IQS3160QFMOQ [ETC]
16 Touch Keys with distributed Proximity Sensing;型号: | IQS3160QFMOQ |
厂家: | ETC |
描述: | 16 Touch Keys with distributed Proximity Sensing |
文件: | 总28页 (文件大小:1817K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
IQS316 Datasheet
IQ Switch® - ProxSense® Series
Multi-channel Capacitive Sensing Controller with Advanced Signal Processing Functions
The IQS316 is a 20 channel surface capacitive touch and proximity controller with advanced on-
chip signal processing features, including Antenna Tuning Implementation (ATI). Proximity
detection can be distributed over all keys, or only selected keys, providing high flexibility for stable
operation in varying designs. The controller is based on patented capacitive sensing technology
that yields stability with high sensitivity and excellent noise immunity. This controller can operate
with a small number of external components to provide a low cost solution for medium to high
channel count applications.
Main Features
16 Touch Keys with distributed Proximity Sensing
Internal Capacitor Implementation (ICI). No external reference capacitors required
Class leading proximity sensitivity with dedicated Prox Mode charging scheme
User selectable gain through Antenna Tuning Implementation (ATI)
All channels individually configurable for maximum design flexibility
Advanced on-chip signal processing
User selectable I2C and SPI communication
High sensitivity
Internal voltage regulator
Supply voltage 2.85V-5.5V
Low power modes (45uA)
Active shield options
RF detection
Available in QFN(5x5)-32 package
Representation
only, not actual
8 General Purpose I/O‟s
marking
Applications
Office machines
Consumer Electronics
Digital cameras
White goods and appliances
Kiosk and POS Terminals
Launch a menu on user approaching
Keypads
High-end kitchen appliances
Personal Media Players
Available options
TA
-40°C to 85°C
QFN32
IQS316
Copyright © Azoteq (Pty) Ltd 2015
All rights reserved.
IQS316 Datasheet
Revision 1.03
Page 1 of 28
November 2015
IQ Switch®
ProxSense® Series
5.2.2 Cx Sensors Requiring Shield....................... 12
5.2.3 Cx Sensors Used For Prox........................... 12
5.2.4 Cx Sensors plus I/O’s.................................. 13
5.2.5 Unused Cx’s................................................ 13
Contents
IQS316 Datasheet...........................................................1
6
Communication ....................................................13
1
2
Overview................................................................3
Packaging and Pin-out............................................4
6.1
Communication Selection............................... 13
Watchdog Timeout and MCLR ....................... 13
SPI................................................................... 13
6.2
6.3
2.1
2.2
QFN32............................................................... 4
ICTRL................................................................. 5
6.3.1 SPI read ...................................................... 14
6.3.2 SPI write..................................................... 14
6.3.3 SPI Communications Window Terminate
Command................................................................ 15
3
ProxSense® Module ................................................5
3.1
3.2
Charge Transfer Concepts ................................ 5
Charging Modes ............................................... 6
6.4
I2C ................................................................... 15
6.4.1 Control byte and Device Address............... 15
6.4.2 I2C read....................................................... 15
6.4.3 I2C write ..................................................... 15
6.4.4 I2C Communications Window Terminate
Command................................................................ 16
3.2.1 Prox Mode Charging .................................... 6
3.2.2 Touch Mode Charging.................................. 6
3.2.3 Interaction Between Prox and Touch Mode 7
3.2.4 Low Power Charging .................................... 7
3.3
Prox Module Setup ........................................... 8
3.3.1 Report rate................................................... 8
3.3.2 Transfer Frequency ...................................... 8
3.3.3 Count Value.................................................. 8
3.3.4 Prox Mode Channel Filters........................... 8
3.3.5 Environmental Drift ..................................... 8
3.3.6 LTA Filter ...................................................... 8
3.3.7 Filter Halt ..................................................... 8
3.3.8 Touch Sensitivity (Touch Mode channels
6.5
Circuit diagrams (all features)........................ 16
7
Electrical specifications.........................................18
7.1
Absolute maximum specifications.................. 18
Operating conditions (Measured at 25°C)...... 18
Moisture Sensitivity Level............................... 18
Recommended storage environment for IC’s . 19
Timing characteristics (Measured at 25°C) .... 20
7.2
7.3
7.4
7.5
only)
9
3.3.9 Proximity Sensitivity (Prox and Touch Mode
channels)................................................................... 9
3.3.10
8
9
Mechanical Dimensions........................................21
Antenna Tuning Implementation ............ 9
8.1
IQS316 Mechanical Dimensions ..................... 21
4
Additional Features..............................................10
8.1.2 QFR package differences to QNR package. 22
4.1
RF Immunity ................................................... 10
4.1.1 Design Guidelines....................................... 10
4.1.2 RF detection............................................... 10
8.2
IQS316 Landing Pad Layout............................ 23
Datasheet and Part-number Information .............24
4.2
Active Shield ................................................... 10
Proximity Output (POUT)................................ 11
Zero Cross Synchronising................................ 11
Device Sleep.................................................... 11
Communication Bypass .................................. 11
General Purpose I/O’s .................................... 12
9.1
Ordering Information ..................................... 24
Package Marking............................................ 24
Tape and Reel................................................. 25
Revision History.............................................. 27
4.3
4.4
4.5
4.6
4.7
9.2
9.3
9.5
Appendix A.
Contact Information.............................28
5
Application Design ...............................................12
5.1
Physical Layout............................................... 12
5.2
Cx Selection .................................................... 12
5.2.1 Cx Sensor Close to Noise Source................ 12
Copyright © Azoteq (Pty) Ltd 2015
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IQS316 Datasheet
Revision 1.03
Page 2 of 28
November 2015
IQ Switch®
ProxSense® Series
each sensor (key) can be viewed as the
positive plate of capacitor and the
1 Overview
a
The IQS316 is a multi-key capacitive sensing
controller designed for touch applications
requiring up to 16 touch inputs. The device
has proximity (PROX) detection integrated
with the existing 16 touch sense electrode,
providing a total of 4 additional PROX channel
outputs.
environment as the negative plate (virtual
ground reference). When a conductive object
such as a human finger approaches the
sensor, it will increase the detected
capacitance.
Advanced signal processing is implemented to
suppress and detect noise, track slow varying
environmental conditions, and avoid effects of
The electrodes used for PROX are selectable,
to allow keys in noisy/unreliable areas to not
influence the PROX stability and sensitivity.
possible drift.
The Antenna Tuning
Implementation (ATI) allows for adapting to a
wide range of application environments,
without requiring external components.
All 20 device channels (16 touch, 4 proximity)
can be individually configured. It can be
selected that 4, or 8 of the channels are setup
to be used as general purpose I/O‟s.
Functions such as simple LED control can be
implemented with these I/O‟s.
The device provides active driven shields to
protect the integrity of sensor line signals if
required. The device has a high immunity to
RF interference. For severe conditions, the
RF detection pin allows for noise detection
when connected to a suitable RF antenna,
providing suppression of noise on the
influenced data.
The device has an internal voltage regulator
and Internal Capacitor Implementation (ICI) to
reduce
Advanced
external
on-chip
components
signal
required.
processing
The IQS316 provides SPI and I2C
capabilities and a dedicated PROX charging
mode yields a stable capacitive controller with
high sensitivity.
communication
options.
