HIN202CBNZ-T [RENESAS]
+5V Powered RS-232 Transmitters/Receivers with 0.1µF External Capacitors; PDIP16, SOIC16; Temp Range: See Datasheet;
| 型号： | HIN202CBNZ-T |
| 厂家： | 
RENESAS TECHNOLOGY CORP |
| 描述： | +5V Powered RS-232 Transmitters/Receivers with 0.1µF External Capacitors; PDIP16, SOIC16; Temp Range: See Datasheet 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总20页 (文件大小：1048K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATASHEET
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
+5V Powered RS-232 Transmitters/Receivers with 0.1Microfarad External
Capacitors
FN3980
Rev 19.00
August 6, 2015
The HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
family of RS-232 transmitters/receivers interface circuits
Features
• Pb-Free Plus Anneal Available (RoHS Compliant)
(See Ordering Info)
meet all ElA RS-232E and V.28 specifications, and are
particularly suited for those applications where 12V is not
available. They require a single +5V power supply and
feature onboard charge pump voltage converters which
generate +10V and -10V supplies from the 5V supply. The
family of devices offers a wide variety of RS-232
transmitter/receiver combinations to accommodate various
applications (see Selection Table).
• Meets All RS-232E and V.28 Specifications
• Requires Only 0.1F or Greater External Capacitors
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . .120kbit/s
• Two Receivers Active in Shutdown Mode (HIN213)
• Requires Only Single +5V Power Supply
The HIN206, HIN211 and HIN213 feature a low power
shutdown mode to conserve energy in battery powered
applications. In addition, the HIN213 provides two active
receivers in shutdown mode allowing for easy “wakeup”
capability.
• Onboard Voltage Doubler/Inverter
• Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA
• Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1A
• Three-State TTL/CMOS Receiver Outputs
The drivers feature true TTL/CMOS input compatibility, slew
rate-limited output, and 300 power-off source impedance.
The receivers can handle up to 30V input, and have a 3k
to 7k input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
• Multiple Drivers
- 10V Output Swing for +5V lnput
- 300 Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
Applications
- 30V/s Maximum Slew Rate
• Multiple Receivers
• Any System Requiring RS-232 Communications Port
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- 30V Input Voltage Range
- 3k to 7k Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
- Modems
Selection Table
NUMBER OF
0.1F
EXTERNAL
NUMBER OF
RECEIVERS
ACTIVE IN
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
PART
NUMBER
POWER SUPPLY
VOLTAGE
CAPACITORS
SHUTDOWN
HIN202
+5V
+5V
+5V
+5V
+5V
+5V
2
4
5
4
4
4
2
3
3
4
5
5
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
4 Capacitors
No/No
Yes/Yes
No/No
0
0
0
0
0
2
HIN206
HIN207
HIN208
HIN211
HIN213
No/No
Yes/Yes
Yes/Yes
FN3980 Rev 19.00
August 6, 2015
Page 1 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Ordering Information (Continued)
Ordering Information
TEMP.
RANGE (°C)
PKG.
DWG. #
TEMP.
RANGE (°C)
PKG.
DWG. #
PART NO.
HIN208CBZ
(See Note)
(No longer
PACKAGE
PART NO.
