (I/Q)
ImR
IM2 (I/Q)
ImR
1.25
1.35
1.45
1.4
1.5
1.6
1.7
1.8
1.9
I/Q(DC) - I/Q Supply Voltage - V
I/Q(DC) - I/Q Supply Voltage - V
I/Q(DC) - I/Q Supply Voltage - V
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
(at VCC = 2.7 V, TA = +25 °C)
(at VCC = 3.0 V, TA = +25 °C)
(at VCC = 3.6 V, TA = +25 °C)
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
–30
–35
–40
–45
–50
–55
–5
P
MODout
P
MODout
P
MODout
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
–10
–15
–20
–25
–30
LoL
LoL
LoL
ImR
IM3 (I/Q)
IM3 (I/Q)
IM3 (I/Q)
ImR
ImR
IM2 (I/Q)
IM2 (I/Q)
IM2 (I/Q)
1.25
1.35
1.45
1.4
1.5
1.6
1.7
1.8
1.9
I/Q(DC) - I/Q Supply Voltage - V
I/Q(DC) - I/Q Supply Voltage - V
I/Q(DC) - I/Q Supply Voltage - V
19
Data Sheet P11487EJ2V0DS00
µPC8126GR
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
PMODout, LoL, ImR, IM3I/Q vs I/Q(DC)
(at VCC = 2.7 V, T
A
= +80 °C)
(at VCC = 3.0 V, T
A
= +80 °C)
(at VCC = 3.6 V, T
A
= +80 °C)
–30
–5
–30
–5
–30
–5
PMODout
PMODout
PMODout
–35
–40
–45
–50
–55
–10
–15
–20
–25
–35
–40
–45
–50
–55
–10
–15
–20
–25
–35
–40
–45
–50
–55
–10
–15
–20
–25
LoL
LoL
ImR
LoL
ImR
ImR
IM2 (I/Q)
IM3 (I/Q)
IM2 (I/Q)
IM3 (I/Q)
IM2 (I/Q)
IM3 (I/Q)
–30
–30
1.6
–30
1.9
1.25
1.35
1.45
1.4
1.5
1.7
1.8
I/Q(DC) - I/Q Supply Voltage - V
I/Q(DC) - I/Q Supply Voltage - V
I/Q(DC) - I/Q Supply Voltage - V
20
Data Sheet P11487EJ2V0DS00
µPC8126GR
P(fIF
×
7) vs PIF-Loin
P(fIF
×
7) vs PIF-Loin
P(fIF
×
7) vs PIF-Loin
(at VCC = 2.7 V, T
A
= –30 °C)
(at VCC = 3.0 V, T
A
= –30 °C)
(at VCC = 3.6 V, T = –30 °C)
A
0
0
0
–20
–20
–20
–40
–60
–40
–60
–40
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
Recommended operating range
Recommended operating range
Recommended operating range
–17
–12
–7
–17
–12
–7
–17
–12
–7
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
P(fIF
×
7) vs PIF-Loin
P(fIF
×
7) vs PIF-Loin
P(fIF
× 7) vs PIF-Loin
(at VCC = 2.7 V, T
A
= +25 °C)
(at VCC = 3.0 V, T
A
= +25 °C)
(at VCC = 3.6 V, T = +25 °C)
A
0
0
–20
–20
–20
–40
–60
–80
–40
–60
–80
–40
–60
–80
–100
–120
–100
–120
–100
–120
Recommended operating range
Recommended operating range
Recommended operating range
–17
–12
–7
–17
–12
–7
–17
–12
–7
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
21
Data Sheet P11487EJ2V0DS00
µPC8126GR
P(fIF
×
7) vs PIF-Loin
P(fIF
×
7) vs PIF-Loin
P(fIF
× 7) vs PIF-Loin
(at VCC = 2.7 V, T
A
= +80 °C)
(at VCC = 3.0 V, T
A
= +80 °C)
(at VCC = 3.6 V, T = +80 °C)
A
0
0
0
–20
–20
–20
–40
–60
–40
–60
–40
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
Recommended operating range
