HWD2171 [ETC]
低电压放大器;
ETC 
HWD2171
3W Audio Power Amplifier with Shutdown Mode
General Description
Key Specifications
n PO at 10% THD+N, 1kHz
The HWD2171 is a mono bridged audio power amplifier ca-
pable of delivering 3W of continuous average power into a
3Ω load with less than 10% THD when powered by a 5V
power supply (Note 1). To conserve power in portable appli-
cations, the HWD2171’s micropower shutdown modeQ(I =
0.6µA, typ) is activated when VDD is applied to the SHUT-
DOWN pin.
n
n
HWD2171LD: 3Ω , 4Ω load
All other HWD2171 packages: 8Ω loa
3W (typ), 2.5W (typ)
1.5W (typ)
0.6µA (typ)
2.0V to 5.5V
n Shutdown current
n Supply voltage range
n THD at 1kHz at 1W continuous average output power
into 8Ω
0.5% (max)
audio power amplifiers are designed specifically to provide
high power, high fidelity audio output. They require
few external components and operate on low supply volt-
ages from 2.0V to 5.5V. Since the HWD2171 does not require
output coupling capacitors, bootstrap capacitors, or snubber
networks, it is ideally suited for low-power portable systems
that require minimum volume and weight.
Features
n No output coupling capacitors, bootstrap capacitors, or
snubber circuits required
n Unity-gain stable
n LLP, MSOP, SO, or DIP packaging
n External gain configuration capability
n Pin compatible with the HWD2161
Additional HWD2171 features include thermal shutdown pro-
tection, unity-gain stability, and external gain set.
Note 1: An HWD2171LD that has been properly mounted to a circuit board will
deliver 3W into 3Ω (at 10% THD). The other package options for the HWD2171
will deliver 1.5W into 8Ω (at 10% THD). See the Application Information
sections for further information concerning the HWD2171LD, HWD2171MM,
HWD2171M, and the HWD2171N.
Applications
n Portable computers
n Desktop computers
n Low voltage audio systems
Typical Application
Connection Diagram
MSOP, Small Outline, and DIP Package
Top View
Order Number HWD2171MM, HWD2171M, or HWD2171N
LLP Package
FIGURE 1. Typical Audio Amplifier Application Circuit
Top View
Order Number HWD2171LD
1
Absolute Maximum Ratings (Note 2)
θJC (typ)—M08A
θJA (typ)—M08A
θJC (typ)—N08E
θJA (typ)—N08E
θJC (typ)—MUA08A
θJA (typ)—MUA08A
θJC (typ)—LDC08A
θJA (typ)—LDC08A
35˚C/W
140˚C/W
37˚C/W
107˚C/W
Supply Voltage
6.0V
56˚C/W
Supply Temperature
Input Voltage
−65˚C to +150˚C
−0.3V to VDD to +0.3V
Internally Limited
5000V
210˚C/W
4.3˚C/W
Power Dissipation (Note 4)
ESD Susceptibility (Note 5)
ESD Susceptibility (Note 6)
Junction Temperature
Soldering Information
Small Outline Package
Vapor Phase (60 sec.)
Infrared (15 sec.)
56˚C/W (Note 9)
Operating Ratings
250V
150˚C
Temperature Range
TMIN ≤ TA ≤ TMAX
Supply Voltage
−40˚C ≤ TA ≤ 85˚C
2.0V ≤ VDD ≤ 5.5V
215˚C
220˚C
See AN-450 ″Surface Mounting and their Effects on
Product Reliability″ for other methods of
soldering surface mount devices.
Electrical Characteristics(Notes 2, 3)
The following specifications apply for VDD = 5V and RL = 8Ω unless otherwise specified. Limits apply for TA = 25˚C.
