EP-784915GF-R [ETC]
IE-784915-R-EM1.EP-784915GF-R User＇s Manual | User＇s Manual[10/1997] ; IE- 784915 -R - EM1.EP - 784915GF -R用户手册|用户手册[ 10/1997 ]\n
| 型号： | EP-784915GF-R |
| 厂家： | 
ETC |
| 描述： | IE-784915-R-EM1.EP-784915GF-R User＇s Manual | User＇s Manual[10/1997]
|
| 文件： | 总65页 (文件大小：360K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
User’s Manual
IE-784915-R-EM1
I/O Emulation Board
EP-784915GF-R
Emulation Probe
µPD784915 Subseries
µPD784928 Subseries
µPD784928Y Subseries
Document No. U10931EJ2V0UM00 (2nd edition)
Date Published October 1997 N
1996
©
Printed in Japan
[MEMO]
2
This product is designed to be used in a commercial or industrial district. If it is used in a residential district
or in an area in the vicinity of a residential district, radio and TV receivers in the district may be affected.
Use this product correctly by carefully reading its User’s Manual.
The information in this document is subject to change without notice.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or of others.
M7A 96.10
3
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 800-366-9782
NEC Electronics Hong Kong Ltd.
Hong Kong
Tel: 2886-9318
NEC Electronics (Germany) GmbH
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 800-729-9288
Fax: 2886-9022/9044
Fax: 040-2444580
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
NEC Electronics Hong Kong Ltd.
Seoul Branch
Seoul, Korea
NEC Electronics (France) S.A.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 0211-65 03 490
Tel: 02-528-0303
Fax: 02-528-4411
Fax: 01-30-67 58 99
NEC Electronics (UK) Ltd.
Milton Keynes, UK
Tel: 01908-691-133
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130
Tel: 253-8311
NEC Electronics (France) S.A.
Spain Office
Madrid, Spain
Fax: 01908-670-290
Fax: 250-3583
Tel: 01-504-2787
NEC Electronics Italiana s.r.1.
Milano, Italy
Tel: 02-66 75 41
Fax: 01-504-2860
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-719-2377
NEC Electronics (Germany) GmbH
Scandinavia Office
Fax: 02-66 75 42 99
Fax: 02-719-5951
Taeby, Sweden
Tel: 08-63 80 820
NEC do Brasil S.A.
Sao Paulo-SP, Brasil
Tel: 011-889-1680
Fax: 011-889-1689
Fax: 08-63 80 388
J96. 8
4
MAJOR REVISIONS IN THIS EDITION
Page
Contents
Throughout
p.61
µPD784928 subseries and µPD784928Y subseries added to the target devices.
VOLUME 2 EP-784915GF-R
APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET
Drawing of the NQPACK100RB added.
The mark
shows major revised points.
5
[MEMO]
6
PREFACE
Product outline
The IE-784915-R-EM1 is connected to the IE-784000-R-EM, inserted in the IE-
784000-R, and used to debug theµPD784915 subseries, µPD784928 subseries, and
µPD784928Y subseries 16-bit single-chip microcontrollers.
The EP-784915GF-R is an emulation probe to connect the IE-784915-R-EM1 and
a target system. The EP-784915GF-R is used in combination with the EV-9200GF-
100 or NQPACK100RB.
Remark The NQPACK100RB is a product of Tokyo Eletech Corp. (03-5295-1661).
When purchasing the product, consult your NEC distributor.
Intended Readership
ThismanualisintendedforengineerswhousetheµPD784915subseries,µPD784928
subseries, and µPD784928Y subseries 16-bit single-chip microcontrollers and
performsystemdebugging,usingtheIE-784000-RandIE-784000-R-EMincombination
with the IE-784915-R-EM1. It is also intended for engineers who upgrade a system
using other in-circuit emulators so that it has functions equivalent to those of the IE-
784000-R. Therefore, the engineers who read this manual are assumed to be
familiar with the functions and usage of the subseries used and have knowledge of
debuggers.
Purpose
The purpose of this manual is to give readers an understanding of the method of
connecting the IE-784915-R-EM1 to the IE-784000-R and IE-784000-R-EM, the
setting method when debugging the µPD784915 subseries, µPD784928 subseries,
and µPD784928Y subseries, and the method of connecting the EP-784915GF-R with
the IE-784915-R-EM1.
Organization
This manual consists of the following two parts.
VOLUME 1: IE-784915-R-EM1
• System configuration
VOLUME 2: EP-784915GF-R
• General description
• Function of external interface
with IE-784000-R
• Connection method
Use the IE-784000-R manual as well.
7
Using This Information
VOLUME 1: IE-784915-R-EM1
To have a general understanding of the IE-784915-R-EM1 functions,
→ read according to the TABLE OF CONTENTS.
To understand the basic specifications,
→ read CHAPTER 1 GENERAL DESCRIPTION.
When looking up the setting method when the IE-784915-R-EM1 is connected with
the IE-784000-R to debug the µPD784915 subseries, µPD784928 subseries, and
µPD784928Y subseries,
→ read CHAPTER 2 INSTALLATION PROCEDURE.