Recommended operating range
Recommended operating range
–17
–12
–7
–17
–12
–7
–17
–12
–7
PIF-Loin - Pre-Mix. IF Input Power - dBm
P
IF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
22
Data Sheet P11487EJ2V0DS00
µPC8126GR
EVM, ∆φ
,
∆
A vs VI/Qin
EVM, ∆φ
,
∆
A vs VI/Qin
EVM, ∆φ, ∆A vs VI/Qin
(at VCC = 2.7 V)
(at VCC = 3.0 V)
(at VCC = 3.6 V)
Single ended Input
MDO Pattern: PN9
Single ended Input
MDO Pattern: PN9
Single ended Input
MDO Pattern: PN9
5
4
3
2
1
5
4
3
2
1
5
4
3
2
1
EVM
EVM
EVM
∆
∆
A
A
∆A
∆φ
∆φ
∆φ
φ
φ
∆φ
∆
∆
∆
10 100 200 500 1000
10 100 200 500 1000
10 100 200 500 1000
VI/Qin - I/Q Input Amplitude - mVP-P
VI/Qin - I/Q Input Amplitude - mVP-P
VI/Qin - I/Q Input Amplitude - mVP-P
ACP vs VI/Qin
ACP vs VI/Qin
ACP vs VI/Qin
(at VCC = 2.7 V)
(at VCC = 3.0 V)
(at VCC = 3.6 V)
Single ended Input
Single ended Input
Single ended Input
MDO Pattern: PN9
MDO Pattern: PN9
MDO Pattern: PN9
–40
–40
–40
–50
–50
–50
f = ±50 kHz
∆
f = ±50 kHz
∆
∆
f = ±50 kHz
–60
–70
–80
–60
–70
–80
–60
–70
–80
∆
f = ±100 kHz
f = ±100 kHz
∆
f = ±100 kHz
∆
10 100200 500 1000
10 100200 500 1000
10 100200 500 1000
VI/Qin - I/Q Input Amplitude - mVP-P
VI/Qin - I/Q Input Amplitude - mVP-P
VI/Qin - I/Q Input Amplitude - mVP-P
23
Data Sheet P11487EJ2V0DS00
µPC8126GR
TYPICAL SINE WAVE MODULATION OUTPUT SPECTRUM
TYPICAL π/4DQPSK MODULATION OUTPUT SPECTRUM
[
]
[
]
α
α
<PDC> 42kbps, RNYQ
= 0.5, MOD Pattern 000
<PDC> 42kbps, RNYQ = 0.5, MOD Pattern PN9
1
TRACE A: Ch1 Spectrum
REF –10. 0 dB
10 dB/
ATT 0 dB
A Marker
948 002 625. 0 Hz
–9. 277 dBm
0
VI/Qin = 500 mVP-P (Single ended Input)
dBm
ImR
LoL
LogMag
2
3
4
IM3 (I/Q)
5
RBW 3 kHz
VBW 3 kHz
SWP 5. 0 s
10
dB
/div
CENTER 948. 00000 MHz
SPAN 500 kHz
* * * Multi Marker List * * *
0 Hz
No. 1:
0. 00 dB
No. 2:
No. 3:
No. 4:
No. 5:
–50. 0 kHz
–100. 0 kHz
50. 0 kHz
–64. 50 dB
–77. 00 dB
–64. 75 dB
–77. 00 dB
–100
dBm
100. 0 kHz
Center: 948 MHz
Span: 50 kHz
24
Data Sheet P11487EJ2V0DS00
µPC8126GR
MOD OUTPUT (15 pin) IMPEDANCE
V
CC = VPS = 2.7 V
VCC = VPS = 3.0 V
1 : 49.039
Ω
–21.127
Ω
7.9465pF
1 : 49. 121
Ω
–22.845
Ω
7.3486 pF
948. 000 000 MHz
948. 000 000 pF
MAEKER 1
948 MHz
MAEKER 1
948 MHz
VSWR
2 : 1
VSWR
2 : 1
1
1
START 500. 000 000 MHz
STOP 1 500. 000 000 MHz
START 500. 000 000 MHz
STOP 1 500. 000 000 MHz
V
CC = VPS = 3.6 V
1 : 49. 783
Ω
–22.645
Ω
7.1004 pF
948. 000 000 MHz
MAEKER 1
948 MHz
VSWR
2 : 1
1
START 500. 000 000 MHz
STOP 1 500. 000 000 MHz
25
Data Sheet P11487EJ2V0DS00
µPC8126GR
STANDARD TYPICAL CHARACTERISTICS <Pre-Mixer>