HWD2171
Sym-
bol
Parameter
Conditions
Min
(Note 7)
2.0
Typical
Limit
(Note 7)
5.5
Units
(Limits)
V
(Note 8)
VDD
Supply Voltage
IDD
Quiescent Power Supply
Current
VIN = 0V, Io = 0A
6.5
10.0
mA
ISD
VOS
Po
Shutdown Current
Output Offset Voltage
Output Power
VPIN1 = VDD
0.6
5.0
2
µA
VIN = 0V
50
mV
THD = 1%, f = 1kHz
HWD2171LD,LR= 3Ω (Note 10)
HWD2171LD,LR= 4Ω (Note 10)
HWD2171,LR= 8Ω (Note 10)
2.38
2
1.2
W
W
THD+N = 10%, f = 1kHz
HWD2171LD,LR= 3Ω (Note 10)
HWD2171LD,LR= 4Ω (Note 10)
HWD2171,LR= 8Ω (Note 10)
3
2.5
1.5
THD+N Total Harmonic
Distortion+Noise
20Hz ≤ f ≤ 20kHz, AVD = 2
HWD2171LD,LR= 4Ω, P = 1.6W
0.13
0.25
%
O
HWD2171,LR= 8Ω, P = 1W
O
PSRR
Power Supply Rejection
Ratio
VDD = 4.9V to 5.1V
60
dB
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 3: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
, θ , and the ambient temperature T . The maximum
A
JMAX JA
allowable power dissipation is P
= (T
–T )/θ or the number given in Absolute Maximum Ratings, whichever is lower. For the HWD2171, T
= 150˚C. For
JMAX
DMAX
JMAX
A
JA
the θ ’s for different packages, please see the Application Information section or the Absolute Maximum Ratings section.
JA
Note 5: Human body model, 100pF discharged through a 1.5kΩ resistor.
Note 6: Machine Model, 220pF–240pF discharged through all pins.
Note 7: Typicals are specified at 25˚C and represent the parametric norm.
Note 8: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
2
Note 9: The given θ is for an HWD2171 packaged in an LDC08A with the Exposed–DAP soldered to an exposed 1in area of 1oz printed circuit board copper.
JA
Note 10: When driving 3Ω or 4Ω loads from a 5V supply, the HWD2171LD must be mounted to a circuit board.
2
External Components Description (Figure 1)
Components
Functional Description
1.
Ri
Inverting input resistance that sets the closed-loop gain in conjunction with Rf. This resistor also forms a
high pass filter with Ci at fC= 1/(2π RiCi).
2.
Ci
Input coupling capacitor that blocks the DC voltage at the amplifiers input terminals. Also creates a highpass
filter with Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components, for an
explanation of how to determine the value of Ci.
3.
4.
Rf
Feedback resistance that sets the closed-loop gain in conjunction with Ri.
CS
Supply bypass capacitor that provides power supply filtering. Refer to the Power Supply Bypassing section
for information concerning proper placement and selection of the supply bypass capacitor.
5.
CB
Bypass pin capacitor that provides half-supply filtering. Refer to the section, Proper Selection of External
Components, for information concerning proper placement and selection of CB.
Typical Performance Characteristics
LD Specific Characteristics
HWD2171LD
THD+N vs Output Power
HWD2171LD
THD+N vs Frequency
HWD2171LD
THD+N vs Frequency
HWD2171LD
THD+N vs Output Power
HWD2171LD
Power Dissipation vs Output Power
HWD2171LD (Note 11)
Power Derating Curve
Note 11: This curve shows the HWD2171LD’s thermal dissipation ability at different ambient temperatures given the exposed-DAP of the part is soldered to a plane
of 1oz. Cu with an area given in the label of each curve. This label also designates whether the plane exists on the same (top) layer as the chip, on the bottom layer,
or on both layers. Infinite heatsink and unattached (no heatsink) conditions are also shown.
3
Typical Performance Characteristics
Non-LD Specific Characteristics
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Frequency
THD+N vs Output Power
THD+N vs Output Power
THD+N vs Output Power
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
4
Typical Performance Characteristics
Non-LD Specific Characteristics (Continued)
Output Power vs
Load Resistance
Power Dissipation vs
Output Power
Power Derating Curve
Clipping Voltage vs
Supply Voltage
Frequency Response vs
Input Capacitor Size
Noise Floor
Power Supply
Rejection Ratio
Open Loop
Frequency Response
Supply Current vs
Supply Voltage
5
supply regulation. Therefore, making the power supply
traces as wide as possible helps maintain full output voltage
swing.
Application Information
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATION
BRIDGE CONFIGURATION EXPLANATION
The HWD2171’s exposed-DAP (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air. The
result is a low voltage audio power amplifier that produces
2W at ≤ 1% THD with a 4Ω load. This high power is achieved
through careful consideration of necessary thermal design.
Failing to optimize thermal design may compromise the
HWD2171’s high power performance and activate unwanted,
though necessary, thermal shutdown protection.