A
typical
implementation of a 16 key touch panel is
shown in Figure 1.1.
With the charge transfer method implemented,
Copyright © Azoteq (Pty) Ltd 2015
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IQS316 Datasheet
Revision 1.03
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November 2015
IQ Switch®
ProxSense® Series
Figure 1.1 Typical implementation
2 Packaging and Pin-out
The IQS316 is available in a QFN32
package.
2.1 QFN32
MOSI-I2CAO 1
SOMI-SDA 2
RDY 3
24 CxA3
23 CxA2
22 CxA1
21 CxA0
20 CxB3
19 CxB2
18 CxB1
17 CxB0
The pin-out for the IQS316 in the QFN32
package is illustrated below in Figure 2.1.
SCK-SCL 4
/SS-IRDY 5
POUT
SPI_ENABLE 7
/MCLR 8
Figure 2.1 QFN32 Top View
Copyright © Azoteq (Pty) Ltd 2015
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IQS316 Datasheet
Revision 1.03
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November 2015
IQ Switch®
ProxSense® Series
In Table 2.2
communication pins are given.
a
description of all
Table 2.1
Name
QFN32 top view
Description
Pin
1
Table 2.2
Communication pins
MOSI-I2CA0 Refer to Table 2.2
2
SOMI-SDA
RDY
Refer to Table 2.2
Refer to Table 2.2
Refer to Table 2.2
Refer to Table 2.2
Proximity output
SPI
I2C
3
Name Description
Name Description
4
SCK-SCL
/SS-IRDY
POUT
MOSI Master Out
Slave In
SOMI Slave
Master In
I2CA0 Sub-Address
0
5
6
Out SDA
Data
7
SPI_ENABLE Comms Selection
/SS
SCK
RDY
Slave Select
Serial Clock
SPI Ready
IRDY I2C Ready
8
/MCLR
VDDHI
RFIN
Master Clear
Supply Voltage
RF Noise Input
Ground Reference
Current Reference
ZC Input
SCL
Not used
Clock
9
10
11
12
13
14
15
16
VSS
Pins are used as defined in the standard
communications protocols, except for the
additional RDY pin in SPI mode and the
IRDY pin in I2C mode. The ready is an
indication to the master that data transfer is
ready to be initiated (that the communication
window is available).
ICTRL
ZC
SHLD_B
SHLD_A
VREG
Shield
Shield
Internal
Voltage
Regulator
17
18
19
20
21
22
23
24
25
CxB0
CxB1
CxB2
CxB3
CxA0
CxA1
CxA2
CxA3
Cx Sensor Line
Cx Sensor Line
Cx Sensor Line
Cx Sensor Line
Cx Sensor Line
Cx Sensor Line
Cx Sensor Line
Cx Sensor Line
/ Cx Sensor Line / I/O
2.2 ICTRL
A reference resistor of 39k MUST be placed
from the ICTRL I/O to ground, as shown in
Figure 1.1. It is very important that the track
to the resistor must be as short as possible,
with the other side having a good connection
to ground.
®
CxB4
GPIO_0
3 ProxSense Module
The device contains a ProxSense® module
that uses patented technology to provide
detection of PROX/TOUCH on the numerous
sensing lines. The ProxSense™ module is a
combination of hardware and software,
based on the principles of charge transfer. A
set of measurements are taken and used for
calculating the touch controller outputs.
26
27
28
29
30
31
32
CxB5/
GPIO_1
Cx Sensor Line / I/O
/ Cx Sensor Line / I/O
/ Cx Sensor Line / I/O
/ Cx Sensor Line / I/O
/ Cx Sensor Line / I/O
/ Cx Sensor Line / I/O
/ Cx Sensor Line / I/O
CxB6
GPIO_4
CxB7
GPIO_5
CxA4
GPIO_2
3.1 Charge Transfer Concepts
CxA5
GPIO_3
Capacitance measurements are taken with a
charge transfer process that is periodically
initiated. The measuring process is referred
to as a charge transfer cycle and consists of
the following:
CxA6
GPIO_6
CxA7
GPIO_7
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IQS316 Datasheet
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IQ Switch®
ProxSense® Series
processing performed to improve stability and
Discharging of an internal sampling
capacitor (Cs) and the sense
electrode (Cx) on a channel.
sensitivity, for optimum PROX operation. The
sensor lines connected to these channels are
also selectable. By default, only CH0 and CH1
are active in Prox Mode Charging, with CxA0 –
CxA3 connected to CH0 and CxB0 – CxB3
connected to CH1. This means that CxA0,
CxA1, CxA2 and CxA3 form a combined sense
plate for CH0.
Charging of Cx‟s connected to the
channel and then a series of charge
transfers from the Cx‟s to the
associated
internal
sampling
capacitor (Cs), until the trip voltage is
reached.
It is possible to connect between 2 and 16 of
the Cx sensor lines to the PROX channels.
The number of charge transfers required to
reach the trip voltage on a channel is
referred to as the count value.
Group 0
CH0
Group 0
CH0
Group 0
CH0
The device continuously repeats charge
transfers on the sense electrode connected
to the Cx Pin.
(CxA0-CxA3)
For each channel a Long Term Average
(LTA) is calculated (12 bit unsigned integer
values). The count value (12 bit unsigned
integer values) are processed and compared
to the LTA to detect TOUCH and PROX.
CH1
CH1
(CxB0-CxB3)
CH1
CH2
CH3
CH2
(CxA4-CxA7)
CH2
CH3
For more information regarding capacitive
sensing, refer to the application note
“AZD004 Azoteq Capacitive Sensing”.
CH3
(CxB4-CxB7)
3.2 Charging Modes
Figure 3.1 Prox Mode Charging
3.2.2 Touch Mode Charging
The IQS316 has 16 sensor lines (Cx). The
device has four internal sampling capacitors,
with the touch channels charging in 4
timeslots, equating to the 16 channels. Each
active sensor line is connected to a channel
to determine touch button actuations. For
PROX channels, a selection of the 16 touch
sensor lines are combined to provide up to 4
dedicated PROX channels. For example,
CxB0, CxB1, CxB2 and CxB3 are connected
together, and charge as one PROX channel,
namely CH1.
In Touch Mode, all active touch channels are
sampled. If all 16 channels are enabled
(default), charge transfers occur in 4 groups,
namely Group1, 2, 3 and 4. In Touch Mode,
this cycle is continually repeated. Figure 3.2
shows how the channels are connected to
the respective sensor lines. The channel
number is written, and below in brackets the
respective sensor line is shown.
example: CH12 is the touch button output of
sensor line CxA2.
For
In the IQS316, charge transfers are
implemented in two charging „Modes‟,
namely Prox Mode, and Touch Mode.
The touch channels are optimised for touch
response time, and less signal processing is
performed compared to the Prox Mode
channels.
3.2.1 Prox Mode Charging
In Prox Mode, CH0 to CH3 are repeatedly
charged. Collectively, they are referred to as
the Group 0 charge transfers.
