IQS550BLQNR [ETC]
Proximity, touch and snap* on each channel;型号: | IQS550BLQNR |
厂家: | ETC |
描述: | Proximity, touch and snap* on each channel |
文件: | 总79页 (文件大小:4625K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ProxSense®
IQS550/572/525-B000 – Capacitive Trackpad/Touchscreen Controller
Projected capacitive controller with proximity, touch, snap, trackpad outputs and gestures
The IQS5xx-B000 is a projected capacitive touch and proximity trackpad/touchscreen
controller implementation on the IQS550, IQS572 and IQS525 platforms. The IQS5xx-
B000 features best in class sensitivity, signal-to-noise ratio and automatic tuning of
electrodes. Low power proximity detection allows extreme low power operation.
Main Features
Proximity, touch and snap* on each channel
Multi-touch support up to 5 fingers
Single and multi-finger gestures
3584 x 2304 max resolution (IQS550)
Scale, orientation and electrode layout selection
I2C communication interface
ATI: automatic tuning for optimum sensitivity
Supply Voltage 1.65V to 3.6V
Proximity low power operation (<10uA)
3 Active and 2 low power modes
Event and streaming modes
Internal voltage regulator and reference capacitor
On-chip noise detection and suppression
IQS550
150
IQS572
72
IQS525
25
Maximum channels
Typical report rate
(with single touch / all channels active)
100Hz
135Hz
190Hz
Maximum resolution
(for shown Tx Rx configurations)
3584 x 2304 2048 x 1792 1280 x 768
(15 x 10)
(9 x 8)
(6 x 4)
Applications
Compact Capacitive Keyboards
Remote Control Trackpads
Appliances
Navigation devices
Kiosks and POS terminals
E-readers
TA
QFN(7x7)-48 QFN(4x4)-28 QFN(4x4)-28
IQS550 IQS572 IQS525
-40°C to 85°C
*patented
Copyright © Azoteq (Pty) Ltd
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IQS5xx-B000 Trackpad Datasheet
Revision 2.0
Page 1 of 79
November 2016
IQ Switch®
ProxSense® Series
Contents
1
2
Overview............................................................................................................................................................ 7
Packaging and Pin-out........................................................................................................................................ 8
2.1
IQS550 - QFN48 ................................................................................................................................................. 8
IQS572 - QFN28 ............................................................................................................................................... 10
IQS525 - QFN28 ............................................................................................................................................... 12
2.2
2.3
3
ProxSense® Module ...........................................................................................................................................14
3.1
Channel Definition........................................................................................................................................... 14
Alternate Low-Power Channel (ALP) .............................................................................................................. 14
Count Value..................................................................................................................................................... 14
3.2
3.3
3.3.1 Trackpad Count Values ............................................................................................................................... 14
3.3.2 ALP Count Values ........................................................................................................................................ 14
3.3.3 Max Count................................................................................................................................................... 15
3.3.4 Delta Value.................................................................................................................................................. 15
3.4
Reference Value............................................................................................................................................... 15
3.4.1 Reference Update Time .............................................................................................................................. 15
3.4.2 ALP Long-Term Average.............................................................................................................................. 15
3.4.3 Reseed......................................................................................................................................................... 15
3.5
Channel Outputs.............................................................................................................................................. 15
3.5.1 Proximity..................................................................................................................................................... 15
3.5.2 Touch .......................................................................................................................................................... 16
3.5.3 Snap ............................................................................................................................................................ 16
3.5.4 Output Debounce ....................................................................................................................................... 16
3.5.5 Maximum Touch ......................................................................................................................................... 16
3.6
Auto Tuning (ATI) ............................................................................................................................................ 17
3.6.1 ATI C Multiplier ........................................................................................................................................... 17
3.6.2 ATI Compensation & Auto ATI .................................................................................................................... 17
3.7
Automatic Re-ATI ............................................................................................................................................ 17
3.7.1 Description.................................................................................................................................................. 17
3.7.2 Conditions for Re-ATI to activate................................................................................................................ 17
3.7.3 ATI Error...................................................................................................................................................... 18
3.7.4 Design requirements................................................................................................................................... 18
3.8
Sensing Hardware Settings.............................................................................................................................. 18
4
5
Sensing Modes ..................................................................................................................................................19
4.1
Report Rate ..................................................................................................................................................... 19
4.1.1 Previous Cycle Time .................................................................................................................................... 20
4.2
4.3
Mode Timeout................................................................................................................................................. 20
Manual Control ............................................................................................................................................... 20
Trackpad ...........................................................................................................................................................20
5.1 Configuration................................................................................................................................................... 20
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IQ Switch®
ProxSense® Series
5.1.1 Size Selection .............................................................................................................................................. 20
5.1.2 Individual Channel Disabling....................................................................................................................... 20
5.1.3 Rx / Tx Mapping .......................................................................................................................................... 20
5.1.4 Rx / Tx Selections ........................................................................................................................................ 21
5.2
Trackpad Outputs............................................................................................................................................ 21
5.2.1 Number of Fingers ...................................................................................................................................... 21
5.2.2 Relative XY .................................................................................................................................................. 21
5.2.3 Absolute XY................................................................................................................................................. 21
5.2.4 Touch Strength............................................................................................................................................ 21
5.2.5 Area............................................................................................................................................................. 21
5.2.6 Tracking / Identification.............................................................................................................................. 21
5.3
Max Number of Multi-touches ........................................................................................................................ 21
XY Resolution................................................................................................................................................... 21
Palm Rejection................................................................................................................................................. 21
Stationary Touch ............................................................................................................................................. 22
Multi-touch Finger Split................................................................................................................................... 22
XY Output Flip & Switch................................................................................................................................... 22
XY Position Filtering......................................................................................................................................... 22
5.4
5.5
5.6
5.7
5.8
5.9
5.9.1 MAV Filter ................................................................................................................................................... 22
5.9.2 IIR Filter....................................................................................................................................................... 22
6
Gestures............................................................................................................................................................23
6.1
Single Tap ........................................................................................................................................................ 23
Press and Hold................................................................................................................................................. 23
Swipe (X-, X+, Y-, Y+)........................................................................................................................................ 24
2 Finger Tap..................................................................................................................................................... 24
Scroll................................................................................................................................................................ 24
Zoom................................................................................................................................................................ 25
Switching Between Gestures ........................................................................................................................... 25
6.2
6.3
6.4
6.5
6.6
6.7
7
Additional Features...........................................................................................................................................25
7.1
Non-volatile Defaults....................................................................................................................................... 25
Automated Start-up ........................................................................................................................................ 25
Suspend ........................................................................................................................................................... 26
7.2
7.3
7.3.1 I2C Wake...................................................................................................................................................... 26
7.3.2 Switch Input Pin Wake ................................................................................................................................ 26
7.4
Reset................................................................................................................................................................ 26
7.4.1 Reset Indication .......................................................................................................................................... 26
7.4.2 Software Reset............................................................................................................................................ 26
7.4.3 Hardware Reset .......................................................................................................................................... 26
7.5
Watchdog Timer (WDT)................................................................................................................................... 26
RF Immunity .................................................................................................................................................... 26
Additional Non-Trackpad Channels................................................................................................................ 26
Bootloader....................................................................................................................................................... 26
7.6
7.7
7.8
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IQ Switch®
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7.8.1 Bootloader Status ....................................................................................................................................... 26
7.9
Version Information ........................................................................................................................................ 27
7.9.1 Product Number ......................................................................................................................................... 27
7.9.2 Project Number........................................................................................................................................... 27
7.9.3 Major and Minor Versions .......................................................................................................................... 27
7.10
7.11
Unique ID......................................................................................................................................................... 27
Switch Input..................................................................................................................................................... 27
8
I2C .....................................................................................................................................................................27
8.1
Data Ready (RDY) ............................................................................................................................................ 27
Slave Address................................................................................................................................................... 27
16-bit Addressing ............................................................................................................................................ 27
I2C Read ........................................................................................................................................................... 27
8.2
8.3
8.4
8.4.1 Default Read Address.................................................................................................................................. 28
8.5
I2C Write .......................................................................................................................................................... 28
I2C Timeout...................................................................................................................................................... 28
End of Communication Session / Window...................................................................................................... 28
Event Mode Communication ........................................................................................................................... 28
8.6
8.7
8.8
8.8.1 Events.......................................................................................................................................................... 28
8.8.2 Force Communication................................................................................................................................. 28
8.9
8.10
8.10.1
8.10.2
Memory Map Registers ................................................................................................................................... 29
Memory Map Bit / Register Definitions........................................................................................................... 36
Gesture Events 0..................................................................................................................................... 37
Gesture Events 1..................................................................................................................................... 37
System Info 0 .......................................................................................................................................... 38
System Info 1 .......................................................................................................................................... 39
Individual Channel Status / Config Bit Definitions.................................................................................. 39
Count / Delta / Reference Data .............................................................................................................. 40
System Control 0 .................................................................................................................................... 41
System Control 1 .................................................................................................................................... 42
System Config 0 ...................................................................................................................................... 42
8.10.3
8.10.4
8.10.5
8.10.6
8.10.7
8.10.8
8.10.9
8.10.10 System Config 1 ...................................................................................................................................... 43
8.10.11 Alternate Channel Setup ........................................................................................................................ 44
8.10.12 ALP Rx select........................................................................................................................................... 45
8.10.13 ALP Tx select........................................................................................................................................... 45
8.10.14 RxToTx .................................................................................................................................................... 45
8.10.15 Hardware Settings A............................................................................................................................... 46
8.10.16 Hardware Settings B ............................................................................................................................... 46
8.10.17 Hardware Settings C ............................................................................................................................... 47
8.10.18 Hardware Settings D............................................................................................................................... 47
8.10.19 XY Config 0.............................................................................................................................................. 48
8.10.20 Single Finger Gestures ............................................................................................................................ 48
8.10.21 Multi-finger Gestures ............................................................................................................................. 49
9
Circuit Diagram .................................................................................................................................................50
10 Electrical Characteristics....................................................................................................................................55
10.1 Absolute Maximum Ratings ............................................................................................................................ 55
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IQ Switch®
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10.2
10.2.1
10.2.2
Operating Conditions ...................................................................................................................................... 56
General Operating Conditions................................................................................................................ 56
Power-up / Power-down Operating Conditions..................................................................................... 56
Supply Current Characteristic................................................................................................................. 57
ProxSense® Current Consumption .......................................................................................................... 57
Expected Total Current Consumption Scenarios .................................................................................... 57
I/O Port Pin Characteristics .................................................................................................................... 59
Output Driving Current........................................................................................................................... 60
NRST Pin ................................................................................................................................................. 60
I2C Characteristics................................................................................................................................... 61
10.2.3
10.2.4
10.2.5
10.2.6
10.2.7
10.2.8
10.2.9
10.2.10 Package Moisture Sensitivity.................................................................................................................. 63
10.2.11 Electrostatic Discharge (ESD).................................................................................................................. 63
10.2.12 Thermal Characteristics.......................................................................................................................... 63
10.2.13 ProxSense Electrical Characteristics ....................................................................................................... 64
11 Mechanical Dimensions ....................................................................................................................................65
11.1
11.2
11.3
11.4
IQS550 QFN(7x7)-48 Mechanical Dimensions................................................................................................. 65
IQS550 Landing Pad Layout............................................................................................................................. 66
IQS572/IQS525 QFN(4x4)-28 Mechanical Dimensions.................................................................................... 67
IQS572/IQS525 Landing Pad Layout................................................................................................................ 68
12 Packaging Information ......................................................................................................................................69
12.1 Tape Specification ........................................................................................................................................... 69
12.1.1
12.1.2
12.2
12.2.1
12.2.2
IQS550 Tape Description ........................................................................................................................ 70
IQS572 and IQS525 Tape Description..................................................................................................... 70
Reel Specification ............................................................................................................................................ 71
Dry Packing ............................................................................................................................................. 72
Baking ..................................................................................................................................................... 72
12.3
12.4
Handling of the IQS5xx.................................................................................................................................... 73
Reflow for IQS5xx ............................................................................................................................................ 74
13 Device Marking .................................................................................................................................................75
13.1
13.2
IQS550 Marking............................................................................................................................................... 75
IQS572/IQS525 Marking.................................................................................................................................. 76
14 Ordering Information ........................................................................................................................................76
14.1
14.2
14.3
IQS550 Ordering.............................................................................................................................................. 76
IQS572 Ordering.............................................................................................................................................. 77
IQS525 Ordering.............................................................................................................................................. 77
Changes:....................................................................................................................................................................... 78
Release v1.00 ........................................................................................................................................................... 78
Release v1.01 ........................................................................................................................................................... 78
Release v2.00 ........................................................................................................................................................... 78
15 Contact Information..........................................................................................................................................79
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IQ Switch®
ProxSense® Series
List of Abbreviations
ALP
Alternate Low Power
ATI
Automatic Tuning Implementation
Electromagnetic Interference
Electrostatic Discharge
Ground
EMI
ESD
GND
GUI
IC
Graphical User Interface
Integrated Circuit
ICI
Internal Capacitor Implementation
Infinite Impulse Response
Low Power
IIR
LP
LTA
MAV
ND
Long Term Average
Moving Average
Noise Detect
THR
TP
Threshold
Trackpad
WDT
Watchdog Timer
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IQ Switch®
ProxSense® Series
1 Overview
The IQS550 / IQS572 / IQS525 are capacitive sensing controllers designed for multi-touch
applications using projected capacitance touch panels. The device offers high sensitivity
proximity wake-up and contact detection (touch) through a selectable number of sensor lines
(Rxs and Txs).
The device has an internal voltage regulator and Internal Capacitor Implementation (ICI) to
reduce external components. Advanced on-chip signal processing capabilities provide stable
high performance with high sensitivity.
A trackpad consists of an array of sensors that are scanned at regular intervals. The controller
uses the principle of projected capacitance charge transfer on the trackpad. When a
conductive object such as a human finger approaches the sense plate it will decrease the
detected capacitance. Thresholds are applied to the sensor data to identify areas that exhibit
proximity and touch deviation. The contours of the touch areas are then translated to
Cartesian position coordinates that are continuously monitored to identify gestures. A user
has access to all of the data layers – the raw sensor data, the sensor proximity/touch status
data, the XY coordinates as well as the gesture outputs.
Multiple filters are implemented to detect and suppress noise, track slow varying
environmental conditions and avoid effects of possible drift. The Auto Tuning (ATI) allows for
the adaptation to a wide range of touch screens without using external components.
An innovative addition, known as a snap*, is also available on each channel. This adds
another channel output, additional to the proximity and touch.
The trackpad application firmware on the IQS5xx is very flexible in design, and can incorporate
standard touch sensors, trackpad / touchscreen areas (giving XY output data) and
conventional snap-dome type buttons, all providing numerous outputs such as proximity,
touch, snap, touch strength, area and actual finger position all in one solution.
The IQS550, IQS572 and IQS525 devices ship with the bootloader only, since the designer
must program custom IQS5xx-B000 firmware during production testing. The custom firmware
is the IQS5xx-B000 trackpad firmware together with customer specific hardware settings
exported by the GUI program.
This datasheet applies to the following IQS550 version:
Product Number 40 / Project Number 15 / Version Number 2
This datasheet applies to the following IQS572 version:
Product Number 58 / Project Number 15 / Version Number 2
This datasheet applies to the following IQS525 version:
Product Number 52 / Project Number 15 / Version Number 2
*patented
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IQ Switch®
ProxSense® Series
2 Packaging and Pin-out
2.1 IQS550 - QFN48
The IQS550 is available in a QFN(7x7)-48
package.
