HIN202CA-T [ETC]
Transceiver ; 收发器\n
| 型号： | HIN202CA-T |
| 厂家： | 
ETC |
| 描述： | Transceiver
|
| 文件： | 总20页 (文件大小：546K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
TM
Data Sheet
August 2001
File Number 3980.12
+5V Powered RS-232
Features
Transmitters/Receiverswith0.1Microfarad
External Capacitors
• Meets All RS-232E and V.28 Specifications
• Requires Only 0.1µF or Greater External Capacitors
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . .120kbit/s
• Two Receivers Active in Shutdown Mode (HIN213)
• Requires Only Single +5V Power Supply
The HIN202-HIN213 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28
specifications, and are particularly suited for those
applications where 12V is not available. They require a
single +5V power supply and feature onboard charge pump
voltage converters which generate +10V and -10V supplies
from the 5V supply The family of devices offers a wide
variety of RS-232 transmitter/receiver combinations to
accommodate various applications (see Selection Table).
• Onboard Voltage Doubler/Inverter
• Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA
• Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1µA
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
The HIN206, HIN211 and HIN213 feature a low power
shutdown mode to conserve energy in battery powered
applications. In addition, the HIN213 provides two active
receivers in shutdown mode allowing for easy “wakeup”
capability.
-
10V Output Swing for +5V lnput
- 300Ω Power-Off Source Impedance
- Output Current Limiting
The drivers feature true TTL/CMOS input compatibility, slew
rate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to 30V input, and have a 3kΩ
to 7kΩ input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
- TTL/CMOS Compatible
- 30V/µs Maximum Slew Rate
• Multiple Receivers
-
30V Input Voltage Range
- 3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
Applications
• Any System Requiring RS-232 Communications Port
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
NUMBER OF
0.1µF
EXTERNAL
NUMBER OF
RECEIVERS
ACTIVE IN
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
PART
NUMBER
POWER SUPPLY
VOLTAGE
CAPACITORS
SHUTDOWN
HIN202
+5V
+5V
+5V
5V
2
4
5
4
4
4
2
3
3
4
5
5
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
No/No
Yes/Yes
No/No
0
0
0
0
0
2
HIN206
HIN207
HIN208
HIN211
HIN213
No/No
+5V
+5V
Yes/Yes
Yes/Yes
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. | Copyright © Intersil Americas Inc. 2001
1
HIN202 thru HIN213
Ordering Information
o
PART NO.
HIN202CA-T
HIN202CBN
HIN202CB
HIN202IB
TEMP. RANGE ( C)
PACKAGE
16 Ld SSOP, Tape and Reel
16 Ld SOIC (N)
16 Ld SOIC (W)
16 Ld SOIC (W)
16 Ld PDIP
PKG. NO.
M16.209
0 to 70
0 to 70
0 to 70
-40 to 85
0 to 70
0 to 70
-40 to 85
0 to 70
0 to 70
-40 to 85
0 to 70
0 to 70
-40 to 85
0 to 70
0 to 70
0 to 70
-40 to 85
0 to 70
0 to 70
M16.15
M16.3
M16.3
HIN202CP
HIN206CB
HIN206IB
E16.3
24 Ld SOIC
M24.3
24 Ld SOIC
M24.3
HIN207CA
HIN207CB
HIN207IB
24 Ld SSOP
M24.209
M24.3
24 Ld SOIC
24 Ld SOIC
M24.3
HIN207CP
HIN208CA
HIN208IA
24 Ld PDIP (N)
24 Ld SSOP
E24.3
M24.209
M24.209
M24.3
24 Ld SSOP
HIN208CB
HIN208CP
HIN211CA
HIN211IA
24 Ld SOIC
24 Ld PDIP (N)
28 Ld SSOP
E24.3
M28.209
M28.209
M28.3
28 Ld SSOP
HIN211CB
HIN213CA
28 Ld SOIC
28 Ld SSOP
M28.209
NOTE: Most surface mount devices are available on tape and reel; add “-T” to suffix.
Pin Descriptions
PIN
FUNCTION
V
Power Supply Input 5V 10%, (5V 5% HIN207).