Test Circuit 3, TA = +25 °C, VCC1 = 3.0 V, Vps2 = 3.0 V, fIFin = 135 MHz, PIFin = −12 dBm, fRFin = 813 MHz,
PRFin = −11 dBm, fMIXout = 948 MHz
I
CC (MIX) vs VCC1
No input signal
T
T
T
A
A
A
= +80 °C
= +25 °C
= –30 °C
10
7.5
5
2.5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
V
CC1 - Pre-Mix. Supply Voltage - V
I
CC (MIX) vs Vps2
No input signal
T
T
T
A
A
A
= +80 °C
= +25 °C
= –30 °C
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Vps2 - Pre-Mix. Supply Voltage - V
26
Data Sheet P11487EJ2V0DS00
µPC8126GR
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
(at VCC = 2.7 V, T
A
= –30 °C)
(at VCC = 3.0 V, T
A
= –30 °C)
(at VCC = 3.6 V, T
A
= –30 °C)
0
0
0
0
0
0
Pout(MIX)
Pout(MIX)
Pout(MIX)
–20
–40
20
40
60
–20
–40
20
40
60
–20
–40
20
40
60
RFL
RFL
RFL
ImL
ImL
ImL
–60
–60
–60
P ( f I F
×
7 )
P ( f I F
×
7 )
P ( f I F × 7 )
–80
80
–80
80
–80
80
–100
–120
100
120
–100
–120
100
120
–100
–120
100
120
–50 –40 –30 –20 –10
0
–50 –40 –30 –20 –10
0
–50 –40 –30 –20 –10
0
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
(at VCC = 2.7 V, T
A
= +25 °C)
(at VCC = 3.0 V, T
A
= +25 °C)
(at VCC = 3.6 V, T
A
= +25 °C)
0
0
0
0
0
0
Pout(MIX)
Pout(MIX)
Pout(MIX)
–20
–40
20
–20
–40
20
40
60
–20
–40
20
40
60
RFL
RFL
RFL
40
ImL
ImL
ImL
–60
60
–60
–60
P ( f I F
×
7 )
P ( f I F × 7 )
P ( f I F × 7 )
–80
80
–80
80
–80
80
–100
–120
100
120
–100
–120
100
120
–100
–120
100
120
–50 –40 –30 –20 –10
0
–50 –40 –30 –20 –10
0
–50 –40 –30 –20 –10
0
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
27
Data Sheet P11487EJ2V0DS00
µPC8126GR
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
Pout (MIX), RFL, ImL, P(fIF
vs PIF-Loin
×
7)
(at VCC = 2.7 V, T
A
= +80 °C)
(at VCC = 3.0 V, T
A
= +80 °C)
(at VCC = 3.6 V, T
A
= +80 °C)
0
0
0
0
0
0
Pout(MIX)
Pout(MIX)
Pout(MIX)
–20
–40
20
40
60
–20
–40
20
40
60
–20
–40
20
40
60
RFL
RFL
RFL
ImL
ImL
ImL
–60
–60
–60
P ( f I F
×
7 )
P ( f I F
×
7 )
P ( f I F × 7 )
–80
80
–80
80
–80
80
–100
–120
100
120
–100
–120
100
120
–100
–120
100
120
–50 –40 –30 –20 –10
0
–50 –40 –30 –20 –10
0
–50 –40 –30 –20 –10
0
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
PIF-Loin - Pre-Mix. IF Input Power - dBm
Pout (MIX), RFL, ImL vs PRF-Loin
Pout (MIX), RFL, ImL vs PRF-Loin
Pout (MIX), RFL, ImL vs PRF-Loin
(at VCC = 2.7 V, T
A
= –30 °C)
(at VCC = 3.0 V, T
A
= –30 °C)
(at VCC = 3.6 V, T = –30 °C)
A
0
–20
0
0
Pout(MIX)
P
out(MIX)
P
out(MIX)
–20
–40
–20
–40
ImL
ImL
ImL
RFL
RFL
RFL
–40
–60
–60
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
–20
–12
–4
–20
–12
–4
–20
–12
–4
