BBA-322-A [ETC]
GENERAL-PURPOSE BROADBAND RF AMPLIFIER DATA GUIDE; 通用宽带射频放大器数据指南
| 型号： | BBA-322-A |
| 厂家： | 
ETC |
| 描述： | GENERAL-PURPOSE BROADBAND RF AMPLIFIER DATA GUIDE |
| 文件： | 总8页 (文件大小：109K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BBA-322-A
BBA-519-A
GENERAL-PURPOSE BROADBAND RF AMPLIFIER DATA GUIDE
DESCRIPTION:
The BBA series is a family of low-cost
high-performance
broadband
RF
amplifiers. The modules are ideally
suited to a wide range of amplification
and buffering applications including
extending the range of Linx’s own RF
modules (when legally appropriate).
Housed in a compact SMD package, the
hybrid amps are prematched to 50Ω
source and load impedances and require
no external RF components. The
modules utilize a GaHBT gain stage
which yields high gain and IP3, excellent
flatness and low noise.
PHYSICAL DIMENSIONS
GND
VCC
GND
RF IN
RF OUT
GND
ALL BBA AMPS FEATURE:
GND
GND
ꢀ
ꢀ
ꢀ
ꢀ
Prematched for 50Ω Impedance I/O
No External RF Components Required
Exceptional Gain Flatness
PINOUTS (BOTTOM VIEW)
Compact Surface-Mount Package
(for easy hand or automated mounting)
BBA-322 FEATURES:
APPLICATIONS INCLUDE:
ꢀ
High Gain Model
ꢀ
ꢀ
ꢀ
ꢀ
TX/RX Range Enhancement*
ꢀ
10 Mhz-3 Ghz Broadband Operation
IF or RF Buffering
ꢀꢀ +20dB Small Signal Gain @ 900MHz
ꢀꢀ Up to +10 (10mW) Linear Output Power
Driver or Final Stage for PA
General-Purpose Gain Blocks
ꢀ
3.8 dB Noise Figure
ꢀꢀ Operates From a Single Supply
BBA- 519 FEATURES:
ORDERING INFORMATION
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
High Output Model
10 Mhz-4 Ghz Broadband Operation
+18dB Small Signal Gain @ 900MHz
Up to +17 (50mW) Linear Output Power
4.8 dB Noise Figure
PART #
BBA-322-A
DESCRIPTION
Hi-Gain RF Amp
Hi-Power RF Amp
BBA-519-A
BBA Amplifiers are supplied in tube
packaging - 50 pcs. per tube.
Operates From a Single Supply
Revised 1/26/01
PERFORMANCE DATA – BBA-519-A
Parameters BBA-519-A
Supply Current
Rating
120
Unit
mA
dBm
°C
Input RF Power
+13
Environmental Operating Temp.
Storage Temp.
-40 to +85
-60 to 150
°C
ABSOLUTE MAXIMUM RATINGS
These ratings are intended to indicate the limits
past which device damage may occur.
Operation of the device at these limits is not
suggested or guaranteed.
HANDLING
CAUTION
ESD Sensitive Device
TYPICAL OPERATING PARAMETERS
All parameters measured @ 5.2 Volts, 25°C, -30dBm input
Parameters
BBA-519-A
Frequency Range
Gain
Typical
Units
Notes
T=25°C, Icc=65mA
10 to 4000 MHz
18
17
15
13
12
dB
dB
dB
dB
dB
dB
dB
Freq=100MHz
Freq=1000MHz
Freq=2000MHz
Freq=3000MHz
Freq=4000MHz
100MHz to 2000MHz
Freq=2000MHz
In a 50Ωsystem, DC to 4000MHz
In a 50Ωsystem, DC to 4000MHz
Freq=1000MHz±50KHz, PTONE=-10dBm
Gain Flatness
Noise Figure
Input VSWR
Output VSWR
Output IP3
±2
4.8
2.1:1
1.8:1
+33
dBm
dBm
dB
Output P1dB
+18.5
20
Freq=1000MHz
Freq=2000MHz
Reverse Isolation
Power Supply
Device Operating Voltage
4.8-5.2
5.2-12
VDC
VDC
VCC regulated between 4.8 and 5.2VDC
VCC Range using appropriate current limiting
resistor inline with VCC
Operating Current
60
mA
@5VDC
Environmental
Rated Operating
Temperature
0-70
°C
Page 2
Page 2
PERFORMANCE DATA – BBA-322-A
Parameters
Rating
Unit
mA
dBm
°C
Supply Current
65
Input RF Power
+15
Environmental Operating Temp.