HIN202CBZ
PACKAGE
0 to 70
24 Ld SOIC
(Pb-free)
M24.3
0 to 70
16 Ld SOIC (W) M16.3
(See Note)
(Pb-free)
HIN202CBZ-T (See
Note)
0 to 70
16 Ld SOIC (W) M16.3
Tape and Reel
available,
recommended
replacement:
HIN208ECBZ-T)
(Pb-free)
HIN202CBNZ (See
Note)
0 to 70
0 to 70
16 Ld SOIC (N)
(Pb-free)
M16.15
M16.15
HIN208CBZ-T
(See Note)
(No longer
0 to 70
24 Ld SOIC
Tape and Reel
(Pb-free)
M24.3
HIN202CBNZ-T
(See Note)
16 Ld SOIC (N)
Tape and Reel
(Pb-free)
available,
HIN202CPZ
(See Note)
0 to 70
-40 to 85
-40 to 85
-40 to 85
16 Ld PDIP
E16.3
recommended
replacement:
HIN208ECBZ-T)
HIN202IBZ
(See Note)
16 Ld SOIC (W) M16.3
(Pb-free)
HIN211CAZ
(See Note)
0 to 70
0 to 70
28 Ld SSOP
(Pb-free)
M28.209
M28.209
HIN202IBNZ
(See Note)
16 Ld SOIC (N)
(Pb-free)
M16.15
HIN211CAZ-T
(See Note)
28 Ld SSOP
Tape and Reel
(Pb-free)
HIN202IBNZ-T
(See Note)
16 Ld SOIC (N)
Tape and Reel
(Pb-free)
M16.15
HIN211CBZ
(See Note)
0 to 70
0 to 70
28 Ld SOIC
(Pb-free)
M28.3
M28.3
HIN207CAZ
(See Note)
(No longer
0 to 70
24 Ld SSOP
(Pb-free)
M24.209
M24.209
HIN211CBZ-T
(See Note)
28 Ld SOIC
Tape and Reel
(Pb-free)
available,
recommended
replacement:
HIN207ECAZ)
HIN213CAZ
(See Note)
0 to 70
0 to 70
28 Ld SSOP
(Pb-free)
M28.209
M28.209
HIN213CAZ-T
(See Note)
28 Ld SSOP
Tape and Reel
(Pb-free)
HIN207CAZ-T
(See Note)
(No longer
0 to 70
24 Ld SSOP
Tape and Reel
(Pb-free)
available,
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
recommended
replacement:
HIN207ECAZ-T)
FN3980 Rev 19.00
August 6, 2015
Page 2 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Pin Descriptions
PIN
FUNCTION
V
Power Supply Input 5V 10%, (5V 5% HIN207).
Internally generated positive supply (+10V nominal).
Internally generated negative supply (-10V nominal).
Ground Lead. Connect to 0V.
CC
V+
V-
GND
C1+
C1-
C2+
C2-
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
External capacitor (+ terminal) is connected to this lead.
External capacitor (- terminal) is connected to this lead.
T
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kpull-up resistor to V is connected to each lead.
IN
CC
T
Transmitter Outputs. These are RS-232 levels (nominally 10V).
OUT
R
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kpull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
IN
R
OUT
EN, EN
SD, SD
Receiver enable Input. With EN = 5V (HIN213 EN = 0V), the receiver outputs are placed in a high impedance state.
Shutdown Input. With SD = 5V (HIN213 SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state
(except R4 and R5 of HIN213) and the transmitters are shut off.
NC
No Connect. No connections are made to these leads.
FN3980 Rev 19.00
August 6, 2015
Page 3 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Pinouts
HIN202 (PDIP, SOIC)
HIN206 (SOIC)
TOP VIEW
TOP VIEW
1
2
24
23
22
21
20
19
18
17
T3
T1
T2
T4
OUT
OUT
OUT
