HIN207EIA-T [ETC]
Transceiver ; 收发器\n
| 型号： | HIN207EIA-T |
| 厂家： | 
ETC |
| 描述： | Transceiver
|
| 文件： | 总23页 (文件大小：318K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HIN202E thru HIN241E
TM
Data Sheet
March 2001
File Number 4315.8
+/-15kV, ESD-Protected, +5V Powered,
RS-232 Transmitters/Receivers
Features
• High Speed ISDN Compatible . . . . . . . . . . . . . 230kbits/s
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC1000)
• Meets All RS-232E and V.28 Specifications
The HIN202E-HIN241E family of RS-232 transmitters/receivers
interface circuits meet all ElA high-speed RS-232E and V.28
specifications, and are particularly suited for those applications
where ±12V is not available. A redesigned transmitter circuit
improves data rate and slew rate, which makes this suitable for
ISDN and high speed modems. The transmitter outputs and
receiver inputs are protected to ±15kV ESD (Electrostatic
Discharge). They require a single +5V power supply and feature
onboard charge pump voltage converters which generate +10V
and -10V supplies from the 5V supply. The family of devices
offers a wide variety of high-speed RS-232 transmitter/receiver
combinations to accommodate various applications (see
Selection Table).
• Requires Only 0.1µF or Greater External Capacitors
• Two Receivers Active in Shutdown Mode (HIN213E)
• Requires Only Single +5V Power Supply
• Onboard Voltage Doubler/Inverter
• Low Power Consumption (Typ). . . . . . . . . . . . . . . . . . 5mA
• Low Power Shutdown Function (Typ) . . . . . . . . . . . . . 1µA
• Three-State TTL/CMOS Receiver Outputs
The HIN206E, HIN211E, HIN213E, HIN236E, and HIN241E
feature a low power shutdown mode to conserve energy in
battery powered applications. In addition, the HIN213E provides
two active receivers in shutdown mode allowing for easy
“wakeup” capability.
• Multiple Drivers
- ±10V Output Swing for +5V Input
- 300Ω Power-Off Source Impedance
- Output Current Limiting
The drivers feature true TTL/CMOS input compatibility, slew
rate-limited output, and 300Ω power-off source impedance. The
receivers can handle up to ±30V input, and have a 3kΩ to 7kΩ
input impedance. The receivers also feature hysteresis to
greatly improve noise rejection.
- TTL/CMOS Compatible
• Multiple Receivers
- ±30V Input Voltage Range
- 3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
Applications
• Any System Requiring High-Speed RS-232
Communications Port
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation, UPS
- Modems, ISDN Terminal Adaptors
Selection Table
NUMBER OF
0.1µF
EXTERNAL
CAPACITORS
NUMBER OF
RECEIVERS
ACTIVE IN
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
PART
NUMBER
POWER SUPPLY
VOLTAGE
SHUTDOWN
HIN202E
HIN206E
HIN207E
HIN208E
HIN211E
HIN213E
HIN232E
HIN236E
HIN237E
HIN238E
HIN241E
+5V
+5V
+5V
+5V
+5V
+5V
+5V
+5V
+5V
+5V
+5V
2
4
5
4
4
4
2
4
5
4
4
2
3
3
4
5
5
2
3
3
4
5
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
NO/NO
YES/YES
NO/NO
0
0
0
0
0
2
0
0
0
0
0
NO/NO
YES/YES
YES/YES
NO/NO
YES/YES
NO/NO
NO/NO
YES/YES
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2001, All Rights Reserved
1
HIN202E thru HIN241E
Ordering Information (Continued)
Ordering Information
TEMP.
TEMP.
o
o
PART NO.
HIN208EIP
RANGE ( C)
-40 to 85
0 to 70
0 to 70
0 to 70
-40 to 85
-40 to 85
0 to 70
0 to 70
0 to 70
-40 to 85
-40 to 85
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
PACKAGE
24 Ld PDIP
PKG. NO.
E24.3
PART NO.
HIN202ECB
HIN202ECBN
HIN202ECBN-T
HIN202ECP
HIN202EIB
RANGE ( C)
0 to 70
PACKAGE
16 Ld SOIC
PKG. NO.