These channels are optimised for PROX
sensing by having specific digital signal
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IQS316 Datasheet
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IQ Switch®
ProxSense® Series
Group 1
CH4
Group 2
CH8
Group 3
CH12
Group 4
In Prox Mode, charging takes place
until any proximity has been detected
on CH0 to CH3, then the charging
changes to Touch Mode.
CH16
(CxA3)
(CxA0)
(CxA1)
(CxA2)
CH5
CH9
CH13
CH17
In Prox Mode, every Tmode the IC will
force Touch Mode charging for one
cycle, so that the Touch Channels
(CH4-CH19) can update their
(CxB0)
(CxB1)
(CxB2)
(CxB3)
CH6
(CxA4)
CH10
(CxA5)
CH14
(CxA6)
CH18
(CxA7)
averaging filters.
CH7
(CxB4)
CH11
(CxB5)
CH15
(CxB6)
CH19
(CxB7)
In Touch Mode, if no touch is pressed
or released for Tmode, the system will
return to Prox Mode charging.
While touches are made or released,
the system will remain in Touch Mode
Figure 3.2 Touch Mode Charging
3.2.3 Interaction Between Prox and
Touch Mode
Interaction between Prox and Touch Mode
Charging occurs automatically as follows:
0
0
0
0
0
0
0
0
1
2
3
4
0
0
0
0
0
0
0
0
0
0
0
0
1
2
3
4
1
2
3
4
1 2 3 4 1 2 3 4 0 0 0 0 0 0 0 0
Prox Mode
Touch
Mode
Prox Mode
Touch Mode
Prox Mode
A
Update
Figure 3.3 Charging Mode Interaction
The interaction between charging modes is
easily understood by means of the following
example, refer to Figure 3.3.
In an ideal situation, the concept is
implemented to operate as follows:
In steady-state (no user interaction), the
For the first stage, the charging is in Prox Mode,
with Group 0 charging repeatedly. A timeout
(TMODE) occurs, and a brief Touch Mode update
is performed, after which Prox Mode charging is
resumed.
device operates in the Prox Mode charging.
The IQS316 will then sense
a
user
approaching by means of the optimised PROX
sensing, and will flip the charging to Touch
Mode.
Now touch button interaction is
constantly monitored. Once touch interaction
has subsided, Prox Mode is resumed. This
provides stable and sensitive proximity
detection, as well as rapid touch response.
At point marked „A‟, a proximity event occurs,
which forces the system into Touch Mode, and
charging of Group 1 to 4 is now repeated.
Touch Mode is continued until a Tmode period of
no touch interaction is monitored, upon which
the device returns to the Prox Mode charging, as
shown in the last stage of the figure.
3.2.4 Low Power Charging
Low current consumption charging modes are
available. These only apply to the Prox Mode
charging, since when in Touch Mode,
interaction with the device is assumed, and
then slow response is not acceptable. In low
The master can override the automatic
interaction between Prox- and Touch Mode,
by forcing the IQS316 into either mode by
means of specific commands.
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IQS316 Datasheet
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November 2015
IQ Switch®
ProxSense® Series
power, charging takes place less often, and sensitivity. The Touch Mode channels (CH4 –
naturally this decreases the response time for CH19) are usually considerably lower (200 –
a proximity event, this does however allow the 500), because the same sensitivity as required
device to sleep for long periods between for PROX is not usually required for touch.
conversions, decrease the power consumption
3.3.4 Prox Mode Channel Filters
considerably.
The Prox Mode channel filter provides a major
improvement on the proximity performance of
3.3 Prox Module Setup
the device. The filter is implemented on CH0
– CH3, and is default ON at start-up. It is
recommended to keep this filter enabled.
To improve the filters effectiveness with
rejecting AC mains noise, the charge transfers
are synchronised to a base frequency (roughly
9ms, to accommodate both 50Hz and 60Hz).
Numerous factors (charge transfer frequency,
high counts, long communication time, more
than two active Prox Mode channels etc)
could cause this timing to be extended, which
would simply reduce the effectiveness of the
filter. Refer to Table 7.5.
3.3.1 Report rate
The report rate of the device depends on the
charge transfer frequency and the LTA of the
channels.
The length of communications
performed by the master device will also have
an effect on the report rate of the IQS316. A
typical value is shown in the characteristic
data in Table 7.5.
3.3.2 Transfer Frequency
The frequency of the transfers can be selected
by the main oscillator (Main_OSC) and main
oscillator divider (CxDIV) settings. Conversion
frequencies are given in Table 3.1 with the
Main_Osc fixed at 8MHz. An optimal transfer
frequency must be selected for a specific
application by choosing the optimal CxDIV
setting.
3.3.5 Environmental Drift
The Long Term Average (LTA) can be seen
as the baseline or reference value. The LTA
is calculated to continuously adapt to any
environmental drift.
Table 3.1
Charge transfer
frequency
3.3.6 LTA Filter
The LTA filter is calculated from the count
value of each channel. The LTA filter allows
the device to adapt to environmental (slow
moving) drift. Touch and PROX information is
calculated by comparing the count value with
this LTA reference value.
CxDIV
Conversion
Frequency
000
001
010
011
100
4MHz
2MHz
For an illustration of the working of the LTA
filter (and filter halt), refer to application note
“AZD024 Graphical Representation of the IIR
Filter”.
1MHz (default)
0.5MHz
3.3.7 Filter Halt
0.25MHz
To ensure that the LTA filters do not adapt
during a PROX or TOUCH, a filter halt
scheme is implemented on the device. The
designer can choose between four options as
given in Table 3.2.
101-111
0.125MHz
3.3.3 Count Value
As a rough guideline, the Prox Mode channels
(CH0 – CH3) are usually set to higher count
values (800 – 1500), to optimise PROX
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IQS316 Datasheet
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IQ Switch®
ProxSense® Series
count value to drop. A touch threshold of 1/32
will be the most sensitive setting and 10/16
will result in the least sensitive.
Table 3.2
Filter
Filter halt options
THALT
Table 3.3
Touch Thresholds
During PROX or TOUCH,
filter halts for ~20s, then
reseeds
Short
Setting LOW Range
HIGH Range
00
01
1/32 (default)
4/16
During PROX or TOUCH,
Filter halts for ~40s, then
reseeds
Long
(default)
1/16
6/16
8/16
10
11
2/16
3/16
Never
Filter NEVER halts
10/16
Always
Filter is HALTED, always
Four values exist for each channel. Two
ranges of settings can be selected, but the
range is a global setting and applies to all
channels; whereby each channel can then
individually be setup to a value within the
selected range.
With the Short and Long option, the filter
operates as follows:
The LTA filter will freeze on a touch or
proximity for THALT seconds. After THALT, if
prox/touch condition still exists, the system will
assume a stuck condition, and the LTA will
reseed to the count value. In applications
where long user interaction is expected, the
„Long Halt‟ option is recommended.
3.3.9 Proximity Sensitivity (Prox and
Touch Mode channels)
The proximity sensitivity of each individual
channel is a user defined threshold calculated
as a delta value below the LTA. A PROX
status is detected when the count value drops
below the selected delta relative to the LTA.
The THALT timer is reset every time a touch is
made or released.
For the „Never Halt‟ setting, the filter will
immediately begin to adapt, without ever
freezing the filter.
recommended.
