BBA-322-A_08 [ETC]
BBA SERIES RF AMPLIFIER DATA GUIDE; BBA系列射频放大器数据指南
| 型号： | BBA-322-A_08 |
| 厂家： | 
ETC |
| 描述： | BBA SERIES RF AMPLIFIER DATA GUIDE |
| 文件： | 总7页 (文件大小：184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BBA-322-A
BBA-519-A
WIRELESS MADE SIMPLE ®
BBA SERIES RF AMPLIFIER DATA GUIDE
DESCRIPTION
The BBA Series is a family of low-cost high-
performance broadband RF amplifiers. The
modules are ideally suited to a wide range of
amplification and buffering applications,
including extending the range of Linx’s own RF
modules (where legally appropriate). Housed in
a compact SMD package, the hybrid amps are
matched to 50Ω source and load impedances.
The modules utilize a GaHBT gain stage, which
yields high gain and IP3, excellent flatness, and
low noise. The BBA-322-A is the high gain
model and is suitable for the LNA stage of many
receivers. This extra gain stage on the front end
of a receiver can improve the sensitivity and
AMP MODULE
BBA-519-A
LOT 0100
0.360"
0.500"
0.130"
Typ.
Figure 1: BBA Package Dimensions
provide a greater range for the product. The BBA-519-A is the high power model and
is suitable for the final gain stage in a transmitter. This amplifier can boost the output
power of a transmitter to much higher levels and provide a significant increase in
range (where legally appropriate).
BBA SERIES FEATURES
Prematched for 50Ω impedance
No external RF components
required
Exceptional gain flatness
Compact SMD package
Operates from a single supply
BBA-322-A FEATURES
BBA-519-A FEATURES
High gain
High output
3.8dB noise figure
DC-3GHz broadband operation
+20dB small signal gain at
900MHz
Up to +10dB (10mW) linear
output power
4.8dB noise figure
10MHz-3GHz broadband
operation
+18dB small signal gain at
900MHz
Up to +17dB (50mW) linear
output power
APPLICATIONS INCLUDE
ORDERING INFORMATION
TX / RX Range Enhancement
IF or RF Buffering
Driver or Final Stage for PA
General Purpose Gain Blocks
PART #
DESCRIPTION
BBA-322-A
BBA-519-A
High Gain RF Amplifier
High Power RF Amplifier
Amplifiers are supplied in tubes of 50 pcs.
Revised 1/28/08
BBA-322-A ELECTRICAL SPECIFICATIONS
BBA-519-A ELECTRICAL SPECIFICATIONS
Parameter
Designation
Min.
Typical
Max.
Units
Notes
Parameter
Designation
Min.
Typical
Max.
Units
Notes
POWER SUPPLY
Operating Voltage
POWER SUPPLY
Operating Voltage
VCC
ICC
4.8
–
–
5.2
VDC
mA
1
–
VCC
ICC
4.8
–
–
5.2
VDC
mA
1
–
Supply Current
AMPLIFIER SECTION
Frequency Range
Gain:
35.0
65.0
Supply Current
AMPLIFIER SECTION
Frequency Range
Gain:
60.0
65.0
FC
–
DC
-50
–
–
–
3,000
MHz
kHz
dB
2
–
–
–
–
–
3
4
5
5
6
4
FC
–
10
-50
–
–
–
4,000
MHz
kHz
dB
2
–
–
–
–
–
–
3
4
5
5
6
7
+50
–
+50
–
@ 100MHz
21.0
20.0
17.0
14.0
2
@ 100MHz
18.5
17.5
15.5
13.5
12.5
2
@ 1,000MHz
@ 2,000MHz
@ 3,000MHz
Gain Ripple
–
–
dB
@ 1,000MHz
@ 2,000MHz
@ 3,000MHz
@ 4,000MHz
Gain Ripple
–
–
dB
–
–
dB
–
–
dB
–
–
dB
–
–
dB
–
–
–
–
–
–
–
–
dB
–
–
dB
Noise Figure
Input VSWR
Output VSWR
Output IP3
–
3.8
–
dB
–
–
–
–
–
–
–
–
dB
–
2.3
–
–
Noise Figure
Input VSWR
Output VSWR
Output IP3
–
4.8
–
dB
–
2.1
–
–
–
2.1
–
–
–
+22.5
+11.2
–
dBm
dBm
–
1.8
–
–
Output P1dB
–
–
–
+33
+18.5
–
dBm
dBm
Output P1dB
–
–
Reverse Isolation
–
–
20
–
dB
4
ANTENNA PORT
Reverse Isolation
–
–
20
–
dB
4
RF Input Impedance
ENVIRONMENTAL
Operating Temperature Range
RIN
–
50
–
Ω
–
ANTENNA PORT
RF Input Impedance
ENVIRONMENTAL
Operating Temperature Range
RIN
–
50
–
Ω
–
–
-40
–
+85
°C
–
–
-40
–
+85
°C
–
Notes
1. 5.2V to 12V range is possible with the appropriate current-limiting resistor.