VOLUME 2: EP-784915GF-R
To have a general understanding of the EP-784915GF-R functions,
→ read according to the TABLE OF CONTENTS.
To understand the operating environment and configuration,
→ read CHAPTER 1 GENERAL DESCRIPTION.
To understand the specific connection method,
→ read CHAPTER 2 CONNECTION.
Terminology
The meaning of each term used in this manual is described in the table below.
Term
Meaning
Emulation device
Generaltermofdevicesthatperformemulation
of target devices in the emulator
Includes the emulation CPU.
Emulation CPU
CPUblockwhichexecutestheprogramcreated
by the user in the emulator
Target device
Device that is an emulation target (real chip)
Target program
Program that is a debugging target (program
created by the user)
Target system
System that is a debugging target (system
created by the user).
Includesatargetprogramandhardwarecreated
by the user.
Refers to hardware only in a narrow sense.
Legend
Note
:
Explanation of items marked with Note in the text
Caution : Item to be especially noted
Remark : Supplementary information
8
TABLE OF CONTENTS
VOLUME 1 IE-784915-R-EM1
CHAPTER 1 GENERAL DESCRIPTION.............................................................................................. 13
1.1 Features .................................................................................................................................... 13
1.2 Product Configuration............................................................................................................. 13
1.3 Part Names ............................................................................................................................... 16
1.4 Target Device ........................................................................................................................... 17
1.5 Emulation Probe ...................................................................................................................... 17
1.6 Operating Precautions ............................................................................................................ 17
CHAPTER 2 INSTALLATION PROCEDURE ...................................................................................... 19
2.1 Connection with IE-784000-R.................................................................................................. 19
2.2 Connection with Target System ............................................................................................. 23
2.3 When Target System is not Connected ................................................................................. 23
CHAPTER 3 SETTING OF USER CLOCK .......................................................................................... 25
3.1 Setting of Operating Clock...................................................................................................... 25
3.2 Attaching Crystal Oscillator.................................................................................................... 26
CHAPTER 4 START-UP....................................................................................................................... 29
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE...................................................................... 31
APPENDIX A PRODUCT SPECIFICATIONS ...................................................................................... 39
9
VOLUME 2 EP-784915GF-R
CHAPTER 1 GENERAL DESCRIPTION.............................................................................................. 43
1.1 Operating Environment ........................................................................................................... 43
1.2 Configuration ........................................................................................................................... 43
CHAPTER 2 CONNECTION................................................................................................................. 49
2.1 Outline of Connection Procedure........................................................................................... 49
2.1.1 Connection of IE-784000-R-EM and IE-784915-R-EM1 ................................................................ 49
2.1.2 Connection of IE-784000-R and EP-784915GF-R......................................................................... 49
2.1.3 Connection of EP-784915GF-R and target system ....................................................................... 51
2.1.4 Connection of external sense clips ................................................................................................ 54
2.2 Powering-On/Powering-Off Order .......................................................................................... 56
2.3 Removing EP-784915GF-R from Target System ................................................................... 57
APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET .......................................................... 59
A.1 External View of EV-9200GF-100 and Recommended Board Mounting Pattern................ 59
A.2 External View of NQPACK100RB ........................................................................................... 61
10
VOLUME 1: IE-784915-R-EM1
I/O EMULATION BOARD
11
[MEMO]
12
CHAPTER 1 GENERAL DESCRIPTION
The IE-784915-R-EM1 is an I/O emulation board for the µPD784915 subseries, µPD784928 subseries, and
µPD784928Y subseries 16-bit single-chip microcontrollers.
It can be made compatible with any product in the µPD784915 subseries, µPD784928 subseries, or µPD784928Y
subseries just by changing the chip set board.
Combining the IE-784915-R-EM1 and an emulation probe (EP-784915GF-R) with the IE-784000-R and IE-784000-
R-EM allows efficient debugging and operation verification of a system using the µPD784915 subseries, µPD784928
subseries, and µPD784928Y subseries.
1.1 Features
The features of a combined system of the IE-784915-R-EM1 with IE-784000-R and IE-784000-R-EM are as follows.
• Allows emulation of the µPD784915 subseries, µPD784928 subseries, and µPD784928Y subseries peripheral
functions (such as I/O port)
• Supply of CPU operating clock
• Combination with a separately available emulation probe (EP-784915GF-R) and connection of a chip set board
to the tip of the EP-784915GF-R allow debugging with characteristics similar to those of the real chip.
1.2 Product Configuration
The IE-784915-R-EM1 has the following product configuration. Check the items included.
• IE-784915-R-EM1
• Chip set board
:
:
1
2
(For the µPD784915 subseries: 1, µPD784928/784928Y subseries: 1)
• User’s Manual (this manual)
:
1
Caution The chip set board is provided with a dedicated device (peripheral emulation device) to perform
emulation of peripheral functions (I/O port, etc.) of the target device.
13
CHAPTER 1 GENERAL DESCRIPTION
Figure 1-1. List of IE-784915-R-EM1 Product Configuration (1/3)
(1) IE-784915-R-EM1
Front
Back
14
CHAPTER 1 GENERAL DESCRIPTION
Figure 1-1. List of IE-784915-R-EM1 Product Configuration (2/3)
(2) Chip set board
The photos below show the chip set board of the µPD784915 subseries. It has the same appearance as that of
the µPD784928 and 784928Y subseries. Please use the µPD784915 subseries as a reference.