As shown in Figure 1, the HWD2171 has two operational
amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier’s gain is externally config-
urable; the second amplifier is internally fixed in a unity-gain,
inverting configuration. The closed-loop gain of the first am-
plifier is set by selecting the ratio of Rf to Ri while the second
amplifier’s gain is fixed by the two internal 40kΩ resistors.
Figure 1 shows that the output of amplifier one serves as the
input to amplifier two, which results in both amplifiers pro-
ducing signals identical in magnitude, but 180˚ out of phase.
Consequently, the differential gain for the IC is
The LD package must have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad is connected to
a large plane of continuous unbroken copper. This plane
forms a thermal mass, heat sink, and radiation area. Place
the heat sink area on either outside plane in the case of a
two-sided PCB, or on an inner layer of a board with more
than two layers. Connect the DAP copper pad to the inner
layer or backside copper heat sink area with 4(2x2) vias. The
via diameter should be 0.012in-0.013in with a 1.27mm pitch.
Ensure efficient thermal conductivity by plating through the
vias.
A
VD= 2 *(Rf/Ri)
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classical single-ended amplifier configura-
tion where one side of its load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same con-
ditions. This increase in attainable output power assumes
that the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing ex-
cessive clipping, please refer to the Audio Power Amplifier
Design section.
Best thermal performance is achieved with the largest prac-
tical heat sink area. If the heatsink and amplifier share the
same PCB layer, a nominal 2.5in2 area is necessary for 5V
operation with a 4Ω load. Heatsink areas not placed on the
same PCB layer as the HWD2171 should be 5in2 (min) for the
same supply voltage and load resistance. The last two area
recommendations apply for 25˚C ambient temperature. In-
crease the area to compensate for ambient temperatures
above 25˚C. The HWD2171’s power de-rating curve in the
Typical Performance Characteristics shows the maximum
power dissipation versus temperature. An example PCB lay-
out for the LD package is shown in the Demonstration
Board Layout section. Further detailed and specific infor-
mation concerning PCB layout, fabrication, and mounting an
LD (LLP) package is available from National Semiconduc-
tor’s Package Engineering Group under application note
AN1187.
Another advantage of the differential bridge output is no net
DC voltage across load. This results from biasing VO1 and
VO2 at the same DC voltage, in this case VDD/2 . This
eliminates the coupling capacitor that single supply, single-
ended amplifiers require. Eliminating an output coupling ca-
pacitor in a single-ended configuration forces a single supply
amplifier’s half-supply bias voltage across the load. The
current flow created by the half-supply bias voltage in-
creases internal IC power dissipation and my permanently
damage loads such as speakers.
POWER DISSIPATION
PCB LAYOUT AND SUPPLY REGULATION
CONSIDERATIONS FOR DRIVING 3Ω AND 4Ω LOADS
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Equation 1 states the maximum
power dissipation point for a bridge amplifier operating at a
given supply voltage and driving a specified output load.
Power dissipated by a load is a function of the voltage swing
across the load and the load’s impedance. As load imped-
ance decreases, load dissipation becomes increasingly de-
pendant on the interconnect (PCB trace and wire) resistance
between the amplifier output pins and the load’s connec-
tions. Residual trace resistance causes a voltage drop,
which results in power dissipated in the trace and not in the
load as desired. For example, 0.1Ω trace resistance reduces
the output power dissipated by a 4Ω load from 2.0W to
1.95W. This problem of decreased load dissipation is exac-
erbated as load impedance decreases. Therefore, to main-
tain the highest load dissipation and widest output voltage
swing, PCB traces that connect the output pins to a load
must be as wide as possible.
PDMAX = 4*(VDD)2/(2π2RL)
(1)
Since the HWD2171 has two operational amplifiers in one
package, the maximum internal power dissipation is 4 times
that of a single-ended ampifier. Even with this substantial
increase in power dissipation, the HWD2171 does not require
heatsinking under most operating conditions and output
loading. From Equation 1, assuming a 5V power supply and
an 8Ω load, the maximum power dissipation point is
625 mW. The maximum power dissipation point obtained
from Equation 1 must not be greater than the power dissi-
pation that results from Equation 2:
Poor power supply regulation adversely affects maximum
output power. A poorly regulated supply’s output voltage
decreases with increasing load current. Reduced supply
voltage causes decreased headroom, output signal clipping,
and reduced output power. Even with tightly regulated sup-
plies, trace resistance creates the same effects as poor
PDMAX = (TJMAX–TA)/θJA
(2)
For the SO package, θJA = 140˚C/W, for the DIP package,
θJA = 107˚C/W, and for the MSOP package, θJA = 210˚C/W
6
current may be greater than the typical value of 0.6µA. In
either case, the shutdown pin should be tied to a definite
voltage to avoid unwanted state changes.