M16.3
HIN211ECA
HIN211ECA-T
HIN211ECB
HIN211EIA
28 Ld SSOP
Tape and Reel
28 Ld SOIC
M28.209
0 to 70
16 Ld SOIC (N)
Tape and Reel
16 Ld PDIP
M16.15
0 to 70
M28.3
0 to 70
E16.3
M16.3
28 Ld SSOP
28 Ld SOIC
M28.209
M28.3
-40 to 85
-40 to 85
-40 to 85
-40 to 85
0 to 70
16 Ld SOIC
HIN211EIB
HIN202EIB-T
HIN202EIBN
HIN202EIBN-T
HIN206ECA
HIN206ECB
HIN206ECB-T
HIN206ECP
HIN206EIA
Tape and Reel
16 Ld SOIC (N)
Tape and Reel
24 Ld SSOP
24 Ld SOIC (W)
Tape and Reel
24 Ld PDIP
HIN213ECA
HIN213ECA-T
HIN213ECB
HIN213EIA
28 Ld SSOP
Tape and Reel
28 Ld SOIC
M28.209
M16.15
M28.3
M24.209
M24.3
28 Ld SSOP
28 Ld SOIC
M28.209
M28.3
0 to 70
HIN213EIB
0 to 70
HIN232ECA
HIN232ECB
HIN232ECBN
HIN232ECP
HIN236ECA
HIN236ECB
HIN236ECB-T
HIN236ECP
HIN237ECA
HIN237ECA-T
HIN237ECB
HIN237ECB-T
HIN237ECP
HIN238ECA
HIN238ECA-T
HIN238ECB
HIN238ECB-T
HIN238ECP
HIN241ECA
HIN241ECA-T
HIN241ECB
16 Ld SSOP
16 Ld SOIC
M16.209
M16.3
0 to 70
E24.3
-40 to 85
-40 to 85
-40 to 85
0 to 70
24 Ld SSOP
24 Ld SOIC (W)
24 Ld PDIP
M24.209
M24.3
16 Ld SOIC (N)
16 Ld PDIP
M16.15
E16.3
HIN206EIB
HIN206EIP
E24.3
24 Ld SSOP
24 Ld SOIC (W)
Tape and Reel
24 Ld PDIP
M24.209
M24.3
HIN207ECA
HIN207ECA-T
HIN207ECB
HIN207ECB-T
HIN207ECP
HIN207EIA
24 Ld SSOP
Tape and Reel
24 Ld SOIC
M24.209
0 to 70
0 to 70
M24.3
E24.3
0 to 70
Tape and Reel
24 Ld PDIP
24 Ld SSOP
Tape and Reel
24 Ld SOIC
M24.209
0 to 70
E24.3
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
0 to 70
24 Ld SSOP
Tape and Reel
24 Ld SOIC (W)
Tape and Reel
24 Ld PDIP
M24.209
M24.3
HIN207EIA-T
HIN207EIB
Tape and Reel
24 Ld PDIP
M24.3
E24.3
HIN207EIB-T
HIN207EIP
24 Ld SSOP
Tape and Reel
24 Ld SOIC
M24.209
E24.3
HIN208ECA
HIN208ECA-T
HIN208ECB
HIN208ECB-T
HIN208ECP
HIN208EIA
24 Ld SSOP
Tape and Reel
24 Ld SOIC
M24.209
M24.3
0 to 70
Tape and Reel
24 Ld PDIP
0 to 70
M24.3
E24.3
0 to 70
Tape and Reel
24 Ld PDIP
28 Ld SSOP
Tape and Reel
28 Ld SOIC
M28.209
0 to 70
E24.3
-40 to 85
-40 to 85
-40 to 85
24 Ld SSOP
24 Ld SOIC
M24.209
M24.3
M28.3
HIN208EIB
HIN208EIB-T
Tape and Reel
2
HIN202E thru HIN241E
Pinouts
HIN202E (PDIP, SOIC)
HIN206E (PDIP, SOIC, SSOP)
TOP VIEW
TOP VIEW
1
2
24
23
22
21
20
19
18
17
T3
T1
T2
T4
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
C1+
V+
V
CC
OUT
OUT
OUT
R2
IN
GND
T1
3
R2
OUT
C1-
C2+
C2-
V-
OUT
4
R1
IN
SD
EN
R1
R1
T1
IN
5
R1
OUT
OUT
6
T2
T4
IN
IN
IN
IN
11
10
9
IN
IN
7
T3
T1
T2
T2
OUT
8
R3
GND
OUT
R2
OUT
R2
IN
9
16 R3
V
IN
CC
10
11
12
15
14
13
V-
C1+
V+
C2-
C2+
C1-
+5V
9
+5V
16
0.1µF
10
+
12
V
+
+
CC
C1+
11
V+
V-
0.1µF
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
V
C1-
1
CC
0.1µF
C1+
13
+
14
+
+
+
+
2
+5V TO 10V
VOLTAGE INVERTER
C2+
0.1µF
0.1µF
V+
V-
3
4
+10V TO -10V
VOLTAGE INVERTER
15
2
C1-
C2-
0.1µF
C2+
+5V
+10V TO -10V
VOLTAGE INVERTER
T1
T2
6
400kΩ
7
5
T1
T1
IN
OUT
C2-
0.1µF
+5V
+5V
+5V
+5V
T1
400kΩ
6
3
1
T2
14
T2
IN
400kΩ
OUT
11
T1
T1
IN
OUT
T3
T4
400kΩ
400kΩ
18
+5V
T2
T3
T4
T3
IN
OUT
OUT
400kΩ
10
12
7
T2
R1
T2
IN
OUT
19
5
24
4
T4
IN
13
R1
IN
OUT
R1
R1
IN
OUT
5kΩ
5kΩ
R1
5kΩ
5kΩ
R1
9
8
R2
R2
IN
22
23
OUT
R2
R2
IN