Internally generated positive supply (+10V nominal).
Internally generated negative supply (-10V nominal).
Ground Lead. Connect to 0V.
CC
V+
V-
GND
C1+
C1-
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
C2+
C2-
T
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to V
is connected to each lead.
CC
IN
T
Transmitter Outputs. These are RS-232 levels (nominally 10V).
OUT
R
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
IN
R
Receiver Outputs. These are TTL/CMOS levels.
OUT
EN, EN
SD, SD
NC
Enable Input. This is an active low input which enables the receiver outputs. With EN = 5V, (HIN213 EN = 0V), the outputs are placed
in a high impedance state.
Shutdown Input. With SD = 5V (HIN213 SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state
(except R4 and R5 of HIN213) and the transmitters are shut off.
No Connect. No connections are made to these leads.
2
HIN202 thru HIN213
Pinouts
HIN202 (PDIP, SOIC, SSOP)
HIN206 (PDIP, SOIC, SSOP)
TOP VIEW
TOP VIEW
1
2
24
23
22
21
20
19
18
17
16
15
14
13
T3
T1
T2
T4
OUT
OUT
OUT
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
C1+
V+
V
CC
R2
IN
GND
T1
3
R2
OUT
C1-
C2+
C2-
V-
OUT
4
R1
SD
EN
T4
IN
R1
R1
T1
IN
5
R1
OUT
OUT
6
T2
IN
IN
IN
11
10
9
7
T1
T3
IN
IN
IN
T2
8
T2
R3
R3
V-
GND
OUT
OUT
IN
9
V
R2
OUT
R2
CC
IN
10
11
12
C1+
V+
C2-
C2+
C1-
+5V
+5V
9
0.1µF
10
+
12
16
V
+
+
CC
C1+
11
V+
V-
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
C1-
V
CC
13
+
14
1
0.1µF
C2+
C1+
+
+
+10V TO -10V
VOLTAGE INVERTER
+
+
2
+5V TO 10V
VOLTAGE INVERTER
15
2
0.1µF
0.1µF
0.1µF
V+
V-
3
4
C2-
0.1µF
C1-
+5V
T1
T2
C2+
400kΩ
7
+10V TO -10V
VOLTAGE INVERTER
T1
T1
IN
6
OUT
5
C2-
0.1µF
+5V
400kΩ
6
3
1
T2
T2
IN
OUT
+5V
T1
14
400kΩ
11
T1
T1
IN
+5V
OUT
T3
T4
400kΩ
400kΩ
18
T3
T4
T3
IN
OUT
+5V
T2
+5V
400kΩ
10
12
7
T2
T2
IN
OUT
IN
19
5
24
4
T4
IN
OUT
13
R1
R1
R1
IN
IN
R1
OUT
OUT
5kΩ
5kΩ
5kΩ
5kΩ
R1
R1
22
23
R2
R2
9
8
OUT
R2
R2
IN
OUT
R2
R2
17
20
16
21
R3
GND
R3
IN
OUT
EN
5kΩ
R3
15
SD
GND
8
3
HIN202 thru HIN213
Pinouts (Continued)
HIN207 (PDIP, SOIC, SSOP)
HIN208 (PDIP, SOIC, SSOP)
TOP VIEW
TOP VIEW
T3
T1
T2
1
2
3
4
5
6
7
8
9
24 T4
OUT
OUT
OUT
OUT
T2
T1
T3
24
23
22
21
20
19
18
17
16
15
14
13
1
2
OUT
OUT
23 R2
IN
R3
R3
T4
OUT
IN
R2
22
21
20
19
18
17
16
OUT
R2
3
IN
OUT
R1
T5
IN
IN
R2
4
OUT
IN
R1
T5
T4
T3
OUT
OUT
T1
IN
T4
T3
T2
5
OUT
IN
T2
IN
IN
R1
6
OUT
T1
IN
IN
R1
IN
7
IN
R3
GND
OUT
IN
R4
R4
V-
GND
8
OUT
V
R3
CC
V
9
CC
IN
C1+ 10
V+ 11
15 V-
C1+
V+
10
11
12
14 C2-
13 C2+
C2-
C1-
12
C1-
C2+
+5V
9
+5V
9
0.1µF
10
V
0.1µF
+
+
CC
C1+