This setting is not
Table 3.4
Prox Thresholds
Setting LOW Range
HIGH Range
8 (default)
The „Always Halt‟ setting can be used to
enable a master device to implement a
custom filter halt scheme. The master device
can monitor the LTA and count values to
determine when a stuck condition has
occurred. This setting is useful since the
master device can decide when the touch key
is in a „stuck‟ condition, and a „Reseed‟
command could be initiated from the master to
rectify this.
00
01
2
3
16
20
30
10
11
4
6
Again four values exist for each channel, and
again a global secondary range can be
selected, changing the 4 available settings for
all channels to a new set of 4 possibilities.
On the IQS316, all channels can be
individually reseeded if need be, otherwise a
global reseed is available.
3.3.10 Antenna Tuning Implementation
The ATI is
a
sophisticated technology
implemented in the new ProxSense® series
devices. It allows optimal performance of the
devices for a wide range of sensing electrode
capacitances, without modification or addition
of external components. The ATI allows the
tuning of two parameters, an ATI Multiplier
3.3.8 Touch Sensitivity (Touch Mode
channels only)
The touch sensitivity of each individual
channel is a user defined threshold, calculated
as a ratio of the count value to the LTA. Note
that a user touching the sensor will cause the
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IQS316 Datasheet
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IQ Switch®
ProxSense® Series
and an ATI Compensation, to adjust the count
value for an attached sensing electrode.
ATI allows the designer to optimise a specific
design by adjusting the sensitivity and stability
of each channel through the adjustment of the
MOSI-I2CAO
SOMI-SDA
RDY
1
2
3
4
5
24 CxA3
23 CxA2
22 CxA1
21 CxA0
20 CxB3
19 CxB2
18 CxB1
17 CxB0
ATI parameters.
Please refer to Azoteq
Application Note AZD027 for more information
regarding ATI.
SCK-SCL
/SS-IRDY
POUT
The IQS316 has an automated ATI function.
This allows the designer to specify a count
target value for either the Prox- or Touch
Mode channels, and then when activated, the
system will increment the relevant ATI
Compensation settings until the channels
reach the target value.
Note that the ATI algorithm (and the ATI Busy
indication) bit will only take effect once the
communication window where the AutoATI is
requested has been ended.
SPI_ENABLE
7
8
/MCLR
GND
Figure 4.1 Ground plane routing
4.1.2 RF detection
In cases of extreme RF interference, the on-
chip RF detection is suggested.
By
connecting a suitable antenna to the RF pin, it
allows the device to detect RF noise and notify
the master of possible corrupt data. A 50Ω
pull-down resistor should be placed on RFIN.
Note that the value of the resistor should
match the impedance of the antenna.
4 Additional Features
4.1 RF Immunity
The IQS316 has immunity to high power RF
noise.
In this section general design
guidelines will be given to improve noise
immunity and the noise detection functionality
is explained.
Noise affected samples are not allowed to
influence the LTA filter, and also do not
contribute to PROX or TOUCH detection.
4.1.1 Design Guidelines
If this function is not implemented in design, it
is recommended to disable the noise detection
in the firmware.
To improve the RF immunity, extra decoupling
capacitors are suggested on VREG and VDDHI
.
Place a 100pF in parallel with the 1uF ceramic
on VREG and VDDHI. All decoupling capacitors
should be placed as close as possible to the
VDDHI and VREG device pins.
4.2 Active Shield
The IQS316 has two active driven shield
outputs, shielding the sensor lines from false
touches and proximities, and countering the
effect of parasitic ground sources. Using
internal driven shields in applications where
the environment requires shielding lowers the
cost of the final solution by avoiding the
necessity of external shield components.
PCB ground planes also improve noise
immunity. Care must be taken to not pour
these planes near the tracks/pins of the
sensing lines, see Figure 4.1. Ground/voltage
planes close to the sensing channels have a
negative effect on the sensitivity of the
sensors. Note, if I/O‟s are used instead of the
sensor lines, the ground pour can also go
under these pins.
Manual control of the shield is provided by the
IQS316 (allowing CxA0/CxB0 to CxA6/CxB6
to be shielded). Additionally, an automatic
shield implementation can be selected,
allowing automatic setup of the shield each
cycle. The channels that are set by the
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IQ Switch®
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automatic selection are highlighted in the
table.
4.3 Proximity Output (POUT)
All the individual PROX status for each
channel is available through the device
memory map, but an additional POUT I/O has
been added. This I/O is active HIGH when
any of the PROX channels (CH0 – CH3)
sense a PROX. This could, for example, be
used to control the backlighting of an
application.
Table 4.1
Automatic Shield
Setting Channels
Group
SHLD_A
CxA0
SHLD_B
CxB0
0
1
2
3
4
CxA0
CxB0
CxA1
CxB1
4.4 Zero Cross Synchronising
CxA2
CxB2
CxA3
CxB3
When an application is operated in a noisy AC
environment, it could be required to
synchronise the charging to the AC. This
reduces the noise influence on the count
value. This is not normally required since the
Prox Mode filters should remove this AC
component, but is available if needed.
The active driven shields follow the waveforms
of the sensor lines. A screenshot of two pairs
of shield and sensor lines are illustrated in
Figure 4.2. It can be seen that generally 2
different channels have very similar signals,
and it has been found that the shield of a
specific channel can be effectively used to
shield the other channels in the same timeslot
(Group).
If unused, it is best to connect directly to GND.
4.5 Device Sleep
The IQS316 can be placed in low power
SLEEP mode. This however is a totally
inactive state, and no channel sensing is
performed.
This could be used if an
application does not require the keys to be
sensed, or if custom low power mode is
implemented. All the device settings and data
is retained after waking from the sleep.
4.6 Communication Bypass
The IQS316 can be set up to bypass the
communication window. This could be useful
if a master does not want to be interrupted
during every charging cycle of the IQS316.
The communication will be resumed (Ready
will indicate available data) if the IQS316
senses a proximity. The master can also
initiate communication if required (only in SPI).
Therefore the master sends a command to
bypass the communication. The IQS316 then
Figure 4.2 Active shields
Pull-up resistors are required on each shield
line as shown in Figure 6.9 and Figure 6.10.
A suggested value for the pull-up resistors are
2kΩ when using the controller at 3.3V, and
4.7kΩ when using the controller at 5V.
Smaller resistor values will increase the
driving ability of the shield, but will also
increase the current consumption.
continually
does
conversions
without
interaction with the master, until a proximity
occurs, which is most likely the first time that
the master will be interested in the IQS316
data.
For more information regarding shielding, refer
to
the
application
note
“AZD009
If the master wants to force the
communication to resume in SPI mode, then
Implementation of Driven Shield”.
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IQ Switch®
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the /SS must be pulled LOW to select the decisions are highlighted here, referring to
device. Then the master must still wait for the Figure 5.1 to illustrate the options. This is
RDY to go HIGH, then communication is mostly important when less than 16 keys are
resumed.
required, and the Cx‟s that are to be used in
the design are chosen.
After communication is resumed, both by the
master or the slave, then the bypass is
removed. Thus if required again, it must be
reconfigured.