OUT
R2
R2
GND
17
20
16
21
15
R3
R3
IN
OUT
EN
5kΩ
R3
SD
GND
8
3
HIN202E thru HIN241E
Pinouts (Continued)
HIN207E (PDIP, SOIC, SSOP)
HIN208E (PDIP, SOIC, SSOP)
TOP VIEW
TOP VIEW
T2
T1
T3
1
2
24
23
22
21
20
19
18
17
16
15
14
13
OUT
OUT
T3
T1
T2
1
2
3
4
5
6
7
8
9
24 T4
OUT
OUT
OUT
OUT
R3
R3
T4
OUT
IN
23 R2
IN
R2
IN
3
OUT
R2
22
21
20
19
18
17
16
OUT
R2
4
OUT
IN
R1
IN
T5
IN
T1
IN
T4
T3
T2
5
OUT
R1
T5
T4
T3
OUT
OUT
R1
6
OUT
IN
T2
IN
IN
R1
IN
7
IN
T1
IN
IN
R4
R4
V-
GND
8
OUT
R3
GND
OUT
IN
V
9
CC
IN
V
R3
CC
C1+
V+
10
11
12
C1+ 10
V+ 11
15 V-
C2-
14 C2-
13 C2+
C1-
C2+
C1- 12
TOP VIEW
+5V
+5V
9
9
0.1µF
10
+
12
V
+
+
CC
C1+
0.1µF
10
11
V
+
+
CC
C1+
V+
V-
0.1µF
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
+
12
11
V+
0.1µF
0.1µF
C1-
+5V TO 10V
VOLTAGE DOUBLER
13
+
14
C1-
C2+
13
+
14
+10V TO -10V
VOLTAGE INVERTER
15
2
C2+
+10V TO -10V
VOLTAGE INVERTER
15
2
V-
C2-
0.1µF
C2-
0.1µF
+5V
T1
T2
400kΩ
5
+5V
T1
T1
T1
IN
OUT
400kΩ
7
T1
T1
IN
OUT
OUT
+5V
+5V
+5V
400kΩ
18
19
1
+5V
T2
T2
T2
IN
OUT
400kΩ
6
3
T2
T2
IN
T3
T4
400kΩ
400kΩ
24
+5V
+5V
+5V
T3
T4
T5
T3
T4
T3
IN
OUT
OUT
400kΩ
400kΩ
400kΩ
18
19
1
T3
T4
T5
T3
IN
OUT
OUT
OUT
21
6
20
7
T4
IN
24
T4
IN
R1
R1
IN
OUT
21
5
20
4
5kΩ
R1
T5
IN
4
22
17
3
R1
R1
IN
R2
R3
R4
OUT
R2
R3
R4
IN
IN
IN
OUT
OUT
OUT
5kΩ
5kΩ
R1
5kΩ
5kΩ
5kΩ
R2
R3
22
17
23
16
23
16
R2
R2
IN
OUT
R2
R3
R3
IN
OUT
5kΩ
R4
R3
GND
GND
8
8
4
HIN202E thru HIN241E
Pinouts (Continued)
HIN211E (SOIC, SSOP)
HIN213E (SOIC, SSOP)
TOP VIEW
TOP VIEW
T3
T1
T2
1
2
3
4
5
6
7
8
9
28 T4
OUT
28 T4
OUT
OUT
OUT
OUT
T3
T1
T2
1
2
3
4
5
6
7
8
9
OUT
OUT
OUT
27 R3
IN
27 R3
26 R3
IN
26 R3
OUT
OUT
25 SD
24 EN
R2
IN
25 SD
24 EN
R2
IN
R2
OUT
R2
OUT
T2
T1
23 R4
22 R4
IN
IN
IN
T2
T1
23 R4
22 R4
IN
IN
IN
OUT
IN
OUT
IN
R1
21 T4
20
OUT
R1
21 T4
20
OUT
R1
IN
T3
R1
IN
IN
T3
IN
GND 10
11
19 R5
18 R5
17 V-
OUT
IN
GND 10
11
19 R5
18 R5
17 V-
OUT
IN
V
CC
V
CC
C1+ 12
V+ 13
C1+ 12
V+ 13
16 C2-
15 C2+
16 C2-
15 C2+
C1- 14
C1- 14
NOTE: R4 and R5 active in shutdown.
+5V
11
+5V
11
0.1µF
0.1µF
12
12
+
14
V
V
CC
+
+
+
+
CC
C1+
C1+
+
14
13
13
V+
V-
V+
V-
0.1µF
0.1µF
0.1µF
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
+5V TO 10V
VOLTAGE DOUBLER
C1-
C1-
15
+
16
15
+
16
C2+
C2+
+10V TO -10V
VOLTAGE INVERTER
+10V TO -10V
VOLTAGE INVERTER
17
2
17
2
C2-
C2-
0.1µF
0.1µF
+5V
+5V
T1
T1
400kΩ
400kΩ
7
7
T1
T1
T1
IN
T1
IN
OUT
OUT
+5V
+5V
+5V
T2
T3
T4
+5V
+5V
+5V
T2
T3
T4
400kΩ
400kΩ
400kΩ
400kΩ
400kΩ
400kΩ
6
3
1
6
3
1
T2
T3
T4
T2
T3
T4
T2
IN
T2
IN
OUT
OUT
20
20
T3
IN
T3
IN
OUT
OUT
OUT
OUT
21
8
28
9
21
8
28
9
T4
IN
T4
IN
R1
R1
R1
R1
OUT
IN
IN
OUT
5kΩ
5kΩ
R1
R1
5
26
22
4
5
26
22
4
R2
R3
R4
R5
R2
R3
R4
R5
R2
R3
R4
R5
R2
R3
R4
R5
IN
IN
IN
IN
IN
IN
OUT
OUT
OUT
OUT
OUT
OUT
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
R2
R3
R4
R2
R3
R4
27
23
27
23
19
24
18
25
19
24
18
25
IN
IN
OUT
OUT
R5
R5
SD
EN
SD
EN
GND
GND
10
10
5
HIN202E thru HIN241E
Pinouts (Continued)
HIN232E (PDIP, SOIC)
HIN236E (PDIP, SOIC, SSOP)
TOP VIEW
TOP VIEW
1
2
24
23
22
21
20
19
18
17
T3
T1
T2
T4
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