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
V+
V
CC
R2
IN
GND
T1
3
R2
OUT
C1-
C2+
C2-
V-
OUT
4
R1
SD
EN
T4
IN
R1
R1
T1
IN
5
R1
OUT
OUT
6
T2
IN
IN
7
T3
IN
T1
IN
IN
IN
T2
T2
R2
8
R3
GND
OUT
OUT
IN
9
16 R3
V
R2
CC
OUT
IN
10
11
12
15
14
13
V-
C1+
V+
C2-
C2+
C1-
+5V
9
+5V
0.1F
10
+
12
V
+
+
C1+
CC
16
11
V+
V-
0.1F
0.1F
+5V TO 10V
VOLTAGE DOUBLER
C1-
13
+
14
V
CC
C2+
1
0.1F
+10V TO -10V
VOLTAGE INVERTER
15
2
C1+
+
+
+
+
2
+5V TO 10V
VOLTAGE INVERTER
0.1F
0.1F
C2-
V+
V-
0.1F
3
4
C1-
+5V
T1
T2
400k
7
C2+
T1
T1
IN
OUT
+10V TO -10V
VOLTAGE INVERTER
6
5
+5V
+5V
+5V
C2-
0.1F
400k
6
3
1
T2
T2
IN
OUT
+5V
T1
14
400k
T3
T4
11
T1
T1
IN
400k
400k
OUT
18
T3
T4
T3
IN
OUT
OUT
+5V
T2
400k
10
12
7
19
5
24
4
T2
R1
T2
IN
T4
IN
OUT
R1
R1
13
IN
OUT
R1
IN
OUT
OUT
5k
5k
R1
5k
5k
R1
22
23
R2
R2
R3
IN
OUT
9
8
R2
R2
R2
IN
R2
17
20
16
21
R3
IN
OUT
EN
GND
5k
R3
SD
15
GND
8
FN3980 Rev 19.00
August 6, 2015
Page 4 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Pinouts (Continued)
HIN207 (SOIC, SSOP)
HIN208 (SOIC)
TOP VIEW
TOP VIEW
T3
T1
T2
1
2
3
4
5
6
7
8
9
24 T4
OUT
OUT
OUT
OUT
T2
T1
T3
1
2
24
23
22
21
20
19
18
17
16
15
14
13
OUT
OUT
OUT
23 R2
IN
R3
R3
T4
IN
R2
T5
22
21
20
19
18
17
16
OUT
R2
3
IN
OUT
R1
IN
IN
R2
4
OUT
IN
R1
T5
T4
T3
OUT
OUT
IN
T1
IN
T4
T3
T2
5
OUT
IN
T2
IN
R1
6
OUT
T1
IN
IN
R1
IN
7
IN
R3
R3
GND
OUT
IN
R4
R4
V-
GND
8
OUT
IN
V
CC
V
9
CC
C1+ 10
V+ 11
15 V-
C1+
V+
10
11
12
14 C2-
13 C2+
C2-
C1- 12
C1-
C2+
+5V
9
+5V
9
0.1F
0.1F
10
+
12
10
V
V
+
+
C1+
CC
+
+
CC
C1+
11
+
11
V+
V-
0.1F
0.1F
V+
0.1F
0.1F
+5V TO 10V
VOLTAGE DOUBLER
+5V TO 10V
VOLTAGE DOUBLER
12
C1-
C1-
13
+
14
13
C2+
C2+
+
+10V TO -10V
VOLTAGE INVERTER
+10V TO -10V
VOLTAGE INVERTER
15
2
15
2
V-
14
C2-
C2-
0.1F
0.1F
+5V
+5V
T1
T2
T1
400k
5
400k
7
T1
T1
IN
T1
T1
IN
OUT
OUT
+5V
+5V
+5V
+5V
T2
400k
18
19
1
400k
6
3
T2
T2
IN
T2
T2
IN
OUT
OUT
+5V
+5V
+5V
T3
T4
T3
T4
T5
400k
400k
24
400k
400k
400k
18
19
1
T3
T4
T3
IN
T3
T4
T5
T3
IN
OUT
OUT
OUT
OUT
OUT
21
6
20
7
24
T4
IN
T4
IN
R1
R1
IN
OUT
21
5
20
4
T5
IN
5k
R1
R1
R1
IN
OUT
4
22
17
3
R2
R3
R4
R2
R3
R4
5k
5k
IN
IN
IN
OUT
OUT
OUT
R1
5k
5k
5k
R2
R3
22
17
23
16
R2
R2
R3
23
16
IN
OUT
R2
R3
IN
OUT
5k
R3
R4
GND
GND
8
8
FN3980 Rev 19.00
August 6, 2015
Page 5 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Pinouts (Continued)
HIN211 (SOIC, SSOP)
HIN213 (SSOP)
TOP VIEW
TOP VIEW
T3
T1
T2
1
2
3
4
5
6
7
8
9
28 T4
OUT
T3
T1
T2
1
2
3
4
5
6
7
8
9
28 T4
OUT
OUT
OUT
OUT
OUT
OUT
OUT
27 R3
26 R3
27 R3
26 R3
IN
IN
OUT
OUT
25 SD
24 EN
23 R4
R2
IN
25 SD
24 EN
23 R4
R2
IN
R2
R2
OUT
OUT
T2
IN
T2
IN
IN
IN
T1
IN
22 R4
21 T4
T1
IN
22 R4
21 T4
OUT
OUT
R1
R1
OUT
IN
IN
OUT
IN
IN
R1
IN
20
T3
R1
IN
20
T3
GND 10
11
19 R5
18 R5
17 V-
GND 10
11
19 R5
18 R5
17 V-
OUT
IN
OUT
IN
V
V
CC
CC
C1+ 12
V+ 13
C1+ 12
V+ 13
16 C2-
15 C2+
16 C2-
15 C2+
C1- 14
C1- 14
NOTE: R4 and R5 active in shutdown.