Tx14 1
PGM 2
SW_IN 3
N/C 4
36 Tx3
35 Tx2
34 Tx1
33 Tx0
SDA 5
32 Rx9B
31 Rx9A
30 Rx8B
29 Rx8A
28 Rx7B
27 Rx7A
26 Rx6B
25 Rx6A
SCL 6
VDDHI 7
VSS 8
VREG 9
NRST 10
RDY 11
N/C 12
Figure 2.1 QFN Top View
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IQ Switch®
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Table 2.1
Name
Tx14
QFN48 Pin-out
Pin
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
Name
Rx6A
Rx6B
Rx7A
Rx7B
Rx8A
Rx8B
Rx9A
Rx9B
Tx0
Description
Pin
1
Description
Transmitter electrode
Programming Pin
Receiver electrode
Note1
2
PGM
Receiver electrode
Note1
Wake-up from suspend
and switch input
3
SW_IN
Receiver electrode
4
5
6
7
8
n/c
SDA
~
Note1
I2C Data
Receiver electrode
SCL
I2C Clock
Note1
VDDHI
VSS
Supply Voltage
Ground Reference
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
I/O Ground Reference
I/O Supply Voltage
Tx1
Internal Regulator
Voltage
9
VREG
Tx2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
NRST
RDY
Reset (active LOW)
Tx3
I2C RDY
~
VSSIO
VDDIO
Tx4
n/c
Rx0A
Rx0B
Rx1A
Rx1B
Rx2A
Rx2B
Rx3A
Rx3B
Rx4A
Rx4B
Rx5A
Rx5B
Receiver electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Note1
Tx5
Receiver electrode
Tx6
Note1
Tx7
Receiver electrode
Tx8
Note1
Tx9
Receiver electrode
Tx10
Tx11
Tx12
Tx13
Note1
Receiver electrode
Note1
Note1: Any of these can be configured through I2C as the
Receiver electrode
ProxSense® electrode.
Note1
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IQ Switch®
ProxSense® Series
2.2 IQS572 - QFN28
The IQS572 is available in a QFN(4x4)-28
package. The production version is shown
below.
n/c 1
SDA 2
21 TX3
20 TX2
SCL 3
19 TX1
VDDHI 4
VSS 5
18 TX0
17 RX7 / TX9
16 RX6 / TX10
15 RX5 / TX11
VREG 6
NRST 7
Figure 2.2 IQS572 QFN Top View
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IQ Switch®
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Table 2.2
Name
IQS572 QFN28 Pin-out
15
16
17
18
19
20
21
22
23
24
25
26
27
Rx5
Rx6
Rx7
Tx0
Tx1
Tx2
Tx3
Tx4
Tx5
Tx6
Tx7
Tx8
PGM
Receiver electrode
Receiver electrode
Receiver electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Transmitter electrode
Programming Pin
Pin
1
Description
~
n/c
SDA
2
I2C Data
3
SCL
I2C Clock
4
VDDHI
VSS
Supply Voltage
Ground Reference
5
Internal Regulator
Voltage
6
VREG
7
NRST
RDY
n/c
Reset (active LOW)
I2C RDY
8
9
~
10
11
12
13
14
Rx0
Rx1
Rx2
Rx3
Rx4
Receiver electrode
Receiver electrode
Receiver electrode
Receiver electrode
Receiver electrode
Wake-up from suspend
and switch input
28
SW_IN
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IQ Switch®
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2.3 IQS525 - QFN28
The IQS525 is available in a QFN(4x4)-28
package. The production version is shown
below.
n/c 1
SDA 2
21 PD3
20 PD2
SCL 3
19 TX0
VDDHI 4
VSS 5
18 TX1
17 RX7 / TX2
16 RX6 / TX3
15 RX5 / TX4
VREG 6
NRST 7
Figure 2.3 IQS525 QFN Top View
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IQ Switch®
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Table 2.3
Name
n/c
QFN28 Pin-out
Rx5 /
TX4
Receiver / Transmitter
electrode
15
16
17
Pin
1
Description
~
Rx6 /
TX3
Receiver / Transmitter
electrode
2
SDA
I2C Data
Rx7 /
TX2
Receiver / Transmitter
electrode
3
SCL
I2C Clock
18
19
20
21
22
23
24
25
26
27
Tx1
Tx0
Transmitter electrode
Transmitter electrode
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O
Programming Pin
4
VDDHI
VSS
Supply Voltage
Ground Reference
5
PD2
PD3
PD4
PD5
PD6
PD7
PB0
PGM
Internal Regulator
Voltage
6
VREG
7
NRST
RDY
n/c
Reset (active LOW)
I2C RDY
8
9
~
10
11
12
13
14
Rx0
Rx1
Rx2
Rx3
Rx4
Receiver electrode
Receiver electrode
Receiver electrode
Receiver electrode
Receiver electrode
Wake-up from suspend
and switch input
28
SW_IN
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IQ Switch®
ProxSense® Series
Sensing
method
(CHARGE_TYPE):
3 ProxSense® Module
projected capacitive or self capacitive.
The IQS5xx contains a ProxSense® module
that uses patented technology to measure and
process the capacitive sensor data. The
trackpad sensors are scanned one Tx
transmitter at a time, until all have completed,
with all enabled Rxs charging in each Tx time
slot. The channel outputs (proximity, touch
and snap) are the primary outputs from the
sensors. These are processed further to
provide secondary trackpad outputs that
include finger position, finger size as well as
on-chip gesture recognition.
Sensors: which Rxs (RX_GROUP / ALP Rx
select) / Txs (ALP Tx select) are active
during conversions.
Reverse sensing: If enabled, negative
deviations can also trigger proximity
detection (PROX_REVERSE).
Count value filtering: gives reliable
proximity detection in noisy environments.
Single channel: since the alternate channel
is processed as only a single channel,
much less processing is done, allowing for
lower overall power consumption.
The additional snap state is a unique sensor
output that utilises capacitive technology to
sense the depression of a metal dome snap
button onto the customized sensor area. This
gives an additional output above the traditional
proximity and touch channel outputs.
Since all Rxs return a count measurement, it
means that the ALP channel can be a
combination of numerous measurements. To
reduce processing time (and this decrease
current consumption) the measurements are
added together, and processed as a single
„channel‟.
For more information on capacitive sensing
and charge transfers, please refer to the
Azoteq Application Note AZD004.
3.3 Count Value
For more information regarding design
guidelines refer to the Application Note
AZD068.
The capacitive sensing measurement returns
a count value for each channel. Count values
are inversely proportional to capacitance, and
all outputs are derived from this them.
3.1 Channel Definition
A channel for a projected capacitive sensor
consists of a Tx electrode that is in close
proximity to an Rx electrode.
3.3.1 Trackpad Count Values
The individual trackpad channel count values
(Count values) are unfiltered.
On a trackpad sensor (typically a diamond
shape pattern), each intersection of an Rx and
Tx row/column forms a capacitive sensing
element which is referred to as a channel.
Each channel has an associated count value,
reference value, proximity, touch and snap (if
enabled) status. The maximum number of Tx
and Rx electrodes on the IQS550 device is
15x10, thus giving 150 channels in total.
3.3.2 ALP Count Values
The combined count value (ALP count value)
used for this channel is a summation of the
individual count values (ALP individual count
values) from each active Rx.
A count value filter is implemented on this
channel to give stable proximity output for
system wake-up from a low-power mode. It is
recommended to leave this count filter
enabled (ALP_COUNT_FILTER).
3.2 Alternate Low-Power
Channel (ALP)
The amount of filtering can be modified (ALP
count beta) if required. This beta is used as
follows to determine the damping factor of the
filter:
If lower power consumption is required (ALP),
LP1 and LP2 can be configured to utilise a
single custom channel sensor, instead of
sensing the trackpad channels. This channel
has a lot of setup flexibility:
Count damping factor = Beta / 256
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IQ Switch®
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If the beta is small, the filtering is stronger,
3.4.2 ALP Long-Term Average
and if the beta is larger, the filtering is weaker.
The ALP channel does not have a snapshot
reference value as used on the trackpad, but
utilises a filtered long-term average value
3.3.3 Max Count
Each channel is limited to having a count
value smaller than the configurable limit (Max
count limit). If the ATI setting or hardware
causes measured count values higher than
this, the conversion will be stopped, and a
value of „0‟ will be read for that relevant count
value. Note that a „0‟ is also returned for a
disabled channel.
(ALP LTA value).
The LTA tracks the
environment closely for accurate comparisons
to the measured count value, to allow for small
proximity deviations to be sensed. The speed
of LTA tracking can be adjusted with the ALP
LTA beta. There is an ALP1 and ALP2, which
are implemented in LP1 and LP2 respectively.
This is to allow different settings for different
report rates, so that the LTA tracking rate can
remain the same.
3.3.4 Delta Value
The delta values (Delta values) are simply:
Delta = Count - Reference
3.4.3 Reseed
Since the Reference (or LTA for ALP channel)
is critical for the device to operate correctly,
there could be known events or situations
3.4 Reference Value
User interaction is detected by comparing
count values to reference values. The count
which would call for a manual reseed.
A
reseed takes the latest measured counts, and
seeds the reference/LTA with this value,
therefore updating the value to the latest
environment. A reseed command can be
given by setting the corresponding bit
(RESEED or ALP_RESEED).
value
of
a
sensor
represents
the
instantaneous capacitance of the sensor. The
reference value of a sensor is the count value
of the sensor that is slowly updated to track
changes in the environment, and is not
updated during user interaction.
The reference value is a two-cycle averaged
of the count value, stored during a time of no
user activity, and thus is a non-affected
reference. The trackpad reference values are
only updated from LP1 and LP2 mode when
modes are managed automatically. Thus, if
the system is controlled manually, the
reference must also be managed and updated
manually by the host.
3.5 Channel Outputs
For the trackpad channels, user interaction
typically causes the count values to increase.
The amount of deviation relative to the
reference can be used to determine the output
state of the channel, dependent on the
sensitivities configured.
For a snap actuation, the count values
decrease, and a negative deviation cause a
snap output.
3.4.1 Reference Update Time
The reference value is updated or refreshed
If the measured count value exceeds the
selected threshold value for consecutive
cycles, equal in number to the selectable
debounce parameter, the output becomes set.
according
to
a
configurable
interval
(Reference update time), in seconds.
To ensure that the reference value is not
updated during user interaction, it only
executes from the LP1 and LP2 states, where
no user interaction is assumed.
3.5.1 Proximity
This output (Prox status) is set when a
channels‟ count value deviates from the
reference value by more than the selected
threshold (Prox threshold).
Setting the Reference update time to „0‟ will
disable the updating of the reference values.
The proximity threshold is the smallest
difference between the count value and the
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reference value that would result in a proximity pattern. The design must be configured so
output. Small threshold values are thus more that a snap on the metal dome will result in a
sensitive than large threshold values.
channels‟ count value falling well below the
reference for that channel.
Note: For the trackpad channels (projected
capacitive) the samples will increase with user
interaction, thus the actual threshold is the reference
value PLUS the threshold parameter.
However, if an ALP channel is implemented in self
capacitive mode, the samples will decrease during
user interaction, thus the actual threshold is the
reference value MINUS the threshold parameter.
If required, the function must be enabled
(Snap enabled channels) for each channel on
which snap is designed. Only channels with
snap must be marked as such, since channels
are handled differently if they are snap
channels, compared to non-snap channels.
3.5.2 Touch
One global snap threshold (Snap threshold) is
implemented as a delta value BELOW the
reference. When a snap is performed, a
sensor saturation effect causes the deviation
to be negative.
This output (Touch status) is set when a
channels‟ count value increases by more than
the selected threshold.
The touch threshold for a specific channel is
calculated as follows:
Because it is only necessary to read the
individual snap registers if a state change has
occurred, a status bit (SNAP_TOGGLE) is
added to indicate this. This is only set when
there is a change of status of any snap
channel.
Threshold = Reference x (1 + Multiplier / 128)
A smaller fraction will thus be a more sensitive
threshold.
A trackpad will have optimal XY data if all of
the channels in the trackpad exhibit similar
deltas under similar user inputs. In such a
case all of the channels will have identical
thresholds. In practise, sensor design and
hardware restrictions could cause deltas
which are not constant over the entire
trackpad. It could then be required to select
individual multiplier values. These (Individual
touch multiplier adjustment) are signed 8-bit
values and indicate how much the unsigned 8-
bit global value (Global touch multiplier) must
be adjusted. The threshold used for a specific
channel (set and clear) is as follows:
A reseed is executed if a snap is sensed for
longer than the Snap timeout time (in
seconds). A setting of 0 will never reseed.
The timeout is reset if any snap is set or
cleared.
3.5.4 Output Debounce
All the channel outputs (proximity, touch and
snap) are debounced according to the
selectable debounce values (Prox debounce /
Touch snap debounce). Note that a debounce
value of 1 means that two samples satisfying
the condition must be met consecutively
before the output is activated. The default
touch debounce is set to 0 / no debouncing.
This is due to the fact that with a 15x10
sensor, debouncing adds too much delay, and
fast movements on the touch panel cannot be
debounced fast enough to provide reliable XY
output data.
Multiplier = Global + Individual adjust
A hysteresis can also be implemented
because there are different touch multiplier
parameters for setting a touch and clearing a
touch. This hysteresis allows the channels to
not flicker in and out of touch with noise.
3.5.5 Maximum Touch
3.5.3 Snap
An additional output is provided (Max Touch),
and indicates the column and row of the
channel with the largest touch deviation. This
is usually only utilised when implementing
discrete buttons, to reject any adjacent keys if
they are located in close proximity to each
When adding a metal snap-dome overlay to
the trackpad pattern, an additional snap output
(Snap status) is available. The device is able
to distinguish between a normal „touch‟ on the
overlay and an actual button „snap‟, which
depresses the metal dome onto the Rx/Tx
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IQ Switch®
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other. If the Rxs and Txs are switched The ATI routine will run for the channels of the
(SWITCH_XY_AXIS), the columns are the Txs, current mode, for example, if the system is
and the rows are the Rxs. If no touches are currently sensing the alternate low-power
seen, then this will output 0xFF.
channel, the auto ATI will apply to it, similarly
the algorithm will configure the trackpad
channels if they are currently active.
3.6 Auto Tuning (ATI)
The ATI is a sophisticated technology
implemented in the new ProxSense® devices
to allow optimal performance of the devices
for a wide range of sensing electrode
capacitances, without modification to external
components. The ATI settings allow tuning of
two parameters, ATI C Multiplier and ATI
Compensation, to adjust the sample value for
an attached sensing electrode.
The ALP channel has individual compensation
values (ALP ATI compensation) for each
enabled Rx.
The ALP ATI target value applies to each of
the individual count values configured for the
ALP channel.
Note: This routine will only execute after the
communication window is terminated, and the
I2C communication will only resume again
once the ATI routine has completed.
For detailed information regarding the on-chip
ATI technology, please refer to AZD027 and
AZD061.
3.7 Automatic Re-ATI
The main advantage of the ATI is to balance
out small variations between trackpad
hardware and IQS5xx variation, to give similar
performance across devices.
3.7.1 Description
When enabled (REATI or ALP_REATI) the ATI
algorithm will be repeated if certain conditions
are met. One of the most important features
of the Re-ATI is that it allows easy and fast
3.6.1 ATI C Multiplier
All trackpad channels can be adjusted globally recovery from an incorrect ATI, such as when
by modifying the global parameter (Global ATI performing ATI during user interaction with the
C).
sensor. This could cause the wrong ATI
Compensation to be configured, since the
user affects the capacitance of the sensor. A
Re-ATI would correct this.
Although it is recommended to keep the same
ATI C value for all trackpad channels, if
different values are required (possibly for
different trackpads), individual adjustments When a Re-ATI is performed on the IQS5xx, a
can be made. The ATI C value for each status bit will set momentarily to indicate that
channel can be adjusted using 8-bit signed this has occurred (REATI_OCCURRED
/
values (ATI C individual adjust) as follows:
ALP_REATI_OCCURRED).