Side to be connected to emulation probe
Side to be connected to dummy board
15
CHAPTER 1 GENERAL DESCRIPTION
Figure 1-1. List of IE-784915-R-EM1 Product Configuration (3/3)
(3) User’s Manual (this manual)
User’s Manual
IE-784915-R-EM1
I/O Emulation Board
EP-784915GF-R
Emulation Probe
µPD784915 Subseries
µPD784928 Subseries
µPD784928Y Subseries
©
1996
Printed in Japan
1.3 Part Names
Table 1-1 shows names of connectors and other parts.
Table 1-1. IE-784915-R-EM1 Part Names
Name
CN1
CN2
PJ1
Function
Emulation probe (EP-784915GF-R) connector
Emulation board (EP-784000-R-EM) connector
Unused
PJ2
TGCN1
TGCN2
L1
Chip set board Connector
L2
16
CHAPTER 1 GENERAL DESCRIPTION
1.4 Target Device
The following products are the target devices that can be emulated by the IE-784000-R and IE-784000-R-EM in
combination with the IE-784915-R-EM1.
<µPD784915 subseries>
• µPD784915
<µPD784928 subseries>
• µPD784927
<µPD784928Y subseries>
• µPD784927Y
• µPD78P4916
• µPD784928
• µPD784928Y
• µPD78F4928
• µPD78F4928Y
Remark The µPD784928 subseries and 784928Y subseries are under development.
1.5 Emulation Probe
Use of the IE-784915-R-EM1 connected to the target system always requires an emulation probe. The emulation
probe is available separately.
Part Number
Target Package
EP-784915GF-R
100-pin plastic QFP (14 × 20 mm)
Caution Two types of probe tip board (dummy board) are provided: LCC type and QFP type. See VOLUME
2 EP-784915GF-R for details.
1.6 Operating Precautions
(1) Be sure to turn off the power of the IE-784000-R and target system before connection of the IE-784915-R-
EM1 with the IE-784000-R and IE-784000-R-EM and its removal.
(2) When performing emulation of the target device by the IE-784915-R-EM1 in combination with the IE-784000-
R and IE-784000-R-EM, note that there are partial differences in pin characteristics from the real chip (see
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE).
(3) Correctly attach the IE-784915-R-EM1 to the IE-784000-R-EM.
(4) Correctly attach the IE-784000-R-EM to the IE-784000-R main unit.
(5) Correctly connect the chip set board.
• When an emulation probe is used,
→
connect the chip set board to the tip of the emulation probe.
• When an emulation probe is not used,
connect the chip select board to connectors L1 and L2 of the IE-784915-R-EM1.
→
Caution Do not simultaneously connect the chip set board to both the tip of the emulation probe and the
IE-784915-R-EM1.
17
[MEMO]
18
CHAPTER 2 INSTALLATION PROCEDURE
2.1 Connection with IE-784000-R
Figure 2-1 shows an installation schematic of the IE-784000-R.
Figure 2-1. Installation Schematic of IE-784000-R
Emulation probe
Cover of IE-784000-R
IE-784000-R-EM
(available separately)
IE-784915-R-EM1
IE-784000-R main unit
19
CHAPTER 2 INSTALLATION PROCEDURE
The IE-784915-R-EM1 is connected to the IE-784000-R and IE-784000-R-EM according the following procedure.
<1> Connection of chip set board
Caution When used with an emulation probe connected, do not connect the chip set board to the IE-
784915-R-EM1.
Connect the chip set board to L1 and L2 on the IE-784915-R-EM1.
Figure 2-2. Connection of Chip Set Board
Chip set board
L2
L1
IE-784915-R-EM1
<2> Setting of user clock
Perform the setting with reference to CHAPTER 3 SETTING OF USER CLOCK.
20
CHAPTER 2 INSTALLATION PROCEDURE
<3> Mounting IE-784915-R-EM1 onto IE-784000-R-EM
Connect connectors PJ1 and PJ2 on the IE-784000-R-EM with connectors PJ1 and PJ2 on the IE-784915-
R-EM1.
Figure 2-3. Connection of IE-784915-R-EM1 and IE-784000-R-EM
PJ2
IE-784915-R-EM1
PJ1
PJ2
IE-784000-R-EM
PJ1
<4> Removal of top cover
Remove 6 screws on the top surface of the unit and remove the top cover as shown in Figure 2-4.
Figure 2-4. Removal of Top Cover
21
CHAPTER 2 INSTALLATION PROCEDURE
<5> Removal of rubber of top cover
After removing the top cover, remove the rubber.
<6> Insert the IE-784000-R-EM + IE-784915-R-EM1 into the 2nd slot and 3rd slot, put the top cover, and replace
the screws.