+5V
+5V
11
11
0.1F
0.1F
12
+
14
12
+
14
V
V
+
+
CC
+
+
C1+
CC
C1+
13
13
V+
V-
0.1F
0.1F
V+
V-
0.1F
0.1F
+5V TO 10V
VOLTAGE DOUBLER
+5V TO 10V
VOLTAGE DOUBLER
C1-
C1-
15
+
16
15
+
16
C2+
C2+
+10V TO -10V
VOLTAGE INVERTER
+10V TO -10V
VOLTAGE INVERTER
17
2
17
2
C2-
C2-
0.1F
0.1F
+5V
+5V
T1
T1
400k
400k
7
7
T1
T1
IN
T1
T1
IN
OUT
OUT
+5V
+5V
+5V
T2
T3
T4
+5V
+5V
+5V
T2
T3
T4
400k
400k
400k
6
3
1
400k
400k
400k
6
3
1
T2
T3
T4
T2
IN
T2
T3
T4
T2
IN
OUT
OUT
20
20
T3
IN
T3
IN
OUT
OUT
OUT
OUT
21
8
28
9
21
8
28
9
T4
IN
T4
IN
R1
R1
R1
R1
IN
OUT
IN
OUT
5k
5k
R1
R1
5
26
22
4
5
26
22
4
R2
R3
R4
R5
R2
R3
R4
R5
R2
R3
R4
R5
R2
R3
R4
R5
IN
IN
IN
OUT
OUT
OUT
IN
IN
IN
OUT
OUT
OUT
5k
5k
5k
5k
5k
5k
5k
5k
R2
R3
R4
R2
R3
R4
27
23
27
23
19
24
18
25
19
24
18
25
IN
OUT
EN
IN
OUT
EN
R5
R5
SD
SD
GND
GND
10
10
FN3980 Rev 19.00
August 6, 2015
Page 6 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Absolute Maximum Ratings
Thermal Information
V
to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <V
< 6V
-0.3V) <V+ < 12V
Thermal Resistance (Typical, Note 1)
JA (°C/W)
CC
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (V
CC
CC
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . .
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC and SSOP - Lead Tips Only)
90
110
100
75
135
70
V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
Input Voltages
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < V < (V+ +0.3V)
IN
IN
30V
IN
Output Voltages
T
R
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
< (V+ +0.3V)
< (V+ +0.3V)
OUT
OUT
TXOUT
RXOUT
100
Short Circuit Duration
T
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
OUT
OUT
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
Electrical Specifications Test Conditions: V = +5V 10%, (V = +5V 5%, HIN207); C1-C4 = 0.1F;
CC
CC
T
= Operating Temperature Range
A
PARAMETER
SUPPLY CURRENTS
Power Supply Current, I
TEST CONDITIONS
MIN
TYP
MAX
UNITS
No Load,
HIN202
-
-
8
15
20
mA
mA
CC
T
= 25°C
A
HIN206,HIN207,HIN208,
11
HIN211, HIN213
HIN206, HIN211
HIN213
Shutdown Supply Current, I (SD)
CC
T
= 25°C
-
-
1
10
50
A
A
A
15
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
T
T
, EN, SD, EN, SD
-
2.0
2.4
-
-
-
0.8
-
V
V
lL
IN
Input Logic High, V
lH
IN
EN, SD, EN, SD
= 0V
-
-
V
Transmitter Input Pullup Current, I
T
15
0.1
200
0.4
A
V
P
IN
TTL/CMOS Receiver Output Voltage Low, V
I
= 1.6mA
-
OL
OUT
(HIN202, I
= 3.2mA)
OUT
= -1mA
OUT
TTL/CMOS Receiver Output Voltage High, V
TTL/CMOS Receiver Output Leakage
RECEIVER INPUTS
I
3.5
-
4.6
-
V
OH
EN = V , EN = 0, 0V < R
< V
0.05
10
A
CC OUT
CC
RS-232 Input Voltage Range, V
-30
3.0
0.8
0.6
-
+30
V
k
V
IN
Receiver Input Impedance, R
T
= 25°C, V = 3V
5.0
1.2
1.5
7.0
IN
A IN
Receiver Input Low Threshold, V (H-L)
V
= 5V,
Active Mode
Shutdown Mode
-
-
IN
CC
= 25°C
T
A
V
HIN213 R4 and R5
Receiver Input High Threshold, V (L-H)
IN
V
= 5V,
Active Mode
-
-
1.7
1.5
2.4
2.4
V
V
CC
= 25°C
T
A
Shutdown Mode
HIN213 R4 and R5
Receiver Input Hysteresis, V
V
= 5V
0.2
0.5
1.0
V
HYST
CC
No Hysteresis in Shutdown Mode
FN3980 Rev 19.00
August 6, 2015
Page 7 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Electrical Specifications Test Conditions: V = +5V 10%, (V = +5V 5%, HIN207); C1-C4 = 0.1F;
CC
CC
T
= Operating Temperature Range (Continued)
A
PARAMETER
TIMING CHARACTERISTICS
Baud Rate
TEST CONDITIONS
MIN
TYP
MAX
UNITS
1 Transmitter
Switching
R
= 3k
120
-
-
kbps
L
Output Enable Time, t
HIN206, HIN211, HIN213
HIN206, HIN211, HIN213
HIN213 SD = 0V, R4, R5
-
-
400
200
0.5
0.5
0.5
-
-
ns
ns
EN
Output Disable Time, t
-
DIS