Group 4
Group 0
Group 1
Group 2
Group 3
CH16
(CxA3)
CH0
(CxA0-CxA3)
CH4
(CxA0)
CH8
(CxA1)
CH12
(CxA2)
Row 0
Row 1
Row 2
CH17
(CxB3)
CH1
(CxB0-CxB3)
CH5
(CxB0)
CH9
(CxB1)
CH13
(CxB2)
4.7 General Purpose I/O’s
The IQS316 has 8 GPIO‟s available. It is
possible to use 0, 4 or 8 I/O‟s, leaving 16, 12
or 8 Cx channels respectively. These I/O‟s
can be controlled via the memory map. The
following considerations should be given when
using these I/O‟s:
CH2
(CxA4-CxA7)
CH6
(CxA4)
CH10
(CxA5)
CH14
(CxA6)
CH18
(CxA7)
CH19
(CxB7)
CH3
(CxB4-CxB7)
CH7
(CxB4)
CH11
(CxB5)
CH15
(CxB6)
Row 3
Figure 5.1 Cx Channel Selection
-
They provide only
indication (no current
a
logic level
sourcing
5.2.1 Cx Sensor Close to Noise Source
If the design is such that some channels will
be in close proximity to a noisy environment, it
is always good to group these channels
together in the same row, where rows are
illustrated in Figure 5.1. This is so that if
channels are affected by noise, they will
influence less of the Prox Mode channels
(noise could reduce the effectiveness of
capabilities), thus for example, if LED‟s
are to be switched, the I/O must
connect to the gate of a FET (thus only
capacitive loads).
-
-
Updating the TRIS of the I/O‟s is only
done after the termination of the
communication window.
proximity sensing).
These Prox Mode
The state of a GPIO can only be
read/written during a communication
window, since it is controlled via the
memory map.
channel(s) can then be set up with an
insensitive PROX threshold, or can be
disabled.
5.2.2 Cx Sensors Requiring Shield
-
The I/O‟s switch to Vreg voltage.
If the design requires the use of shields, it can
be useful to select the Cx‟s according to those
used by the automatic shield function (Section
4.2). The Cx‟s used by this are circled in
Figure 5.1.
5 Application Design
5.1 Physical Layout
For more information regarding the layout of
the buttons / electrode, please refer to the
application note “AZD008 Design Guidelines
for Touch Pads.” Information such as button
size and shape, overlay type and thickness,
sensor line routing, and ground effects on
sensing are highlighted.
5.2.3 Cx Sensors Used For Prox
If specific channels are required to provide
good
proximity sensing,
then it
is
recommended to also keep these in the same
row, preferably row0 and row1 as circled
(since these are part of CH0 and CH1 which
are default active). If you require independent
proximity information, then these channels
must be chosen to be in different rows (since
all channels in the same row charge together
to give a collective PROX result).
5.2 Cx Selection
A few points need to be considered when
designing a multi-key application. Factors
such as noise, shielding and proximity
requirements need to be evaluated. A few key
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IQ Switch®
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@ 8Mhz) to be serviced. If the device is not
5.2.4 Cx Sensors plus I/O’s
serviced within this time, a reset will occur.
The watchdog is disabled by default and can
be enabled in the Memory Map. It is advised
to disable the watchdog timer during the
development phase.
If the I/O‟s are to be used, the Cx‟s must be
selected appropriately. If 8 I/O‟s are used,
then the 8 Cx‟s available are again those
circled in the figure, the remaining are then
converted to I/O‟s. If 12 Cx‟s are required with
4 I/O‟s, then the I/O‟s used will be either:
The watchdog is also not crucial, since a
MCLR pin is available for the master to reset
the IQS316. The MCLR has an internal pull-
up resistor. To reset, pull the MCLR LOW
(active LOW).
CxA4, CxA5, CxB4 and CxB5 or
CxA6, CxA7, CxB6 and CxB7.
The remaining 12 will thus be the sensor lines.
5.2.5 Unused Cx’s
It is important to disable unused Cx‟s, since
this increases the response time of the device,
as shown in Table 7.5.
6 Communication
The IQS316 can communicate in SPI or I2C
using the respective standard communication
protocols. Both communication protocols are
implemented with similar interaction with the
memory map. For both of the communication
protocols, the respective Ready I/O will be set
when data is available.
Figure 6.1
Communication start-up
time
It can be seen in Figure 6.1 that it takes
roughly 16ms for communication to start after
the MCLR pin has been released. The IC
does an initial conversion, while performing
device initialisation and calculations, after
which the communication window is available.
A general I2C and SPI Memory Map is defined
so that all ProxSense® devices can use a
standard framework. The complete Memory
Map is defined in the “AZD032 IQS316
Communication Interface” document. This
document is a design guideline covering all
the specific device details, device information,
and settings.
6.3 SPI
SPI uses a memory mapped structure when
sending or retrieving data to/from the IC. The
device must be selected by pulling the /SS
low.
In I2C and SPI mode a WRITE = 00 and a
READ = 01.
At the beginning of a communication window,
the pointer will be set to a default value. This
value can be overwritten to change the default
pointer position. Note that the clock polarity is
idle high, and the data is sampled at the
second edge of the clock pin (rising edge).
6.1 Communication Selection
The IQS316 uses I2C communication by
default. To enable SPI communication, the
SPI enable pin must be pulled HIGH at start-
up, which will configure the device to SPI
mode. The SPI_ENABLE input pin can be
connected to VDDHI or a pull-up resistor smaller
than 39kΩ can be used.
6.2 Watchdog Timeout and MCLR
When data is available, and Ready is set, the
device will allow a full watchdog period (16ms
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IQ Switch®
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/SS
RDY
SCK
data read from the IC will be from that specific
address, as long as that address is a valid
Read Address from the memory map. This
speeds up the reading of sporadic addresses,
by allowing addresses to be specified „on the
fly‟. When an illegal address is specified in a
read operation, the device will return a „27‟
decimal, the IQS316 product number.
MOSI
SOMI
bit7
7
bit6
bit5
bit5
bit3
bit2
bit1
bit0
0
Figure 6.2 SPI timing illustration
6.3.1 SPI read
An example of the read process is illustrated
in Figure 6.3.
The SPI read is performed by sending the
„Read‟ bit in the control byte during the first
data time-slot. The pointer will increment and
step through the relevant memory mapped
blocks, as long as the value sent in to the
device is „FE‟. If an „FF‟ is sent, the SPI read
cycle is terminated. If any value other than a
„FE‟ or an „FF‟ is received, that value will be
loaded into the address pointer, and the next
Header
Data @
Adr 13
Data @
pointer
Data @
pointer+1
Data @
Adr 12
FF
SOMI
MOSI
MCU
Stop
FF
Control
FE
12
FE
R
01
Overwrite Pointer with
address ‘12’
Figure 6.3 SPI Read
Header
00
01
00
01
00
FF
SOMI
MOSI
MCU
Stop
FF
Control
Address
n
Data n
Address
n+1
Data n+1
W
00
Figure 6.4 SPI Write
An example of the SPI write process is given
in Figure 6.4. If an „FF‟ is sent as an address,
the Write cycle is terminated. The value „FF‟
is sent in the Read and Write cycle to
terminate the respective cycles, but will not
terminate the communication window.