Figure 2-5. Insertion of IE-784000-R-EM in IE-784000-R
IE-784000-R-EM (2nd slot)
IE-784915-R-EM1 (3rd slot)
IE-784000-R-BK (performance board) (4th slot)
Power supply switch
IE-784000-R-BK (event trace board) (5th slot)
Supervisor board (fixed)
22
CHAPTER 2 INSTALLATION PROCEDURE
2.2 Connection with Target System
Connection of the IE-784000-R and the target system is performed using a separately available emulation probe
(EP-784915GF-R). See 2.1.3 Connection of EP-784915GF-R and target system of VOLUME 2: EP-784915GF-
R for details.
2.3 When Target System is not Connected
Even if the target system is not connected, the IE-784000-R can still be used. In this case, connect the chip set
board that contains the µPD78P4916, µPD78F4928, or µPD78F4928Y (emulation chip) to connectors L1 and L2 of
the IE-784915-R-EM1 to start the IE-784000-R. See 2.1 Connection with IE-784000-R for details.
23
[MEMO]
24
CHAPTER 3 SETTING OF USER CLOCK
In the IE-784000-R, a fixed clock (16 MHz) on the IE-784915-R-EM1 is supplied to the emulation device unless
the clock setting is changed.
Operating the emulation device with an oscillation clock on the target system or an arbitrary clock requires the
setting of the clock setting socket (IC15) and selection of an external clock in the configuration dialog on the integrated
debugger (ID78K4).
See the ID78K/IV Integrated Debugger User’s Manual for the setting method using the integrated debugger and
this chapter for operating with an arbitrary clock.
3.1 Setting of Operating Clock
The following operating clocks can be set in the IE-784000-R.
(1) Operation with fixed clock on IE-784915-R-EM1
When an internal clock is selected by the debugger, a fixed clock (16 MHz) on the emulation board is supplied
to the emulation device.
This mode is set after the power of the IE-784000-R is turned on. This mode remains unchanged unless an
external clock is selected.
(2) Operation with arbitrary clock on IE-784915-R-EM1
An arbitrary clock mounted on the clock setting socket (IC15) is supplied to the emulation device by mounting
a crystal oscillator with the same frequency as the clock supplied to the target device on the clock setting socket
on the IE-784915-R-EM1 and selecting an external clock by the integrated debugger (ID78K4).
See 3.2 Attaching Crystal Oscillator for details.
Caution It is not possible to supply the clock from the oscillation clock on the target system to the
emulation device. When operating at a frequency other than 16 MHz, use the method in (2) to
supply the clock at the frequency actually used.
25
CHAPTER 3 SETTING OF USER CLOCK
3.2 Attaching Crystal Oscillator
<1> Prepare the IE-784915-R-EM1.
<2> Attach a crystal oscillator (MAX. 16 MHz) to the clock setting socket (IC15) on the IE-784915-R-EM1.
Figure 3-1. Mounting Position on IE-784915-R-EM1
CN1
CN2
CLOCK OUT 8
7 GND
CLOCK OUT
GND
NC
VCC
[Crystal oscillator]
VCC 14
1 NC
[IC socket]
26
CHAPTER 3 SETTING OF USER CLOCK
When an external clock is selected by the integrated debugger (ID78K4), the following circuit is configured by which
a clock is supplied from the crystal oscillator to the emulation device in the IE-784000-R-EM.
Figure 3-2. Clock Supply of IE-784915-R-EM1
V
CC
4.7 kΩ
VHC244
CLOCK IN
(to emulation device)
Clock of clock setting socket on
IE-784915-R-EM1
27
CHAPTER 3 SETTING OF USER CLOCK
[MEMO]
28
CHAPTER 4 START-UP
For the start-up method, see the ID78K/IV Integrated Debugger User’s Manual after the connection with the host
machine is completed.
If the start-up does not work out, check problems using this manual or the IE-784000-R User’s Manual.
29
[MEMO]
30
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE
Since this IE performs emulation using the emulation CPU and peripheral simulation device, the IE pin
characteristics are partly different from the pin characteristics of the target device.
31
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE
(1) When chip set board is connected to emulation probe
Figure 5-1. Equivalent Circuit Diagram of Port Pin Emulation Circuit (1/3)
Emulation
device side
Target probe
side
LVCC
10 KΩ
AS244 HC125
27Ω
STOP
AVDD1
RESET
AVDD1
AVDD2
AVSS1
AVREF
NC
NC
AVSS1
AVREF
V
DD
Noise filter
V
DD
SS
AVDD2
V
SS
V
AVSS2
AVSS2
V
CC
NC
NC
NC
NC
NC
TEST/VPP
X1
CKIN
16 MHz
X2
TX1
V
CC
TX2
Clock module
(IC socket)
Caution If an external clock is selected in the configuration setting of the ID78K4, the clock frequency of
the crystal oscillator mounted on the IC socket is selected.