10
+
12
V
11
+
12
+
+
CC
C1+
V+
0.1µF
0.1µF
11
+5V TO 10V
VOLTAGE DOUBLER
V+
V-
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
C1-
C1-
13
+
14
C2+
13
+
14
+10V TO -10V
VOLTAGE INVERTER
C2+
15
2
V-
+10V TO -10V
VOLTAGE INVERTER
15
2
0.1µF
C2-
0.1µF
C2-
0.1µF
+5V
T1
+5V
T1
T2
400kΩ
7
T1
T1
IN
400kΩ
5
OUT
T1
T1
IN
OUT
+5V
T2
+5V
+5V
+5V
400kΩ
6
3
T2
T2
IN
OUT
400kΩ
18
19
1
T2
T2
IN
OUT
+5V
+5V
+5V
T3
T4
T5
400kΩ
400kΩ
400kΩ
T3
T4
18
19
1
T3
T3
IN
400kΩ
400kΩ
24
OUT
T3
T4
T3
IN
OUT
OUT
24
T4
T4
IN
OUT
21
6
20
7
T4
IN
21
5
20
4
R1
R1
T5
T5
IN
IN
OUT
OUT
5kΩ
R1
R1
R1
IN
OUT
4
22
17
3
5kΩ
5kΩ
R1
R2
R3
R4
R2
R3
R4
IN
IN
IN
OUT
OUT
OUT
5kΩ
5kΩ
5kΩ
R2
R3
22
17
23
16
R2
R2
IN
OUT
23
16
R2
R3
R3
IN
OUT
5kΩ
R3
R4
GND
GND
8
8
4
HIN202 thru HIN213
Pinouts (Continued)
HIN211 (SOIC, SSOP)
HIN213 (SOIC, SSOP)
TOP VIEW
TOP VIEW
28 T4
OUT
T3
T1
T2
1
2
3
4
5
6
7
8
9
28 T4
OUT
T3
T1
T2
1
2
3
4
5
6
7
8
9
OUT
OUT
OUT
OUT
OUT
OUT
27 R3
27 R3
IN
IN
26 R3
26 R3
OUT
OUT
25 SD
24 EN
23 R4
R2
25 SD
24 EN
23 R4
R2
IN
IN
R2
R2
OUT
OUT
T2
IN
T2
IN
IN
IN
22 R4
21 T4
T1
IN
T1
IN
22 R4
21 T4
OUT
OUT
R1
R1
OUT
IN
IN
OUT
IN
IN
20
R1
IN
T3
20
R1
IN
T3
19 R5
18 R5
17 V-
GND 10
11
GND 10
11
19 R5
18 R5
17 V-
OUT
IN
OUT
IN
V
V
CC
CC
C1+ 12
V+ 13
C1+ 12
V+ 13
16 C2-
15 C2+
16
C2-
C1- 14
15 C2+
C1- 14
NOTE: R4 and R5 active in shutdown.
+5V
11
+5V
11
0.1µF
0.1µF
12
12
+
14
V
V
+
+
CC
+
+
C1+
CC
C1+
13
+
13
V+
V-
0.1µF
0.1µF
V+
V-
0.1µF
0.1µF
+5V TO 10V
VOLTAGE DOUBLER
+5V TO 10V
VOLTAGE DOUBLER
14
C1-
C1-
15
15
+
16
C2+
C2+
+
+10V TO -10V
VOLTAGE INVERTER
+10V TO -10V
VOLTAGE INVERTER
17
2
17
2
16
C2-
C2-
0.1µF
0.1µF
+5V
+5V
T1
T1
400kΩ
400kΩ
7
7
T1
T1
IN
T1
T1
IN
OUT
OUT
+5V
+5V
+5V
T2
T3
T4
+5V
+5V
+5V
T2
T3
T4
400kΩ
400kΩ
400kΩ
6
3
1
400kΩ
400kΩ
400kΩ
6
3
1
T2
T3
T4
T2
IN
T2
T3
T4
T2
IN
OUT
OUT
20
20
T3
IN
T3
IN
OUT
OUT
OUT
OUT
21
8
28
9
21
8
28
9
T4
IN
T4
IN
R1
R1
R1
R1
IN
OUT
IN
OUT
5kΩ
5kΩ
R1
R1
5
26
22
4
5
26
22
4
R2
R3
R4
R2
R3
R4
R5
R2
R3
R4
R2
R3
R4
R5
IN
IN
IN
IN
OUT
OUT
OUT
IN
IN
IN
OUT
OUT
OUT
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
R2
R3
R4
R2
R3
R4
27
23
27
23
19
24
18
25
19
24
18
25
R5
R5
OUT
IN
OUT
5kΩ
5kΩ
R5
R5
EN
SD
SD
EN
GND
GND
10
10
5
HIN202 thru HIN213
Absolute Maximum Ratings
Thermal Information
o
V
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <V
< 6V
-0.3V) <V+ < 12V
Thermal Resistance (Typical, Note 1)
θ
( C/W)
CC
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (V
CC
JA
CC
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . .
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
115
100
90
75
135
75
70
100
o
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)
IN
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
IN
Output Voltages
T
R
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
< (V+ +0.3V)
< (V+ +0.3V)
OUT
TXOUT
RXOUT
OUT
Short Circuit Duration
Maximum Junction Temperature (Plastic Package) . . . . . . . .150 C
o
o
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
OUT
Maximum Storage Temperature Range. . . . . . . . . . -65 C to 150 C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300 C
o
OUT
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
(SOIC and SSOP - Lead Tips Only)
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 C to 70 C
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 C to 85 C
o
o
o
o
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ is measured with the component mounted on an evaluation PC board in free air.
JA
Electrical Specifications Test Conditions: V
= +5V 10%, (V
= +5V 5%, HIN207); C1-C4 = 0.1µF;
CC
CC
= Operating Temperature Range
T
A
PARAMETER
SUPPLY CURRENTS
Power Supply Current, I
TEST CONDITIONS
MIN
TYP
MAX
UNITS
No Load,
HIN202
-
-
-
-
8
11
1
15
20
10
50
mA
mA
µA
CC
o
T
= 25 C
A
HIN206 - HIN213
HIN206, HIN211
HIN213
o
Shutdown Supply Current, I (SD)
CC
T
= 25 C
A
15
µA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
T
T
, EN, SD, EN, SD
-
2.0
2.4
-
-
-
0.8
-
V
V
lL
IN
Input Logic High, V
lH
IN
EN, SD, EN, SD
= 0V
-
-
V
Transmitter Input Pullup Current, I
T
15
0.1
200
0.4
µA
V
P
IN
TTL/CMOS Receiver Output Voltage Low, V
I
= 1.6mA
-
OL
OUT
(HIN202, I
= 3.2mA)
OUT
= -1mA
TTL/CMOS Receiver Output Voltage High, V
TTL/CMOS Receiver Output Leakage
RECEIVER INPUTS
I
3.5
-
4.6
-
V
OH
OUT
EN = V , EN = 0, 0V < R
CC
< V
CC
0.05
10
µA
OUT
RS-232 Input Voltage Range, V
IN
-30
3.0
0.8
0.6
-
+30
V
kΩ
V
o
Receiver Input Impedance, R
T
= 25 C, V
=
3V
Active Mode
Shutdown Mode
5.0
1.2
1.5
7.0
IN
A
IN
Receiver Input Low Threshold, V (H-L)
V
= 5V,
-
-
IN
CC
= 25 C
o
T
A
V
HIN213 R4 and R5
Receiver Input High Threshold, V (L-H)
IN
V
= 5V,
Active Mode
-
-
1.7
1.5
2.4
2.4
V
V
CC
= 25 C
o
T
A
Shutdown Mode
HIN213 R4 and R5
6
HIN202 thru HIN213
Electrical Specifications Test Conditions: V
= +5V 10%, (V
= Operating Temperature Range (Continued)
= +5V 5%, HIN207); C1-C4 = 0.1µF;
CC
CC
T
A
PARAMETER
Receiver Input Hysteresis, V
TEST CONDITIONS
MIN
TYP
MAX
UNITS
V
= 5V
0.2
0.5
1.0
V
HYST
CC
No Hysteresis in Shutdown Mode
TIMING CHARACTERISTICS
Baud Rate
1 Transmitter
Switching
R
= 3kΩ
120
-
-
kbps
L
Output Enable Time, t
HIN206, HIN211, HIN213
HIN206, HIN211, HIN213
HIN213 SD = 0V, R4, R5
-
-
400
200
0.5
0.5
0.5
-
-
ns
ns
EN
Output Disable Time, t
-
DIS
Transmitter, Receiver Propagation Delay, t
-
40
10
10
30
µs
PD
HIN213 SD = V , R1 - R5
CC
-
µs
HIN202 - HIN211
-
µs
Transition Region Slew Rate, SR
R
= 3kΩ, C = 2500pF Measured from
3
V/µs
T
L
L
+3V to -3V or -3V to +3V, 1 Transmitter
Switching (Note 2)
TRANSMITTER OUTPUTS
Output Voltage Swing, T
OUT