3.7.2 Conditions for Re-ATI to activate
1. Reference drift
ATI C = Global + Individual Adjust
The ALP channel has its own global ATI C
parameter (ALP ATI C).
A Re-ATI is performed when the reference of
a channel drifts outside of the acceptable
range around the ATI Target.
3.6.2 ATI Compensation & Auto ATI
The ATI Compensation value for each channel
(ATI compensation) is set by means of an
automated ATI procedure. The algorithm is
executed after the AUTO_ATI bit is set. The
ATI Compensation values are chosen so that
each count value is close to the selected
target value (ATI target / ALP ATI target).
The boundaries where Re-ATI occurs for the
trackpad channels and for the ALP channels
are independently set via the drift threshold
value (Reference drift limit / ALP LTA drift
limit). The Re-ATI boundaries are calculated
from the delta value as follows:
Re-ATI Boundary = ATI target ± Drift limit
The AUTO_ATI bit clears automatically on chip
when the algorithm has completed.
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For example, assume that the ATI target is
Count is already outside the Re-ATI range
configured to 800 and that the reference drift
value is set to 50. If Re-ATI is enabled, the
ATI algorithm will be repeated under the
following conditions:
upon completion of the ATI algorithm.
If any of these conditions are met, the
corresponding error flag will be set
(ATI_ERROR / ALP_ATI_ERROR). The flag
status is only updated again when a new ATI
algorithm is performed.
Reference > 850 or
Reference < 750
Re-ATI will not be repeated immediately if
an ATI Error occurs. A configurable time
(Re-ATI retry time) will pass where the Re-ATI
is momentarily suppressed. This is to prevent
the Re-ATI repeating indefinitely. An ATI error
should however not occur under normal
circumstances.
The ATI algorithm executes in a short time, so
goes unnoticed by the user.
2. Very large count values
The configurable Max count limit is used to
sense for unexpectedly large count values. A
Re-ATI is triggered if the max count limit is
exceeded for 15 consecutive cycles.
3.7.4 Design requirements
This limit is configured to be a value higher
than the maximum count possible through
user interaction, plus worst case noise on the
count value, plus headroom. The monitoring
of this assists in correcting for a Re-ATI which
occurred during a snap press. If this does
occur, after removing the snap, the counts are
typically very high. If this was not monitored a
stuck touch could occur.
The Re-ATI can be very useful when ATI
parameters are selected for which successful
Re-ATI operation can be expected. With the
conditions for Re-ATI mentioned above, it is
clear that when the designer sets the ATI
parameters, it is beneficial to select the ATI C
and ATI Target so that the resulting ATI
Compensation values are near the centre of
the range. This ensures that with changing
sensitivity, the ATI Compensation has the
ability to increase/decrease in value without it
easily becoming 0 or 255. In general, ATI
Compensation values between 100 and 150
are desirable as they provide ample room for
adjustment. Note that the range is dependent
on the sensitivity requirements, and on the
capacitance of the sensor.
3. Decreased count value
A considerable decrease in the count value of
a non-snap channel is abnormal, since user
interaction increases the count value.
Therefore if a decrease larger than the
configurable threshold (Minimum count Re-
ATI delta) is seen on such a channel, it is
closely monitored. If this is continuously seen
for 15 cycles, it will trigger a Re-ATI. If the
channel is a snap channel, this decrease is
allowed since snap does cause count values
to decrease.
3.8 Sensing Hardware Settings
Settings specific to the ProxSense® Module
charge transfer characteristics can be
changed.
3.7.3 ATI Error
The charge transfer frequency (fcc) can be
calculated as:
After the ATI algorithm is performed, a check
is done to see if there was any error with the
algorithm. An ATI error is reported if one of
the following is true for any channel after the
ATI has completed:
16.106
푓
푐푐
=
[Hz]
ꢀ
7−퐶퐾_퐹푅퐸푄
(2
× (2 + 푈푃 + 푃퐴푆푆 + 퐼푁퐶_푃퐻퐴푆퐸)
where
푈푃 = 2(푈푃퐿퐸푁−2) (if UPLEN > 4)
푈푃 = 푈푃퐿퐸푁 (if UPLEN ≤ 4)
ATI Compensation <= ReATI lower
compensation limit
푃퐴푆푆 = 2(푃퐴푆푆퐿퐸푁 −2) (if PASSLEN > 4)
푃퐴푆푆 = 푃퐴푆푆퐿퐸푁 (if PASSLEN ≤ 4)
ATI Compensation >= ReATI upper
compensation limit
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Note: CK_FREQ, UPLEN and PASSLEN are the
4 Sensing Modes
numerical values of the settings.
For example, the default frequency is:
16.106
The IQS5xx automatically switches between
different charging modes dependent on user
interaction and other aspects. This is to allow
for fast response, and also low power
consumption when applicable. The current
mode can be read from the device
(CHARGING_MODE).
푓 =
푐푐
= 1.77푀퐻푧
ꢀ
7−7
(2
× (2 + 4 + 3 + 0)
The other hardware parameters are not
discussed as they should only be adjusted
under guidance of Azoteq support engineers.
The modes are best illustrated by means of
the following state diagram.
Idle-Touch
Mode
Sensing:
Trackpad
Timeout
Action: reseed trackpad
No touch
Movement: reset timer
Touch or snap
Active
Mode
Idle
Mode
No Touch and no snap
Sensing:
Trackpad
Sensing:
Trackpad
These modes are always the
trackpad channels sensing. Prox,
touch and snap are processed.
e
t
a
d
p
u
e
c
n
e
r
e
f
e
R
l
a
n
o
i
LP1 and LP2:
These can be either the trackpad
(only prox processing is done) or an
alternative LP channel setup
(flexible)
s
a
c
c
O
LP2
LP1
Sensing:
Sensing:
Timeout
Trackpad or
customisable
ALP channel
Trackpad or
customisable
ALP channel
Figure 4.1 System Mode State Diagram
rate, and the other modes are configured
according to the power budget of the design,
and the expected response time.
4.1 Report Rate
The report rate for each mode can be adjusted
as required by the design. A faster report rate
will have a higher current consumption, but
will give faster response to user interaction.
Active mode typically has the fastest report
The report rate is configured by selecting the
cycle time (in milliseconds) for each mode:
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IQ Switch®
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reference values by reseeding (RESEED) or
manually writing to the reference registers
(Reference values).
Report rate Active mode
Report rate Idle touch mode
Report rate Idle mode
Report rate LP1 mode
Report rate LP2 mode
5 Trackpad
5.1 Configuration
4.1.1 Previous Cycle Time
5.1.1 Size Selection
The achieved report rate can be read The total number of Rx and Tx channels used
(Previous cycle time) from the device each
for trackpad purposes must be configured
cycle; this is the previous cycles‟ length in (Total Rx / Total Tx). This gives a rectangular
milliseconds.
If the desired rate is not
area of channels, formed by rows and
columns of Rx and Tx sensors.
achievable, that is, if processing and sensing
takes longer than the specified time, a status
flag (RR_MISSED) indicates that the rate could
not be achieved.
5.1.2 Individual Channel Disabling
If the sensor is not a completed rectangle (this
could be due to board cut-outs or trackpad
shape), channels not implemented but falling
within the Total Rx / Total Tx rectangle, must
be individually disabled (Active channels).
4.2 Mode Timeout
The timeout values can be configured, and
once these times have elapsed, the system
will change to the next state according to the
state diagram.
5.1.3 Rx / Tx Mapping
The Rxs and Txs of the trackpad can be
assigned to the trackpad in any order to
simplify PCB layout and design. Rxs and Txs
can however not be interchanged (for example
you cannot use both Rxs and Txs for the
columns of the trackpad).
These times are adjusted by selecting a
desired value (in seconds), for the specific
timeout:
Timeout - Active mode
Timeout - Idle touch mode
Timeout - Idle mode
For both the mapping registers (Rx mapping /
Tx mapping) the first byte relates to the
mapping of the first row/column, the next byte
in the memory map is the next row/column,
and so on.
Timeout - LP1 mode
Note: the timeout for LP1 is set in multiples of
20s (thus a setting of ‘30’ translates to 600s,
or 10min).
Example: If a 5x5 trackpad was to be
designed with Rx/Tx mapping to columns and
rows as shown in Table 5.1, the Rx and Tx
mapping registers would need to be set as
follows:
A timeout value of 255 will result in a „never‟
timeout condition.
4.3 Manual Control
Rx Mapping = {3, 0, 8, 1, 2}
The default method allows the IQS5xx to
automatically switch between modes and
update reference values as shown in Figure
4.1. This requires no interaction from the
master to manage the IQS5xx.
Tx Mapping = {0, 1, 13, 12, 11}
Each value shown here is a byte in the
memory map. The rest of the mapping bytes
are „don‟t care‟ since they are not used.
The master can manage various states and
implement custom power modes when Manual
Control is enabled (MANUAL_CONTROL). The
master needs to control the mode
(MODE_SELECT), and also manage the
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Table 5.1
Mapping Example
5.2.3 Absolute XY
For all the multi-touch inputs, the absolute
finger position (Absolute X/Y), in the selected
resolution (Resolution X/Y) of the trackpad, is
available.
Column number
(mapped Rx)
Row
number
(mapped Tx)
0
1
2
3
4
(Rx3) (Rx0) (Rx8) (Rx1) (Rx2)
5.2.4 Touch Strength
This value (Touch strength) indicates the
strength of the touch by giving a sum of all the
deltas associated with the finger, and
therefore varies according to the sensitivity
setup of the sensors.
0 (Tx0)
1 (Tx1)
5x5
Trackpad
2 (Tx13)
3 (Tx12)
4 (Tx11)
5.2.5 Area
The number of channels associated with a
finger is provided here. This area is usually
equal to or smaller than the number of touch
channels under the finger.
5.1.4 Rx / Tx Selections
On the IQS525 and IQS572, some Rxs can be
configured to take on Tx functionality. The
preferred option is to keep them as Rxs, but if
more Txs are needed in the design, they can
be configured as such in the RxToTx register.
This allows for elongated trackpads or sliders
to be implemented on the two devices. The
corresponding Rx or Tx number is then used
in the mapping registers to configure the order
of the electrodes.
5.2.6 Tracking / Identification
The fingers are tracked from one cycle to the
next, and the same finger will be located in the
same position in the memory map. The
memory location thus identifies the finger.
5.3 Max Number of Multi-touches
The maximum number of allowed multi-
touches is configurable (Max multi-touches)
up to 5 points. If more than the selected value
is sensed, a flag is set (TOO_MANY_FINGERS)
and the XY data is cleared.
5.2 Trackpad Outputs
The channel count variation (deltas) and touch
status outputs are used to calculate finger
location data.
5.4 XY Resolution
The output resolution for the X and Y
coordinates are configurable (X/Y Resolution).
The on-chip algorithms use 256 points
5.2.1 Number of Fingers
This gives an indication of the number of
active finger inputs on the trackpad (Number
of fingers).
between each row and column.
The
resolution is defined as the total X and total Y
output range across the complete trackpad.
5.2.2 Relative XY
5.5 Palm Rejection
If there is only one finger active, a Relative X
and Relative Y value is available. This is a
signed 2‟s complement 16-bit value. It is a
delta of the change in X and Y, in the scale of
the selected output resolution.
A maximum finger size/area (Palm reject
threshold) can be set up to allow for palm
rejection or similar input suppression. This
feature can be enabled or disabled
(PALM_REJECT), and when a palm reject
condition is sensed, a status flag will indicate
this result (PALM_DETECT). All XY outputs
are also suppressed during palm detection.
Palm reject is latched on for the timeout period
Note: Gestures also use these registers to
indicate swipe, scroll and zoom parameters.
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(Palm reject timeout) to prevent erratic
behaviour before and after the palm is seen.
This timeout sets in increments of 32ms.
5.9 XY Position Filtering
Stable XY position data is available from the
IQS5xx due to two on-chip filters, namely the
Moving Average (MAV) filter, and the Infinite
Impulse Response (IIR) filter. The filters are
applied to the raw positional data in the
aforementioned order. It is recommended to
keep both of the filters enabled for optimal XY
data.
5.6 Stationary Touch
A stationary touch is defined as a point that
does not move outside of a certain boundary
within a specific time.
This movement
boundary or threshold can be configured
(Stationary touch movement threshold), and is
defined as a movement in either X or Y in the
configured resolution.
5.9.1 MAV Filter
If enabled (MAV_FILTER), raw XY points from
the last two cycles are averaged to give the
filter output.
The device will switch to Idle-Touch mode
when a stationary point is detected, where a
lower duty cycle can be implemented to save
power in applications where long touches are
expected.
5.9.2 IIR Filter
The IIR filter, if enabled (IIR_FILTER), can be
configured to select between a dynamic and a
static filter (IIR_SELECT).
If movement is detected, a status flag
(TP_MOVEMENT) is set.
The damping factor is calculated from the
selected Beta as follows:
5.7 Multi-touch Finger Split
The position algorithm looks at areas
(polygons) of touches, and calculates
positional data from this. Two fingers in close
proximity to each other could have areas
touching, which would merge them incorrectly
into a single point. A finger split algorithm is
implemented to separate these merged
polygons into multiple fingers. There is a
finger split aggression factor which can be
adjusted to determine how aggressive this
finger splitting must be implemented. A value
of „0‟ will not split polygons, and thus merge
any fingers with touch channels adjacent
(diagonally also) to each other.
Damping factor = Beta / 256
5.9.2.1 Dynamic Filter
Relative to the speed of movement of a co-
ordinate, the filter dynamically adjusts the
amount of filtering (damping factor) performed.
When fast movement is detected, and quick
response is required, less filtering is done.
Similarly when a co-ordinate is stationary or
moving at a slower speed, more filtering can
be applied.
The damping factor is adjusted depending on
the speed of movement. Three of these
parameters are adjustable to fine-tune the
dynamic filter if required (XY dynamic bottom
beta / XY dynamic lower speed / XY dynamic
upper speed).
5.8 XY Output Flip & Switch
By default, X positions are calculated from the
first column (usually Rx0) to the last column.
Y positions are by default calculated from the
first row (usually Tx0) to the last row. The X
and/or Y output can be flipped (FLIP_X /
FLIP_Y), to allow the [0, 0] co-ordinate to be
defined as desired. The X and Y axes can
also be switched (SWITCH_XY_AXIS) allowing
X to be the Txs, and Y to be along the Rxs.
The speed is defined as the distance (in the
selected resolution) travelled in one cycle
(pixels/cycle).
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All gestures are calculated relative to their
starting coordinates, i.e., the first coordinate at
which the touch was detected. Furthermore, if
at any time during a gesture, more than the
required number of touches is detected, the
gesture will be invalidated.
No filtering
Filter damping
factor (beta)
Lower Beta
(more filtering)
6.1 Single Tap
The single tap gesture requires that a touch is
made and released in the same location and
within a short period of time. Some small
amount of movement from the initial
coordinate must be allowed to compensate for
shift in the finger coordinate during the
release. This bound is defined in register Tap
distance, which specifies the maximum
deviation in pixels the touch is allowed to
move before a single tap gesture is no longer
valid.
Top Speed
Bottom Speed
Speed of
movement
Figure 5.1 Dynamic Filter Parameters
5.9.2.2 Static Filter
Co-ordinates filtered with
a
fixed but
configurable damping factor (XY static beta)
are obtained when using the static filter. It is
recommended that the dynamic filter is used
due to the advantages of a dynamically
changing damping value.
Similarly, the Tap time register defines the
maximum duration in ms that will result in a
valid gesture. That is, the touch should be
released before the time period in Tap time is
reached.
6 Gestures
The IQS5xx has an on-chip gesture
recognition feature. The list of recognisable
gestures includes:
A valid single tap gesture will be reported
(SINGLE_TAP) in the same processing cycle
as the touch release was detected, and will be
cleared on the next cycle. No movement will
be reported in the relative XY registers
(Relative X and Relative Y) during this
gesture.