2. T = 25°C, ICC = 35mA.
Notes
1. 5.2V to 12V range is possible with the appropriate current-limiting resistor.
2. T = 25°C, ICC = 65mA.
3. 100MHz to 2,000MHz.
4. At 2,000MHz.
5. In a 50Ω system, DC to 3,000MHz.
6. At 2,000MHz 50kHz, PTONE = -18dBm.
3. 100MHz to 2,000MHz.
4. At 2,000MHz.
5. In a 50Ω system, DC to 4,000MHz.
6. At 1,000MHz 50kHz, PTONE = -10dBm.
7. At 1,000MHz.
ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage VCC
Supply Current
RF Input
Operating Temperature
Storage Temperature
Soldering Temperature
+4.8
to
65
+15
to
+5.2
VDC
mA
dBm
°C
Supply Voltage VCC
Supply Current
+4.8
to
120
+13
to
+5.2
VDC
mA
dBm
°C
0
-60
+70
+150
RF Input
to
°C
Operating Temperature
Storage Temperature
Soldering Temperature
0
-60
+70
+150
+225°C for 10 seconds
to
°C
*NOTE* Exceeding any of the limits of this section may lead to permanent
damage to the device. Furthermore, extended operation at these maximum
ratings may reduce the life of this device.
+225°C for 10 seconds
*NOTE* Exceeding any of the limits of this section may lead to permanent
damage to the device. Furthermore, extended operation at these maximum
ratings may reduce the life of this device.
*CAUTION*
This product incorporates numerous static-sensitive components.
Always wear an ESD wrist strap and observe proper ESD handling
procedures when working with this device. Failure to observe this
precaution may result in module damage or failure.
*NOTE* The purchaser of this device should be aware that approvals may be
required by applicable governing bodies for systems producing RF energy. It
is the responsibility of the user to determine and adhere to the appropriate
regulations for the region in which operation is intended.
Page 2
Page 3
PERFORMANCE DATA
THEORY OF OPERATION
These performance parameters
are based on module operation at
25°C from a 5.0VDC supply with a
-50dBm input unless otherwise
noted. Figure 2 illustrates the
connections necessary for testing
and operation. It is recommended
all ground pins be connected to the
ground plane.
The BBA Series is a family of low-cost, high-performance, broadband RF
amplifiers. They utilize an advanced Gallium Arsenide Heterojunction Bipolar
Transistor (HBT) gain stage, which yields high gain and IP3, excellent flatness,
and low noise. They are self-contained with 50Ω input and output impedances
and require only one external DC biasing resistor to operate as specified.
VCC
1
2
3
4
8
7
6
5
GND RF OUT
VCC
GND
GND
GND
GND
RF IN
The BBA-322-A is the high gain model and is suitable for the LNA stage of many
receivers. This extra gain stage on the front end of a receiver can improve the
sensitivity and provide a greater range for the product.