PIF-Loin - Pre-Mix. RF Input Power - dBm
PIF-Loin - Pre-Mix. RF Input Power - dBm
PIF-Loin - Pre-Mix. RF Input Power - dBm
28
Data Sheet P11487EJ2V0DS00
µPC8126GR
Pout (MIX), RFL, ImL
vs PRF-Loin
Pout (MIX), RFL, ImL
vs PRF-Loin
Pout (MIX), RFL, ImL
vs PRF-Loin
(at VCC = 2.7 V, TA = +25 °C)
(at VCC = 3.0 V, TA = +25 °C)
(at VCC = 3.6 V, TA = +25 °C)
0
0
0
Pout (MIX)
Pout (MIX)
Pout (MIX)
–20
–40
–20
–40
–20
–40
ImL
ImL
ImL
RFL
RFL
RFL
–60
–60
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
–20
–12
–4
–20
–12
–4
–20
–12
–4
PRF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
Pout (MIX), RFL, ImL
vs PRF-Loin
(at VCC = 2.7 V, TA = +80 °C)
Pout (MIX), RFL, ImL
vs PRF-Loin
(at VCC = 3.0 V, TA = +80 °C)
Pout (MIX), RFL, ImL
vs PRF-Loin
(at VCC = 3.6 V, TA = +80 °C)
0
0
0
Pout (MIX)
Pout (MIX)
Pout (MIX)
–20
–40
–20
–40
–20
–40
ImL
ImL
ImL
RFL
RFL
RFL
–60
–60
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
–20
–12
–4
–20
–12
–4
–20
–12
–4
PRF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
PRF-Loin - Pre-Mix. RF Input Power - dBm
29
Data Sheet P11487EJ2V0DS00
µPC8126GR
P
out(MIX) vs fMIXout
P
out(MIX) vs fMIXout
Pout(MIX) vs fMIXout
(at VCC = 2.7 V, T
A
= –30 °C)
(at VCC = 3.0 V, T
A
= –30 °C)
(at VCC = 3.6 V, T = –30 °C)
A
0
0
0
Pout (MIX)
Pout (MIX)
Pout (MIX)
–20
–40
–20
–40
–20
–40
–60
–60
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
Recommended operating range
Recommended operating range
Recommended operating range
900
950
1000
900
950
1000
900
950
1000
f
MIXout - Pre-Mix. Output Frequency - MHz
f
MIXout - Pre-Mix. Output Frequency - MHz
fMIXout - Pre-Mix. Output Frequency - MHz
P
out(MIX) vs fMIXout
P
out(MIX) vs fMIXout
Pout(MIX) vs fMIXout
(at VCC = 2.7 V, T
A
= +25 °C)
(at VCC = 3.0 V, T
A
= +25 °C)
(at VCC = 3.6 V, T = +25 °C)
A
0
0
0
Pout (MIX)
Pout (MIX)
Pout (MIX)
–20
–40
–20
–40
–20
–40
–60
–60
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
Recommended operating range
Recommended operating range
Recommended operating range
900
950
1000
900
950
1000
900
950
1000
f
MIXout - Pre-Mix. Output Frequency - MHz
f
MIXout - Pre-Mix. Output Frequency - MHz
fMIXout - Pre-Mix. Output Frequency - MHz
30
Data Sheet P11487EJ2V0DS00
µPC8126GR
P
out(MIX) vs fMIXout
P
out(MIX) vs fMIXout
Pout(MIX) vs fMIXout
(at VCC = 2.7 V, T
A
= +80 °C)
(at VCC = 3.0 V, T
A
= +80 °C)
(at VCC = 3.6 V, T = +80 °C)
A
0
0
0
Pout (MIX)
Pout (MIX)
Pout (MIX)
–20
–40
–20
–40
–20
–40
–60
–60
–60
–80
–80
–80
–100
–120
–100
–120
–100
–120
Recommended operating range