1 finger gestures (GESTURE_EVENTS_0):
o A single tap
o A press and hold
o Swipe X+
Since the gesture reports after the finger is
removed, the location of the tap gesture is
placed in the Absolute X/Y registers of finger 1
at this time. With Number of fingers set to 0,
this will not look like an active finger, and is
just a repetition of the location of the tap that
has occurred for the main controller to utilise.
o Swipe X-
o Swipe Y+
o Swipe Y-
2 finger gestures (GESTURE_EVENTS_1):
o 2 simultaneous taps
o Scroll
6.2 Press and Hold
The same register that defines the bounds for
the single tap gesture (Tap distance) is used
for the press and hold gesture. If the touch
deviates more than the specified distance, the
gesture is no longer valid.
o Zoom
Each single finger gesture can individually be
enabled and disabled by setting or clearing
the corresponding bits in the register
SINGLE_FINGER_GESTURES. The multi finger
gestures can be enabled and disabled via the
register MULTI_FINGER_GESTURES.
However, if the touch remains within the given
bound for longer that the period in ms, defined
as the sum of the register values in Tap time
and Hold time, a press and hold gesture will
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IQ Switch®
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be reported (PRESS_AND_HOLD).
The [pixels] and Swipe consecutive time [ms].
gesture will continue to be reported until the Once the initial swipe gesture conditions are
touch is released or if a second touch is met as defined above, the parameters of
registered.
Swipe initial distance [pixels] and Swipe initial
time [ms] will be replaced with these. Also,
the gesture engine will reset its properties,
thus evaluating the current touch‟s movement
as if its initial coordinate was at the point at
which the previous swipe gesture was
recognised and as if it first occurred at that
point in time.
No data will be reported in Relative X and
Relative Y before the defined maximum hold
period is reached, however, the relative data
will be reported thereafter. This allows for
features such as drag-n-drop.
6.3 Swipe (X-, X+, Y-, Y+)
The consecutive events allow for the
continuous stream of swipe events for a single
action by the user. However, once the initial
conditions are satisfied, the direction of the
swipe gesture is fixed. For example, if a
swipe X+ gesture is recognised by the engine,
the consecutive swipe gestures will also be of
type X+. And the 3rd condition will only be
evaluated against the X axis.
All four swipe gestures work in the same
manner, and are only differentiated in their
direction. The direction is defined with respect
to the origin (0, 0) of the trackpad, typically at
Rx0, Tx0 (Channel 0). If the touch is moving
away from the origin, it is considered a
positive swipe (+) and if it is moving towards
the origin, it is a negative swipe (-). Whether
the swipe is of the type X or Y is defined by
which axis the touch is moving approximately
parallel to.
In the case that only a single event is desired,
the settings in Swipe consecutive distance can
be set to its maximum value and Swipe
consecutive time set to zero. This would
make it impossible to meet these conditions
on a standard trackpad.
A swipe gesture event is only reported when a
moving touch meets all three of the following
conditions:
1. A minimum distance is travelled from its
initial coordinates, as defined in pixels by
the value in register Swipe initial distance.
6.4 2 Finger Tap
The simultaneous tap gesture simply requires
two tap gestures to occur simultaneously. For
this reason the gesture uses the same
parameters (Tap distance and Tap time) as
that of the tap gesture. It is also confined to
the same conditions for the output to be
reported (2_FINGER_TAP).
2. The distance in (1) is covered within the
time specified in Swipe initial time (in ms).
3. The angle of the swipe gesture, as
determined by its starting coordinate and
the coordinate at which conditions (1) and
(2) were first met, does not exceed the
threshold in Swipe angle with regards to at
least 1 of the axes. The value in register
Swipe angle is calculated as 64 tan 휃,
where 휃 is the desired angle (in degrees).
6.5 Scroll
A
scroll gesture is identified by two
simultaneous and parallel moving touches. A
scroll gesture will be reported (SCROLL) once
the average distance travelled by the two
touches in pixels exceeds the value stored in
register Scroll initial distance. Thereafter, a
scroll gesture will continuously be reported
until one of the touches is released or if a
zoom gesture is validated.
The respective swipe gesture will be reported
for 1 cycle (SWIPE_X-, X+, Y- Y+) when all of
these conditions are met.
The relative
distance travelled will be reported in registers
Relative X and Relative Y throughout.
It is also possible to generate consecutive
swipe gesture events during the same swipe
gesture by defining the swipe gesture settings
in registers Swipe consecutive distance
Similar to the swipe gestures, the scroll
gestures are also bounded by a given angle to
the axis (Scroll angle). The value in this
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IQ Switch®
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can be made and validated. However, for the
register is calculated as 64 tan 휃, where 휃 is
the desired angle (in degrees). This condition
is only enforced during the initial validation
stage of the scroll gesture.
scroll and zoom gestures, it is possible to
alternate between the gestures and their
directions without releasing any touches.
A
switch between multi-touch gestures
The direction of the scroll gesture is defined
by the reported relative X (horizontal scroll)
and Y (vertical scroll) data. For instance, a
positive relative X value will correspond with
includes
Alternating between scroll axes
the direction of a swipe X+ gesture. Unlike Alternating between zoom in and out
the swipe gestures, a scroll gesture may
Going from a scroll to a zoom gesture
alternate between a positive and negative
direction without requiring the validation of the
initial conditions. However, switching between
the axes will require the validation.
Going from a zoom to a scroll gesture
Releasing any one of the two touches
Having more than 2 touches on the
At any given stage during a scroll gesture,
only the axis applicable to the gesture will
have a non-zero value in its relative data
register. For example, a scroll parallel to the
X-axis will have a non-zero Relative X value
and a zero Relative Y value. This value
relates to the movement of the scroll gesture.
trackpad at any given moment.
A release of 1 of the touches will require a
new touch be generated before any multi-
touch gesture can be validated. The multi-
touch gestures require 2, and only 2, touches
at all time during the gesture.
6.6 Zoom
7 Additional Features
Zoom gestures require two touches moving
toward (zoom out) or away (zoom in) from 7.1 Non-volatile Defaults
each other. Similar to the scroll and swipe
The designer can use the supplied GUI to
gestures, the zoom requires that an initial
distance threshold in the register Zoom initial
distance [pixels] is exceeded before a zoom
gesture is reported (ZOOM). Thereafter, the
register Zoom Consecutive Distance defines
the distance threshold for each zoom event
that follows the initial event. The direction/axis
along which the two touches move is not
relevant.
easily configure the optimal settings for
different setups. The design specific firmware
is then exported by the GUI, and programmed
onto the IQS5xx. These parameters are used
as the default values after start-up, without
requiring any setup from the master.
Two registers (Export file version number) are
available so that the designer can label and
identify the exported HEX file with the
Switching from a zoom in to a zoom out
gesture, or vice versa, requires that the initial
conditions be met in the opposite direction
corresponding settings.
This allows the
master to verify if the device firmware has the
intended configuration as required.
before the switch can occur.
Alternating
between a zoom and a scroll gesture requires
the same.
7.2 Automated Start-up
The IQS5xx is programmed with the trackpad
application firmware, bundled with settings
specifically configured for the current
hardware as described in Section 7.1. After
power-up the IQS5xx will automatically use
the settings and configure the device
accordingly.
The size of each zoom event will be reported
in Relative X, where the negative sign
indicates a zoom out gesture and a positive
sign a zoom in gesture.
6.7 Switching Between Gestures
For all single finger gestures it is necessary to
release all touches before any new gesture
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IQ Switch®
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7.3 Suspend
7.5 Watchdog Timer (WDT)
The IQS5xx can be placed into a suspended A watchdog timer is implemented to prevent
state (SUSPEND). No processing is any stuck conditions which could occur from
performed, minimal power is consumed ESD events or similar scenarios. The
watchdog timeout is set to about 500ms. The
(<1uA), and the device retains existing data.
watchdog can be disabled (WDT), however,
this needs to be programmed into the non-
volatile defaults, since this only takes effect
after a reset.
An automatic reseed of the trackpad is
triggered after the IQS5xx is woken from
suspend, since it cannot be guaranteed that
the reference values are still relevant.
7.3.1 I2C Wake
7.6 RF Immunity
The IQS5xx has immunity to high power RF
noise. To improve the RF immunity, extra
decoupling capacitors are suggested on VREG
The device can be woken from suspend by
addressing it on the I2C bus. It will respond
with a not-acknowledge (NACK) on the first
addressing attempt and with an acknowledge
(ACK) on the second addressing attempt,
providing that there was at least a time
difference of ~150us between the two
addressing attempts. The suspend bit must
then be disabled in that communication
session to resume operations.
and VDDHI
.
Place a 100pF in parallel with the 1uF ceramic
on VREG. Place a 1uF ceramic on VDDHI. All
decoupling capacitors should be placed as
close as possible to the VDDHI and VREG pads.
PCB ground planes also improve noise
immunity.
7.3.2 Switch Input Pin Wake
7.7 Additional Non-Trackpad
Channels
The SW_IN input pin can be used to wake the
device from suspend (when enabled). The
input can be connected to an alternate long-
range proximity sensing IC (such as IQS211),
or a mechanical switch/button for example.
For more details on the input see Section
7.11.
Unused projected capacitance channels can
be used to design additional buttons or sliders.
Note that the channels will still provide XY
data output, which can be ignored (or utilised)
by the master.
7.4 Reset
7.8 Bootloader
7.4.1 Reset Indication
A bootloader is included to allow easy
application firmware upgrading via the I2C
bus, without the need to access the PGM and
NRST pins for reprogramming.
After a reset, the SHOW_RESET bit will be set
by the system to indicate the reset event
occurred. This bit will clear when the master
sets the ACK_RESET, if it becomes set again,
the master will know a reset has occurred, and
can react appropriately.
For more information, refer to the
documentation “IQS5xx I2C Bootloader v2.x
Technical User Guide.pdf”.
7.8.1 Bootloader Status
7.4.2 Software Reset
The IQS5xx can be reset by means of an I2C
command (RESET).
The bootloader status register can be used to
confirm the availability/presence of the
bootloader (Bootloader status).
7.4.3 Hardware Reset
The NRST pin (active low) can be used to
reset the IQS5xx. For more details see
Section 10.2.6.
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IQ Switch®
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A change in the state of the SW_IN can also
Table 7.1
Register value
0xA5
Bootloader Status
Status
trigger an event, see Section 8.8.1. This input
can be used as an additional switch or
proximity sensor, and has the ability to wake
the IQS5xx from the extreme (<1uA) low
power suspend state.
Bootloader is available
No bootloader
0xEE
8 I2C
*Note the bootloader is available on the standard
IQS5xx-B000 firmware; this could possibly be
unavailable on custom firmware versions.
The IQS5xx communicates via the standard
I2C communication protocol.
7.9 Version Information
Clock stretching can occur, thus monitoring
the availability of the SCL is required, as per
standard I2C protocol.
7.9.1 Product Number
The different IQS5xx devices can be identified
by their relevant product numbers.
8.1 Data Ready (RDY)
Table 7.2
Product Number
Device
An additional RDY I/O indicates (active HIGH)
when the communication window is available
with new data for optimal response. Polling
can however be used, but is not
recommended. RDY should be connected to
an interrupt-on-change input for easier
implementation and optimal response time.
Product Number
(decimal)
40
IQS550
IQS572
IQS525
58
8.2 Slave Address
52
The default 7-bit device address is „1110100‟.
The device address can be modified during
programming. The full address byte will thus
be 0xE9 (read) or 0xE8 (write).
7.9.2 Project Number
The project number for the generic B000
project is 15 (decimal) for all devices.
8.3 16-bit Addressing
The I2C employs a 16-bit address to access all
individual registers in the memory map.
8.4 I2C Read
7.9.3 Major and Minor Versions
These will vary as the B000 is updated, this
datasheet relates to the version as indicated
at the bottom of the Overview Section 1.
7.10Unique ID
The master can read from the device at the
current address if the address is already set
up, or when reading from the default address.
A 12-byte unique ID can be read from memory
map address 0xF000 – 0xF00B. This number
gives each individual IC a unique identifier.
Current Address Read
Control Byte
Start
S
Data n
Data n+1
Stop
S
7.11Switch Input
ACK
ACK
NACK
The SW_IN (switch input) pin, when enabled
(SW_INPUT), will display the state of the input
pin to the master controller (SWITCH_STATE).
This state is updated before each I2C session.
Figure 8.1 Current Address Read
The master can perform a random read by
specifying the address.
A WRITE is
performed to set up the address, and a
repeated start is used to initiate the READ
section.
The input can be configured as active LOW or
active HIGH (SW_INPUT_SELECT). For active
LOW, an internal pull-up resistor (typical value
of 40kΩ) is connected to the SW_IN pin.
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IQ Switch®
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Address [7..0]
Address [15..8]
ADR - high
Control Byte
Start
S
the communication window, RDY will go low
and the IQS5xx will continue with a new
sensing and processing cycle.
Adr + WRITE ACK
ACK
ADR - low
ACK . . .
Control Byte
Start
S
Data n
Stop
P
Adr + READ ACK
NACK
. . .
8.8 Event Mode Communication
The device can be set up to bypass the
communication window when no activity is
Figure 8.2 Random Read
sensed (EVENT_MODE).
This is usually
8.4.1 Default Read Address
enabled since the master does not want to be
interrupted unnecessarily during every cycle if
no activity occurred. The communication will
resume (RDY will indicate available data) if an
enabled event occurs. It is recommended that
the RDY be placed on an interrupt-on-pin-
change input on the master.
When a new communication window begins,
the configurable default read address is used
if a current address read is performed (no
address is specified). If an application will
always read from a specific register, the
IQS5xx can be configured to point to the
required register, negating the need to specify
the address at each new communication
window, allowing for faster data reading.
8.8.1 Events
Numerous events can be individually enabled
to trigger communication, they are:
8.5 I2C Write
Trackpad events (TP_EVENT): event
triggered if there is a change in X/Y value,
or if a finger is added or removed from the
trackpad
The master uses a Data Write to write settings
to the device. A 16-bit data address is always
required, followed by the relevant data bytes
to write to the device.
Proximity events (PROX_EVENT): event
only triggers if a channel has a change in a
proximity state
Start Control Byte
Address [15..8]
Address [7..0]
Data n
Data n+1
Stop
S
Adr + WRITE ACK
ADR - high
ACK
ADR - low
ACK
ACK
ACK
P
Touch events (TOUCH_EVENT): event only
triggers if a channel has a change in a
touch state
Figure 8.3 Data Write
8.6 I2C Timeout
Snap (SNAP_EVENT): event only triggers if
If the communication window is not serviced
within the I2C timeout period (in milliseconds),
the session is ended (RDY goes LOW), and
processing continues as normal. This allows
the system to continue and keep reference
values up to date even if the master is not
responsive.
a channel has a change in a snap state
Re-ATI (REATI_EVENT): one cycle is given
to
indicate
the
Re-ATI
occurred
(REATI_OCCURRED).
Proximity on ALP (ALP_PROX_EVENT):
event given on state change
8.7 End of Communication
Session / Window
Switch input (SW_INPUT_EVENT): event
triggers if there is a change in the input pin
state.
Unlike the previous A000 implementation, an
I2C
STOP
will
not
terminate
the
The proximity/touch/snap events are therefore
mostly aimed at channels that are used for
traditional buttons, where you want to know
only when a status is changed.
communication window. When all required
I2C transactions have been completed, the
communication session must be terminated
manually. This is achieved by sending the
End Communication Window command, by
writing a single byte (any data) to the address
0xEEEE, followed by a STOP. This will end
8.8.2 Force Communication
The master can initiate communication with
the IQS5xx, even while RDY is LOW. The
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IQ Switch®
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IQS5xx will clock stretch until an appropriate before retrying), and the IQS5xx will be ready
time to complete the I2C transaction. The and ACK the transaction.
master firmware will not be affected (as long
Figure 8.4 shows a forced communication
as clock stretching is correctly handled).
transaction. Communication starts with RDY
For optimal program flow, it is suggested that = LOW. The IQS5xx is in a low power state
RDY is used to sync on new data from the on the first request, and a NACK is sent. After
IQS5xx.