C1+
V+
V
CC
OUT
OUT
OUT
R2
IN
GND
T1
3
R2
OUT
C1-
C2+
C2-
V-
OUT
4
R1
IN
SD
EN
R1
R1
T1
IN
5
R1
OUT
OUT
6
T2
T4
IN
IN
IN
IN
11
10
9
IN
IN
7
T3
T1
T2
T2
OUT
8
R3
GND
OUT
R2
OUT
R2
IN
9
16 R3
V
IN
CC
10
11
12
15
14
13
V-
C1+
V+
C2-
C2+
C1-
+5V
9
+5V
16
0.1µF
10
+
12
V
+
+
CC
C1+
11
V+
V-
0.1µF
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
V
C1-
1
CC
0.1µF
C1+
13
+
14
+
+
+
+
2
+5V TO 10V
VOLTAGE INVERTER
C2+
0.1µF
0.1µF
V+
V-
3
4
+10V TO -10V
VOLTAGE INVERTER
15
2
C1-
C2-
0.1µF
C2+
+5V
+10V TO -10V
VOLTAGE INVERTER
T1
T2
6
400kΩ
7
5
T1
T1
IN
OUT
C2-
0.1µF
+5V
+5V
+5V
+5V
T1
400kΩ
6
3
1
T2
14
T2
IN
400kΩ
OUT
11
T1
T1
IN
OUT
T3
T4
400kΩ
400kΩ
18
+5V
T2
T3
T4
T3
IN
OUT
OUT
400kΩ
10
12
7
T2
R1
T2
IN
OUT
19
5
24
4
T4
IN
13
R1
IN
OUT
R1
R1
IN
OUT
5kΩ
5kΩ
R1
5kΩ
5kΩ
R1
9
8
R2
R2
IN
22
23
OUT
R2
R2
IN
OUT
R2
R2
GND
17
20
16
21
15
R3
R3
IN
OUT
EN
5kΩ
R3
SD
GND
8
6
HIN202E thru HIN241E
Pinouts (Continued)
HIN237E (PDIP, SOIC, SSOP)
HIN238E (PDIP, SOIC, SSOP)
TOP VIEW
TOP VIEW
T2
T1
T3
1
2
24
23
22
21
20
19
18
17
16
15
14
13
OUT
OUT
T3
T1
T2
1
2
3
4
5
6
7
8
9
24 T4
OUT
OUT
OUT
OUT
R3
R3
T4
OUT
IN
23 R2
IN
R2
3
IN
OUT
R2
22
21
20
19
18
17
16
OUT
R2
4
OUT
IN
R1
IN
T5
IN
T1
IN
T4
T3
T2
5
OUT
R1
T5
T4
T3
OUT
OUT
R1
6
OUT
IN
T2
IN
IN
R1
IN
7
IN
T1
IN
IN
R4
R4
V-
GND
8
OUT
R3
GND
OUT
IN
V
9
CC
IN
V
R3
CC
C1+
V+
10
11
12
C1+ 10
V+ 11
15 V-
C2-
14 C2-
13 C2+
C1-
C2+
C1- 12
+5V
+5V
9
9
0.1µF
10
+
12
V
0.1µF
+
+
CC
C1+
10
+
12
V
11
+
+
CC
C1+
V+
V-
0.1µF
0.1µF
11
+5V TO 10V
VOLTAGE DOUBLER
V+
0.1µF
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
C1-
C1-
13
+
14
C2+
13
+
14
+10V TO -10V
VOLTAGE INVERTER
C2+
15
2
+10V TO -10V
VOLTAGE INVERTER
15
2
V-
C2-
0.1µF
C2-
0.1µF
+5V
T1
T2
+5V
400kΩ
T1
5
T1
T1
IN
400kΩ
OUT
7
T1
T1
IN
OUT
+5V
+5V
+5V
+5V
T2
400kΩ
18
19
1
T2
T2
IN
OUT
400kΩ
6
3
T2
T2
IN
OUT
T3
T4
+5V
+5V
+5V
400kΩ
400kΩ
T3
T4
T5
24
T3
T4
T3
IN
400kΩ
400kΩ
400kΩ
18
19
1
OUT
OUT
T3
T4
T5
T3
IN
OUT
OUT
OUT
21
6
20
7
T4
IN
24
T4
IN
R1
R1
IN
OUT
21
5
20
4
5kΩ
R1
T5
IN
4
22
17
3
R1
R1
IN
OUT
R2
R3
R4
R2
R3
R4
IN
IN
IN
OUT
OUT
OUT
5kΩ
5kΩ
R1
5kΩ
5kΩ
5kΩ
R2
R3
22
17
23
16
23
16
R2
R2
R3
IN
OUT
R2
R3
IN
OUT
5kΩ
R3
R4
GND
GND
8
8
7
HIN202E thru HIN241E
Pinouts (Continued)
HIN241E (SOIC, SSOP)
+5V
TOP VIEW
11
0.1µF
12
+
14
V
+
+
CC
C1+
T3
T1
T2
1
2
3
4
5
6
7
8
9
28 T4
OUT
13
OUT
OUT
OUT
V+
V-
0.1µF
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
27 R3
26 R3
C1-
IN
15
+
16
C2+
OUT
+10V TO -10V
VOLTAGE INVERTER
17
2
25 SD
24 EN
23 R4
R2
IN
C2-
0.1µF
R2
OUT
+5V
T1
T2
IN
400kΩ
7
IN
T1
T1
IN
OUT
T1
IN
22 R4
OUT
+5V
+5V
+5V
T2
T3
T4
R1
21 T4
20
OUT
IN
400kΩ
400kΩ
400kΩ
6
3
1
T2
T3
T4
T2
IN
OUT
R1
IN
T3
IN
GND 10
11
19 R5
18 R5
17 V-
OUT
IN
20
T3
IN
OUT
OUT
V
CC
C1+ 12
V+ 13
21
8
28
9
T4
IN
16 C2-
15 C2+
R1
R2
R3
R4
R5
R1
C1- 14
IN
IN
IN
IN
OUT
OUT
OUT
OUT
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
R1
5
26
22
4
R2
R3
R4
R5
R2
R3
R4
27
23
19
24
18
25
IN
OUT
EN
R5
SD
GND
10
Pin Descriptions
PIN
FUNCTION
V
Power Supply Input 5V ±10%, (5V ±5% HIN207E).