32
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE
Figure 5-1. Equivalent Circuit Diagram of Port Pin Emulation Circuit (2/3)
Emulation device
side
Target probe
side
P0 (7 : 0)
P0 (7 : 0)
27Ω
27Ω
P4 (7 : 0)
P5 (7 : 0)
P6 (7 : 0)
P4 (7 : 0)
P5 (7 : 0)
P6 (7 : 0)
27Ω
27Ω
P7 (7 : 0)
P8 (7 : 0)
P9 (6 : 0)
P7 (7 : 0)
P8 (7 : 0)
P9 (6 : 0)
27Ω
INTP (2 : 0)
PTO0 (2 : 0)
PWM (1 : 0)
INTP (2 : 0)
PTO0 (2 : 0)
PWM (1 : 0)
SCK2
SO2
SCK2
SO2
SI2/BUSY
SI2/BUSY
ANI (11 : 8)
ANI (11 : 8)
NMI
NMI
Q D
NMIMSK1
(emulation board)
33
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE
Figure 5-1. Equivalent Circuit Diagram of Port Pin Emulation Circuit (3/3)
Emulation
Target probe
device side
side
REEL0IN
REEL1IN
CSYNCIN
DFGIN
REEL0IN
REEL1IN
CSYNCIN
DFGIN
DPGIN
DPGIN
CFGIN
CFGIN
CFGAMP0
CFGCPIN
CTLDLY
RECCTL+
CFGAMP0
CFGCPIN
CTLDLY
RECCTL+
RECCTL–
CTLIN
RECCTL–
CTLIN
CTLOUT1
CTLOUT2
VREFC
CTLOUT1
CTLOUT2
VREFC
34
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE
(2) When chip set board is connected to IE-784915-R-EM1
Figure 5-2. Equivalent Circuit Diagram of Port Pin Emulation Circuit (1/3)
Emulation
device side
LVCC
STOP
V
CC
V
DD
Noise filter
AVDD1
AVDD2
V
SS
AVSS1
AVSS2
V
CC
CKIN
16 MHz
V
CC
Clock module
(IC socket)
P0 (7 : 0)
P4 (7 : 0)
P5 (7 : 0)
P6 (7 : 0)
P7 (7 : 0)
P8 (7 : 0)
P9 (6 : 0)
NC
NC
NC
NC
NC
NC
NC
35
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE
Figure 5-2. Equivalent Circuit Diagram of Port Pin Emulation Circuit (2/3)
Emulation device
side
INTP (2 : 0)
NC
NC
PTO0 (2 : 0)
PWM (1 : 0)
VCC
SCK2
SO2
NC
NC
SI2/BUSY
ANI (11 : 8)
NMI
REEL0IN
REEL1IN
36
CHAPTER 5 DIFFERENCES FROM TARGET DEVICE
Figure 5-2. Equivalent Circuit Diagram of Port Pin Emulation Circuit (3/3)
Emulation device
side
CSYNCIN
DFGIN
DPGIN
CFGIN
CFGAMP0
CFGCPIN
NC
CTLDLY
RECCTL+
RECCTL–
CTLIN
NC
NC
NC
NC
NC
CTLOUT1
CTLOUT2
VREFC
NC
Caution When the chip set board is connected with the IE-784915-R-EM1, power supply VDD from the target
is connected with LVCC.
37
[MEMO]
38
APPENDIX A PRODUCT SPECIFICATIONS
Product name
:
:
:
:
:
:
IE-784915-R-EM1
Operating temperature
Humidity
10 to 40 °C (however, there should be no condensation.)
10 to 80% (however, there should be no condensation.)
–15 to +45 °C (however, there should be no condensation.)
+3.0 V to +5.5 V (supplied from IE-784000-R)
210 × 140 mm
Storage temperature
Power supply
Printed circuit board size
Connectors:
Name
CN1
CN2
PJ1
Function
Emulation probe (EP-784915GF-R) connector
Emulation board (IP-784000-R-EM) connector
Unused
PJ2
TGCN1
TGCN2
L1
Chip set board connector
L2
39
[MEMO]
40
VOLUME 2: EP-784915GF-R
EMULATION PROBE
41
[MEMO]
42
CHAPTER 1 GENERAL DESCRIPTION
This chapter explains an outline of the EP-784915GF-R.
1.1 Operating Environment
The EP-784915GF-R is a probe set to connect the IE-784915-R-EM1 with the target system.
Connection by means of the EP-784915GF-R prepares a debugging environment for the microcontroller and allows
you to perform integrated debugging of hardware and software of the target system using the µPD784915 subseries,
µPD784928 subseries, and µPD784928Y subseries.
It can be made compatible with any product in the µPD784915 subseries, µPD784928 subseries, or µPD784928Y
subseries just by changing the chip set board.
For the specific connection method, see CHAPTER 2 CONNECTION.
Figure 1-1. Connection of IE-784000-R and Target System
In-circuit emulator
IE-784000-R
Emulation probe
EP-784915GF-R
Conversion socket
EV-9200GF-R
or
IE-784000-R-EM
Target system
+
NQPACK100RB
IE-784915-R-EM1
1.2 Configuration
The EP-784915GF-R consists of the following three parts.
• Cables
• Chip set board
• Dummy board (LCC type or QFP type can be selected)
Caution The EP-784915GF-R does not come with the chip set board. Use the one provided for the EP-
784915-R-EM1.