The forced method is only the second request the IQS5xx responds with
recommended if the master must perform I2C an ACK. The IQS5xx clock stretches until an
and Event Mode is active.
appropriate time to communicate (to prevent
interference with the capacitive
measurements). When appropriate, the clock
is released and the transaction completes as
normal. RDY is not set during a forced
communication transaction.
NOTE: If the IQS5xx is in a low-power state
when the master forces the communication,
the first addressing will respond with a NACK.
The master must repeat the addressing (wait
a minimum of 150us after the I2C STOP
Figure 8.4 Forced communication
the shading in the „R‟ (read) and/or „W‟ (write)
columns.
8.9 Memory Map Registers
The registers available in the memory map,
via I2C, are provided in this section. The
memory map starts with a READ-ONLY
section, followed by a READ/WRITE section.
The read/write permissions are indicated by
Certain registers in the memory map have
defaults loaded from non-volatile memory,
which can be configured during programming;
these are highlighted also in the „E2‟ column.
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IQ Switch®
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Table 8.1
Bit5 Bit4
Direct-Addressable Memory Map
E2
Address
Bit7
Bit6
Bit3
Bit2
Bit1
Bit0
Details
(See 7.9)
(See 7.8.1)
R W
0x0000 -
0x0001
Product number (2 bytes)
Project number (2 bytes)
0x0002 -
0x0003
0x0004
0x0005
0x0006
Major version
Minor version
Bootloader status
0x0007 -
0x000A
Open (4 bytes)
0x000B
0x000C
Max touch column
Previous cycle time [ms]
Max touch row
PRESS
(See 3.5.5)
(See 4.1.1)
SWIPE SWIPE SWIPE SWIPE
SINGLE
_TAP
Gesture
Events 0
0x000D
0x000E
_AND_
HOLD
-
-
-
_Y-
_Y+
_X+
_X-
2_
FINGER_
TAP
Gesture
Events 1
SCROLL
-
-
-
-
ZOOM
ALP_
ALP_
ATI_
ERROR
REATI_
OCCUR
RED
System Info
0
SHOW_ REATI_
RESET OCCUR
RED
ATI_
ERROR
0x000F
CHARGING_MODE
TP_
MOVE-
MENT
TOO_
MANY_
FINGERS
System Info
1
SWITCH
_STATE
SNAP_
TOGGLE
RR_
MISSED
PALM_
DETECT
0x0010
0x0011
-
-
Number of fingers
(See 5.2.1)
0x0012 -
0x0013
Relative X [pixels] (2 bytes)
Relative Y [pixels] (2 bytes)
(See 5.2.2)
0x0014 -
0x0015
0x0016 -
0x0017
Absolute X position [pixels] (2 bytes)
Absolute Y position [pixels] (2 bytes)
Touch strength (2 bytes)
(See 5.2.3)
(See 5.2.4)
0x0018 -
0x0019
0x001A -
0x001B
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IQ Switch®
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E2
Address
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Details
R W
0x001C
Touch area / size
Repeat:
(See 5.2.5)
0x001D
:
Absolute X
Absolute Y
Touch strength
Touch area / size
0x0038
For fingers 2 - 5
0x0039 -
0x0058
Prox status (32 bytes)
0x0059 -
0x0076
Touch status (30 bytes)
Snap status (30 bytes)
Count values (300 bytes)
Delta values (300 bytes)
(See 8.10.5)
0x0077 -
0x0094
0x0095 -
0x01C0
(See 8.10.6)
(See 3.3.2)
0x01C1 -
0x02EC
0x02ED -
0x02EE
ALP count value (2 bytes)
ALP individual count values (20 bytes)
Reference values (300 bytes)
ALP LTA (2 bytes)
0x02EF -
0x0302
0x0303 -
0x042E
(See 8.10.6)
(See 3.4.2)
0x042F -
0x0430
ACK_
RESET
AUTO_
ATI
System
Control 0
ALP_
RESEED
RESEED
0x0431
0x0432
-
-
MODE_SELECT
System
Control 1
SUSPEND
-
-
-
-
-
RESET
0x0433 -
0x0434
Open (2 bytes)
0x0435 -
0x043E
ALP ATI compensation (10 bytes)
ATI compensation (150 bytes)
(See 3.6.2)
0x043F -
0x04D4
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IQ Switch®
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E2
Address
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Details
R W
0x04D5 -
0x56A
ATI C individual adjust (150)
(See 3.6.1)
0x056B
0x056C
-
-
-
-
Global ATI C
ALP ATI C
0x056D -
0x056E
ATI target (2 bytes)
(See 3.6.2)
0x056F -
0x0570
ALP ATI target (2 bytes)
0x0571
0x0572
0x0573
0x0574
Reference drift limit
ALP LTA drift limit
(See 3.7.2)
(See 3.7.3)
Re-ATI lower compensation limit
Re-ATI upper compensation limit
(See 3.3.3
and 3.7.2)
0x0575 -
0x0576
Max count limit (2 bytes)
Re-ATI retry time [s]
Open (2 bytes)
0x0577
(See 3.7.3)
0x0578 -
0x0579
0x057A -
0x057B
Report rate [ms] – Active mode (2 bytes)
Report rate [ms] – Idle touch mode (2 bytes)
Report rate [ms] – Idle mode (2 bytes)
Report rate [ms] – LP1 mode (2 bytes)
Report rate [ms] – LP2 mode (2 bytes)
0x057C -
0x057D
0x057E -
0x057F
(See 4.1)
0x0580 -
0x0581
0x0582 -
0x0583
0x0584
0x0585
0x0586
0x0587
Timeout [s] – Active mode
Timeout [s] – Idle touch mode
Timeout [s] – Idle mode
(See 4.2)
Timeout [x 20s] – LP1 mode
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IQ Switch®
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E2
Address
0x0588
0x0589
0x058A
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Details
(See 3.4.1)
(See 3.5.3)
(See 8.6)
R W
Reference update time [s]
Snap timeout [s]
I2C timeout [ms]
0x058B -
0x058D
Open (3 bytes)
SW_
INPUT_
EVENT
SW_
INPUT_
SELECT
ALP_
REATI
SW_
INPUT
System
Config 0
MANUAL_
CONTROL
SETUP_
COMPLETE
0x058E
0x058F
WDT
REATI
ALP_
PROX_
EVENT
SNAP_
EVENT
TP_
EVENT
System
Config 1
PROX_
EVENT
REATI_
EVENT
TOUCH_
EVENT
EVENT_
MODE
GESTURE
_EVENT
0x0590 –
0x0591
Open (2 bytes)
0x0592 -
0x0593
Snap threshold (2 bytes)
(See 3.5.3)
(See 3.5.1)
0x0594
0x0595
0x0596
0x0597
Prox threshold - trackpad
Prox threshold - ALP channel
Global touch multiplier - set
Global touch multiplier - clear
(See 3.5.2)
(See 3.7.2)
0x0598 -
0x062D
Individual touch multiplier adjustments (150 bytes)
Minimum count Re-ATI delta
0x062E
0x062F -
0x0631
Open (3 bytes)
ALP_
COUNT
_FILTER
Filter
Settings 0
IIR_
SELECT
MAV_
FILTER
IIR_
FILTER
0x0632
-
-
-
-
0x0633
0x0634
0x0635
0x0636
0x0637
XY static beta
ALP count beta
ALP1 LTA beta
ALP2 LTA beta
(See 5.9.2.2)
(See 3.3.2)
(See 3.4.2)
XY dynamic filter – bottom beta
(See 5.9.2.1)
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IQ Switch®
ProxSense® Series
E2
Address
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Details
R W
0x0638
XY dynamic filter– lower speed
0x0639 –
0x063A
XY dynamic filter– upper speed (2 bytes)
0x063B –
0x063C
Open (2 bytes)
0x063D
0x063E
Total Rx
Total Tx
(See 5.1.1)
(See 5.1.3)
0x063F -
0x0648
Rx mapping (10 bytes)
0x0649 -
0x0657
Tx mapping (15 bytes)
ALP Channel
Setup 0
RX_
GROUP
CHARGE
_TYPE
PROX_
REVERSE
0x0658
0x0659
0x065A
0x065B
0x065C
ALP
-
-
-
-
-
-
-
ALP_
RX9
ALP_
RX8
-
-
-
ALP Rx
Select
ALP_
RX7
ALP_
RX6
ALP_
RX5
ALP_
RX4
ALP_
RX3
ALP_
RX2
ALP_
RX1
ALP_
RX0
ALP_
TX14
ALP_
TX13
ALP_
TX12
ALP_
TX11
ALP_
TX10
ALP_
TX9
ALP_
TX8
-
ALP Tx
Select
ALP_
TX7
ALP_
TX6
ALP_
TX5
ALP_
TX4
ALP_
TX3
ALP_
TX2
ALP_
TX1
ALP_
TX0
Rx7/Tx2
Rx7/Tx9
Rx6/Tx3
Rx6/Tx10
Rx5/Tx4
Rx5/Tx11
Rx4/Tx5
Rx4/Tx12
Rx3/Tx6
Rx3/Tx13
Rx2/Tx7
Rx2/Tx14
Rx1/Tx8
-
Rx0/Tx9
-
0x065D
RxToTx
0x065E
0x065F
Open
Hardware
Settings A
RX_
FLOAT
-
-
-
ND
-
-
-
0
0
ANA_
DEAD_
TIME
INCR_
PHASE
Hardware
Settings B1
0x0660
CK_FREQ
-
-
Hardware
Settings B2
(ALP)
ANA_
DEAD_
TIME
INCR_
PHASE
0x0661
0x0662
-
CK_FREQ
-
Hardware
Settings C1
STAB_ TIME
OPAMP_BIAS
VTRIP
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IQ Switch®
ProxSense® Series
E2
Address
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Details
R W
Hardware
Settings C2
(ALP)
0x0663
STAB_ TIME
OPAMP_BIAS
UPLEN
VTRIP
Hardware
Settings D1
0x0664
0x0665
-
-
-
-
PASSLEN
PASSLEN
Hardware
Settings D2
(ALP)
UPLEN
0x0666 -
0x0668
Open (3 bytes)
SWITCH
_XY_
AXIS
PALM_
REJECT
0x0669
-
-
-
-
FLIP_Y FLIP_X XY Config 0
0x066A
0x066B
0x066C
0x066D
Max multi-touches
(See 5.3)
(See 5.7)
Finger split aggression factor
Palm reject threshold
(See 5.5)
(See 5.4)
Palm reject timeout [x 32ms]
0x066E -
0x066F
X Resolution [pixels] (2 bytes)
Y Resolution [pixels] (2 bytes)
0x0670 -
0x00671
0x0672
Stationary touch movement threshold [pixels]
Open (2 bytes)
(See 5.6)
0x0673 -
0x0674
0x0675 -
0x0676
Default read address (2 bytes)
(See 8.4.1)
(See 7.1)
0x0677 -
0x0678
Export file version number (2 bytes)
Prox
debounce
0x0679
0x067A
PROX_DB_SET
PROX_DB_CLEAR
SNAP_DB_
SET
TOUCH_DB_
SET
SNAP_DB_
CLEAR
TOUCH_DB_
CLEAR
Touch snap
debounce
0x067B -
0x0698
Active channels (30 bytes)
(See 8.10.5)
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IQ Switch®
ProxSense® Series
E2
Address
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Details
R W
0x0699 -
0x06B6
Snap enabled channels (30 bytes)
TAP_
AND_
HOLD
SWIPE SWIPE SWIPE SWIPE
SINGLE Single Finger
0x06B7
0x06B8
-
-
-
-
_TAP
_Y-
-
_Y+
-
_X+
-
_Y-
Gestures
2_
FINGER_
TAP
Multi Finger
Gestures
SCROLL
ZOOM
0x06B9 -
0x06BA
Tap time [ms] (2 bytes)
(see 6.1 and
6.4)
0x06BB -
0x06BC
Tap distance [pixels] (2 bytes)
Hold time [ms] (2 bytes)
0x06BD -
0x06BE
(see 6.2)
0x06BF -
0x06C0
Swipe initial time [ms] (2 bytes)
Swipe initial distance [pixels] (2 bytes)
Swipe consecutive time [ms] (2 bytes)
0x06C1 -
0x06C2
0x06C3 -
0x06C4
(see 6.3)
0x06C5 -
0x06C6
Swipe consecutive distance [pixels] (2 bytes)
Swipe angle [64tan(deg)]
0x06C7
0x06C8 -
0x06C9
Scroll initial distance [pixels] (2 bytes)
Scroll angle [64tan(deg)]
(see 6.5)
(see 6.6)
0x06CA
0x06CB -
0x06CC
Zoom initial distance [pixels] (2 bytes)
0x06CD -
0x06CE
Zoom consecutive distance [pixels] (2 bytes)
Open (1 byte)
0x06CF
8.10 Memory Map Bit / Register Definitions
The bit definitions for the registers in the memory map are explained in this section. Also
certain parameters that have a multiple number of bytes (registers) are also explained here.
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IQ Switch®
ProxSense® Series
8.10.1 Gesture Events 0
Gesture Events 0
Bit
7
-
6
-
5
4
3
2
1
0
Name
PRESS_
AND_
HOLD
SWIPE_
Y-
SWIPE_
Y+
SWIPE_
X+
SWIPE_
X-
SINGLE_
TAP
Bit 7-6:
Unused
Bit 5:
Bit 4:
Bit 3:
Bit 2:
Bit 1:
Bit 0:
SWIPE_Y-: Swipe in negative Y direction status
0 = No gesture
1 = Swipe in negative Y-direction occurred
SWIPE_Y+: Swipe in positive Y direction status
0 = No gesture
1 = Swipe in positive Y-direction occurred
SWIPE_X+: Swipe in positive X direction status
0 = No gesture
1 = Swipe in positive X-direction occurred
SWIPE_X-: Swipe in negative X direction status
0 = No gesture
1 = Swipe in negative X direction occurred
PRESS_AND_HOLD: Press and hold gesture status
0 = No gesture
1 = Press and hold occurred
SINGLE_TAP: Single tap gesture status
0 = No gesture
1 = Single tap occurred
8.10.2 Gesture Events 1
Gesture Events 1
Bit
7
-
6
-
5
-
4
-
3
-
2
1
0
Name
2_
ZOOM
SCROLL FINGER_
TAP
Bit 7-3:
Bit 2:
Unused
ZOOM: Zoom gesture status
0 = No gesture
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IQ Switch®
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1 = Zoom gesture occurred
Bit 1:
Bit 0:
SCROLL: Scroll status
0 = No gesture
1 = Scroll gesture occurred
2_FINGER_TAP: Two finger tap gesture status
0 = No gesture
1 = Two finger tap occurred
8.10.3 System Info 0
System Info 0
Bit
Name
7
6
5
4
3
2
1
0
ALP_
REATI_
OCCURR
ED
ALP_
ATI_
ERROR
REATI_
OCCURR
ED
SHOW_
RESET
ATI_
ERROR
CHARGING_MODE
Bit 7:
SHOW_RESET: Indicates a reset
0 = Reset indication has been cleared by host, writing to „Ack Reset‟ bit
1 = Reset has occurred, and indication has not yet been cleared by host
ALP_REATI_OCCURRED: Alternate Low Power channel Re-ATI status
0 = No Re-ATI
Bit 6:
Bit 5:
Bit 4:
Bit 3:
1 = Re-ATI has just completed on the alternate LP channel
ALP_ATI_ERROR: Alternate Low Power channel ATI error status
0 = Most recent ATI process was successful
1 = Most recent ATI process had errors
REATI_OCCURRED: Trackpad Re-ATI status
0 = No Re-ATI
1 = Re-ATI has just completed on the trackpad
ATI_ERROR: Error condition seen on latest ATI procedure
0 = Most recent ATI process was successful
1 = Most recent ATI process had errors
CHARGING_MODE: Indicates current mode
000 = Active mode
Bit 2-0:
001 = Idle-Touch mode
010 = Idle mode
011 = LP1 mode
100 = LP2 mode
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IQ Switch®
ProxSense® Series
8.10.4 System Info 1
System Info 1
Bit
Name
7
-
6
5
4
3
2
1
0
TOO_
MANY_
FINGERS
TP_
MOVE-
MENT
SWITCH
_STATE TOGGLE MISSED
SNAP_
RR_
PALM_
DETECT
-
Bit 7-6:
Unused
Bit 5:
Bit 4:
Bit 3:
Bit 2:
Bit 1:
Bit 0:
SWITCH_STATE: Status of input pin SW_IN
0 = SW_IN is LOW
1 = SW_IN is HIGH
SNAP_TOGGLE: Change in any snap channel status
0 = No change in any channels‟ snap status
1 = At least one channel has had a change in snap status
RR_MISSED: Report rate status
0 = Report rate has been achieved
1 = Report rate was not achieved
TOO_MANY_FINGERS: Total finger status
0 = Number of fingers are within the max selected value
1 = Number of fingers are more than the max selected
PALM_DETECT: Palm detect status
0 = No palm reject detected
1 = Palm reject has been detected
TP_MOVEMENT: Activity or movement on trackpad status
0 = No finger or no movement of fingers on trackpad
1 = Movement of finger(s) seen on trackpad
8.10.5 Individual Channel Status / Config Bit Definitions
For all status outputs or configuration parameters where one bit relates to one channel, the
structure is defined as shown in the tables below. Each row has a 16-bit value where the
status/config of each bit corresponds to the status/config of the corresponding column.