Application Information (Continued)
assuming free air operation. For the LD package soldered to
a DAP pad that expands to a copper area of 1.0in2 on a
PCB, the HWD2171’sJAθ is 56˚C/W. TJMAX = 150˚C for the
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry which pro-
vides a quick, smooth transition into shutdown. Another so-
lution is to use a single-pole, single-throw switch in conjunc-
tion with an external pull-up resistor. When the switch is
closed, the shutdown pin is connected to ground and en-
ables the amplifier. If the switch is open, then the external
pull-up resistor will disable the HWD2171. This scheme guar-
antees that the shutdown pin will not float thus preventing
unwanted state changes.
HWD2171. The θ can be decreased by using some form of
JA
heat sinking. The resultant θJA will be the summation of the
θJC, θCS, and θSA. θJC is the junction to case of the package
(or to the exposed DAP, as is the case with the LD package),
θCS is the case to heat sink thermal resistance and θSA is the
heat sink to ambient thermal resistance. By adding addi-
tional copper area around the HWD2171, theJAθ can be
reduced from its free air value for the SO and MSOP pack-
ages. Increasing the copper area around the LD package
from 1.0in2 to 2.0in2 area results in a θJA decrease to
46˚C/W. Depending on the ambient temperature, TA, and the
θJA, Equation 2 can be used to find the maximum internal
power dissipation supported by the IC packaging. If the
result of Equation 1 is greater than that of Equation 2, then
either the supply voltage must be decreased, the load im-
pedance increased, the θJA decreased, or the ambient tem-
perature reduced. For the typical application of a 5V power
supply, with an 8Ω load, and no additional heatsinking, the
maximum ambient temperature possible without violating the
maximum junction temperature is approximately 61˚C pro-
vided that device operation is around the maximum power
dissipation point and assuming surface mount packaging.
For the LD package in a typical application of a 5V power
supply, with a 4Ω load, and 1.0in2 copper area soldered to
the exposed DAP pad, the maximum ambient temperature is
approximately 77˚C providing device operation is around the
maximum power dissipation point. Internal power dissipation
is a function of output power. If typical operation is not
around the maximum power dissipation point, the ambient
temperature can be increased. Refer to the Typical Perfor-
mance Characteristics curves for power dissipation infor-
mation for different output powers and output loading.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications us-
ing integrated power amplifiers is critical to optimize device
and system performance. While the HWD2171 is tolerant of
external component combinations, consideration to compo-
nent values must be used to maximize overall system qual-
ity.
The HWD2171 is unity-gain stable which gives a designer
maximum system flexibility. The HWD2171 should be used in
low gain configurations to minimize THD+N values, and
maximize the signal to noise ratio. Low gain configurations
require large input signals to obtain a given output power.
Input signals equal to or greater than 1 Vrms are available
from sources such as audio codecs. Please refer to the
section, Audio Power Amplifier Design, for a more com-
plete explanation of proper gain selection.
Besides gain, one of the major considerations is the closed-
loop bandwidth of the amplifier. To a large extent, the band-
width is dictated by the choice of external components
shown in Figure 1. The input coupling capacitor, Ci, forms a
first order high pass filter which limits low frequency re-
sponse. This value should be chosen based on needed
frequency response for a few distinct reasons.
POWER SUPPLY BYPASSING
Selection Of Input Capacitor Size
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on both the bypass and power supply pins
should be as close to the HWD2171 as possible. The capacitor
connected between the bypass pin and ground improves the
internal bias voltage’s stability, producing improved PSRR.
The improvements to PSRR increase as the bypass pin
capacitor increases. Typical applications employ a 5V regu-
lator with 10µF and a 0.1µF bypass capacitors which aid in
supply stability. This does not eliminate the need for bypass-
ing the supply nodes of the HWD2171 with a 1µF tantalum
capacitor. The selection of bypass capacitors, especially CB,
is dependent upon PSRR requirements, click and pop per-
formance as explained in the section, Proper Selection of
External Components, system cost, and size constraints.
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenu-
ation. But in many cases the speakers used in portable
systems, whether internal or external, have little ability to
reproduce signals below 100Hz to 150Hz. Thus, using a
large input capacitor may not increase actual system perfor-
mance.