BBA-519-A
GND
GND
Figure 2: Test / Basic Application Circuit
The BBA-519-A is the high power model and is suitable for the final gain stage
in a transmitter. This amplifier can boost the output power of a transmitter to
much higher levels and provide a significant increase in range (where legally
appropriate).
PIN ASSIGNMENTS
1
2
3
4
GND RF OUT
8
VCC
VCC
GND
RF IN
GND
GND
GND
7
6
5
RF OUT
Figure 3: BBA Series Amplifier Pinout (Top View)
RF IN
PIN DESCRIPTIONS
Pin # Name
Description
Analog Ground
Supply Voltage
Analog Ground
50-ohm RF Input
Analog Ground
Analog Ground
Analog Ground
50-ohm RF Output
1
2
3
4
5
6
7
8
GND
VCC
GND
RF IN
GND
GND
Figure 4: BBA Series Amplifier Schematic
GND
OPERATIONAL CONSIDERATIONS
GND
The use of a gain stage can produce a significant increase in the range
performance of an RF link. It is important to note that it can also introduce
detrimental effects, such as the following:
RF OUT
Table 1: BBA Series Amplifier Pin Descriptions
• Amplification of harmonics and LO along with the fundamental carrier frequency.
• Adverse effect on the front-end noise figure on receivers.
• Potential damage if the receiver input is not capable of accommodating high
input power levels.
• Risk of generating illegal power levels and unacceptable interference.
It is up to the designer to ensure that the final product will comply with all
appropriate regulations in the county of intended use.
Page 4
Page 5
POWER SUPPLY REQUIREMENTS
TYPICAL APPLICATIONS
The module does not have an internal voltage
regulator; therefore it requires a clean, well-regulated
power source. While it is preferable to power the unit
from a battery, the unit can also be operated from a
power supply as long as noise is less than 20mV.
Power supply noise can significantly affect the
performance; therefore, providing a clean power
supply for the module should be a high priority during
design.
The schematic in the figure below shows a typical configuration for amplifying the
output of a transmitter.
Vcc TO
MODULE
10Ω
VCC
Vcc IN
+
VCC
10μF
1
8
7
6
5
GND RF OUT
GND
GND
GND
GND
270
Figure 5: Supply Filter
1
10
9
4
PDN
VCC
ANT
GND
RF IN
BBA-519-A
A 10Ω resistor in series with the supply followed by a 10µF tantalum capacitor
from VCC to ground will help in cases where the quality of supply power is poor.
These values may need to be adjusted depending on the noise present on the
supply line.
3
4
8
LO V D
GND
7
6
GND /CLK SE
/CLK
GND
TX DATA
TXM-xxx-ES
GND
The power supply must be regulated to within the primary range specified or the
maximum current limited using an appropriate resistance in series with the
amplifier’s positive supply pin. Failure to observe the supply limits will irreparably
damage the device. The resistor should be selected so that the device current is
limited to or less than the maximum rated current. The resistor value may be
easily selected using the following formula:
Figure 6: Typical Application Circuit
In this circuit, the BBA-519-A amplifies the output of the ES Series transmitter.
The transmitter operates on 3V while the amplifier requires 5V, so a 270Ω
resistor is used to drop the 5V supply to 3V for the transmitter.
V
- V
DEVICE TYP.
This configuration would result in a 6 to 7 times increase in system range. Note
that such output levels may render the transmitter illegal for operation in certain
countries, so it is up to the designer to ensure that the product will comply with
the appropriate regulations.
SUPPLY
R =
I
CC
Example:
BBA-519-A @ 9V Supply
9 - 5
9 - 5
4
= 66Ω
R =
=
=
-3
-3
60x10
60x10
0.06
Page 6
Page 7
BOARD LAYOUT GUIDELINES
MICROSTRIP DETAILS
If you are at all familiar with RF devices, you may be concerned about
specialized board layout requirements. Fortunately, because of the care taken by
Linx in designing the modules, integrating them is very straightforward. Despite
this ease of application, it is still necessary to maintain respect for the RF stage
and exercise appropriate care in layout and application in order to maximize
performance and ensure reliable operation. The antenna can also be influenced
by layout choices. Please review this data guide in its entirety prior to beginning
your design. By adhering to good layout principles and observing some basic
design rules, you will be on the path to RF success.