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IQ Switch®
ProxSense® Series
Table 8.2
Status Bytes
Data
Address
X
Status/Config [Row0] – High Byte
Status/Config [Row0] – Low Byte
Status/Config [Row1] – High Byte
Status/Config [Row1] – Low Byte
:
X+1
X+2
X+3
X+28
X+29
Status/Config [Row14] – High Byte
Status/Config [Row14] – Low Byte
*Note that the proximity status bits have two extra bytes appended to the end to include the
proximity status bit of the ALP channel. Its status is located at Bit0.
Table 8.3
High byte
Status/Config Bit Definitions
Low byte
-
-
-
-
-
-
Col9
Col8
Col7
Col6
Col5
Col4
Col3
Col2
Col1
Col0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Row Z
*Note that if the XY axes are switched, these registers do NOT switch. This means that the
bits will always link to Rxs, and the registers will always link to Txs.
For the example above the parameter shown in the grey box in the table above is associated
with the Zth Tx and the 6th Rx.
The bit definitions for these parameters are shown in the table below.
Table 8.4
Channel Status/Config Bit Definitions
Bit = 0 Bit = 1
Parameter
Prox status
Channel does not have a proximity
Channel does not have a touch
Channel does not have a snap
Channel disabled
Channel does have a prox
Channel does have a touch
Channel does have a snap
Channel enabled
Touch status
Snap status
Active channels
Snap enabled channels
Snap feature disabled on channel
Snap feature enabled on channel
8.10.6 Count / Delta / Reference Data
For the count, delta and reference values (2 bytes per channel), the structure is defined as
shown in the table below.
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IQ Switch®
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Table 8.5
Count / Delta / Reference Value Bytes
Byte
Data
Description
number
X
Count/Delta/Reference value[0][0] – High Byte
Count/Delta/Reference value[0][0] – Low Byte
Count/Delta/Reference value[0][1] – High Byte
Count/Delta/Reference value[0][1] – Low Byte
Count, delta or reference @
first Tx, and first Rx (thus top
left)
X+1
X+2
X+3
Count, delta or reference @
first Tx, and 2nd Rx
:
:
:
X+298
X+299
Count/Delta/Reference value[14][9] – High Byte
Count/Delta/Reference value[14][9] – Low Byte
Count, delta or reference @
last Tx, and last Rx (thus
bottom right)
8.10.7 System Control 0
System Control 0
Bit
7
6
-
5
4
3
2
1
0
Name
ACK_
RESET
AUTO_
ATI
ALP_
RESEED
RESEED
MODE_SELECT
Bit 7:
ACK_RESET: Acknowledge a reset
0 = nothing
1 = Acknowledge the reset by clearing SHOW_RESET bit
Bit 6:
Bit 5:
unused
AUTO_ATI: Run ATI algorithm
0 = nothing
1 = Run ATI algorithm (affected channels depending on current mode)
ALP_RESEED: Reseed alternate low power channel
0 = nothing
Bit 4:
1 = reseed the LTA of the alternate LP channel
RESEED: Reseed trackpad channels
0 = nothing
Bit 3:
1 = Reseed reference values of trackpad
MODE_SELECT: Select mode (only applies in Manual Mode)
000 = Active mode
Bit 2-0:
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IQ Switch®
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001 = Idle-Touch mode
010 = Idle mode
011 = LP1 mode
100 = LP2 mode
8.10.8 System Control 1
System Control 1
Bit
7
-
6
-
5
-
4
-
3
-
2
-
1
0
SUSPEND
Name
RESET
Bit 7-2:
Unused
Bit 1:
RESET: Reset the IQS5xx
0 = nothing
1 = Reset the device after the communication window terminates
SUSPEND: Suspend IQS5xx
Bit 0:
0 = nothing
1 = Place IQS5xx into suspend after the communication window terminates
8.10.9 System Config 0
System Config 0
Bit
7
6
5
4
3
2
1
0
Name
SW_
INPUT_
EVENT
SW_
INPUT_
SELECT
MANUAL_
CONTROL
ALP_
REATI
SW_
INPUT
SETUP_
COMPLETE
WDT
REATI
Bit 7:
MANUAL_CONTROL: Override automatic mode switching
0 = Modes are automatically controlled by IQS5xx
1 = Manual control of modes are handled by host
SETUP_COMPLETE: Device parameters are set up
0 = IQS5xx will remain in I2C setup window (no processing yet)
1 = Setup is complete, run auto-start procedure
WDT: Watchdog timer enable/disable
Bit 6:
Bit 5:
Bit 4:
0 = Watchdog is disabled (only disables after a reset)
1 = Watchdog is enabled
SW_INPUT_EVENT: Enable switch state change triggering event
0 = Toggle of SW_IN does not trigger an event
1 = Toggle of SW_IN triggers an event
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IQ Switch®
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Bit 3:
ALP_REATI: Enable/Disable automatic Re-ATI on alternate LP channel
0 = Re-ATI is disabled for alternate LP channel
1 = Re-ATI is enabled for alternate LP channel
REATI: Enable/Disable automatic Re-ATI on trackpad
0 = Re-ATI is disabled for alternate trackpad channels
1 = Re-ATI is enabled for alternate trackpad channels
SW_INPUT_SELECT: Select I/O polarity
0 = SW_IN is active LOW
Bit 2:
Bit 1:
1 = SW_IN is active HIGH
Bit 0:
SW_INPUT: Enable/disable the input switch function on pin SW_IN
0 = Input disabled
1 = Input enabled
8.10.10
System Config 1
System Config 1
Bit
Name
7
6
5
4
3
2
1
0
ALP_
PROX_
EVENT
PROX_
EVENT
TOUCH_
EVENT
SNAP_
EVENT
REATI_
EVENT
TP_
EVENT
GESTURE EVENT_
_EVENT
MODE
Bit 7:
PROX_EVENT: Enable proximity triggering event
0 = Toggle of proximity status does not trigger an event
1 = Toggle of proximity status triggers an event
TOUCH_EVENT: Enable touch triggering event
0 = Toggle of touch status does not trigger an event
1 = Toggle of touch status triggers an event
Bit 6:
Bit 5:
Bit 4:
Bit 3:
Bit 2:
SNAP_EVENT: Enable snap triggering event
0 = Toggle of snap status does not trigger an event
1 = Toggle of snap status triggers an event
ALP_PROX_EVENT: Enable alternate LP channel proximity triggering event
0 = Toggle of alternate channel proximity status does not trigger an event
1 = Toggle of alternate channel proximity status triggers an event
REATI_EVENT: Enable Re-ATI generating an event
0 = Re-ATI occurring does not trigger an event
1 = Re-ATI occurring triggers an event
TP_EVENT: Enable trackpad events
0 = Trackpad actions will not trigger event
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IQ Switch®
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1 = Trackpad actions trigger event
Bit 1:
Bit 0:
GESTURE_EVENT: Enable gesture events
0 = Gestures will not trigger event
1 = Gestures will trigger event
EVENT_MODE: Enable event mode communication
0 = I2C is presented each cycle
1 = I2C is only initiated when an enabled event occurs
Filter Settings 0
Bit
Name
7
-
6
-
5
-
4
3
2
1
0
ALP_
COUNT_
FILTER
IIR_
SELECT
MAV_
FILTER
IIR_
FILTER
-
Bit 7-4:
Unused
Bit 3:
ALP_COUNT_FILTER: Enable alternate LP channel count filtering
0 = Alternate LP channel counts are unfiltered
1 = Alternate LP channel counts are filtered
Bit 2:
IIR_SELECT: Select the IIR filtering method for the XY data points
0 = Damping factor for IIR filter is dynamically adjusted relative to XY movement
1 = Damping factor for IIR filter is fixed
MAV_FILTER: Enable moving averaging filter
0 = XY MAV filter disabled
Bit 1:
1 = XY MAV filter enabled
Bit 0:
IIR_FILTER: Enable IIR filter
0 = XY IIR filter disabled
1 = XY IIR filter enabled
8.10.11
Alternate Channel Setup
ALP Channel Setup 0
Bit
7
6
5
4
3
-
2
-
1
-
0
-
Name CHARGE
_TYPE
RX_
GROUP
PROX_
REVERSE
ALP
Bit 7:
CHARGE_TYPE: Charge type selection
0 = Projected capacitive charging
1 = Self capacitive charging
Bit 6:
RX_GROUP: Select Rx group
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IQ Switch®
ProxSense® Series
0 = Rx group A
1 = Rx group B
Bit 5:
PROX_REVERSE: Enable reverse proximity sensing
0 = Allow proximity to only trigger in conventional direction (positive for
projected, negative for self capacitive)
1 = Proximity detects change in counts in both directions
ALP: Enable alternate low power channel
0 = LP1 and LP2 use trackpad channels
1 = LP1 and LP2 use alternate channel configuration
Unused
Bit 4:
Bit 3-0:
8.10.12
ALP Rx select
Bit Z:
ALP_RxZ: Select Rx for alternate low power channel
0 = RxZ is not part of ALP channel
1 = RxZ is part of ALP channel
8.10.13
ALP Tx select
Bit Z:
ALP_TxZ: Select Tx for alternate low power channel
0 = TxZ is not part of ALP channel
1 = TxZ is part of ALP channel
RxToTx
8.10.14
RxToTx(1)
Bit
7
6
5
4
3
2
1
Rx1/Tx8
0
0
Rx0/Tx9
0
IQS525
IQS572
Rx7/Tx2
Rx6/Tx3
Rx5/Tx4
Rx4/Tx5
Rx3/Tx6
Rx2/Tx7
Rx7/Tx9 Rx6/Tx10 Rx5/Tx11 Rx4/Tx12 Rx3/Tx13 Rx2/Tx14
Bit 7-0:
Rx/Tx: Change an Rx electrode to a Tx electrode
0 = Activate indicated Rx
1 = Activate indicated Tx
1: This register is only available on the IQS572 and IQS525 firmware
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IQ Switch®
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8.10.15
Hardware Settings A
Hardware Settings A
Bit
Name
7
-
6
-
5
4
-
3
-
2
1
0
0
0
RX_
FLOAT
ND
Bit 7-6:
Unused
Bit 5:
ND: Enable hardware noise detection
0 = noise detect disabled
1 = noise detect enabled
Unused
Bit 4-3:
Bit 2:
RX_FLOAT: Select Rx status when inactive
0 = Rx is grounded when inactive
1 = Rx is floating when inactive
Internal use, set to 0
Bit 1-0
8.10.16
Hardware Settings B
Hardware Settings B
Bit
Name
7
-
6
5
4
3
-
2
-
1
0
ANA_
DEAD_
TIME
INCR_
PHASE
CK_FREQ
Bit 7:
Unused
Bit 6-4:
CK_FREQ: Configure Prox module clock source
000 = 125kHz
001 = 250kHz
010 = 500kHz
011 = 1MHz
100 = 2MHz
101 = 4MHz
110 = 8MHz
111 = 16MHz
Unused
Bit 3-2:
Bit 1:
ANA_DEAD_TIME: Analog dead time between up and pass phase
0 = Analog dead time disabled (dead time is half a prox clock cycle)
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IQ Switch®
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1 = Analog dead time enabled (dead time is ~10ns, and UP increased by one
cycle)
Bit 0:
INCR_PHASE: Increase the phase length of UP and PASS
0 = Phase (UP / PASS) not incremented
1 = Phase (UP / PASS) increased by one half of a prox clock cycle
Hardware Settings C
8.10.17
Hardware Settings C
Bit
Name
Bit 7-6:
7
6
5
4
3
2
1
0
STAB_ TIME
OPAMP_BIAS
VTRIP
STAB_TIME: Stabilisation time after module power-on before conversion starts
00 = 1.7ms
01 = 500us
10 = 120us
11 = no not use
Bit 6-4:
OPAMP_BIAS: Opamp bias strength
00 = 2.5uA
01 = 5uA
10 = 7.5uA
11 = 10uA
Bit 3-0:
VTRIP: Charge transfer trip voltage
Trip voltage = [0.5 + (VTRIP x 0.0267)] x Vreg
Hardware Settings D
8.10.18
Hardware Settings D
Bit
Name
Bit 7:
7
-
6
5
4
3
-
2
1
0
UPLEN
PASSLEN
Unused
Bit 6-4:
Bit 3:
UPLEN: Length of UP phase
Unused
Bit 2-0:
PASSLEN: Length of PASS phase
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IQ Switch®
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8.10.19
XY Config 0
XY Config 0
Bit
Name
7
-
6
-
5
-
4
-
3
2
1
0
SWITCH
_XY_
AXIS
PALM_
REJECT
FLIP_Y
FLIP_X
Bit 7-4:
Unused
Bit 3:
PALM_REJECT: Enable palm reject sensing and suppression
0 = Large fingers (palms) are allowed
1 = Large fingers (palms) will block XY outputs.