Recommended operating range
Recommended operating range
900
950
1000
900
950
1000
900
950
1000
f
MIXout - Pre-Mix. Output Frequency - MHz
f
MIXout - Pre-Mix. Output Frequency - MHz
fMIXout - Pre-Mix. Output Frequency - MHz
31
Data Sheet P11487EJ2V0DS00
µPC8126GR
TEST CIRCUIT 1 (Modulator+Pre-Mixer / In case of VI/Qin is single ended input)
Signal Generator
Spectrum Analyzer
Voltage
Signal Generator
Source
BPF
RFin
51
IFin Vps2
RFout
VCC1
Q
Qb
MODout
51
1000 pF
33 pF
0.22µF
100 pF
33 pF
1000 pF
20
19
18
17
16
15
14
13
12
11
PreMixer
I/Q
Mixer
Q
Qb
Frequency
Doubler
TFF
I/Q Signal
Generator
I
I/Q
Mixer
Ib
1
2
3
4
5
6
7
8
9
10
15 nH
300
100 pF
33 pF
22 nH
0.22 µF
22 nH
µ
0.22
F
33 pF
6.8 nH
100 pF
1000 pF
2 pF
1000 pF
2 pF
LOin VCC1 Vps1
I
Ib
VCC2
Mix out
6 pF
Voltage
Source
Voltage
Source
6.8 nH
6 pF
6.8 nH
2 pF
6.8 nH
Filter
32
Data Sheet P11487EJ2V0DS00
µPC8126GR
TEST CIRCUIT 2 (Modulator+Pre-Mixer / In case of VI/Qin is differential input)
Signal Generator
Spectrum Analyzer
Voltage
Signal Generator
Source
BPF
RFin
51
IFin Vps2
RFout
V
CC
1
Q
Qb
51
1000 pF
100 K
33 pF
0.22 µF
10 pF
22 K
10 pF
22 K
100 pF
33 pF
1000 pF
20
19
18
17
16
15
14
13
12
11
PreMixer
I/Q
Mixer
Q
Qb
Frequency
Doubler
TFF
I/Q Signal
Generator
I
I/Q
Mixer
Ib
22 K
22 K
10 pF
1
2
3
4
5
6
7
8
9
10
15 nH
300
100 pF
10 pF
33 pF
0.22µF
22 nH
0.22 µF
33 pF
6.8 nH
22 nH
100 pF
100 K
1000 pF
2 pF
1000 pF
2 pF
LOin
V
CC1
Vps1
I
Ib
V
CC
2
Mix out
6 pF
Voltage
Source
Voltage
Source
6.8 nH
2 pF
6 pF
6.8 nH
6.8 nH
Filter
33
Data Sheet P11487EJ2V0DS00
µPC8126GR
TEST CIRCUIT 3 (Pre-Mixer)
Signal Generator
Voltage
Source
Signal Generator
BPF
IFin Vps2
RFin
MODout
V
CC3
Q
Qb
51
51
33 pF
1000
pF
20
19
18
17
16
15
14
13
12
11
PreMixer
I/Q
Mixer
Frequency
Doubler
TFF
I/Q
Mixer
1
2
3
4
5
6
7
8
9
10
15 nH
0.22 µF
22 nH
100 pF
2 pF
1000 pF
LOimb LOin
V
CC2
Vps1
I
Ib
VCC1
Mix out
Voltage
Source
Spectrum Analyzer
34
Data Sheet P11487EJ2V0DS00
µPC8126GR
APPLICATION CIRCUIT EXAMPLE
Note 1
0.22µF
1
2
3
4
5
6
7
8
9
V
CC
1
RF-Loin 20
GND 19
1000 pF
100 pF
33 pF
51 Ω
15 nH
MIXout
GND
Loinb
Loin
51 Ω
Filter
2 pF 22 nH
33 pF
IF-Loin 18
Vps2 17
1000 pF
6.8 nH
2 pF
300 Ω
GND 16
33 pF
Note 2
22 nH
µ
0.22
F
V
CC2
MODout 15
1000 pF
33 pF
1000 pF
100 pF
Vps1
GND
I
VCC3
14
100 pF
GND 13
0.22 µF
Q
12
10 Ib
Qb 11
TABLE 1 : Example of filter connect between pin2 and pin5
Kind of filter
Circuit
BPF
Zin = 50 Ω
6.8 nH
6 pF
2 pF
Zout = 50 Ω
fo = 948 MHz
Insertion Loss = 3.5 dB
6 pF
6.8 nH
6.8 nH
Notes 1. 50 Ω matching circuit at fMIXout = 948 MHz.