Storage Temp.
-40 to +85
-60 to 150
°C
ABSOLUTE MAXIMUM RATINGS
These ratings are intended to indicate the limits
past which device damage may occur.
Operation of the device at these limits is not
suggested or guaranteed.
HANDLING
CAUTION
ESD Sensitive Device
TYPICAL OPERATING PARAMETERS
All parameters measured @ 5 Volts, 25°C, -50dBm input
Parameters
BBA-322-A
Frequency Range
Gain
Typical
Units
Notes
T=25°C, Icc=35mA
DC to 3000 MHz
21
20
17
14
±2
dB
dB
dB
dB
dB
dB
Freq=100MHz
Freq=1000MHz
Freq=2000MHz
Freq=3000MHz
100MHz to 2000MHz
Freq=2000MHz
In a 50Ωsystem, DC to 3000MHz
In a 50Ωsystem, DC to 3000MHz
Freq=2000MHz±50KHz, PTONE=-18dBm
Gain Flatness
Noise Figure
Input VSWR
Output VSWR
Output IP3
3.8
2.3:1
2.1:1
+22.5
dBm
Output P1dB
Reverse Isolation
+11.2
20
dBm
dB
Freq=2000MHz
Freq=2000MHz
Power Supply
Device Operating
Voltage
4.8-5.2
5.2-12
VDC
VDC
VCC regulated between 4.8 and 5.2VDC
VCC Range using appropriate current limiting
resistor inline with VCC
Operating Current
35
mA
@ 5VDC
Environmental
Rated Operating
Temperature
0-70
°C
Page 3
PIN DESCRIPTIONS:
Pin 1,3,5,6,7 GROUND Ground Connection. Keep traces short and connect
immediately to ground plane for best results.
VCC Positive Supply Voltage. Read the Power Supply
Considerations section of this manual carefully to
avoid permanent device damage
Pin 2
VCC
Pin 4
Pin 8
RF IN
RF input pin. This pin is internally DC blocked.
RF output. This pin is internally DC blocked.
RF OUT
GND
VCC
GND
RF IN
RF OUT
GND
GND
GND
*IMPORTANT NOTE:
The purchaser of this device should be aware that approvals
may be required by applicable governing bodies for systems
producing RF energy. It is the responsibility of the user to
determine and adhere to the appropriate regulations for the
region in which operation is intended.
OPERATIONAL CONSIDERATIONS
The use of a gain stage can produce a significant increase in the range
performance of an RF link. It is important to note that it can also introduce
detrimental effects such as the following:
• Amplification of harmonics and LO along with the fundamental carrier
frequency.
• Adverse effect on front-end noise figure on RX’s.
• Potential damage if receiver input is not capable of accommodating high input
power levels.
• Risk of generating illegal power levels and unacceptable interference.
Page 4
POWER SUPPLY CONSIDERATIONS
The user should insure a clean source of power for the amplifier module. In
cases where the supply contains excessive noise, a filter and bypass should be
placed on the supply line in close proximity to the module.
The power supply must be regulated to within the primary range specified or the
maximum current limited using an appropriate resistance in series with the
amplifier’s positive supply pin. Failure to observe the supply limits will irreparibly
damage the device. The resistor should be selected so that the device current is
limited to or less than the maximum rated current. The resistor value may be
easily selected using the following formula:
V
SUPPLY - VDEVICE TYP.
ICC
R=
9-5
Example:
BBA-519 @ 9 Volt Supply
4÷.06
66Ω
=
=
R=
60x10-3
PAD LAYOUT
The pad layout shown below is designed to facilitate both hand and automated
assembly.
0.100"
BBA Pad Layout Pattern
0.310"
(Not to Scale)
0.100"
0.070"
BOARD LAYOUT
If you are at all familiar with RF devices you may be concerned about specialized
layout requirements. Hi-gain high-frequency amplifiers are notorious for layout
challenges. Thankfully, the BBA series is inherently very stable. By adhering to a
few simple design and layout rules you will enjoy a trouble-free implementation.
The module should be placed as close as possible to the transmitter or receiver
with which it is to be paired. A ground plane should be placed under the module,
usually on the backside of the PCB. RF traces to and from the amp should be
kept short and of the proper width to assure service as a 50Ω transmission line.