SWITCH_XY_AXIS: Switch X and Y outputs
Bit 2:
0 = Columns Rx0-Rx9 gives change in X, rows Tx0-Tx14 gives change in Y
1 = Columns Tx0-Tx14 gives change in X, rows Rx0-Rx9 gives change in Y
FLIP_Y: Flip Y output values
Bit 1:
0 = Keep default Y values
1 = Invert Y output values
Bit 0:
FLIP_X: Flip X output values
0 = Keep default X values
1 = Invert X output values
8.10.20
Single Finger Gestures
Single Finger Gestures
Bit
Name
7
-
6
-
5
4
3
2
1
0
PRESS_
AND_
HOLD
SWIPE_
Y-
SWIPE_
Y+
SWIPE_
X+
SWIPE_
Y-
SINGLE_
TAP
Bit 7-6:
Unused
Bit 5:
Bit 4:
Bit 3:
SWIPE_Y-: Swipe in negative Y direction
0 = Gesture disabled
1 = Gesture enabled
SWIPE_Y+: Swipe in positive Y direction
0 = Gesture disabled
1 = Gesture enabled
SWIPE_X+: Swipe in positive X direction
0 = Gesture disabled
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1 = Gesture enabled
Bit 2:
SWIPE_X-: Swipe in negative X direction
0 = Gesture disabled
1 = Gesture enabled
Bit 1:
PRESS_AND_HOLD: Press and hold gesture
0 = Gesture disabled
1 = Gesture enabled
Bit 0:
SINGLE_TAP: Single tap gesture
0 = Gesture disabled
1 = Gesture enabled
8.10.21
Multi-finger Gestures
Multi-finger Gestures
Bit
Name
7
-
6
-
5
-
4
-
3
-
2
1
0
2F_
TAP
ZOOM
SCROLL
Bit 7-3:
Unused
Bit 2:
Bit 1:
Bit 0:
ZOOM: Zoom gestures
0 = Gestures disabled
1 = Gestures enabled
SCROLL: Scroll gestures
0 = Gestures disabled
1 = Gestures enabled
2F_TAP: Two finger tap gesture
0 = Gesture disabled
1 = Gesture enabled
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IQ Switch®
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9 Circuit Diagram
Supply
Voltage
Tx14
PGM
SW_IN
N/C
1
2
3
4
5
6
7
8
9
36 Tx3
35 Tx2
34 Tx1
Transmitters
and
receivers
to
33 Tx0
SDA
32 Rx9B
31 Rx9A
30 Rx8B
29 Rx8A
28 Rx7B
27 Rx7A
26 Rx6B
25 Rx6A
SCL
touchscreen
VDDHI
VSS
Digital
Interface
(i2c)
VREG
NRST 10
RDY 11
N/C 12
Figure 9.1 IQS550 Overview Diagram
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Supply
Voltage
N/C 1
21 TX3
SDA 2
SCL 3
20 TX2
19 TX1
Digital
Interface
(i2c)
VDDHI 4
VSS 5
18 TX0
Transmitters
and
receivers
to trackpad /
touchscreen
17 RX7 / TX9
16 RX6 / TX10
15 RX5 / TX11
VREG 6
NRST 7
Figure 9.2 IQS572 Overview Diagram
Supply
Voltage
N/C 1
SDA 2
21 PD3
20 PD2
SCL 3
19 TX0
Digital
Interface
(i2c)
VDDHI 4
VSS 5
18 TX1
Transmitters
and
receivers
to trackpad /
touchscreen
17 RX7 / TX2
16 RX6 / TX3
15 RX5 / TX4
VREG 6
NRST 7
Figure 9.3 IQS525 Overview Diagram
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Figure 9.4 IQS550 Application Circuit
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Figure 9.5 IQS572 Application Circuit
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Figure 9.6 IQS525 Application Circuit
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IQ Switch®
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10 Electrical Characteristics
10.1Absolute Maximum Ratings
Exceeding these maximum ratings may cause permanent damage to the device.
Table 10.1 Voltage Characteristics
Symbol
Rating
Min
Max
Unit
VDDHI
VSS
-
External supply voltage
-0.3
4.0
Receiver channel pins (Rx0A...Rx9B)
VSS–0.3
VSS–0.3
VSS–0.3
VREG (-1.55)
4.0
Input voltage on transmit pins
(Tx0...Tx14))
PXS off
V
VIN
PXS
on(1)
VREG (-1.55)
Input voltage on any pin(2)
VSS–0.3
4.0
1. If the ProxSense® peripheral is on, no injection must be performed on any pin having the transmit
function (Tx) as an alternate function, even if this alternate function is not specified
2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN
maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A
positive injection is induced by VIN>VDDHI while a negative is induced by VIN<VSS.
Table 10.2 Current Characteristics
Symbol
IVDDHI
IVSS
Rating
Max.
80
Unit
Total current into VDDHI power line (source)
Total current out of VSS ground line (sink)
Output current sunk by any other I/O and control pin
Output current source by any I/Os and control pin
Injected current on any pin(2)
80
25
IIO
mA
-25
±5
(1)
IINJ(PIN)
(1)
∑ IINJ(PIN)
Total injected current (sum of all I/O and control pins)(2)
±25
1. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN
maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A
positive injection is induced by VIN>VDDHI while a negative injection is induced by VIN<VSS. For true
open-drain pads, there is no positive injection current, and the corresponding VIN maximum must
always be respected.
2. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum
of the positive and negative injected currents (instantaneous values). These results are based on
characterization with ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
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Table 10.3 Thermal Characteristics
Symbol
TSTG
TJ
Rating
Max.
-65 to +150
150
Unit
Storage temperature range
Maximum junction temperature
°C
10.2Operating Conditions
10.2.1 General Operating Conditions
Table 10.4 General Operating Conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
1.65V ≤ VDDHI
≤3.6V
16
(1)
fMASTER
Master clock frequency
-
-
MHz
Standard operating
voltage
-
-
-
-
VDDHI
-
-
1.65
-
3.6
625
85
V
mW
°C
Power dissipation at TA
= 85°C
(2)
PD
1.65V ≤ VDDHI
≤3.6V
TA
TJ
Temperature range
-40
-40
Junction temperature
range
-40°C ≤ VDDHI ≤
105
°C
85°C
1. fMASTER = fCPU
2. To calculate PDmax(TA) use the formula given in thermal characteristics PDmax=(TJmax −TA)/θJA with
TJmax in this table and θJA in Table 10.15.
10.2.2 Power-up / Power-down Operating Conditions
Table 10.5 Operating Conditions at Power Up / Down
Symbol
tVDDHI
tTEMP
Parameter
Conditions
Min
20
Typ
Max
1300
-
Unit
µs/V
Ms
V
VDDHI rise time rate
-
1
-
Reset release decay
Power on reset threshold
Power down reset threshold
VDDHI rising
-
VPOR
1.44
1.30
1.65(1)
1.60(2)
VPDR
-
V
1. Tested in production
2. Data based on characterisation results, not tested in production.
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10.2.3 Supply Current Characteristic
Table 10.6 Current Consumption(1)
Symbol
Parameter
Conditions
Typ
Max
Unit
IDD(CORE)
Run current for processor core
16MHz master frequency
(TA = -40 °C to 85 °C)
2.8
3.5
mA
IDD(LP STATE)
Supply current in low-power
sleep state (which is added to
cycle time to obtain desired
report rate)
TA = -40 °C to 25 °C
TA = 85 °C
1
2
uA
uA
1.4
3.2
IDD(SUSPEND)
Supply current in suspend state
TA = -40 °C to 25 °C
TA = 85 °C
0.4
1
1.2
2.5
uA
uA
1. Data based on characterisation results, unless otherwise specified.
10.2.4 ProxSense® Current Consumption
The break-down of the consumption from the ProxSense peripheral is shown below.
Table 10.7 ProxSense® Current Consumption(1)
Symbol
ProxSense transmitter (Tx)
ProxSense receiver (Rx)
Typ
0.6
1.1
2.3
Unit
mA
mA
mA
IDD(PXS)
1
1
1
1
4
10
1. Data based on characterisation results, unless otherwise specified.
10.2.5 Expected Total Current Consumption Scenarios
The specific parameters configured on varying designs have a great impact on the obtained
current consumption. Due to this, the following table is purely illustrative of the expected
consumption for similar configurations. The device configurations used below are examples of
practical setups expected in applications.
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Table 10.8 Total Current Consumption(1)
Current (Typ)
Report Rate
Symbol
Sensors
Unit
IQS550
3.75
2.52
1.9
IQS572
2.73
1.85
1.38
690
346
174
89
IQS525
1.46
0.99
0.74
370
185
96
Trackpad(2)
Trackpad(2)
Trackpad(2)
Trackpad(2)
Trackpad(2)
Trackpad(2)
Trackpad(2)
Trackpad(2)
ALP(3)
10ms
15ms
mA
mA
mA
uA
uA
uA
uA
uA
uA
uA
uA
uA
uA
uA
uA
uA
uA
uA
uA
uA
20ms
40ms
975
483
243
121
67
80ms
160ms
320ms
640ms
80ms
48
55
26
48
ALP(3)
160ms
320ms
640ms
80ms
25
IDD(Total)
ALP(3)
13
ALP(3)
7
ALP(4)
43
ALP(4)
160ms
320ms
640ms
80ms
22
ALP(4)
12
ALP(4)
7
ALP(5)
41
ALP(5)
160ms
320ms
640ms
21
ALP(5)
12
ALP(5)
6
1. Based on bench measurements, not characterised
2. Tested with maximum number of sensors active (IQS550 – 15x10 / IQS572 – 9x8 / IQS525 – 5x5);
ATI Target of 500 counts; Max number of multi-touches = 2 / default hardware (conversion) settings /
1 finger touch (8mm diameter) active / streaming 27 bytes (XY data and gestures) / I2C pull-ups of
4.7kΩ / VDDHI = 3.3V
3. Tested with ALP channel configured in projected capacitive mode; ATI Target of 500; Alternating Txs
enabled, all Rxs enabled; Event-Mode enabled
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4. Tested with ALP channel configured in projected capacitive mode; ATI Target of 500; All Txs
enabled, single Rxs around trackpad enabled; Event-Mode enabled
5. Tested with ALP channel configured in self capacitive mode; ATI Target of 800; single Rx enabled;
Event-Mode enabled
10.2.6 I/O Port Pin Characteristics
General characteristics
Subject to general operating conditions for VDDHI and TA unless otherwise specified. All
unused pins must be kept at a fixed voltage: using the output mode of the I/O for example or
an external pull-up or pull-down resistor.
Table 10.9 Standard I/O Static Characteristic (1) (2)
Symbol
VIL
Parameter
Conditions
Standard I/Os
Standard I/Os
Min.
Typ.
Max.
Unit
Input low level voltage(3)
Input high level voltage(3)
VSS-0.3
-
-
0.3VDDHI
V
VIH
0.7
VDDHI
VDDHI
+0.3
Vhys
Schmitt trigger voltage
hysteresis(4)
Standard I/Os
-
200
-
-
1
mV
uA
IIkg
Input leakage current(5)
VSS ≤ VIN ≤ VDDHI
Standard I/Os
-1
-1
30
-
(6)
VSS ≤ Vin ≤ VREG
-
1
Rx, Tx I/Os
RPU
Weak pull-up equivalent
resistor(7)
VIN = VSS
45
5
60
-
kΩ
(8)
CIO
I/O pin capacitance
pF
1. VDDHI = 3.0 V, TA = -40 to 85°C unless otherwise specified.
2. Not applicable to Rx and Tx pins.
3. Data based on characterisation results, not tested in production.
4. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not
tested.
5. The maximum value may be exceeded if negative current is injected on adjacent pins.
6. VIN must not exceed VREG value if ProxSense® is enabled, even on port B and D (Tx), VREG = 1.55V.
7. RPU pull-up equivalent resistor based on a resistive transistor (corresponding IPU current
characteristics)
8. Data guaranteed by design, not tested in production
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10.2.7 Output Driving Current
Subject to general operating conditions for VDDHI and TA unless otherwise specified.
Table 10.10 Output Driving Current (high sink ports)
I/O type
Symbol
Parameter Conditions
Conditions
Min. Max. Unit
IIO = +2mA,
VDDHI = 1.8V
-
0.45
IIO = +2mA,
VDDHI = 3.0V
-
-
0.45
(1)
VOL
Output low level voltage for an I/O pin
IIO = +10mA,
VDDHI = 3.0V
0.7
Standard
IIO = -1mA,
VDDHI
-
VDDHI = 1.8V -0.45
V
Output high level voltage for an I/O
pin
IIO = -1mA,
VDDHI = 3.0V -0.45
VDDHI
-
(2)
VOH
IIO = -10mA,
VDDHI = 3.0V
VDDHI
-0.7
-
ProxSense
I/O
VOL
VOH
VOH
Output low level voltage for Tx and Rx
ProxSense I/Os
IRX = TBD
ITX = 1mA
-
TBD
Output high level voltage for Tx
ProxSense I/O
1.45
1.35
-
-
Output high level voltage for Rx
ProxSense I/O
IPXS_RX
=
0.5mA
1. The IIO current sunk must always respect the absolute maximum rating and the sum of IIO (I/O ports
and control pins) must not exceed IVSS
2. The IIO current sourced must always respect the absolute maximum rating and the sum of IIO (I/O
ports and control pins) must not exceed IVDDHI
.
.
10.2.8 NRST Pin
The NRST pin input driver is CMOS. A permanent pull-up is present, thus an external
component is not needed if NRST is unconnected in the design.
Subject to general operating conditions for VDDHI and TA unless otherwise specified.
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Table 10.11 NRST Pin Characteristics
Symbol
VIL(NRST)
VIH(NRST)
Parameter
Conditions
Min.
VSS
1.4
-
Typ.
Max.
0.8
Unit
NRST Input low level voltage(1)
NRST Input high level voltage(1)
-
-
-
V
VDDHI
VDDHI
0.8
-
VOL(NRST)
NRST Output low level voltage
IOL = 2mA
RPU(NRST)
VF(NRST)
tOP(NRST)
VNF(NRST)
NRST pull-up equivalent resistor(2)
NRST input filtered pulse(3)
NRST output pulse width
30
-
45
-
60
50
-
kΩ
20
300
-
ns
NRST input not filtered pulse(3)
-
-
1. Data based on characterization results, not tested in production.
2. The RPU pull-up equivalent resistor is based on a resistive transistor.
3. Data guaranteed by design, not tested in production.
The reset network shown in Figure 10.1 protects the device against parasitic resets. The user
must ensure that the level on the NRST pin can go below the VIL max. level specified in Table
10.11. Otherwise the reset is not taken into account internally.
Figure 10.1 Recommended NRST Pin Configuration
10.2.9 I2C Characteristics
Subject to general operating conditions for VDDHI, fMASTER, and TA unless otherwise specified.
The IQS5xx I2C interface meets the requirements of the Standard I2C communication protocol
described in the following table with the restrictions mentioned below.
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Table 10.12 I2C Characteristics
Standard I2C
(100kHz)
Fast I2C
(400kHz)
Symbol
Parameter
Unit
Min(1)
4.7
4.0
250
0(2)
-
Max(1)
Min(1)
Max(1)
tw(SCLL)
tw(SCLH)
tsu(SDA)
th(SDA)
tr(SDA)
tr(SCL)
tf(SDA)
tf(SCL)
SCL clock low time
SCL clock high time
SDA setup time
-
1.3
0.6
100
0
-
-
µs
µs
ns
ns
ns
ns
ns
ns
µs
µs
µs
pF
-
-
-
-
SDA data hold time
900(2)
300
300
300
300
-
SDA rise time
1000
1000
300
300
-
-
SCL rise time
-
-
SDA fall time
-
-
SCL fall time
-
-
th(STA)
tsu(STA)
tsu(STO)
Cb
START condition hold time
Repeated START condition setup time
STOP condition setup time
Capacitive load for each bus line
4.0
4.7
4.0
-
0.6
0.6
0.6
-
-
-
-
-
400
400
1. Data based on protocol requirement, not tested in production
Figure 10.2 Typical Bus Application and Timing Diagram
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10.2.10
10.2.11
Package Moisture Sensitivity
Table 10.13 Moisture Sensitivity Level (MSL)
Parameter
IQS550
IQS572
IQS525
Package Moisture Sensitivity Level (MSL)
3
3
3
Electrostatic Discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied
to the pins of each sample according to each pin combination. The sample size depends on
the number of supply pins in the device (3 parts*(n+1) supply pin). Two models can be
simulated: human body model and charge device model. This test conforms to the JESD22-
A114A/A115A standard.
