DEMO-ACPF-7001 [ETC]
Demo board for ACPF-7001 ; 演示板的ACPF- 7001\n
| 型号： | DEMO-ACPF-7001 |
| 厂家： | 
ETC |
| 描述： | Demo board for ACPF-7001
|
| 文件： | 总7页 (文件大小：91K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent ACPF-7001
High Rejection Tx Filter
for US PCS Band
Data Sheet
Features
• High rejection from a single filter
with no switches required
• Passband: 1850 –1910 MHz
33 dB min Attenuation,
1930–1990 MHz
Description
Package
3.5 dB max Insertion Loss
2
This product is a high rejection
full band transmit filter designed
for US PCS handsets. Its perfor-
mance rivals splitband surface
acoustic wave (SAW) transmit
filters. Since the rejection is
provided by a single filter, no
switches are required, saving
board space and external compo-
nents, eliminating switch loss,
and reducing programming
complexity.
3
1
• Space saving solution
Small footprint: 3 x 3-mm solution
Low profile package:
1.1 mm high (typ)
8
4
9
1.25 mm (max)
Applications
• US PCS band handsets
7
5
6
4: Input
8: Output
1, 2, 3, 5, 6, 7, 9: Grounded
Center pad grounded
• Wireless data terminals
See Figure 10 for details.
"x" = date code character
In typical cellular phone archi-
tectures, the transmit filter fits
between the driver amplifier and
the power amplifier. This filter
reduces the noise in the Rx band
being amplified by the transmit
chain, enhancing receiver sensi-
tivity. High rejection keeps
unwanted signals out of the
receive path.
Agilent’s thin-Film Bulk Acoustic
Resonator (FBAR) technology
makes possible high-Q filters at a
fraction of their usual size.
Electrical Specifications, ZO = 50Ω
25°C
-30° to +25°C
25° to +70°C
Symbol
Parameter
Units
Min Typ Max
Min Typ Max
Min Typ Max
f
Passband
MHz
dB
1850
1910
3.5
1850
1910
3.7
1850
1910
3.2
IL
Insertion Loss 1850-1855 MHz
Insertion Loss 1855-1905 MHz
Insertion Loss 1905-1910 MHz
Ripple, 1850-1910 MHz
2.0
1.5
2.5
IL
dB
3.0
3.0
3.0
IL
dB
3.5
3.2
3.7
∆S21
S21
S21
S21
S21
S11, S22
Pin max
dBm
dB
2.5
Min Rejection, 1930-1990 MHz
Min Rejection, 10-1800 MHz
Min Rejection, 1990-3820 MHz
Min Rejection, 3820-5730 MHz
In-band Return Loss
33
37
33
33
dB
25
30
dBm
dBm
dB
15
11
9.0
20
9.0
20
11
9.0
20
11
Safe Input Power Level
dBm
Absolute Maximum Ratings[2]
Parameter
Notes:
Unit
Value
1. Temperature is defined at case TC, the
temperature of the underside of the filter
where it makes contact with the circuit board.
2. Specifications are guaranteed over the given
temperature range. Operation in excess of
any one of these conditions may result in
permanent damage to the device.
Operating Temperature[1]
Storage Temperature[1]
°C
°C
–30 to +85
-30 to +100
Typical Performance, 25°C, ZO = 50Ω
0
0
-10
-20
-30
-40
-50
-1
-2
-3
-4
-5
1.7
1.80
1.90
2.00
2.10
1.83
1.85
1.87
1.89
1.91
1.93
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 1. Attenuation vs. Frequency.
Figure 2. Insertion Loss vs. Frequency.
0
0
-10
-20
-30
-40
-50
-4
-8
-12
-16
-20
0
1.0
2.0
3.0
4.0
5.0
6.0
1.83
1.85
1.87
1.89
1.91
1.93
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 3. Attenuation vs. Frequency
(Broadband).
Figure 4. Return Loss vs. Frequency.
2
PCB Interface and Mounting Instructions
Mounting Consideration and
Demo Boards
Board Description
SMA connectorized Demo boards
are available for sampling. (See
board drawing in Figure 5).
The ACPF-7001 filter has one
input (Pin 4), one output (Pin 8)
and 6 grounds (Pins 1, 2, 3, 5, 6,
7). Furthermore, the inside of the
filter (center pad Pin 9) is
ground-plane; therefore it must
be soldered to PCB ground.