Transmitter Outputs, 3kΩ to Ground
5
300
-
9
-
10
-
V
Ω
Output Resistance, R
V
= V+ = V- = 0V, V
OUT
=
2V
OUT
CC
RS-232 Output Short Circuit Current, I
T
Shorted to GND
10
-
mA
SC
OUT
NOTE:
2. Guaranteed by design.
VOLTAGE DOUBLER
VOLTAGE INVERTER
S5
S1
S3
S2
C2+
C1+
V+ = 2V
S6
CC
V
GND
CC
+
+
+
+
C3
C2
C4
C1
-
-
-
-
V
GND
CC
V- = - (V+)
GND
C1-
S4
C2-
S7
S8
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
7
HIN202 thru HIN213
Receivers
Detailed Description
The receiver inputs accept up to 30V while presenting the
required 3kΩ to 7kΩ input impedance even if the power is off
(V = 0V). The receivers have a typical input threshold of
1.3V which is within the 3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
The HIN202 thru HIN213 family of RS-232
transmitters/receivers are powered by a single +5V power
supply feature low power consumption, and meet all ElA
RS232C and V.28 specifications. The circuit is divided into
three sections: The charge pump, transmitter, and receiver.
CC
0V to V . The output will be low whenever the input is
CC
Charge Pump
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis (except during shutdown) to improve noise
rejection. The receiver Enable line (EN on HIN206 and
HIN211, EN on HIN213) when unasserted, disables the
receiver outputs, placing them in the high impedance mode.
The receiver outputs are also placed in the high impedance
state when in shutdown mode (except HIN213 R4 and R5).
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the
voltage doubler and the voltage inverter. Each section is
driven by a two phase, internally generated clock to generate
+10V and -10V. The nominal clock frequency is 125kHz.
During phase one of the clock, capacitor C1 is charged to
V
. During phase two, the voltage on C1 is added to V
,
CC
CC
producing a signal across C3 equal to twice V . During
CC
phase two, C2 is also charged to 2V , and then during
V+
CC
phase one, it is inverted with respect to ground to produce a
V
CC
signal across C4 equal to -2V . The charge pump accepts
400kΩ
CC
300Ω
V- < V
input voltages up to 5.5V. The output impedance of the
voltage doubler section (V+) is approximately 200Ω, and the
output impedance of the voltage inverter section (V-) is
approximately 450Ω. A typical application uses 0.1µF
capacitors for C1-C4, however, the value is not critical.
Increasing the values of C1 and C2 will lower the output
impedance of the voltage doubler and inverter, increasing
the values of the reservoir capacitors, C3 and C4, lowers the
ripple on the V+ and V- supplies.
T
XIN
T
OUT
GND < T
< V
CC
XIN
< V+
TOUT
V-
FIGURE 2. TRANSMITTER
V
CC
R
XIN
R
OUT
-30V < R
< +30V
During shutdown mode (HIN206 and HIN211, SD = V
,
XIN
GND < V
< V
CC
5kΩ
ROUT
CC
HIN213, SD = 0V) the charge pump is turned off, V+ is
GND
FIGURE 3. RECEIVER
pulled down to V , V- is pulled up to GND, and the supply
CC
current is reduced to less than 10µA. The transmitter outputs
are disabled and the receiver outputs (except for HIN213, R4
and R5) are placed in the high impedance state.