Transmitter, Receiver Propagation Delay, t
-
40
10
10
30
s
PD
HIN213 SD = V , R1 - R5
CC
-
s
HIN202, HIN206, HIN207, HIN208, HIN211
-
s
Transition Region Slew Rate, SR
R
= 3k, C = 2500pF Measured from
3
V/s
T
L
L
+3V to -3V or -3V to +3V, 1 Transmitter
Switching (Note 2)
TRANSMITTER OUTPUTS
Output Voltage Swing, T
Transmitter Outputs, 3k to Ground
5
300
-
9
-
10
V
OUT
Output Resistance, T
V
= V+ = V- = 0V, V
= 2V
OUT
-
-
OUT
CC
RS-232 Output Short Circuit Current, I
T
Shorted to GND
10
mA
SC
OUT
NOTE:
2. Guaranteed by design.
VOLTAGE DOUBLER
VOLTAGE INVERTER
S5
S1
S3
S2
C2+
C1+
V+ = 2V
CC
S6
V
GND
CC
+
+
+
+
C3
C2
C4
C1
-
-
-
-
V
GND
CC
V- = - (V+)
GND
C1-
S4
C2-
S7
S8
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
FN3980 Rev 19.00
August 6, 2015
Page 8 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Receivers
Detailed Description
The receiver inputs accept up to 30V while presenting the
required 3k to 7k input impedance even if the power is off
The HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
family of RS-232 transmitters/receivers are powered by a
single +5V power supply feature low power consumption, and
meet all ElA RS232C and V.28 specifications. The circuit is
divided into three sections: The charge pump, transmitter, and
receiver.
(V
= 0V). The receivers have a typical input threshold of
CC
1.3V which is within the 3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is 0V
to V . The output will be low whenever the input is greater
CC
than 2.4V and high whenever the input is floating or driven
between +0.8V and -30V. The receivers feature 0.5V
hysteresis (except during shutdown) to improve noise
rejection. The receiver Enable line (EN on HIN206 and
HIN211, EN on HIN213) when unasserted, disables the
receiver outputs, placing them in the high impedance mode.
The receiver outputs are also placed in the high impedance
state when in shutdown mode (except HIN213 R4 and R5).
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure
1. The charge pump contains two sections: the voltage doubler
and the voltage inverter. Each section is driven by a two
phase, internally generated clock to generate +10V and -10V.
The nominal clock frequency is 125kHz. During phase one of
the clock, capacitor C1 is charged to V . During phase two,
CC
the voltage on C1 is added to V , producing a signal across
CC
V+
C3 equal to twice V . During phase two, C2 is also charged
CC
V
CC
to 2V , and then during phase one, it is inverted with respect
CC
400k
300
to ground to produce a signal across C4 equal to -2V . The
charge pump accepts input voltages up to 5.5V. The output
impedance of the voltage doubler section (V+) is
approximately 200, and the output impedance of the voltage
inverter section (V-) is approximately 450. A typical
application uses 0.1F capacitors for C1-C4, however, the
value is not critical. Increasing the values of C1 and C2 will
lower the output impedance of the voltage doubler and
inverter, increasing the values of the reservoir capacitors, C3
and C4, lowers the ripple on the V+ and V- supplies.
CC
T
XIN
T
OUT
GND < T
< V
CC
XIN
V-
V- < V
< V+
TOUT
FIGURE 2. TRANSMITTER
V
CC
R
XIN
R
OUT
-30V < R
< +30V
During shutdown mode (HIN206 and HIN211, SD = V
CC
,
XIN
GND < V
< V
CC
5k
ROUT
HIN213, SD = 0V) the charge pump is turned off, V+ is pulled
GND
down to V , V- is pulled up to GND, and the supply current is
CC
FIGURE 3. RECEIVER
reduced to less than 10A. The transmitter outputs are
disabled and the receiver outputs (except for HIN213, R4 and
R5) are placed in the high impedance state.