A transmission line is a medium whereby RF energy is transferred from one
place to another with minimal loss. This is a critical factor, especially in high-
frequency products like Linx RF modules, because the trace leading to the
module’s antenna can effectively contribute to the length of the antenna,
changing its resonant bandwidth. In order to minimize loss and detuning, some
form of transmission line between the antenna and the module should be used,
unless the antenna can be placed very close (<1/8in.) to the module. One
common form of transmission line is a coax cable, another is the microstrip. This
term refers to a PCB trace running over a ground plane that is designed to serve
as a transmission line between the module and the antenna. The width is based
on the desired characteristic impedance of the line, the thickness of the PCB,
and the dielectric constant of the board material. For standard 0.062in thick FR-
4 board material, the trace width would be 111 mils. The correct trace width can
be calculated for other widths and materials using the information below. Handy
software for calculating microstrip lines is also available on the Linx website,
www.linxtechnologies.com.
The adjacent figure shows the suggested
PCB footprint for the module. The actual pad
dimensions are shown in the Pad Layout
section of this manual. A ground plane (as
large as possible) should be placed on a
lower layer of your PC board opposite the
GROOUUNNDD PPLLAANNEE
ON LLOWER LAYER
module. This ground plane can also be critical
to the performance of your antenna, which will
be discussed later. There should not be any
Trace
ground or traces under the module on the
same layer as the module, just bare PCB.
Figure 7: Suggested PCB Layout
Board
During prototyping, the module should be soldered to a properly laid-out circuit
board. The use of prototyping or “perf” boards will result in horrible performance
and is strongly discouraged.
Ground plane
No conductive items should be placed within 0.15in of the module’s top or sides.
Do not route PCB traces directly under the module. The underside of the module
has numerous signal-bearing traces and vias that could short or couple to traces
on the product’s circuit board.
The module’s ground lines should each have their own via to the ground plane
and be as short as possible.
The module should, as much as reasonably possible, be isolated from other
components on your PCB, especially high-frequency circuitry such as crystal
oscillators, switching power supplies, and high-speed bus lines. Make sure
internal wiring is routed away from the module and antenna, and is secured to
prevent displacement.
The power supply filter should be placed close to the module’s VCC line.
In some instances, a designer may wish to encapsulate or “pot” the product.
Many Linx customers have done this successfully; however, there are a wide
variety of potting compounds with varying dielectric properties. Since such
compounds can considerably impact RF performance, it is the responsibility of
the designer to carefully evaluate and qualify the impact and suitability of such
materials.
Figure 8: Microstrip Formulas
Effective Dielectric
Constant
Characteristic
Impedance
Dielectric Constant Width/Height (W/d)
The trace from the module to the antenna should be kept as short as possible.
A simple trace is suitable for runs up to 1/8-inch for antennas with wide
bandwidth characteristics. For longer runs or to avoid detuning narrow bandwidth
antennas, such as a helical, use a 50-ohm coax or 50-ohm microstrip
transmission line as described in the following section.
4.80
4.00
2.55
1.8
2.0
3.0
3.59
3.07
2.12
50.0
51.0
48.0
Page 8
Page 9
PAD LAYOUT
AUTOMATED ASSEMBLY
The following pad layout diagram is designed to facilitate both hand and
automated assembly.
For high-volume assembly, most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with reflow processing
techniques; however, due to the their hybrid nature, certain aspects of the
assembly process are far more critical than for other component types.
0.065"
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
0.340"
0.070"
The single most critical stage in the automated assembly process is the reflow
stage. The reflow profile below should not be exceeded, since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven’s
profile to ensure that it meets the requirements necessary to successfully reflow
all components while still remaining within the limits mandated by the modules.