T
IN
OR
R
Transmitters
IN
T
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic
OUT
V
V
OL
OL
OR
R
OUT
threshold is about 26% of V , or 1.3V for V
= 5V. A logic
t
t
PLH
CC
CC
PHL
1 at the input results in a voltage of between -5V and V- at
the output, and a logic 0 results in a voltage between +5V
and (V+ - 0.6V). Each transmitter input has an internal
400kΩ pullup resistor so any unused input can be left
unconnected and its output remains in its low state. The
output voltage swing meets the RS-232C specifications of
5V minimum with the worst case conditions of: all
t
t
PHL + PLH
2
AVERAGE PROPAGATION DELAY =
FIGURE 4. PROPAGATION DELAY DEFINITION
HIN213 Operation in Shutdown
The HIN213 features two receivers, R4 and R5, which
transmitters driving 3kΩ minimum load impedance, V
=
CC
4.5V, and maximum allowable operating temperature. The
transmitters have an internally limited output slew rate which
is less than 30V/µs. The outputs are short circuit protected
and can be shorted to ground indefinitely. The powered
down output impedance is a minimum of 300Ω with 2V
remain active in shutdown mode. During normal operation
the receivers propagation delay is typically 0.5µs. This
propagation delay may increase slightly during shutdown.
When entering shut down mode, receivers R4 and R5 are
not valid for 80µs after SD = V . When exiting shutdown
IL
applied to the outputs and V
= 0V.
CC
mode, all receiver outputs will be invalid until the charge
pump circuitry reaches normal operating voltage. This is
typically less than 2ms when using 0.1µF capacitors.
8
HIN202 thru HIN213
Typical Performance Curves
12
12
10
8
0.1µF
10
8
V+ (V
= 5V)
CC
6
6
V+ (V
= 4V)
= 5V)
CC
V- (V
CC
= 4V)
4
4
o
T
= 25 C
A
2
2
0
V- (V
CC
30
TRANSMITTER OUTPUTS
OPEN CIRCUIT
0
3.0
3.5
4.0
4.5
5.0
5.5
CC
6.0
0
5
10
15
|I
20
25
35
V
| (mA)
CC
LOAD
FIGURE 5. V- SUPPLY VOLTAGE vs V
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD
Test Circuits (HIN202)
+4.5V TO
+5.5V INPUT
C1+
V+
16
15
14
1
2
3
4
5
6
7
8
V
CC
GND
T1
-
0.1µF
C3
+
C1-
C2+
C2-
OUT
V
C1+
V+
1
2
3
4
5
6
7
8
16
CC
R1 13
IN
+
-
0.1µF
C1
3kΩ
GND 15
R1
12
11
10
9
OUT
T1
C1-
C2+
C2-
V-
14
13
12
11
T1 OUTPUT
OUT
T1
IN
V-
R1
IN
RS-232 30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
-
T2
T2
IN
0.1µF
C2
OUT
R1
OUT
R2
R2
OUT
-
IN
+
T1
IN
0.1µF C4
T2
T2 10
IN
OUT
3kΩ
R
= V /I T2
IN OUT
OUT
V
R2
OUT
9
R2
IN
T1
A
OUT
T2
OUTPUT
=
2V
IN
RS-232
30V INPUT
FIGURE 7. GENERAL TEST CIRCUIT
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
Application Information
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where 12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kW resistor
connected to V+.