T
IN
OR
Transmitters
R
IN
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic
T
OUT
OR
V
V
OL
threshold is about 26% of V , or 1.3V for V
= 5V. A logic 1
CC CC
OL
R
OUT
at the input results in a voltage of between -5V and V- at the
output, and a logic 0 results in a voltage between +5V and (V+
- 0.6V). Each transmitter input has an internal 400k pullup
resistor so any unused input can be left unconnected and its
output remains in its low state. The output voltage swing meets
the RS-232C specifications of 5V minimum with the worst
case conditions of: all transmitters driving 3k minimum load
impedance,
t
t
PLH
PHL
t
t
PHL + PLH
2
AVERAGE PROPAGATION DELAY =
FIGURE 4. PROPAGATION DELAY DEFINITION
HIN213 Operation in Shutdown
The HIN213 features two receivers, R4 and R5, which remain
active in shutdown mode. During normal operation the
receivers propagation delay is typically 0.5s. This propagation
delay may increase slightly during shutdown. When entering
shut down mode, receivers R4 and R5 are not valid for 80s
V
= 4.5V, and maximum allowable operating temperature.
CC
The transmitters have an internally limited output slew rate
which is less than 30V/s. The outputs are short circuit
protected and can be shorted to ground indefinitely. The
powered down output impedance is a minimum of 300 with
after SD = V . When exiting shutdown mode, all receiver
IL
2V applied to the outputs and V
= 0V.
CC
outputs will be invalid until the charge pump circuitry reaches
normal operating voltage. This is typically less than 2ms when
using 0.1F capacitors.
FN3980 Rev 19.00
August 6, 2015
Page 9 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Typical Performance Curves
12
10
8
12
0.1F
10
8
V+ (V
= 5V)
CC
6
6
V+ (V
CC
= 4V)
= 5V)
V- (V
= 4V)
CC
4
4
T
= 25°C
A
2
2
V- (V
CC
TRANSMITTER OUTPUTS
OPEN CIRCUIT
0
3.0
0
3.5
4.0
4.5
5.0
5.5
CC
6.0
0
5
10
15
|I
20
25
30
35
V
| (mA)
CC
LOAD
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD
FIGURE 5. V- SUPPLY VOLTAGE vs V
Test Circuits (HIN202)
+4.5V TO
+5.5V INPUT
C1+
V+
1
2
3
4
16
15
14
13
12
11
10
9
V
CC
-
0.1F
C3
GND
+
C1+
V+
V
1
2
3
4
5
6
7
8
16
CC
C1-
C2+
T1
OUT
+
0.1F
C1
3k
GND 15
R1
IN
-
T1
C1-
C2+
C2-
V-
14
13
12
11
T1 OUTPUT
OUT
5 C2-
R1
OUT
R1
IN
RS-232 30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
-
T1
IN
6 V-
T2
0.1F
C2
R1
OUT
T2
IN
7
8
OUT
-
+
T1
IN
R2
R2
IN
OUT
0.1F C4
T2
T2 10
IN
OUT
3k
R2
9
R2
IN
OUT
R
= V /I T2
IN
OUT
V
OUT
T2
OUTPUT
T1
A
OUT
RS-232
30V INPUT
= 2V
IN
FIGURE 7. GENERAL TEST CIRCUIT
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
Application Information
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particularly useful in applications
where 12V power supplies are not available for conventional
RS-232 interface circuits. The applications presented
represent typical interface configurations.
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and the
reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR (data
terminal ready) and DSRS (data signaling rate select) is
generated by driving them through a 5kW resistor connected to
V+.