6.3.2 SPI write
Similar to the read, while receiving the
„header‟ byte, a WRITE must be selected in
the control byte. The address to which to
write to always precedes the data (address,
data, address, data…)
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IQ Switch®
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6.3.3 SPI
Communications
Window 6.4.2 I2C read
Terminate Command
With the R/W bit SET in the control byte, a
read is initiated. Data will be read from the
address specified by the internal address
pointer (Figure 6.6). This pointer will be
automatically incremented to read through the
Once the master received all required data
from the device, and has written any required
settings to the device, the communication
must be ended, so that the IC can perform
another charge transfer. To achieve this, a
value of „FE‟ must be written in the Address
time slot of a WRITE cycle.
memory map data blocks.
If a random
address is to be read, a Random Read must
be performed. The process for a Random
Read is as follows: write to the pointer (Word
Address in Figure 6.7), initiate a repeated-
Start, read from the address.
6.4 I2C
The IQS316 can communicate on an I2C
compatible bus structure. Note that 4.7kΩ
pull-up resistors should be placed on SDA and
SCL.
Current Address Read
Control Byte
Start
S
Data n
Data n+1
Stop
S
ACK
ACK
NACK
6.4.1 Control byte and Device Address
Figure 6.6 I2C Current Address Read
The Control byte indicates the 7-bit device
address and the Read/Write indicator bit. The
structure of the control byte is shown in Figure
6.5.
Random Read
Control Byte
Control Byte
Start
S
Word Address(n)
ACK
Start
Data n
Stop
S
ACK
S
ACK
NACK
7 bit address
Figure 6.7 I2C Random Read
6.4.3 I2C write
MSB
LSB
R/W
I2CA1 I2CA0
1
1
1
0
1
With the R/W bit cleared in the control byte, a
write is initiated. An I2C write is performed by
sending the address, followed by the data.
Unlike the SPI write, the Address is only sent
once, followed by data bytes. A block of data
can be written by sending the address
followed by multiple blocks of data. The
internal address pointer is incremented
automatically for each consecutive write, if the
pointer increments to an address which
doesn‟t exist in the memory map, no write will
take place.
Note that the pointer doesn‟t automatically
jump from the end of the LT average block to
the settings block.
An example of the write process is given in
Figure 6.8.
I2C Group
Sub-addresses
Figure 6.5 I2C control byte
The I2C device has a 7 bit Slave Address in
the control byte as shown in Figure 6.5. To
confirm the address, the software compares
the received address with the device address.
Sub-address 0 of the device address is a
static variable read from state of the I2CA0 pin
at start-up. The default value of Sub-address
1 (I2CA1) is „0‟, please contact your local
Azoteq distributor for devices with I2CA1 set
to „1‟.
The two sub-addresses allow 4 IQS316 slave
devices to be used on the same I2C bus, as
well as to prevent address conflict.
DATA WRITE
Start Control Byte
S
Word Address(n)
Data n
Data n+1
Stop
S
The fixed device address is „11101‟ followed
by the 2 sub-address bits, giving a default 7-
bit address of „1110100‟.
ACK
ACK
ACK
ACK
Figure 6.8 I2C write
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IQ Switch®
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6.4.4 I2C
Terminate Command
Communications
Circuit diagrams of implementations using
Window
additional features are shown in Figure 6.9
and Figure 6.10. Additional 100pF decoupling
capacitors are placed on VDDHI and VREG to
increase the noise immunity of the controller.
In Figure 6.9 the controller is configured to
communicate in SPI mode and in Figure 6.10
the controller is configured to communicate in
I2C mode.
To terminate the communication window in
I2C, a STOP is given.
When sending
numerous Read and Write commands in one
communication cycle, a „Repeated Start‟
command must be used to stack them
together (since a STOP will jump out of the
communication window, which is not desired).
6.5 Circuit diagrams (all features)
IQS316
VDDHI
VDDHI
VDDHI
VREG
SPI_ENABLE
(Optional)
(Optional)
C4
100pF
C1
1uF
C2
100pF
C3
1uF
CXA0
CXA1
CXB1
CXA5
CXB5
CXA2
CXB2
CXA6
CXB6
CXA3
CXB3
CXA7
CXB7
CXA[7:0]
CXB[7:0]
GND
GND
GND
GND
CXB0
CXA4
CXB4
MOSI
VDDHI VDDHI
SOMI
RDY
SCK
R2
R3
Shield (Optional)
/SS
SPI Interface
to Master Controller
SHLD_A
SHLD_B
MCLR
MCLR
C5
10nF
(RF Optional)
RF antenna
GND
RF
ZC
ZC_IN
(Zero-Cross Optional)
VSS
ICTRL
39k
R1
GND
R4
GND
GND
GND
Figure 6.9 Circuit diagram for SPI implementation
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IQ Switch®
ProxSense® Series
IQS316
VDDHI
VDDHI
SPI_ENABLE
VREG
(Optional)
(Optional)
CXA0
CXA1
CXB1
CXA5
CXB5
CXA2
CXB2
CXA6
CXB6
CXA3
CXB3
CXA7
CXB7
C1
1uF
C2
100pF
C3
1uF
C4
100pF
VDDHI VDDHI
CXA[7:0]
CXB[7:0]
(Standard I2C pull-ups)
CXB0
CXA4
CXB4
GND
GND
GND
GND
R1
R2
VDDHI VDDHI
SDA
SCL
R4
R5
Shield (Optional)
IRDY
I2CA0
SHLD_A
SHLD_B
I2C Interface
to Master Controller
GND
MCLR
MCLR
C5
10nF
(RF Optional)
RF antenna
GND
RF
ZC
ZC_IN
VSS
(Zero-Cross Optional)
ICTRL
39k
R3
GND
R6
GND
GND
GND
Figure 6.10 Circuit diagram for I2C implementation
VDDHI
BACKLIGHTING LED
IQS316
VDDHI
VDDHI
VDDHI
VREG
SPI_ENABLE
R
GPIO (7:0)
GPIO (7:0)
4
3
D
Q1
GPIO_0
1
G
S
(Optional)
(Optional)
C4
100pF
C1
1uF
C2
100pF
C3
1uF
GND
GND
GND
GND
GND
VDDHI VDDHI
MOSI
SOMI
RDY
SCK
R2
R3
Shield (Optional)
SHLD_A
SHLD_B
/SS
SPI Interface
to Master Controller
CXA0
CXB0
CXA1
CXB1
CXA2
CXA3
CXB3
CXA[3:0]
CXB[3:0]
MCLR
MCLR
C5
10nF
CXB2
(RF Optional)
RF antenna
GND
RF
ZC
ZC_IN
(Zero-Cross Optional)
VSS
ICTRL
39k
R1
GND
R4
GND
GND
GND
Figure 6.11 Circuit Diagram for 8 GPIO implementation
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IQ Switch®
ProxSense® Series
7 Electrical specifications
7.1 Absolute maximum specifications
Operating temperature
-40°C to 85°C
Supply Voltage (VDDHI-VSS)
Max pin voltage for ESD=VDDHI
Maximum pin voltage for ESD=VREG
Min pin voltage
5.5V
VDDHI + 0.5V
VREG + 0.5V
VSS - 0.5V
100V/s
Min power on slope
ESD protection (Human Body Model)
Latch-up current
3kV
100mA
7.2 Operating conditions (Measured at 25°C)
Table 7.1
Electrical operating conditions
Description
Conditions
Parameter
VREG
VDDHI
INP
Min Typ Max Unit
Internal regulator output
Supply voltage
2.85V<VDDHI<5.5V
2.3
2.85
2.4
2.5
5.5
680
V
V
Normal operating current
Normal operating current
Low power operating current (LP1)
Low power operating current (LP2)
Low power operating current (LP3)
Current in SLEEP mode
Main Oscillator (8MHz setting)
2. 85V<VDDHI<5.5V
VDDHI=3.3V+4shields
2. 85V<VDDHI<5.5V
2. 85V<VDDHI<5.5V
2. 85V<VDDHI<5.5V
2. 85V<VDDHI<5.5V
2. 85V<VDDHI<5.5V
640
4
µA
mA
µA
µA
µA
µA
INP
ILP1
ILP2
ILP3
ISL
Fosc
100
60
45
20
8
25
7.36
8.64 MHz
Please Note: LP1, LP2 and LP3 are dependent on a variety of settings and thus a MIN/MAX
value cannot sensibly be given.