9
HIN202 thru HIN213
+5V
-
+
16
1
CTR (20) DATA
TERMINAL READY
+
C1
0.1µF
3
DSRS (24) DATA
SIGNALING RATE
SELECT
-
HIN202
4
6
+
-
+
C2
0.1µF
RS-232
INPUTS AND OUTPUTS
5
-
T1
11
14
TD
TD (2) TRANSMIT DATA
T2
10
12
7
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
INPUTS RTS
OUTPUTS
TTL/CMOS
13
RD
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
15
SIGNAL GROUND (7)
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
1
4
+
+
C1
C2
HIN202
T1
5
0.1µF
3
0.1µF
-
-
11
14
TD
RTS
RD
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
T2
10
12
7
INPUTS
OUTPUTS
TTL/CMOS
13
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
15
V
16
CC
6
6
2
2
C4
C3
+5V
-
-
V- V+
RS-232
INPUTS AND OUTPUTS
0.2µF
0.2µF
V
16
4
CC
HIN202
T1
1
+
+
C1
0.1µF
C2
0.1µF
5
3
-
-
11
14
DTR
DSRS
DCD
R1
DTR (20) DATA TERMINAL READY
T2
10
12
7
INPUTS
OUTPUTS
TTL/CMOS
DSRS (24) DATA SIGNALING RATE SELECT
13
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
R2
R1
9
8
15
SIGNAL GROUND (7)
FIGURE 10. COMBINING TWO HIN202s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
10
HIN202 thru HIN213
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
Type: Nitride over Silox
160 mils x 140 mils
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
METALLIZATION:
Type: Al
TRANSISTOR COUNT:
Thickness: 10kÅ 1kÅ
SUBSTRATE POTENTIAL
V+
238
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
HIN211
SHD
EN
R4
IN
R4
T4 T3
IN IN
R5
OUT
R5
IN
OUT
R3
OUT
V-
C2-
R3
IN
T4
OUT
C2+
C1-
T3
OUT
T1
T2
OUT
V+
OUT
C1+
R2
IN
V
CC
R2
OUT
T2 T1 R1
IN IN OUT
R1 GND
IN
11
HIN202 thru HIN213
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INCHES
MILLIMETERS
INDEX
AREA
1
2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
18.66
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
0.775
-
4.95
0.558
1.77
0.355
19.68
-
-
A2
A
-C-
-
SEATING
PLANE
B1
C
8, 10
L
C
L
-
D1
B1
eA
A1
A
D1
e
D
5
eC
B S
C
B
D1
E
5
eB
0.010 (0.25) M
C
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
e
A
6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
e
-
0.430
0.150
-
10.92
3.81
7
B
L
0.115
2.93
4
9
4. Dimensions A, A1 and L are measured with the package seated in JE-
N
16
16
DEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
12
HIN202 thru HIN213
Dual-In-Line Plastic Packages (PDIP)
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
N
E1
INDEX
AREA
1
2
3
N/2
INCHES
MILLIMETERS
-B-
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-A-
A
A1
A2
B
-
4
D
E
0.015
0.115
0.014
0.045
0.008
1.230
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
31.24
0.13
7.62
6.10
4
BASE
PLANE
A2
A
0.195
0.022
0.070
0.014
1.280
-
4.95
0.558
1.77
0.355
32.51
-
-
-C-
SEATING
PLANE
-
L
C
L
B1
C
8
D1
B1
eA
A1
A
D1
-
e
eC
B S
C
B
D
5
eB
0.010 (0.25) M
C
D1
E
5
0.325
0.280
8.25
7.11
6
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
E1
e
5
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
e
e
6
A
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
-
0.430
0.150
-
10.92
3.81
7
B
4. Dimensions A, A1 and L are measured with the package seated in
L
0.115
2.93
4
9
JEDEC seating plane gauge GS-3.