43
CHAPTER 1 GENERAL DESCRIPTION
Figure 1-2. EP-784915GF-R Configuration
<1> LCC type
EP-784915GF-R
Cable
Chip set board
Target connection part
Dummy board (LCC type)
<2> QFP
EP-784915GF-R
Cable
Chip set board
Screw
Target connection part
Dummy board (QFP type)
44
CHAPTER 1 GENERAL DESCRIPTION
<1> Cables
The cables are used to connect CN1 and CN2 of the EP-784915-R-EM1 with the chip set board. The cables
come with earth clips and external sense clips connected.
• Earth clips
Connect them to GND of the target system.
They allow the GND potential of the IE-784000-R to become the same as that of the target system making
them resistant to static electricity and noise.
• External sense clips
8 sense clips are provided.
They are used to examine the voltage level of the IC pin mounted on the target system.
Figure 1-3. Emulation Probe (EP-784915GF-R)
Earth clips
100-pin GF
External sense clips
45
CHAPTER 1 GENERAL DESCRIPTION
<2> Chip set board
This is a board on which the µPD78P4916GF, µPD78F4928GF, or µPD78F4928YGF are mounted to perform
emulation of peripheral functions.
Two chip set boards are attached to the IE-784915-R-EM1; one is for the µPD784915 subseries, and other
is for the µPD784928 and 784928Y subseries. The emulation probe can be made compatible with any product
in the µPD784915 subseries, µPD784928 subseries, or µPD784928Y subseries just by changing the chip set
board.
<3> Dummy board
This comprises the connection with the target system and two types are available: LCC type and QFP type
The LCC type and QFP type have different sockets connected to the target (see Table 1-1).
Table 1-1. LCC Type and QFP Type Sockets
LCC Type
Socket on target side EV-9200GF-100
Features
QFP Type
NQPACK100RB
–
µPD78P4916GF, µPD78F4928GF,
or µPD78F4928YGF mountable
on socket (top cover is necessary)
46
CHAPTER 1 GENERAL DESCRIPTION
Figure 1-4. Dummy Board
(1) LCC type
• Side to be connected to chip set board
• Side to be connected to target system
(2) QFP type
• Side to be connected to chip set board
• Side to be connected to target system
47
[MEMO]
48
CHAPTER 2 CONNECTION
This chapter explains the method of connecting the EP-784915GF-R, powering-on/powering-off procedure, and
the method of removing the emulation probe from the target system.
2.1 Outline of Connection Procedure
(1) Connection of emulation board and I/O emulation board
(2) Connection of in-circuit emulator and emulation probe
(3) Connection of emulation probe and target system
(4) Connection of external sense clips (when external sense clips are used)
(5) Powering-on
Details of the connection procedure are given below.
2.1.1 Connection of IE-784000-R-EM and IE-784915-R-EM1
(1) Turn off the power of the IE-784000-R.
(2) Remove the cover of the IE-784000-R.
(3) Connect the IE-784915-R-EM1 to the IE-784000-R-EM.
(4) Insert the IE-784000-R-EM and IE-784915-R-EM1 in the IE-784000-R.
(5) Put the cover on the IE-784000-R.
2.1.2 Connection of IE-784000-R and EP-784915GF-R
(1) Connect the EP-784915GF-R to the emulation probe connection DIN connectors (CN1 and CN2 of the IE-
784915-R-EM1) on the IE-784000-R.
(2) After the connection, be sure to fix the EP-784915GF-R and IE-784000-R with fitting screws.
49
CHAPTER 2 CONNECTION
Figure 2-1. Example of Connection of IE-784000-R Main Unit and EP-784915GF-R
Fitting screws
Emulation probe
(CN1)
(CN2)
IE-784000-R main unit
Caution The connection locations vary depending on the I/O emulation board. See the IE-784000-R User’s
Manual.
50
CHAPTER 2 CONNECTION
2.1.3 Connection of EP-784915GF-R and target system
The emulation probe and target system are connected in the following order.
Cautions 1. Before connecting the EP-784915GF-R with the target system, be sure to connect the earth
clips first. Without the earth clips, the IE-784000-R may be destroyed by static electricity,
etc.
2. Pay attention to inverse insertion of pins when making the connection.
Erroneous connection may destroy the IE-784000-R.
(1) Turn off the power of the target system.
(2) Solder the conversion socket (EV-9200GF-100 or NQPACK100RB) attached to the IE-78495-R-EM1 to the
target system.
(3) Connect the earth clips of the EP-784915GF-R to GND of the target system.
(4) Insert the EP-784915GF-R while aligning the 100-pin GF at the tip of the EP-784915GF-R and pin 1 of the
conversion socket (EV-9200GF-100 or NQPACK100RB) soldered to the target system in (2).
51
CHAPTER 2 CONNECTION
Figure 2-2. Example of Connection of EP-784915GF-R and Target System (LCC Type)
EP-784915GF-R
Chip set board
Dummy board (for LCC type)
EV-9200GF-100
IE-784000-R
Target system
<1> Connect the chip set board and dummy board.
<2> Connect the EP-784915GF-R and <1>.
<3> Connect <1> + <2> with the target system.
52
CHAPTER 2 CONNECTION
Figure 2-3. Example of Connection of EP-784915GF-R and Target System (QFP Type)
EP-784915GF-R
Chip set board
Dummy board (for QFP type)
NQPACK100RB
IE-784000-R
Target system
<1> Connect the dummy board and target system and then fix them with screws.