Internally generated positive supply (+10V nominal).
Internally generated negative supply (-10V nominal).
Ground Lead. Connect to 0V.
CC
V+
V-
GND
C1+
C1-
C2+
C2-
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
T
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to V is connected to each lead.
IN
CC
T
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
OUT
R
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
IN
R
OUT
EN
SD, SD
NC
Enable Input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placed in a high
impedance state.
Shutdown Input. With SD = 5V (HIN213E SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance
state (except R4 and R5 of HIN241E) and the transmitters are shut off.
No Connect. No connections are made to these leads.
8
HIN202E thru HIN241E
Absolute Maximum Ratings
Thermal Information
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < V
< 6V
Thermal Resistance (Typical, Note 1)
θJA ( C/W)
CC
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . .(V
CC
-0.3V) < V+ < 12V
CC
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .
16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . .
24 Ld PDIP (W) Package . . . . . . . . . . . . . . . . . . . . .
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
110
100
155
90
75
135
75
55
70
100
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
Input Voltages
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)
IN
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
IN
Output Voltages
T
R
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
< (V+ +0.3V)
< (V+ +0.3V)
OUT
TXOUT
RXOUT
OUT
Short Circuit Duration
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
OUT
o
OUT
Maximum Junction Temperature (Plastic Package) . . . . . . . .150 C
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C
o
o
ESD Classification . . . . . . . . . . . . . . . . . . . . See Specification Table
o
(SOIC and SSOP - Lead Tips Only)
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C
o
o
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ is measured with the component mounted on an evaluation PC board in free air.
JA
Electrical Specifications Test Conditions: V = +5V ±10%, (V = +5V ±5% HIN207E); C1-C4 = 0.1µF; T = Operating Temperature
CC
CC
A
Range
PARAMETER
SUPPLY CURRENTS
Power Supply Current, I
TEST CONDITIONS
MIN
TYP
MAX
UNITS
No Load,
o
HIN202E
-
-
8
15
20
mA
mA
CC
T = 25 C
A
HIN206E - HIN208E, HIN211E,
HIN213E, HIN236E - HIN241E
11
HIN232E
-
-
5
1
10
10
mA
o
Shutdown Supply Current, I (SD)
CC
T = 25 C
HIN206E, HIN211E, HIN236E,
HIN241E
µA
A
HIN213E
-
15
50
µA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
T
T
, EN, SD, EN, SD
-
2.0
2.4
-
-
0.8
-
V
V
lL
IN
IN
Input Logic High, V
-
lH
EN, SD, EN, SD
= 0V
-
-
V
Transmitter Input Pullup Current, I
T
15
0.1
4.6
0.5
200
0.4
-
µA
V
P
IN
TTL/CMOS Receiver Output Voltage Low, V
I
I
= 1.6mA (HIN202E, HIN232E, I
= -1mA
= 3.2mA)
OUT
-
OL
OUT
OUT
TTL/CMOS Receiver Output Voltage High, V
TTL/CMOS Receiver Output Leakage
RECEIVER INPUTS
3.5
-
V
OH
EN = V , EN = 0, 0V < R
CC
< V
±10
µA
OUT
CC
RS-232 Input Voltage Range, V
IN
-30
-
+30
7.0
-
V
kΩ
V
o
Receiver Input Impedance, R
IN
T = 25 C, V = ±3V
3.0
5.0
1.2
1.5
1.7
1.5
0.5
A
IN
Receiver Input Low Threshold, V (H-L)
IN
V
= 5V,
Active Mode
-
CC
T = 25 C
o
A
Shutdown Mode HIN213E R4 and R5
Active Mode
-
-
-
V
Receiver Input High Threshold, V (L-H)
IN
V
= 5V,
2.4
2.4
1.0
V
CC
T = 25 C
o
A
Shutdown Mode HIN213E R4 and R5
-
V
Receiver Input Hysteresis, V
V
= 5V, No Hysteresis in Shutdown Mode
CC
0.2
V
HYST
9
HIN202E thru HIN241E
Electrical Specifications Test Conditions: V = +5V ±10%, (V = +5V ±5% HIN207E); C1-C4 = 0.1µF; T = Operating Temperature
CC
CC
A
Range (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
TIMING CHARACTERISTICS
Output Enable Time, t
HIN206E, HIN211E, HIN213E, HIN236E, HIN241E
HIN206E, HIN211E, HIN213E, HIN236E, HIN241E
HIN213E SD = 0V, R4, R5
-
-
600
200
4.0
0.5
0.5
20
-
ns
ns
EN
Output Disable Time, t
-
DIS
Transmitter, Receiver Propagation Delay, t
-
40
10
10
45
µs
PD
HIN213E SD = V , R1 - R5
CC
-
µs
All except HIN213E
-
µs
Transition Region Slew Rate, SR
R
= 3kΩ, C = 1000pF Measured from +3V to -3V
3
V/µs
T
L
L
or -3V to +3V, 1 Transmitter Switching (Note 2)
TRANSMITTER OUTPUTS
Output Voltage Swing, T
OUT
Transmitter Outputs, 3kΩ to Ground
±5
300
-
±9
-
±10
V
Ω
Output Resistance, R
OUT
V
= V+ = V- = 0V, V
OUT
= ±2V
-
-
CC
RS-232 Output Short Circuit Current, I
ESD PERFORMANCE
RS-232 Pins
T
Shorted to GND
±10
mA
SC
OUT
Human Body Model
-
-
-
-
±15
±8
-
-
-
-
kV
kV
kV
kV
(T , R )
OUT IN
IEC1000-4-2 Contact Discharge
IEC1000-4-2 Air Gap (Note 3)
Human Body Model
±15
±2
All Other Pins
NOTES:
2. Guaranteed by design.
3. Meets Level 4.
10
HIN202E thru HIN241E
Test Circuits (HIN232E)
+4.5V TO
+5.5V INPUT
C1+
V+
1
2
3
4
5
6
7
8
16
15
14
V
CC
GND
T1
-
+
0.1µF
C3
C1-
C2+
C2-
OUT
V
C1+
V+
1
2
3
4
5
6
7
8
16
CC
R1 13
IN
+
0.1µF
3kΩ
GND 15
R1
12
11
10
9
C1
-
OUT
T1
C1-
C2+
C2-
V-
14
13
12
11
T1 OUTPUT
OUT
T1
IN
V-
R1
IN
RS-232 ±30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
+
T2
0.1µF
T2
IN
OUT
C2
-
R1
OUT
R2
IN
-
R2
OUT
+
T1
IN
0.1µF C4
T2
TTL/CMOS INPUT
T2 10
IN
OUT
3kΩ
R
= V /I T2
IN
OUT
OUT
R2
OUT
9
TTL/CMOS OUTPUT
R2
IN
T1
OUT
T2
OUTPUT
V
= ±2V
A
IN
RS-232
±30V INPUT
FIGURE 1. GENERAL TEST CIRCUIT
FIGURE 2. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
VOLTAGE DOUBLER
VOLTAGE INVERTER
S5
S1
S3
S2
S4
C2+
C1+
V+ = 2V
S6
CC
V
GND
CC
+
+
+
+
C3
C2
C4
C1
-
-
-
-
V
GND
CC
GND
V- = - (V+)
C1-
C2-
S7
S8
RC
OSCILLATOR
FIGURE 3. CHARGE PUMP
voltage doubler section (V+) is approximately 200Ω, and the
output impedance of the voltage inverter section (V-) is
approximately 450Ω. A typical application uses 0.1µF
capacitors for C1-C4, however, the value is not critical.
Increasing the values of C1 and C2 will lower the output
impedance of the voltage doubler and inverter, increasing
the values of the reservoir capacitors, C3 and C4, lowers the
ripple on the V+ and V- supplies.
Detailed Description
The HIN2XXE family of high-speed RS-232
transmitters/receivers are powered by a single +5V power
supply, feature low power consumption, and meet all ElA
RS232C and V.28 specifications. The circuit is divided into
three sections: the charge pump, transmitter, and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 3. The charge pump contains two sections: the
voltage doubler and the voltage inverter. Each section is
driven by a two phase, internally generated clock to generate
+10V and -10V. The nominal clock frequency is 125kHz.
During phase one of the clock, capacitor C1 is charged to
During shutdown mode (HIN206E, HIN211E, HIN213E,
HIN236E and HIN241E) the charge pump is turned off, V+ is
pulled down to V , V- is pulled up to GND, and the supply
CC
current is reduced to less than 10µA. The transmitter outputs
are disabled and the receiver outputs (except for HIN213E,
R4 and R5) are placed in the high impedance state.
V
. During phase two, the voltage on C1 is added to V
,
CC
CC
Transmitters
producing a signal across C3 equal to twice V . During
CC
phase two, C2 is also charged to 2V , and then during
CC
phase one, it is inverted with respect to ground to produce a
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic
signal across C4 equal to -2V . The charge pump accepts
input voltages up to 5.5V. The output impedance of the
threshold is about 26% of V , or 1.3V for V
CC
= 5V. A logic
CC
CC
1 at the input results in a voltage of between -5V and V- at
11
HIN202E thru HIN241E
the output, and a logic 0 results in a voltage between +5V
HIN213E Operation in Shutdown
and (V+ -0.6V). Each transmitter input has an internal 400kΩ
pullup resistor so any unused input can be left unconnected
and its output remains in its low state. The output voltage
swing meets the RS-232C specifications of ±5V minimum
with the worst case conditions of: all transmitters driving 3kΩ
The HIN213E features two receivers, R4 and R5, which
remain active in shutdown mode. During normal operation
the receivers propagation delay is typically 0.5µs. This
propagation delay may increase slightly during shutdown.
When entering shut down mode, receivers R4 and R5 are
minimum load impedance, V
= 4.5V, and maximum
CC
not valid for 80µs after SD = V . When exiting shutdown
IL
allowable operating temperature. The transmitters have an
internally limited output slew rate which is less than 30V/µs.