FN3980 Rev 19.00
August 6, 2015
Page 10 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
+5V
-
+
16
CTR (20) DATA
TERMINAL READY
1
+
C1
0.1F
3
4
DSRS (24) DATA
SIGNALING RATE
SELECT
-
HIN202
6
+
-
+
C2
0.1F
RS-232
INPUTS AND OUTPUTS
5
-
T1
11
14
TD
TD (2) TRANSMIT DATA
T2
10
12
7
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
INPUTS RTS
OUTPUTS
TTL/CMOS
13
RD
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
15
SIGNAL GROUND (7)
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
1
4
+
+
C1
C2
HIN202
T1
5
0.1F
3
0.1F
-
-
11
14
TD
RTS
RD
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
T2
10
12
7
INPUTS
OUTPUTS
TTL/CMOS
13
R2
R1
9
8
CTS
CTS (5) CLEAR TO SEND
15
V
16
CC
6
6
2
2
C4
C3
+5V
-
-
V- V+
RS-232
INPUTS AND OUTPUTS
0.2F
0.2F
V
16
4
CC
HIN202
T1
1
+
+
C1
0.1F
C2
0.1F
5
3
-
-
11
14
DTR
DSRS
DCD
R1
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
T2
10
12
7
INPUTS
OUTPUTS
TTL/CMOS
13
R2
R1
9
8
15
SIGNAL GROUND (7)
FIGURE 10. COMBINING TWO HIN202s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
FN3980 Rev 19.00
August 6, 2015
Page 11 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
Type: Nitride over Silox
160 mils x 140 mils
Nitride Thickness: 8kÅ
METALLIZATION:
Silox Thickness: 7kÅ
Type: Al
TRANSISTOR COUNT:
Thickness: 10kÅ 1kÅ
SUBSTRATE POTENTIAL
V+
238
PROCESS:
CMOS Metal Gate
Metallization Mask Layout
HIN211
SHD
EN
R4
R4
T4 T3
IN
R5
R5
IN
IN
OUT
IN
OUT
R3
OUT
V-
C2-
R3
IN
T4
OUT
OUT
C2+
C1-
T3
T1
T2
OUT
OUT
V+
C1+
R2
IN
V
CC
R2
T2 T1 R1
IN IN OUT
R1
GND
IN
OUT
FN3980 Rev 19.00
August 6, 2015
Page 12 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make
sure that you have the latest revision.
DATE
REVISION
CHANGE
August 6, 2015
FN3980.19
Updated Ordering Information table on page 2.
Added Revision History and About Intersil sections.
Updated package outline drawings to the latest revision. Changes are listed as follows:
M24.3
-Revision 0 to Revision 1, “Removed µ symbol which is overlapping the alpha symbol in the diagram.”
-Revision 1 to Revision 2, “Updated to new POD standard by removing table listing dimensions and
putting dimensions on drawing. Added Land Pattern.”
M28.3
-Revision 0 to Revision 1, “Added land pattern”
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask.
Reliability reports are also available from our website at www.intersil.com/support
FN3980 Rev 19.00
August 6, 2015
Page 13 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
N
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
INCHES
MILLIMETERS
1 2
3
N/2
AREA
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
-C-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
18.66
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
0.775
-
4.95
0.558
1.77
0.355
19.68
-
-
A2
A
-
SEATING
PLANE
B1
C
8, 10
L
C
L
-
D1
B1
eA
A1
A
D1
e
D
5
eC
C
B
D1
E
5
eB
0.010 (0.25) M
C
B S
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
e
A
6
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
e
-
0.430
0.150
-
10.92
3.81
7
B
L
0.115
2.93
4
9
4. Dimensions A, A1 and L are measured with the package seated in JE-
N
16
16
DEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
e
6. E and
are measured with the leads constrained to be perpendic-
A
-C-
ular to datum
.
7. e and e are measured at the lead tips with the leads unconstrained.