7.3 Moisture Sensitivity Level
Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions for some
semiconductors. The MSL is an electronic standard for the time period in which a moisture
sensitive device is allowed to be exposed to ambient room conditions (approximately
30°C/60%RH) before reflow must occur.
Table 7.2
MSL
Package
Level (duration
QFN5x5-32
QFR5x5-32
MSL 3 (168 hours)
MSL 3 (168 hours)
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IQ Switch®
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7.4 Recommended storage environment for IC’s
This storage environment assumes that the IC‟s are packed properly inside a humidity barrier
bag
Table 7.3
Min Typ Max Unit Notes
-55 25 150 °C
IC Storage
Parameter Description
TSTG
Storage
Recommended storage temperature is 25
°C ± 25 °C. Extended duration storage at
temperatures above 85 °C degrades
reliability as well as reduces data
retention performance
Temperature
Tj
Junction
150 °C
Temperature
Supplementary notes according to Jedec recommendations:
Optimal Storage Temperature Range: 5 °C to 30 °C
Humidity: between 40 to 70% RH
Air should be clean
Avoid harmful gasses and dust
Avoid outdoor exposure or storage in areas subject to rain or water spraying
Avoid storage in areas subject to corrosive gas or dust. Products shall not be stored in
areas exposed to direct sunlight
Avoid rapid changes of temperature
Avoid condensation
Mechanical stress such as vibration and impact shall be avoided
The products shall not be placed directly on the floor
The products shall be stored on a plane area. They should not be turned upside down.
They should not be placed against the wall
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IQ Switch®
ProxSense® Series
7.5 Timing characteristics (Measured at 25°C)
Table 7.4
Timing characteristics
Description
Symbol
Min
Typical Max Unit
SPI clock frequency
FSCK
0.4
0.8
MHz
I2C clock frequency
FSCL
FCX
0.1
1
MHz
MHz
Charge transfer oscillator (setting =
osc/8)
0.92
1.08
Filter Halt Short
tFHS
20
s
Filter Halt Long
Mode timer
tFHL
40
4
s
s
TMODE
Table 7.5
IQS316 Data Report Rate2
Number of
Total
Total Groups
Charging Mode
Channels
Channels
per Group
Typical
Unit
Charging
Prox Mode
Prox Mode
Prox Mode
Prox Mode
Touch Mode
1
1
1
1
4
4
3
2
1
4
4
3
110 Note1
110 Note1
110 Note1
110 Note1
41
Hz
Hz
Hz
Hz
Hz
2
1
16
Touch Mode
Touch Mode
Touch Mode
Touch Mode
Touch Mode
Touch Mode
3
2
1
1
1
1
4
4
4
3
2
1
12
8
4
3
2
54
82
161
192
238
250
Hz
Hz
Hz
Hz
Hz
Hz
1
Note 1:
In Prox Mode, the target charging frequency can decrease if certain situations
exist. For example if lengthy communication is done, the frequency will decrease, of if the
charge transfer is long (slower prox oscillator divider, or very high count values).
Note 2:
Measurements in Table 7.5 where obtained with the following settings:
-
-
-
Prox Mode count values = ±1000
Touch Mode count values = ±500
4 bytes read per cycle (XY info, Prox, Touch and Group).
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IQ Switch®
ProxSense® Series
8 Mechanical Dimensions
8.1 IQS316 Mechanical Dimensions
W
P
F
B
Tt
Wt
C2
C1
A
H
T
Figure 8.1 IQS316 Package. Drawings not too scale - illustration only.
Table 8.1
Packaging Dimensions.
QNR QFR
MIN
DESCRIPTION
MAX
5.10
5.10
0.05
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
A
B
4.90
4.90
0
4.90
5.10
5.10
0.05
4.90
0
C1
C2
F
0.203TYP
0.600TYP
0.85 0.95
0.5TYP
0.3 0.5
0.203TYP
0.3
0.4
H
0.85
0.95
P
0.5TYP
T
0.3
0.5
Tt
3.3 TYP
0.25TYP
3.3 TYP
3.55
3.75
W
Wt
0.25TYP
3.55
3.75
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IQS316 Datasheet
Revision 1.03
Page 21 of 28
November 2015
IQ Switch®
ProxSense® Series
8.1.2 QFR package differences to QNR package
The overall physical size of the part (l x w x h) and pitch of the pins did not change.
The mechanical dimensions of the saddle (Tt & Wt) and length of the pins (F) have changed
from the old part (IQS316-0-QNR) to the new part (IQS316-0-QFR). The new dimensions are
given below:
IQS316-
IQS316-
0-QNR
0-QFR
Figure 8.2 Changes in Package. Only affected dimensions are shown. Drawing for
illustration only, not too scale.
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IQS316 Datasheet
Revision 1.03
Page 22 of 28
November 2015
IQ Switch®
ProxSense® Series
8.2 IQS316 Landing Pad Layout
X2
Y1
32
31
30
29
28
27
26
25
X1
1
2
3
24
23
22
21
20
19
18
17
4
5
6
7
8
C2
Y2
33
16
9
10
11
12
13
14
15
C1
Figure 8.3 IQS316 Footprint. Illustration not to scale.
*NOTE: Pad 33 must be connected to GND.