In addition to system cost and size, click and pop perfor-
mance is effected by the size of the input coupling capacitor,
Ci. A larger input coupling capacitor requires more charge to
reach its quiescent DC voltage (nominally 1/2 VDD). This
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
HWD2171 contains a shutdown pin to externally turn off the
amplifier’s bias circuitry. This shutdown feature turns the
amplifier off when a logic high is placed on the shutdown pin.
The trigger point between a logic low and logic high level is
typically half- supply. It is best to switch between ground and
supply to provide maximum device performance. By switch-
ing the shutdown pin to VDD, the HWD2171 supply current
draw will be minimized in idle mode. While the device will be
disabled with shutdown pin voltages less then VDD, the idle
Besides minimizing the input capacitor size, careful consid-
eration should be paid to the bypass capacitor value. Bypass
capacitor, CB, is the most critical component to minimize
turn-on pops since it determines how fast the HWD2171 turns
on. The slower the HWD2171’s outputs ramp to their quiescent
DC voltage (nominally 1/2 VDD), the smaller the turn-on pop.
Choosing CB equal to 1.0µF along with a small value of Ci (in
the range of 0.1µF to 0.39µF), should produce a virtually
clickless and popless shutdown function. While the device
will function properly, (no oscillations or motorboating), with
CB equal to 0.1µF, the device will be much more susceptible
7
design an amplifier with a higher differential gain, the
HWD2171 can still be used without running into bandwidth
limitations.
Application Information (Continued)
to turn-on clicks and pops. Thus, a value of CB equal to
1.0µF is recommended in all but the most cost sensitive
designs.
AUDIO POWER AMPLIFIER DESIGN
Design a 1W/8Ω Audio Amplifier
Given:
Power Output
Load Impedance
Input Level
1 Wrms
8Ω
1 Vrms
20 kΩ
Input Impedance
Bandwidth
±
100 Hz–20 kHz 0.25 dB
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Per-
formance Characteristics section, the supply rail can be
easily found. A second way to determine the minimum sup-
ply rail is to calculate the required Vopeak using Equation 3
and add the output voltage. Using this method, the minimum
supply voltage would be (Vopeak + (VOD
+ VODBOT)), where
VOD
and VOD
are extrapolated frToOmP the Dropout Volt-
TOP
age BvOsT Supply Voltage curve in the Typical Performance
Characteristics section.
(3)
Using the Output Power vs Supply Voltage graph for an 8Ω
load, the minimum supply rail is 4.6V. But since 5V is a
standard voltage in most applications, it is chosen for the
supply rail. Extra supply voltage creates headroom that al-
lows the HWD2171 to reproduce peaks in excess of 1W with-
out producing audible distortion. At this time, the designer
must make sure that the power supply choice along with the
output impedance does not violate the conditions explained
in the Power Dissipation section.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equa-
tion 4.
(4)
Rf/Ri = AVD/2
(5)
From Equation 4, the minimum AVD is 2.83; use AVD = 3.
Since the desired input impedance was 20kΩ, and with a
AVD impedance of 2, a ratio of 1.5:1 of Rf to Ri results in an
allocation of Ri = 20kΩ and Rf = 30kΩ. The final design step
is to address the bandwidth requirements which must be
stated as a pair of −3dB frequency points. Five times away
from a −3dB point is 0.17dB down from passband response
±
which is better than the required 0.25dB specified.
fL = 100Hz/5 = 20Hz
fH = 20kHz * 5 = 100kHz
As stated in the External Components section, Ri in con-
junction with Ci create a highpass filter.
Ci ≥ 1/(2π*20kΩ*20Hz) = 0.397µF; use 0.39µF
The high frequency pole is determined by the product of the
desired frequency pole, fH, and the differential gain, AVD
.
With a AVD = 3 and fH = 100kHz, the resulting GBWP =
150kHz which is much smaller than the HWD2171 GBWP of
4MHz. This figure displays that if a designer has a need to
8
Demonstration Board Layout
Recommended LD PC Board Layout:
Component-Side Silkscreen
Recommended LD PC Board Layout:
Component-Side Layout
Recommended LD PC Board Layout:
Bottom-Side Layout
9
Physical Dimensions inches (millimeters) unless otherwise noted
Order Number HWD2171LD
Order Number HWD2171M
10
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Order Number HWD2171MM
11
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Order Number HWD2171N
12
Chengdu Sino Microelectronics System Co.,Ltd
(Http://www.csmsc.com)
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