In case of using NEC’s evaluation board.
2. 50 Ω matching circuit at fLoin = 948 MHz.
In case of using NEC’s evaluation board.
35
Data Sheet P11487EJ2V0DS00
µPC8126GR
EXAMPLE OF TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD
33 pF
VCC3
100 pF 0.22 µF 1000 pF
Vps2
51 Ω
1000 pF
33 pF
51 Ω
Qb
1000 pF 100 pF 0.22
F
µ
VCC1
15 nH
Ib
33 pF
Vps1
22 nH
2 pF
100 pF
0.22
1000 pF
VCC2
300 Ω
µ
F
6 pF 2 pF 6.8 nH
22 nH
33 pF
6.8 nH
6 pF 6.8 nH 6.8 nH
2 pF
Notes 1. Double-sided patterning with 35 mm thick copper on polyhimid board.
2. GND pattern on backside.
3. solder coating over patterns.
4.
,
indicate through-holes.
NOTICE The test circuits and board pattern on data sheet are for performance evaluation use only. In case of
actual design-in, matching circuit should be determined using S-parameter of desired frequency in
accordance to actual mounting pattern.
36
Data Sheet P11487EJ2V0DS00
µPC8126GR
PACKAGE DIMENSIONS
20 PIN PLASTIC SSOP (225 mil) (UNIT: mm)
20
11
detail of lead end
+7˚
–3˚
3˚
1
10
6.7 ± 0.3
6.4 ± 0.2
4.4 ± 0.1
1.8 MAX.
1.5 ± 0.1
1.0 ± 0.2
0.5 ± 0.2
+0.10
–0.05
0.15
M
0.15
0.575 MAX.
0.65
0.22
+0.10
–0.05
0.10
0.1 ± 0.1
NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition.
37
Data Sheet P11487EJ2V0DS00
µPC8126GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.x. 1 000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering method and
conditions than the recommended conditions are to be consulted with sales representatives.
µPC8126GR
Soldering process
Infrared ray reflow
Soldering conditions
Symbol
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher)
Number of reflow process: 2, Exposure limitNote: None
IR35-00-2
VPS
Peak package’s surface temperature: 215 °C or below,
Reflow time: 40 seconds or below (200 °C or higher )
Number of reflow process: 2, Exposure limitNote: None
VP15-00-2
WS60-00-1
Wave soldering
Partial heating method
Solder temperature: 260 °C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limitNote: None
Terminal temperature: 300 °C or below,
Flow time: 3 seconds/pin or below,
Exposure limitNote: None
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Caution Apply only a single process at once, except for ‘‘Partial heating method’’.
For details of recommended soldering conditions for surface mounting, refer to information
document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
38
Data Sheet P11487EJ2V0DS00
µPC8126GR
[MEMO]
39
Data Sheet P11487EJ2V0DS00
µPC8126GR
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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