ER2GTR [ETC]
DIODE GEN PURP 400V 2A SMB;型号: | ER2GTR |
厂家: | ETC |
描述: | DIODE GEN PURP 400V 2A SMB |
文件: | 总5页 (文件大小:295K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ER2A-ER2J
Technical Data
Data Sheet N0132, Rev. F
ER2A-ER2J SURFACE
MOUNT SUPER FAST RECTIFIER
Features
Glass Passivated Die Construction
Ideally Suited for Automatic Assembly
Low Forward Overload Drop, High Efficiency
Low Power Loss
Super-Fast Recovery Time
Plastic Case Material has UL Flammability
Classification Rating 94V-O
This is a Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional testing can be offered upon request
SMB
Circuit Diagram
Mechanical Data
Case: Low Profile Molded Plastic
Terminals: Solder Plated, Solderable per MIL-STD-750,
Method 2026
Polarity: Cathode Band or Cathode Notch
Marking: Type Number
Weight: 0.09grams(approx)
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Characteristic
Symbol
ER2A ER2B ER2C ER2D ER2E ER2G ER2J Units
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50
35
100
70
150
105
200
140
300
210
400
280
600
420
V
RMS Reverse Voltage
VR(RMS)
Io
Average Rectified Output Current @TL =110°C
2.0
A
A
Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
50
Forward Voltage
@IF = 2.0A, TJ=25°C
VF
IR
0.95
1.25
1.7
V
Maximum DC reverse current
at rated DC blocking voltage
TA = 25°C
TA = 125°C
5.0
100
µA
pF
Typical junction capacitance (Note 1)
Maximum Reverse Recovery Time (Note 2)
Typical thermal resistance (Note 3)
CJ
Trr
25
35
20
ns
RθJL
°C/W
°C
Operating junction and storage temperature
range
TJ,TSTG
-65 to +150
Note: 1. Measured at 1.0 MHZ and applied reverse voltage of 4.0 VDC
2. Measured with IF=0.5A, IR=1.0A, Irr=0.25A,
3. Mounted on P.C. Board with 8.0mm2 lead area
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ER2A-ER2J
Technical Data
Data Sheet N0132, Rev. F
Ratings and Characteristics Curves
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ER2A-ER2J
Technical Data
Data Sheet N0132, Rev. F
Mechanical Dimensions SMB
Millimeters
Inches
SYMBOL
Min.
Max.
3.94
4.70
2.20
Min.
0.130
0.160
0.071
Max.
0.155
0.185
0.087
A
B
C
3.30
4.06
1.80
D
0.152
0.305
0.006
0.012
E
F
4.80
2.10
5.59
2.60
0.189
0.083
0.002
0.030
0.220
0.102
0.008
0.060
G
H
0.051
0.76
0.203
1.52
Suggested Solder Pad Layout (Millimeters/Inches)
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ER2A-ER2J
Technical Data
Data Sheet N0132, Rev. F
Ordering Information
Marking Diagram
Where XXXXX is YYWWL
Device
ER2A-ER2J
Package
SMB (Pb-Free)
Shipping
3000pcs / reel
ER
2
A
YY
WW
L
= Device Type
= Forward Current (2A)
= Reverse Voltage (50V)
= Year
= Week
= Lot Number
For information on tape and reel specifications, including part
orientation and tape sizes, please refer to our tape and reel
packaging specification.
Cautions:Molding resin
Epoxy resin UL:94V-0
Carrier Tape Specification SMB
Millimeters
SYMBOL
Min.
Max.
A
B
C
d
2.97
5.70
2.32
1.40
3.17
5.90
2.52
1.60
E
F
P
P0
P1
1.40
5.60
3.90
3.90
1.90
1.60
5.70
4.10
4.10
2.10
T
0.25
0.35
W
11.80
12.20
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ER2A-ER2J
Technical Data
Data Sheet N0132, Rev. F
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC Diode Solutions sales department for the latest version of
the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC Diode Solutions be liable for any damages that may result from an accident or any other cause during
operation of the user’s units according to the datasheet(s). SMC Diode Solution assumes no responsibility for any intellectual property
claims or any other problems that may result from applications of information, products or circuits described in the datasheets.
4- In no event shall SMC Diode Solutions be liable for any failure in a semiconductor device or any secondary damage resulting from use
at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC Diode Solutions.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
Diode Solutions.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations.
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