<2> Connect the EP-784915GF-R and the chip set board.
<3> Connect <1> and <2>.
53
CHAPTER 2 CONNECTION
2.1.4 Connection of external sense clips
The EP-784915GF-R is provided with 8 external sense clips that can trace signals of hardware on the target system
in real-time.
Since the external sense clips are directly connected to the HCT244 input buffer in the IE-784000-R, they are TTL-
level inputs.
Normally, there are 8 external sense clip input signal lines, but the signal line of external sense clip 1 can be used
as an outgoing trigger output signal line when an event occurs by setting the OUT command of the IE-784000-R (see
the IE-784000-R User’s Manual for details).
Cautions 1. Connect the external sense clips only to the TTL-level signal lines. If connected to signal lines
other than the TTL-level signal lines, they cannot detect high/low levels accurately, or the
sensor in the IE-784000-R may be destroyed depending on the voltage level.
2. When external sense clip 1 is used as an external trigger output, ensure that external sense
clip 1 is not connected with the signal output line. Erroneous connection may cause
malfunction.
54
CHAPTER 2 CONNECTION
When using the external sense clips, connect them in the following order.
(1) Turn off the power of the target system and IE-784000-R, in that order.
(2) Attach the IC clips (sold separately) to any IC to be traced on the target system.
(3) Connect the external sense clips to the IC clips attached.
(4) Turn on the power of the IE-784000-R and target system, in that order.
Figure 2-4. Connection of External Sense Clip
External sense clip
IC clip
IC
Target system
Remark When connecting the external clips, use the IC clips wherever possible. This will prevent mis-connection
and improve operability.
55
CHAPTER 2 CONNECTION
2.2 Powering-On/Powering-Off Order
After connection of the emulation probe and target system is completed, turn on the power. The powering-on/
powering-off order is as follows.
Caution Be sure to observe the powering-on/powering-off order. Failing to observe it may destroy the
IE-784000-R.
<Powering-on order>
(1) Turn on the power of the IE-784000-R.
(2) Turn on the power of the target system.
<Powering-off order>
(1) Turn off the power of the target system.
(2) Turn off the power of the IE-784000-R.
56
CHAPTER 2 CONNECTION
2.3 Removing EP-784915GF-R from Target System
Remove the EP-784915GF-R from the target system in the following order.
(1) LCC type
<1> Turn off the power of the target system.
<2> Turn off the power of the IE-784000-R.
<3> Remove the EP-784915GF-R + chip set board + dummy board from the target system.
(2) QFP type
<1> Turn off the power of the target system.
<2> Turn off the power of the IE-784000-R.
<3> Remove the EP-784915GF-R + chip set board from the dummy board + target system.
57
[MEMO]
58
APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET
A.1 External View of EV-9200GF-100 and Recommended Board Mounting Pattern
Figure A-1. External View of EV-9200GF-100 (Reference)
A
B
M
N
O
E
F
EV-9200GF-100
1
No.1 pin index
P
G
H
I
EV-9200GF-100-G0E
ITEM
A
MILLIMETERS
24.6
21
INCHES
0.969
0.827
0.591
0.732
4-C 0.079
0.031
0.472
0.89
B
C
D
E
15
18.6
4-C 2
0.8
F
G
H
I
12.0
22.6
25.3
6.0
0.996
0.236
0.654
076
J
K
16.6
19.3
8.2
L
M
N
O
P
0.323
0.315
0.098
0.079
0.014
0.091
0.059
8.0
2.5
2.0
Q
R
S
0.35
2.3
1.5
59
APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET
Figure A-2. Recommended Board Mounting Pattern of EV-9200GF-100 (Reference)
G
J
K
L
C
B
A
EV-9200GF-100-P1E
ITEM
MILLIMETERS
26.3
INCHES
1.035
A
B
C
D
E
F
G
H
I
21.6
0.85
0.65 0.02 × 29=18.85 0.05 0.026+0.001
+0.002
–0.002 × 1.142=0.742
–0.002
±
±
0.65 0.02 × 19=12.35 0.05 0.026+0.001
+0.003
–0.002 × 0.748=0.486
–0.002
±
±
15.6
20.3
0.614
0.799
0.472
0.236
0.014
+0.003
–0.002
±
12 0.05
+0.003
–0.002
±
6 0.05
+0.001
–0.001
±
0.35 0.02
+0.001
–0.002
±
J
2.36 0.03
0.093
0.091
0.062
K
L
2.3
+0.001
–0.002
±
1.57 0.03
Dimensions of mount pad for EV-9200 and that for target
device (QFP) may be different in some parts. For the
recommended mount pad dimensions for QFP, refer to
"SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL" (C10535E).