Table 8.2
Dimensions from Figure 8.3
QFN
Dimension
4.90
QFR
Dimension
4.85
DESCRIPTION
Unit
mm
mm
mm
mm
mm
mm
C1
C2
X1
X2
Y1
Y2
4.90
4.85
0.30
0.25
3.25
3.65
0.90
0.8
3.25
3.65
Copyright © Azoteq (Pty) Ltd 2015
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IQS316 Datasheet
Revision 1.03
Page 23 of 28
November 2015
IQ Switch®
ProxSense® Series
9 Datasheet and Part-number Information
9.1 Ordering Information
IQS316 z pp b
IC NAME
BULK PACKAGING
PACKAGE TYPE
IC CONFIGURATION
IC CONFIGURATION
PACKAGE TYPE
z
=
=
0 : I2C Sub-address 1 = 0
1 : I2C Sub-address 1 = 1
QN
QF
=
=
QFN32
QFR32
BULK PACKAGING QFN5x5-32
R
=
Reel (3000 pcs/reel)
MOQ =
1 reel. Mass production orders shipped as full reels
9.2 Package Marking
IQS316 x i z PWWYY
IC NAME
REVISION
DATE CODE
IC CONFIGURATION
TEMPERATURE RANGE
REVISION
X
i
=
=
IC Revision Number
TEMPERATURE RANGE
IC CONFIGURATION
-40°C to 85°C (Industrial)
z
=
=
I2C Sub-address 1 = 0
I2C Sub-address 1 = 1
DATE CODE
P
WW
=
=
Package House
Week
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IQS316 Datasheet
Revision 1.03
Page 24 of 28
November 2015
IQ Switch®
ProxSense® Series
YY
=
Year
9.3 Tape and Reel
Figure 9.1 Tape Dimensions Figure
Table 9.1
Tape Dimensions Table
LABEL
A0
Dimensions (mm)
5.3 ± 0.10
LABEL
P0
Dimensions (mm)
4.0 ± 0.10
B0
5.3 ± 0.10
P1
8.0 ± 0.10
D0
D1
E
1.5 ± 0.10
P2
2.0 ± 0.05
1.5 ± 0.25
10xP0
T
40.0 ± 0.2
1.75 ± 0.10
5.5 ± 0.05
0.3 ± 0.05
F
W
12.0 ± 0.30
K0
1.1 ± 0.10
Copyright © Azoteq (Pty) Ltd 2015
All rights reserved.
IQS316 Datasheet
Revision 1.03
Page 25 of 28
November 2015
IQ Switch®
ProxSense® Series
Figure 9.2 Reel Dimension Figure
Table 9.2
Reel Dimension Table
Tape Size
Combination
Part Number
T12-13/04-A1
12
13/04-04-1
13/04-08-1
A(+0.25/-4.0) N(±2.0) W1(+2/-0)
330 100 12.4
W2(Max)
W3(Min/Max) Sw
11.9/15.4 6.0
18.4
Copyright © Azoteq (Pty) Ltd 2015
All rights reserved.
IQS316 Datasheet
Revision 1.03
Page 26 of 28
November 2015
IQ Switch®
ProxSense® Series
9.5 Revision History
Revision
Number
V0.03
History
Added Section 2.2
Updated Figure 2.1 (new qfn package)
Update Section 8.1.
V0.04
V0.05
Fixed Section
9.1
bulk
packaging
description and removed tube option
Added Section 9.3 (tape and reel details)
Updated 7.1 (ESD Model)
Updated patents
Fixed text Section 3.2
Terminology updated
Updated to Section 4.6
Updated to Section 2.2
Updated Section 4.4
Connected ZC to ground in Figure 1.1
Added ground tab information to Section
8.1.2
Updated Figure 2.1
Updated Section 4.1.2
Added MSL details Section 7.3
Added footer first page
Updated Table 3.3 and Table 3.4 to show
selection bits
V1.00
Updated Section 3.3.10
Updated Table 7.4
Updated contacts section
V1.01
V1.02
V1.03
Add QFR32 package descriptions
Updated contacts section
Updated current consumption values in
Table 7.1
Added storage temperature Section 7.4
Copyright © Azoteq (Pty) Ltd 2015
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IQS316 Datasheet
Revision 1.03
Page 27 of 28
November 2015
IQ Switch®
ProxSense® Series
Appendix A. Contact Information
USA
Asia
South Africa
Physical
Address
Rm2125, Glittery City
Shennan Rd
Futian District
Shenzhen, 518033
China
109 Main Street
Paarl
7646
6507 Jester Blvd
Bldg 5, suite 510G
Austin
TX 78750
USA
South Africa
Postal
Address
Rm2125, Glittery City
Shennan Rd
Futian District
Shenzhen, 518033
China
PO Box 3534
Paarl
7620
6507 Jester Blvd
Bldg 5, suite 510G
Austin
TX 78750
USA
South Africa
Tel
+1 512 538 1995
+1 512 672 8442
info@azoteq.com
+86 755 8303 5294
ext 808
+27 21 863 0033
+27 21 863 1512
info@azoteq.com
Fax
Email
linayu@azoteq.com.cn
Please visit www.azoteq.com for a list of distributors and worldwide representation.
The following patents relate to the device or usage of the device: US 6,249,089 B1; US 6,621,225 B2; US 6,650,066 B2;
US 6,952,084 B2; US 6,984,900 B1; US 7,084,526 B2; US 7,084,531 B2; US 7,265,494 B2; US 7,291,940 B2; US 7,329,970 B2;
US 7,336,037 B2; US 7,443,101 B2; US 7,466,040 B2 ; US 7,498,749 B2; US 7,528,508 B2; US 7,755,219 B2; US 7,772,781
B2; US 7,781,980 B2; US 7,915,765 B2; US 7,994,726 B2; US 8,035,623 B2; US RE43,606 E; US 8,288,952 B2; US 8,395,395
B2; US 8,531,120 B2; US 8,659,306 B2; US 8,823,273 B2; EP 1 120 018 B2; EP 1 206 168 B1; EP 1 308 913 B1; EP 1 530 178
A1; EP 2 351 220 B1; EP 2 559 164 B1; CN 1330853; CN 1783573; AUS 761094; HK 104 1401
IQ Switch®, SwipeSwitch™, ProxSense®, LightSense™, AirButtonTM, ProxFusion™, Crystal Driver™ and the
logo are trademarks of Azoteq.
The information in this Datasheet is believed to be accurate at the time of publication. Azoteq uses reasonable effort to maintain the information up-to-date and accurate, but does not warrant
the accuracy, completeness or reliability of the information contained herein. All content and information are provided on an “as is” basis only, without any representations or warranties, express
or implied, of any kind, including representations about the suitability of these products or information for any purpose. Azoteq disclaims all warranties and conditions with regard to these
products and information, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title and non-infringement of any third party
intellectual property rights. Azoteq assumes no liability for any damages or injury arising from any use of the information or the product or caused by, without limitation, failure of performance,
error, omission, interruption, defect, delay in operation or transmission, even if Azoteq has been advised of the possibility of such damages. The applications mentioned herein are used solely
for the purpose of illustration and Azoteq makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for
application that may present a risk to human life due to malfunction or otherwise. Azoteq products are not authorized for use as critical components in life support devices or systems. No
licenses to patents are granted, implicitly, express or implied, by estoppel or otherwise, under any intellectual property rights. In the event that any of the abovementioned limitations or
exclusions does not apply, it is agreed that Azoteq‟s total liability for all losses, damages and causes of action (in contract, tort (including without limitation, negligence) or otherwise) will not
exceed the amount already paid by the customer for the products. Azoteq reserves the right to alter its products, to make corrections, deletions, modifications, enhancements, improvements
and other changes to the content and information, its products, programs and services at any time or to move or discontinue any contents, products, programs or services without prior
notification. For the most up-to-date information and binding Terms and Conditions please refer to www.azoteq.com.
www.azoteq.com/ip
info@azoteq.com
Copyright © Azoteq (Pty) Ltd 2015
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IQS316 Datasheet
Revision 1.03
Page 28 of 28
November 2015
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