2
3
1
Ground
Ground
Ground
U
1.55 SQ
0.1
9
*
Ground
4
8
Input
Output
0.28
In summary:
• Pins 1, 2, 3, 5, 6, 7, 9 are
grounded. (Figure 5)
0.6
0.28
5
7
6
0.7
Ground
Ground
0.1
Ground
0.7
• Demo board uses 14 mil Getek
Microstrip. (see board layer
Figure 6)
1.3
BOARD
Figure 5. PCB footprint dimensions in mm; pad nomenclature and grounding description.
Note: For best performance, try
to reproduce this board stack up
closely. For example, if
customer’s ground layer is less
than 14 mils, void the 1st ground
layer (and others if necessary)
and use the next available
ground closest to 14 mils. If less
than 14 mils dielectric is used,
parasitic capacitance will slightly
degrade the return loss and
rejection. If Ground-Signal-
Ground (GSG) type board is
used, better return loss can be
achieved since it eliminates
connector mismatch.
0.7 mils
Layer 1 (signal)
14 mils
Getek®
Layer 2 (ground)
Layer 3 is unused
2nd dielectric is for
mechanical support only
Getek® material (ML200D)
dielectric constant: 4.2
Figure 6. Demo board stack up description: layer 1 (signal), layer 2 (ground),
14 mils Getek® dielectric constant (4.2)
4.0 ± 0.1[2]
1.75 ± 0.1
2.0 ± 0.1[1]
0.3 ± 0.05
φ1.55 ± 0.05
5.5 ± 0.1[3]
12.0 ± 0.3
φ1.6 ± 0.1
C
3.3 ± 0.1
L
R 0.3 typ
1.55 ± 0.1
3.3 ± 0.1
8.0 ± 0.1
Notes:
1. Measured from centerline of sprocket hole to centerline of pocket
2. Cumulative tolerance of 10 sprocket holes is ±0.20
All dimensions in millimeters unless otherwise stated.
Figure 7. Tape drawing.
3
13.0 ± 0.5
60.00 ± 0.5
1.60
179.0 ± 1.0
Figure 8. Reel drawing.
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
Notes:
1. Material polyester and acrylic adhesive layers
2. All dimensions in mm, except tape length.
6
12
3. Surface resistivity: 10 to 10 ohms/sq
Figure 9a. Device orientation in the tape.
User Feed Direction
11XX
TXXX
11XX
TXXX
11XX
TXXX
Empty Pocket/Cavity
Leader: 125 Pocket - 1 Meter
Trailer: 125 Pocket - 1 Meter
Top View
End View
Figure 9b. Device orientation in the tape.
4
Ordering Information
Specify part number followed by option. For example:
ACPF-7001-XXX
Bulk or Tape and Reel option
Option Descriptions
-BLK = Bulk, 25 parts per antistatic bag
-TR1 = Tape and Reel, 1000 devices per 7" reel
Orientation
Feature
1.25 max
0.50 ± 0.15
0.50 ± 0.15
1
2
0.35 ± 0.15 8X
3
0.30 MIN
3.0 ± 0.15 SQ
9
4
1.40 SQ
8
0.40
0.40 ± 0.15
7
6
0.60 ± 0.15
5
0.30 DIA
0.20 DIA
SIDE VIEW
Castellation height: 0.35 mm
Total height: 1.1 mm (typ)
1.25 mm (max)
Shaded region: grounded
Figure 10. Detailed bottom and side view of package (dimensions in mm).
5
Alloy type
Melting temp. (oC)
Recommended working
temperature (oC)
Comments
Sn42Bi58
138
160 – 180
165 – 185
200 – 240
200 – 240
200 – 240
235 – 255
235 – 255
240 – 260
260 – 280
260 – 280
260 – 300
Lead free
Sn43Pb43Bi14
Sn63Pb37
144 – 163
183
Contains lead – some customers prohibit it
Contains lead – some customers prohibit it
Contains lead – some customers prohibit it
May have oxidation problems
Sn60Pb40
186
Sn91/Zn9
199
Sn96.2Ag2.5Cu0.8Sb0.5
Sn95.8Ag3.5Cu0.7
Sn96.5Ag3.5
Sn100
216
Popular lead free composition
217
Other alloy ratios are available
221
Used in the assembly of filters
232
Too hot – will melt package assembly
Too hot – will melt package assembly
Too hot – will melt package assembly
Sn95Sb5
235
Sn97Cu3
240
10 to 20 sec.
250
235°C ± 5°C
217°C
200
60 to 120 sec.
125°C ± 25°C
150
100
50
-6°C/sec. max
3°C/sec. max
120 sec. max.
Guidelines
Tested profile
0
0
100
200
300
Time, seconds
400
500
600
Figure 11. Recommended solder profile.
6
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
May 15, 2002
5988-6276EN
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