The figure below shows the recommended reflow oven profile for the modules.
0.100"
Figure 9: Recommended PCB Layout
PRODUCTION GUIDELINES
300
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
The modules are housed in a hybrid SMD package that supports hand or
automated assembly techniques. Since the modules contain discrete
components internally, the assembly procedures are critical to ensuring the
reliable function of the modules. The following procedures should be reviewed
with and practiced by all assembly personnel.
255°C
250
200
150
100
50
235°C
217°C
185°C
180°C
HAND ASSEMBLY
Pads located on the bottom of the
module are the primary mounting
surface. Since these pads are
inaccessible during mounting,
Soldering Iron
Tip
125°C
castellations that run up the side of
the module have been provided to
facilitate solder wicking to the
module’s underside. This allows for
very quick hand soldering for
Solder
PCB Pads
0
30
60
90
120
150
180
210
240
270
300
330
360
Castellations
Time (Seconds)
prototyping and small volume
Figure 11: Maximum Reflow Profile
Figure 10: Soldering Technique
production.
If the recommended pad guidelines have been followed, the pads will protrude
slightly past the edge of the module. Use a fine soldering tip to heat the board
pad and the castellation, then introduce solder to the pad at the module’s edge.
The solder will wick underneath the module, providing reliable attachment. Tack
one module corner first and then work around the device, taking care not to
exceed the times listed below.
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the modules not be
subjected to shock or vibration during the time solder is liquid. Should a shock
be applied, some internal components could be lifted from their pads, causing
the module to not function properly.
Washability
Absolute Maximum Solder Times
The modules are wash resistant, but are not hermetically sealed. Linx
recommends wash-free manufacturing; however, the modules can be subjected
to a wash cycle provided that a drying time is allowed prior to applying electrical
power to the modules. The drying time should be sufficient to allow any moisture
that may have migrated into the module to evaporate, thus eliminating the
potential for shorting damage during power-up or testing. If the wash contains
contaminants, the performance may be adversely affected, even after drying.
Hand-Solder Temp. TX +225°C for 10 Seconds
Hand-Solder Temp. RX +225°C for 10 Seconds
Recommended Solder Melting Point +180°C
Reflow Oven: +220°C Max. (See adjoining diagram)
Page 10
Page 11
WIRELESS MADE SIMPLE ®
U.S. CORPORATE HEADQUARTERS
LINX TECHNOLOGIES, INC.
159 ORT LANE
MERLIN, OR 97532
PHONE: (541) 471-6256
FAX: (541) 471-6251
www.linxtechnologies.com
Disclaimer
Linx Technologies is continually striving to improve the quality and function of its products. For this reason,
we reserve the right to make changes to our products without notice. The information contained in this
Overview Guide is believed to be accurate as of the time of publication. Specifications are based on
representative lot samples. Values may vary from lot-to-lot and are not guaranteed. "Typical" parameters can
and do vary over lots and application. Linx Technologies makes no guarantee, warranty, or representation
regarding the suitability of any product for use in any specific application. It is the customer's responsibility
to verify the suitability of the part for the intended application. NO LINX PRODUCT IS INTENDED FOR USE
IN ANY APPLICATION WHERE THE SAFETY OF LIFE OR PROPERTY IS AT RISK.
Linx Technologies DISCLAIMS ALL WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE. IN NO EVENT SHALL LINX TECHNOLOGIES BE LIABLE FOR ANY OF
CUSTOMER'S INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING IN ANY WAY FROM ANY DEFECTIVE
OR NON-CONFORMING PRODUCTS OR FOR ANY OTHER BREACH OF CONTRACT BY LINX
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refund limited to the original product purchase price. Devices described in this publication may contain
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© 2008 by Linx Technologies, Inc. The stylized Linx logo,
Linx, “Wireless Made Simple”, CipherLinx, and the stylized
CL logo are the trademarks of Linx Technologies, Inc.
Printed in U.S.A.
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