The module’s RF ports are AC-coupled and require no matching in a 50Ω
system.
Page 5
TYPICAL APPLICATION:
The schematic below pictures a typical configuration for amplifying the output of
a low-cost narrowband transmitter. This configuration would result in a 6-7X
increase in system range. Note that such output levels may render the transmitter
illegal for operation in certain countries.
ANT1
ANTENNA
VCC
LINX LC SERIES TX
LINX BBA-519
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
GND
GND
VCC
GND
GND
RF OUT
GND
DATA IN
GND
VCC
GND
RF IN
DATA IN
GND
IADJ/GND RF OUT
GND
GND
GND
GND
GND
Typical Configuration
PRODUCTION GUIDELINES
The BBA modules are packaged in a hybrid SMD package which has been
designed to support hand- or automated-assembly techniques. Since BBA
devices contain discrete components internally, the assembly procedures are
critical to insuring the reliable function of the BBA product. The following
procedures should be reviewed with and practiced by all assembly personnel.
HAND ASSEMBLY
The BBA’s primary mounting surface is
eight pads located on the bottom of the
module. Since these pads are inaccessible
Soldering Iron
Tip
during mounting, castellations that run up
the side of the module have been provided
to facilitate solder wicking to the module's
underside. If the recommended pad
placement has been followed, the pad on
the board will extend slightly past the edge
of the module.Touch both the PCB pad and
Solder
PCB Pads
Castellations
the module castellation with
a fine
BBA Soldering Technique
soldering tip. Tack one module corner first,
then work around the remaining
attachment points, using care not to exceed the solder times listed below.
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Sec.
Hand-Solder Temp. RX +225°C for 10 Sec.
Recommended Solder Melting Point +180°C
Reflow Oven: +220° Max. (See adjoining diagram)
Page 6
AUTOMATED ASSEMBLY
For high-volume assembly most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with most pick-and-place
equipment; however, due to the module's hybrid nature, certain aspects of the
automated-assembly process are far more critical than for other component
types.
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
process. The reflow profile below should be closely followed since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven's
profile to insure that it meets the requirements necessary to successfully reflow
all components while still meeting the limits mandated by the modules
themselves.
Forced Air Reflow Profile
The stated temperatures refer to the
component mounting pads.
300
°C
Ideal Curve
Limit Curve
250
200
220°C
210°C
180°C
Temperature
150
100
50
Reflow Zone
125°C
20-40 Sec.
Soak Zone
2 Minutes Max.
Preheat Zone
2-2.3 Minutes
Cooling
Ramp-up
1-1.5 Minutes
0
0
30
60
90
120 150 180 210 240 270 300 330 360
Time (Seconds)
Required reflow profile
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the module not be
subjected to shock or vibration during the time solder is liquidus.
Washability
The modules are wash-resistant, but are not hermetically sealed. They may be
subject to a standard wash cycle; however, a twenty-four-hour drying time should
be allowed before applying electrical power to the modules. This will allow any
moisture that has migrated into the module to evaporate, thus eliminating the
potential for shorting during power-up or testing.
Page 7
U.S. CORPORATE HEADQUARTERS:
Linx Technologies, Inc.
5 7 5 S.E. ASHLEY PLACE
Gra nt s Pa ss, O r 9 7 5 2 6
PHO N E: (5 4 1 ) 4 7 1 -6 2 5 6
FAX: (5 4 1 ) 4 7 1 -6 2 5 1
http://www.linxtechnologies.com
Disclaimer
Linx Technologies is continually striving to improve the quality and function of its products; for
this reason, we reserve the right to make changes without notice. The information contained in
this Data Sheet is believed to be accurate as of the time of publication. Specifications are based
on representative lot samples. Values may vary from lot to lot and are not guaranteed. Linx
Technologies makes no guarantee, warranty, or representation regarding the suitability of any
product for use in a specific application. None of these devices is intended for use in
applications of a critical nature where the safety of life or property is at risk. The user assumes
full liability for the use of product in such applications. Under no conditions will Linx Technologies
be responsible for losses arising from the use or failure of the device in any application, other
than the repair, replacement, or refund limited to the original product purchase price. Some
devices described in this publication are patented. Under no circumstances shall any user be
conveyed any license or right to the use or ownership of these patents.
© 2000 by Linx Technologies, Inc. The stylized
Linx logo, Linx, and “Wireless Made Simple”
are the trademarks of Linx Technologies, Inc.
Printed in U.S.A.
Page 8
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