The outputs are short circuit protected and can be shorted to
ground indefinitely. The powered down output impedance is
a minimum of 300Ω with ±2V applied to the outputs and
mode, all receiver outputs will be invalid until the charge
pump circuitry reaches normal operating voltage. This is
typically less than 2ms when using 0.1µF capacitors.
Application Information
V
= 0V.
CC
The HIN2XXE may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
Receivers
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
(V
= 0V). The receivers have a typical input threshold of
CC
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 7. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
0V to V . The output will be low whenever the input is
CC
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis (except during shutdown) to improve noise
rejection. The receiver Enable line EN, (EN on HIN213E)
when unasserted, disables the receiver outputs, placing
them in the high impedance mode. The receiver outputs are
also placed in the high impedance state when in shutdown
mode (except HIN213E R4 and R5).
In applications requiring four RS-232 inputs and outputs
(Figure 8), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
V+
V
CC
400kΩ
300Ω
T
XIN
T
+5V
OUT
-
+
GND < T
< V
CC
XIN
V-
V- < V
TOUT
< V+
16
CTR (20) DATA
TERMINAL READY
1
+
C1
0.1µF
3
4
DSRS (24) DATA
SIGNALING RATE
SELECT
-
HIN232E
FIGURE 4. TRANSMITTER
6
+
-
+
C2
RS-232
5
0.1µF
V
-
CC
INPUTS AND OUTPUTS
T1
T2
11
14
TD
TD (2) TRANSMIT DATA
R
XIN
R
OUT
10
12
7
-30V < R
< +30V
XIN
GND < V
< V
CC
5kΩ
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
INPUTS RTS
OUTPUTS
TTL/CMOS
ROUT
13
GND
RD
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
FIGURE 5. RECEIVER
T
IN
OR
15
SIGNAL GROUND (7)
R
IN
T
FIGURE 7. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
OUT
OR
V
OL
V
OL
R
OUT
t
t
PLH
PHL
t
t
PHL + PLH
AVERAGE PROPAGATION DELAY =
2
FIGURE 6. PROPAGATION DELAY DEFINITION
12
HIN202E thru HIN241E
1
4
+
C2
+
C1
0.1µF
HIN232E
5
3
0.1µF
-
-
T1
11
14
TD
RTS
RD
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
T2
10
12
7
INPUTS
OUTPUTS
TTL/CMOS
13
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
15
V
16
CC
6
6
2
2
C4
C3
+5V
-
-
V- V+
RS-232
INPUTS AND OUTPUTS
0.2µF
0.2µF
V
16
4
CC
HIN232E
1
+
+
C1
C2
5
0.1µF
3
0.1µF
-
-
T1
T2
11
14
DTR
DSRS
DCD
R1
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
10
12
7
INPUTS
OUTPUTS
TTL/CMOS
13
R2
R1
9
8
15
SIGNAL GROUND (7)
FIGURE 8. COMBINING TWO HIN232Es FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
Typical Performance Curves
12
10
8
12
10
8
0.1µF
V+ (V
CC
= 5V)
6
6
V+ (V
= 4V)
= 5V)
CC
V- (V
CC
= 4V)
4
4
o
T
= 25 C
A
2
2
V- (V
CC
TRANSMITTER OUTPUTS
OPEN CIRCUIT
0
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
0
5
10
15
|I
20
25
30
35
V
CC
| (mA)
LOAD
FIGURE 9. V- SUPPLY VOLTAGE vs V
FIGURE 10. V+, V- OUTPUT VOLTAGE vs LOAD
CC
13
HIN202E thru HIN241E
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
128 mils x 77 mils
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
METALLIZATION:
Type: Al
Thickness: 10kÅ ±1kÅ
TRANSISTOR COUNT:
185
SUBSTRATE POTENTIAL
PROCESS:
GND
CMOS Metal Gate
Metallization Mask Layout
HIN232E
V-
C2-
C2+
C1-
PIN 6
PIN 5
PIN 4
PIN 3
PIN 2 V+
PIN 1 C1+
T2
OUT
PIN 7
PIN 8
R2
IN
T3
PIN 9
OUT
PIN 17 V
CC
R2
PIN 10
OUT
PIN 11
T2
PIN 12
T1
PIN 13
PIN 14
R1
PIN 15
T1
OUT
PIN 16
GND
R1
IN
IN
OUT
IN
14
HIN202E thru HIN241E
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
INCHES
MILLIMETERS
1
2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
18.66
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
0.775
-
4.95
0.558
1.77
0.355
19.68
-
-
A2
A
-C-
-
SEATING
PLANE
B1
C
8, 10
L
C
L
-
D1
B1
eA
A1
A
D1
e
D
5
eC
C
B
D1
E
5
eB
0.010 (0.25) M
C
B S
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
e
A
6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
e
-
0.430
0.150
-
10.92
3.81
7
B
L
0.115
2.93
4
9
4. Dimensions A, A1 and L are measured with the package seated in JE-
N
16
16
DEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
15
HIN202E thru HIN241E
Dual-In-Line Plastic Packages (PDIP)
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
N
E1
INDEX
AREA
1
2
3
N/2
INCHES
MILLIMETERS
-B-
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-A-
A
A1
A2
B
-
4
D
E
0.015
0.115
0.014
0.045
0.008
1.230
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
31.24
0.13
7.62
6.10
4
BASE
PLANE
A2
A
0.195
0.022
0.070
0.014
1.280
-
4.95
0.558
1.77
0.355
32.51
-
-
-C-
SEATING
PLANE
-
L
C
L
B1
C
8
D1
B1
eA
A1
A
D1
-
e
eC
C
B
D
5
eB
0.010 (0.25) M
C
B S
D1
E
5
0.325
0.280
8.25
7.11
6
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
E1
e
5
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
e
e
6
A
B
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
-
0.430
0.150
-
10.92
3.81
7
4. Dimensions A, A1 and L are measured with the package seated in
L
0.115
2.93
4
9
JEDEC seating plane gauge GS-3.