Caution
60
APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET
A.2 External View of NQPACK100RB
Figure A-3. External View of NQPACK100RB (Target connection side) (Reference)
A
B
C
R
S
P
Q
c
D
N
O
M
a
G F E
J K
U T
Z
b
L
d
Protrusion height
e
X
V
W
Y
H
I
i
f
k
q
h
g
o
j
p
l
m
n
ITEM MILLIMETERS
INCHES
0.856
ITEM MILLIMETERS
INCHES
0.896
A
B
C
D
E
F
21.75
14.25
0.65x19=12.35
0.65
a
b
c
d
e
f
22.75
0.5
0.561
0.020
0.020
0.026x0.748=0.486
0.026
0.5
φ
φ
4- 2.0
4- 0.079
7.0
0.276
1.8
0.071
0.372
20.75
28.25
17.4
0.817
9.45
1.85
3.7
G
H
I
1.112
g
h
i
0.073
0.685
0.146
21.75
0.65x29=18.85
23.9
0.856
3.9
0.154
J
0.026x1.142=0.742
0.941
j
0.2
0.008
K
L
k
l
1.2
0.047
0.65
0.026
15.25
16.25
0.5
0.600
M
N
O
P
Q
R
S
T
0.4
0.016
m
n
o
p
q
0.640
6.0
0.236
0.020
φ
φ
3- 1.0
3- 0.039
0.25
0.5
0.010
C 1.5
3-R 1.5
17.15
10.0
C 0.059
3-R 0.059
0.675
0.020
6.95
0.274
NQPACK100RB-G1E
0.394
12.0
0.472
U
V
W
X
Y
Z
23.65
15.25
16.25
0.5
0.931
0.600
0.640
0.020
0.5
0.020
21.75
0.856
note: Product by TOKYO ELETECH CORPORATION.
61
APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET
Figure A-4. External view of NQPACK100RB (Top Cover Mounted on Device) (Reference)
A
B
D
O
C
Z
N
S
L
Y
F
G H I
P Q
X
K
J
R
M
k
T
U
V
W
E
i
h
j
b
a
g
c
d
f
e
ITEM MILLIMETERS
INCHES
ITEM MILLIMETERS
INCHES
A
B
C
D
E
F
17.4
0.685
a
b
c
d
e
f
2.25
1.6
0.089
0.063
0.010
0.652
0.692
0.020
0.154
0.091
0.047
0.122
0.291
0.026x0.748=0.486
0.026
0.65x19=12.35
0.65
0.25
16.57
17.57
0.5
0.236
6.0
23.75
7.0
0.935
0.276
G
H
I
0.65x29=18.85
23.9
0.026x1.142=0.742
0.941
g
h
i
3.9
2.3
30.25
0.65
1.191
1.2
J
0.026
j
3.1
φ
φ
K
L
3- 1.0
3- 0.039
k
7.4
C 2.0
C 0.079
HQPACK100RB-G0E
M
N
O
P
Q
R
S
T
3-R 2.5
3-R 0.098
φ
φ
4- 2.2
4- 0.087
14.1
24.07
23.07
0.5
0.555
0.948
0.908
0.020
0.020
0.652
0.692
0.020
0.020
0.791
0.008
C 0.059
0.5
16.57
17.57
0.5
U
V
W
X
Y
Z
0.5
20.1
0.2
C 1.5
note: Product by TOKYO ELETECH CORPORATION.
62
APPENDIX A EXTERNAL VIEW OF CONVERSION SOCKET
Figure A-5. External View of NQPACK100RB (Probe side) (Reference)
A
B
D
X
C
W
U
i
b
h
S
R
g
H G F E
N O P
Z Y
Q
T
a
I
e
c
d
f
V
J
K
L
M
j
k
p
o
x
w
l
n
u
m
v
t
q
r
s
ITEM MILLIMETERS
INCHES
0.685
ITEM MILLIMETERS
INCHES
A
B
C
D
E
F
17.4
a
b
c
d
e
f
0.4
0.685
0.026
0.748
0.486
0.016
0.016
0.791
0.008
C 0.059
0.012
0.010x0.012
0.354
0.087
0.122
0.146
0.098
0.010
0.581
0.612
0.016
0.291
0.154
0.091
0.047
0.026x0.748=0.486
0.026
0.65x19=12.35
0.65
0.4
14.75
15.55
0.4
0.236
6.0
16.85
19.25
21.65
24.05
10.35
12.75
15.15
17.55
23.75
0.65x29=18.85
23.9
0.663
0.758
0.4
G
H
I
0.852
g
h
i
20.1
0.2
0.947
0.407
C 1.5
0.3
J
0.502
j
K
L
0.596
k
l
0.25x0.3
9.0
0.691
M
N
O
P
Q
R
S
T
0.935
m
n
o
p
q
r
2.2
0.026x1.142=0.742
0.941
3.1
3.7
30.25
0.65
1.191
2.5
0.026
0.25
14.75
15.55
0.4
7.0
0.276
0.25
0.010
s
t
3-
φ
1.0
3- 0.039
φ
U
V
W
X
Y
Z
C 2.0
C 0.079
u
v
w
x
7.4
3-R 2.5
3-R 0.098
3.9
φ
φ
4- 2.2
4- 0.087
2.3
14.1
0.555
0.837
0.868
1.2
21.25
22.05
YQPACK100RB-G0E
note: Product by TOKYO ELETECH CORPORATION.
63
[MEMO]
64
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