Table 10.14 ESD Absolute Maximum Ratings
Symbol
Ratings
Conditions
Max Value
Unit
Electrostatic
discharge voltage
(human body model)
VESD(HBM)
2000(2)
TA = +25 °C
V
Electrostatic
discharge voltage
(charge device
model)
VESD(CDM)
1000
1. Data based on characterisation results, not tested in production.
2. Device sustained up to 3000 V during ESD trials.
10.2.12
Thermal Characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in Table 10.4.
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using the
following equation:
TJmax = TAmax + (PDmax x θJA)
Where:
● TAmax is the maximum ambient temperature in °C
● θJA is the package junction-to-ambient thermal resistance in °C/W
● PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax
● PINTmax is the product of IDD and VDDHI, expressed in watts. This is the maximum chip internal power.
PI/Omax represents the maximum power dissipation on output pins
)
●
where:
PI/Omax = Σ (VOL*IOL) + Σ((VDDHI −VOH)*IOH), taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low
and high level in the application.
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Table 10.15 Thermal Characteristics(1)
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction ambient
32
°C/W
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment.
10.2.13
ProxSense Electrical Characteristics
Table 10.16 Rx / Tx Characteristics
Symbol
Parameter
Conditions IQS550 IQS572 IQS525 Unit
CRG
Rx capacitance to
ground
60
60
4
pF
pF
pF
kΩ
kΩ
kΩ
kΩ
CTG
CM
Tx capacitance to
ground
60
40
Mutual capacitance
between Rx and Tx
16MHz
Prox Clock
2
Rrx
Rtx
Total Rx resistance
Total Tx resistance
4MHz Prox
Clock
20
2
16MHz
Prox Clock
4MHz Prox
Clock
20
Data based on characterisation results, not tested in production.
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11 Mechanical Dimensions
11.1IQS550 QFN(7x7)-48 Mechanical Dimensions
P
1
48
B
Tt
Z
W
Wt
A
Area „Z‟
H
1
Tp
48
r
Pin 1 corner
C 0.5 x 45°
T
Figure 11.1 QFN(7x7)-48 Package
Table 11.1 Dimensions from Figure 11.1
Dimension (mm)
Dimension (mm)
Label
Label
Min
Typical
0.500
0.400
0.250
5.600
5.500
Max
Min
Typical
0.550
7.00
Max
P
T
H
A / B
Tp
r
0.500
6.900
0.600
7.100
0.300
0.200
5.500
5.400
0.500
0.300
5.700
5.600
W
Tt
Wt
0.152
0.125
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IQ Switch®
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11.2IQS550 Landing Pad Layout
H
48 47 46 45 44 43 42 41 40 39 38 37
1
2
36
35
34
33
32
31
30
29
28
27
26
25
X
3
W
4
5
6
Y1 Y2
7
8
9
49 (*Note1)
Y
g
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
P
X3
X1
X2
Figure 11.2 QFN(7x7)-48 Footprint
Table 11.2 Dimensions from Figure 11.2
Label
X
Dimension (mm)
Label
Y2
H
Dimension (mm)
5.60
6.20
7.30
5.80
5.60
6.20
7.30
0.55
0.30
0.20
0.50
X1
X2
X3
Y
W
g
P
Y1
*Note1: It is recommended to connect and solder this back-side pad to PCB ground.
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IQ Switch®
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11.3IQS572/IQS525 QFN(4x4)-28 Mechanical Dimensions
Figure 11.3 QFN(4x4)-28 Package
Table 11.3 Dimensions from Figure 11.3
Dimension (mm)
Dimension (mm)
Label
Label
Min
0.5
Typical
0.55
0
Max
0.6
Min
0.3
Typical
0.4
Max
0.5
A
A1
D
L
L1
T
-0.05
3.9
0.05
4.1
0.25
0.35
0.152
0.25
0.5
0.45
4.0
D1
E
2.9
3.0
3.1
b
0.2
0.3
3.9
4.0
4.1
e
E1
2.9
3.0
3.1
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IQ Switch®
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11.4IQS572/IQS525 Landing Pad Layout
Figure 11.4 QFN(4x4)-48 Footprint (dimensions in millimetres)
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12 Packaging Information
12.1Tape Specification
The IQS5xx products come packaged in a carrier tape on a reel. The carrier tape has a leader
and trailer section where no products are populated. A 400mm (min) section at the start of the
carrier tape is empty (leader part). The cover tape starts in this leader part and covers a
100mm (min) of carrier tape that has no products. From there the products are consecutively
populated in the carrier tape. The trailer of 160mm (min) has no products.
Figure 12.1 Representation of Leader and Trailer for the Carrier Tape
Table 12.1 Tape Dimensions
Measurement (mm)
Description
IQS550
IQS572
IQS525
12
Tape width
Part pitch
16
12
12
8
8
Sprocket hole diameter
Sprocket hole pitch
Cavity length
1.5
4
2
2
4
4
7.2
7.2
1.2
13
5.3
5.3
1.1
9.5
5.3
5.3
1.1
9.5
Cavity width
Cavity depth
Cover tape width
Please note: Cover tape does not cover the sprocket holes.
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12.1.1 IQS550 Tape Description
Azoteq logo
and name
IQS550 chip name
Pin 1 corner
indicator
Sprocket holes
Figure 12.2 IQS550 QFN48-7x7 Package in Carrier Tape Example
The IQS550 is packed in a carrier tape as shown above and placed on the reel. It fits in a long
carrier tape that is moulded specifically for this product and a removable see-through cover
tape is placed over. This cover can be peeled off and the product taken out of the tape with a
pick-and-place machine. The Pin 1 corner indicator is closest to a side facing the sprocket
holes in the carrier tape as illustrated.
12.1.2 IQS572 and IQS525 Tape Description
The IQS525 & IQS572 share the same tape and reel details, with an example of the IQS525
tape provided here.
Pin 1 corner
indicator
IQS525
chip name
Sprocket
holes
Figure 12.3 IQS525 QFN28-4x4 Package in Carrier Tape Example
Again the Pin 1 corner indicator is closest the side facing the sprocket holes in the carrier tape
as illustrated.
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12.2 Reel Specification
The reel is made from a high impact PS material. The physical dimensions are illustrated in
the table and figure below.
Figure 12.4 Reel Dimensions: Front and Side View
Table 12.2 Reel Dimensions
Value (in mm)
Dimension
IQS550
330 (max)
1.5 (min)
13 ±0.2
IQS572
330 (max)
1.5 (min)
IQS525
330 (max)
1.5 (min)
A
B
C
D
N
G
T
13 ±0.2
13 ±0.2
20.2 (min)
60
20.2 (min)
60
20.2 (min)
60
16.4 + 2/-0
22.4 (max)
12.4 + 2/-0mm
18.4mm (max)
12.4 + 2/-0mm
18.4mm (max)
Note: The reel could also have additional cut-outs not illustrated in the figure
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IQ Switch®
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12.2.1 Dry Packing
The IQS5xx is specifically dry packed to protect them from moisture absorption while
shipping/storing which has a large effect on the quality and reliability of the IQS5xx after
soldering. To improve the quality and reliability of soldering joints, it is advised to bake the
IQS5xx before reflow soldering.
Below is a flow diagram which shows how Azoteq aims to minimise moisture absorption during
shipping and storage. On the right side is a flow diagram specific for the customer to consult
whether baking is needed.
Figure 12.5 Moisture Absorption Control Method / Guide
The flow diagram above informs the customer whether the baking process is needed. When
opening the dry pack consult the humidity indicator (gel) inside the pack. If it turned pink, the
product must be baked. If the gel is not pink, within the specified period there is no need for
baking, as long as the humidity and temperature conditions are met.
12.2.2 Baking
The IQS5xx is packed in a tape and reel and can thus not be baked. It must first be transferred
to a non-metal tube or tray, for example a glass tray. This is placed in an oven and baked
according to the IPC/JEDEC J-STD-033C MSL specification. A picture of this baking method
is shown below.
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IQ Switch®
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Figure 12.6 IQS550 Baking Example
Take the IQS5xx out of the carrier tape and place on for example a glass sheet. Ensure all the
IQS5xx‟s are turned top side up and not lying on top of each other. Bake the product for 24
hours at 125 0C. Remove from oven and let cool for about 1 hour before handling.
12.3Handling of the IQS5xx
When handling the IQS5xx product, ESD (Electrostatic discharge) must be avoided as far as
possible. Make sure all equipment and personnel are grounded to avoid static build-up.
Machines should be grounded and personnel should wear grounding straps.
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12.4Reflow for IQS5xx
When soldering the IQS5xx to a board, the correct temperature curve must be followed to
ensure good soldering joints and to avoid damaging the chip due to high temperatures.
Figure 12.7 Reflow Temperature Curve for the IQS5xx
The figure above shows the temperature profile to be used when soldering the IQS5xx onto a
board. This is according to the JEDEC (J-STD-020D.1) standard lead-free reflow profile.
Table 12.3 JEDEC Standard Lead-Free Reflow Profile
Symbol
Description
Average ramp-up rate
Temperature min
Temperature max
Preheat time
Value
3 0C/second max
150 0C
TSmax to TP
TSmin
TSmax
ts
200 0C
60 – 120 seconds
217 0C
TL
Temperature
tL
Time maintained above
temperature TL
60 – 150 seconds
TP
tP
Peak/classification temperature
260 0C
Time within 5 0C of actual peak
temperature (TP)
30 seconds
Ramp-down rate
6 0C/second max
8 minutes max
t25C to tP
Time: 25 0C to peak temperature
All temperatures refer to topside of the package, measured on the body surface.
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IQ Switch®
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13 Device Marking
13.1IQS550 Marking
A
B
C
D
E
F
G
H
I
=
=
=
=
=
=
=
=
=
=
IC Name
Assembly Plant
Internal use
Internal use
Country of Origin
Assembly Year
Assembly Week
Dot – Pin1 reference
Internal use
J
Design Revision
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IQ Switch®
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13.2IQS572/IQS525 Marking
A
B
D
C
E
F
G
H
A
B
C
D
E
F
=
=
=
=
=
=
=
=
IC Name
Assembly Plant
Internal use
Internal use
Country of Origin
Assembly Date
G
H
Additional Information including Design Revision Code
Dot – Pin1 reference
14 Ordering Information
Order quantities will be subject to multiples of full reels. For large orders, Azoteq can provide
custom configured devices.
14.1 IQS550 Ordering
zz
IQS550
QN R
IC NAME
BULK PACKAGING
PACKAGE TYPE
CONFIGURATION CODE
IC NAME
IQS550
=
=
IQS550
CONFIGURATION CODE BL
Bootloader (ready for application firmware
programming, B000 firmware NOT pre-loaded)
PACKAGE TYPE
QN
R
=
=
QFN(7x7)-48
BULK PACKAGING
Reel (2500pcs/reel)
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14.2 IQS572 Ordering
zz
IQS572
QN R
IC NAME
BULK PACKAGING
PACKAGE TYPE
CONFIGURATION CODE
IC NAME
IQS572
=
=
IQS572
CONFIGURATION CODE BL
Bootloader (ready for application firmware
programming, B000 firmware NOT pre-loaded)
PACKAGE TYPE
QN
R
=
=
QFN(4x4)-28
BULK PACKAGING
Reel (3000pcs/reel)
14.3IQS525 Ordering
zz
IQS525
QN R
IC NAME
BULK PACKAGING
PACKAGE TYPE
CONFIGURATION CODE
IC NAME
IQS525
=
=
IQS525
CONFIGURATION CODE BL
Bootloader (ready for application firmware
programming, B000 firmware NOT pre-loaded)
PACKAGE TYPE
QN
R
=
=
QFN(4x4)-28
BULK PACKAGING
Reel (3000pcs/reel)
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IQ Switch®
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Changes:
Release v1.00
IQS5xx-B000 datasheet released
Release v1.01
Added ‘Minimum count Re-ATI delta„ to memory map, and updated Section 3.7.2.
Updated links (Sections 4.3 and 8.8.2)
Release v2.00
Updated wake pin functionality and changed terminology from wake to switch input:
Updated section 7.3.2 and 8.8.1, added SWITCH_STATE bit, added SW_INPUT_EVENT
bit, Added section 7.11
Added export file version: Updated Section 7.1 and memory map
Updated Note 2 in Table 10.8 (525 setup added and ATI target fixed)
Fixed heading of Table 2.3
Updated Figure 11.4
Updated RxToTx register to include IQS572 (memory map also updated), and updated
Section 5.1.4
Added Section 7.9 and 7.10
Updated Section 8.8.1 with updated trackpad event definition
Added tap location details to Section 6.1
Removed manual device setup description and startup flow diagram from Section 7.2
Updated overview diagrams and circuit diagrams (removed program interface on PGM and
NRST, and updated SW_IN pin)
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IQ Switch®
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15 Contact Information
USA
Asia
South Africa
Physical
Address
Rm2125, Glittery City
Shennan Rd
Futian District
Shenzhen, 518033
China
109 Main Street
Paarl
7646
6507 Jester Blvd
Bldg 5, suite 510G
Austin
TX 78750
USA
South Africa
Postal
Address
Rm2125, Glittery City
Shennan Rd
Futian District
Shenzhen, 518033
China
PO Box 3534
Paarl
7620
6507 Jester Blvd
Bldg 5, suite 510G
Austin
TX 78750
USA
South Africa
Tel
+1 512 538 1995
+1 512 672 8442
info@azoteq.com
+86 755 8303 5294
ext 808
+27 21 863 0033
+27 21 863 1512
info@azoteq.com
Fax
Email
info@azoteq.com
Please visit www.azoteq.com for a list of distributors and worldwide representation.
The following patents relate to the device or usage of the device: US 6,249,089; US 6,952,084; US 6,984,900; US
7,084,526; US 7,084,531; US 8,395,395; US 8,531,120; US 8,659,306; US 8,823,273; US 9,209,803; US 9,360,510; EP
2,351,220; EP 2,559,164; EP 2,656,189; HK 1,156,120; HK 1,157,080; SA 2001/2151; SA 2006/05363; SA 2014/01541; SA
2015/023634
IQ Switch®, SwipeSwitch™, ProxSense®, LightSense™, AirButtonTM, ProxFusion™, Crystal Driver™ and the
logo are trademarks of Azoteq.
The information in this Datasheet is believed to be accurate at the time of publication. Azoteq uses reasonable effort to maintain the information up-to-date and accurate, but does not warrant
the accuracy, completeness or reliability of the information contained herein. All content and information are provided on an “as is” basis only, without any representations or warranties, express
or implied, of any kind, including representations about the suitability of these products or information for any purpose. Values in the datasheet is subject to change without notice, please ensure
to always use the latest version of this document. Application specific operating conditions should be taken into account during design and verified before mass production. Azoteq disclaims all
warranties and conditions with regard to these products and information, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title
and non-infringement of any third party intellectual property rights. Azoteq assumes no liability for any damages or injury arising from any use of the information or the product or caused by,
without limitation, failure of performance, error, omission, interruption, defect, delay in operation or transmission, even if Azoteq has been advised of the possibility of such damages. The
applications mentioned herein are used solely for the purpose of illustration and Azoteq makes no warranty or representation that such applications will be suitable without further modification,
nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Azoteq products are not authorized for use as critical components in
life support devices or systems. No licenses to patents are granted, implicitly, express or implied, by estoppel or otherwise, under any intellectual property rights. In the event that any of the
abovementioned limitations or exclusions does not apply, it is agreed that Azoteq‟s total liability for all losses, damages and causes of action (in contract, tort (including without limitation,
negligence) or otherwise) will not exceed the amount already paid by the customer for the products. Azoteq reserves the right to alter its products, to make corrections, deletions, modifications,
enhancements, improvements and other changes to the content and information, its products, programs and services at any time or to move or discontinue any contents, products, programs or
services without prior notification. For the most up-to-date information and binding Terms and Conditions please refer to www.azoteq.com
www.azoteq.com/ip
info@azoteq.com
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