B
C
e
must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
FN3980 Rev 19.00
August 6, 2015
Page 14 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
M16.15 (JEDEC MS-012-AC ISSUE C)
N
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
0.25(0.010)
M
L
B M
H
AREA
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
0.0688
0.0098
0.020
MIN
1.35
0.10
0.33
0.19
9.80
3.80
MAX
1.75
NOTES
-B-
A
A1
B
C
D
E
e
0.0532
0.0040
0.013
-
1
2
3
0.25
-
0.51
9
SEATING PLANE
A
0.0075
0.3859
0.1497
0.0098
0.3937
0.1574
0.25
-
-A-
10.00
4.00
3
h x 45°
D
4
-C-
0.050 BSC
1.27 BSC
-
H
h
0.2284
0.0099
0.016
0.2440
0.0196
0.050
5.80
0.25
0.40
6.20
0.50
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
16
16
7
0°
8°
0°
8°
-
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
FN3980 Rev 19.00
August 6, 2015
Page 15 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
N
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
0.25(0.010)
M
L
B M
H
AREA
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
10.10
7.40
MAX
2.65
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
0.4133
0.2992
-
0.30
-
1
2
3
0.51
9
SEATING PLANE
A
0.0091
0.3977
0.2914
0.32
-
-A-
10.50
7.60
3
h x 45°
D
4
-C-
0.050 BSC
1.27 BSC
-
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
0.25(0.010) M
C
A M B S
N
16
16
7
0°
8°
0°
8°
-
NOTES:
Rev. 1 6/05
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
FN3980 Rev 19.00
August 6, 2015
Page 16 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Package Outline Drawing
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 2, 3/11
24
INDEX
AREA
7.60 (0.299)
7.40 (0.291)
10.65 (0.419)
10.00 (0.394)
DETAIL "A"
1
2
3
TOP VIEW
1.27 (0.050)
0.40 (0.016)
SEATING PLANE
2.65 (0.104)
2.35 (0.093)
15.60 (0.614)
15.20 (0.598)
0.75 (0.029)
x 45°
0.25 (0.010)
0.30 (0.012)
0.10 (0.004)
1.27 (0.050)
8°
0°
0.51 (0.020)
0.33 (0.013)
0.32 (0.012)
0.23 (0.009)
SIDE VIEW “A”
SIDE VIEW “B”
1.981 (0.078)
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. Package length does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
3. Package width does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm
(0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
9.373 (0.369)
7. Controlling dimension: MILLIMETER. Converted inch dimensions in
(
) are not necessarily exact.
8. This outline conforms to JEDEC publication MS-013-AD ISSUE C.
1.27 (0.050)
0.533 (0.021)
TYPICAL RECOMMENDED LAND PATTERN
FN3980 Rev 19.00
August 6, 2015
Page 17 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
M24.209 (JEDEC MO-150-AG ISSUE B)
N
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
0.078
-
-
0.002
0.065
0.009
0.004
0.312
0.197
-
0.05
1.65
0.22
0.09
7.90
5.00
1
2
3
0.072
0.014
0.009
0.334
0.220
1.85
0.38
0.25
8.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-
-A-
C
D
E
D
3
4
-
-C-
µ
e
0.026 BSC
0.65 BSC
A2
e
A1
C
H
L
0.292
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
0.022
6
7
-
0.25(0.010) M
C
A M B S
N
24
24
o
o
o
o
0
8
0
8
NOTES:
Rev. 1 3/95
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
FN3980 Rev 19.00
August 6, 2015
Page 18 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
M28.3 (JEDEC MS-013-AE ISSUE C)
N
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
0.25(0.010)
M
L
B M
H
AREA
INCHES
MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
-
0.30
-
1
2
3
0.51
9
SEATING PLANE
A
0.0091
0.6969
0.2914
0.32
-
0.7125 17.70
18.10
7.60
3
-A-
h x 45o
D
0.2992
7.40
4
0.05 BSC
1.27 BSC
-
-C-
a
H
h
0.394
0.01
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
0.016
6
0.25(0.010) M
C
A M B S
N
28
28
7
o
o
o
o
0
8
0
8
-
Rev. 1, 1/13
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
TYPICAL RECOMMENDED LAND PATTERN
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
(1.50mm)
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
(9.38mm)
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
(1.27mm TYP)
(0.51mm TYP)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
FN3980 Rev 19.00
August 6, 2015
Page 19 of 20
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010)
M
B M
H
INCHES
MILLIMETERS
E
GAUGE
PLANE
SYMBOL
MIN
MAX
0.078
-
MIN
-
MAX
2.00
-
NOTES
-B-
A
A1
A2
B
-
-
0.002
0.065
0.009
0.004
0.390
0.197
0.05
1.65
0.22
0.09
9.90
5.00
-
1
2
3
0.072
0.014
0.009
0.413
0.220
1.85
0.38
0.25
10.50
5.60
-
L
0.25
0.010
SEATING PLANE
A
9
-A-
C
D
E
-
D
3
-C-
4
e
0.026 BSC
0.65 BSC
-
A2
e
A1
C
H
L
0.292
0.022
0.322
0.037
7.40
0.55
8.20
0.95
-
B
0.10(0.004)
6
0.25(0.010) M
C
A M B S
N
28
28
7
NOTES:
0°
8°
0°
8°
-
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
Rev. 2 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
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For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN3980 Rev 19.00
August 6, 2015
Page 20 of 20
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