N
24
24
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
Rev. 0 12/93
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
16
HIN202E thru HIN241E
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
N
INDEX
AREA
0.25(0.010)
M
B M
H
E
INCHES
MILLIMETERS
-B-
SYMBOL
MIN
MAX
0.0688
0.0098
0.020
MIN
1.35
0.10
0.33
0.19
9.80
3.80
MAX
1.75
0.25
0.51
0.25
10.00
4.00
NOTES
A
A1
B
C
D
E
e
0.0532
0.0040
0.013
-
1
2
3
L
-
SEATING PLANE
A
9
-A-
0.0075
0.3859
0.1497
0.0098
0.3937
0.1574
-
o
h x 45
D
3
4
-C-
α
0.050 BSC
1.27 BSC
-
e
A1
C
H
h
0.2284
0.0099
0.016
0.2440
0.0196
0.050
5.80
0.25
0.40
6.20
0.50
1.27
-
B
0.10(0.004)
5
0.25(0.010) M
C
A M B S
L
6
N
α
16
16
7
NOTES:
o
o
o
o
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
17
HIN202E thru HIN241E
Small Outline Plastic Packages (SSOP)
M16.209 (JEDEC MO-150-AC ISSUE B)
N
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
0.078
-
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
-
-
0.002
0.065
0.009
0.004
0.233
0.197
0.05
1.65
0.22
0.09
5.90
5.00
1
2
3
0.072
0.014
0.009
0.255
0.220
1.85
0.38
0.25
6.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-
-A-
C
D
E
D
3
4
-
-C-
α
e
0.026 BSC
0.65 BSC
A2
e
A1
C
H
L
0.292
0.022
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
6
7
-
0.25(0.010) M
C
A M B S
N
α
16
16
o
o
o
o
0
8
0
8
NOTES:
Rev. 2 3/95
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
18
HIN202E thru HIN241E
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
10.50
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.3977
0.2914
-
-A-
o
0.4133 10.10
3
h x 45
D
0.2992
7.40
4
-C-
0.050 BSC
1.27 BSC
-
α
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
α
16
16
7
o
o
o
o
0
8
0
8
-
NOTES:
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
19
HIN202E thru HIN241E
Shrink Small Outline Plastic Packages (SSOP)
M24.209 (JEDEC MO-150-AG ISSUE B)
N
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
0.078
-
-
0.002
0.065
0.009
0.004
0.312
0.197
-
0.05
1.65
0.22
0.09
7.90
5.00
1
2
3
0.072
0.014
0.009
0.334
0.220
1.85
0.38
0.25
8.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-
-A-
C
D
E
D
3
4
-
-C-
α
e
0.026 BSC
0.65 BSC
A2
e
A1
C
H
L
0.292
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
0.022
6
7
-
0.25(0.010) M
C
A M B S
N
α
24
24
o
o
o
o
0
8
0
8
NOTES:
Rev. 1 3/95
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
20
HIN202E thru HIN241E
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
15.60
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.020
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.5985
0.2914
0.0125
-
-A-
o
0.6141 15.20
3
h x 45
D
0.2992
7.40
4
-C-
0.05 BSC
1.27 BSC
-
α
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
α
24
24
7
o
o
o
o
0
8
0
8
-
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
21
HIN202E thru HIN241E
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
0.078
-
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
-
0.002
0.065
0.009
0.004
0.390
0.197
0.05
1.65
0.22
0.09
9.90
5.00
-
1
2
3
0.072
0.014
0.009
0.413
0.220
1.85
0.38
0.25
10.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-A-
C
D
E
-
D
3
-C-
4
α
e
0.026 BSC
0.65 BSC
-
A2
e
A1
C
H
L
0.292
0.022
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
6
0.25(0.010) M
C
A M B S
N
α
28
28
7
o
o
o
o
NOTES:
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
Rev. 1 3/95
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual in-
dex feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
22
HIN202E thru HIN241E
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
18.10
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.6969
0.2914
-
-A-
0.7125 17.70
3
o
h x 45
D
0.2992
7.40
4
0.05 BSC
1.27 BSC
-
-C-
α
H
h
0.394
0.01
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
0.016
6
0.25(0.010) M
C
A M B S
N
α
28
28
7
o
o
o
o
0
8
0
8
-
NOTES:
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Sales Office Headquarters
NORTH AMERICA
EUROPE
ASIA
Intersil Corporation
Intersil SA
Intersil Ltd.
2401 Palm Bay Rd., Mail Stop 53-204
Palm Bay, FL 32905
TEL: (321) 724-7000
FAX: (321) 724-7240
Mercure Center
8F-2, 96, Sec. 1, Chien-kuo North,
Taipei, Taiwan 104
Republic of China
TEL: 886-2-2515-8508
FAX: 886-2-2515-8369
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
23
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