N
24
24
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
Rev. 0 12/93
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
13
HIN202 thru HIN213
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
N
INDEX
AREA
0.25(0.010)
M
B M
H
E
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
0.0688
0.0098
0.020
MIN
1.35
0.10
0.33
0.19
9.80
3.80
MAX
1.75
0.25
0.51
0.25
10.00
4.00
NOTES
-B-
A
A1
B
C
D
E
e
0.0532
0.0040
0.013
-
1
2
3
L
-
9
SEATING PLANE
A
0.0075
0.3859
0.1497
0.0098
0.3937
0.1574
-
-A-
o
h x 45
D
3
4
-C-
0.050 BSC
1.27 BSC
-
α
µ
e
H
h
0.2284
0.0099
0.016
0.2440
0.0196
0.050
5.80
0.25
0.40
6.20
0.50
1.27
-
A1
C
B
5
0.10(0.004)
L
6
0.25(0.010) M
C A M B S
N
α
16
16
7
NOTES:
o
o
o
o
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
14
HIN202 thru HIN213
Small Outline Plastic Packages (SSOP)
M16.209 (JEDEC MO-150-AC ISSUE B)
N
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
0.078
-
MIN
-
MAX
2.00
-
NOTES
GAUGE
PLANE
-B-
A
A1
A2
B
-
-
-
0.002
0.065
0.009
0.004
0.233
0.197
0.05
1.65
0.22
0.09
5.90
5.00
1
2
3
0.072
0.014
0.009
0.255
0.220
1.85
0.38
0.25
6.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-
-A-
C
D
E
D
3
4
-
-C-
α
µ
e
0.026 BSC
0.65 BSC
A2
e
A1
C
H
L
0.292
0.022
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
6
7
-
0.25(0.010) M
C
A M B S
N
α
16
16
o
o
o
o
0
8
0
8
NOTES:
Rev. 2 3/95
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
15
HIN202 thru HIN213
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
10.50
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.3977
0.2914
-
-A-
o
0.4133 10.10
3
h x 45
D
0.2992
7.40
4
-C-
0.050 BSC
1.27 BSC
-
α
µ
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C A M B S
N
α
16
16
7
o
o
o
o
0
8
0
8
-
NOTES:
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
16
HIN202 thru HIN213
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
N
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
0.30
0.51
0.32
15.60
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.020
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.5985
0.2914
0.0125
-
-A-
o
0.6141 15.20
3
h x 45
D
0.2992
7.40
4
-C-
0.05 BSC
1.27 BSC
-
α
µ
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C A M B S
N
α
24
24
7
o
o
o
o
0
8
0
8
-
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
17
HIN202 thru HIN213
Shrink Small Outline Plastic Packages (SSOP)
M24.209 (JEDEC MO-150-AG ISSUE B)
N
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
0.078
-
-
0.002
0.065
0.009
0.004
0.312
0.197
-
0.05
1.65
0.22
0.09
7.90
5.00
1
2
3
0.072
0.014
0.009
0.334
0.220
1.85
0.38
0.25
8.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-
-A-
C
D
E
D
3
4
-
-C-
α
µ
e
0.026 BSC
0.65 BSC
A2
e
A1
C
H
L
0.292
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
0.022
6
7
-
0.25(0.010) M
C
A M B S
N
α
24
24
o
o
o
o
0
8
0
8
NOTES:
Rev. 1 3/95
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
18
HIN202 thru HIN213
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
17.70
7.40
MAX
2.65
0.30
0.51
0.32
18.10
7.60
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
0.7125
0.2992
-
-
1
2
3
L
9
SEATING PLANE
A
0.0091
0.6969
0.2914
-
3
-A-
o
h x 45
D
4
0.05 BSC
1.27 BSC
-
-C-
α
µ
H
h
0.394
0.01
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
0.016
6
0.25(0.010) M
C A M B S
N
α
28
28
7
o
o
o
o
0
8
0
8
-
NOTES:
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
19
HIN202 thru HIN213
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
0.078
-
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
-
0.002
0.065
0.009
0.004
0.390
0.197
0.05
1.65
0.22
0.09
9.90
5.00
-
1
2
3
0.072
0.014
0.009
0.413
0.220
1.85
0.38
0.25
10.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-A-
C
D
E
-
D
3
-C-
4
α
µ
e
0.026 BSC
0.65 BSC
-
A2
e
A1
C
H
L
0.292
0.022
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
6
0.25(0.010) M
C
A M B S
N
α
28
28
7
o
o
o
o
NOTES:
0
8
0
8
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
Rev. 1 3/95
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual in-
dex feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality/iso.asp
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. How-
ever, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
2401 Palm Bay Rd.
Palm Bay, FL 32905
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil Ltd.
8F-2, 96, Sec. 1, Chien-kuo North,
Taipei, Taiwan 104
Republic of China
TEL: 886-2-2515-8508
FAX: 886-2-2515-8369
20
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