BAS16WT1/D [ETC]
Switching Diode ; 开关二极管\n
| 型号： | BAS16WT1/D |
| 厂家： | 
ETC |
| 描述： | Switching Diode
|
| 文件： | 总8页 (文件大小：66K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ON Semiconductort
Silicon Switching Diode
BAS16WT1
ON Semiconductor Preferred Device
MAXIMUM RATINGS (T = 25°C)
A
Rating
Symbol
Max
75
Unit
V
Continuous Reverse Voltage
Recurrent Peak Forward Current
V
R
3
I
R
200
500
mA
mA
1
2
Peak Forward Surge Current
I
FM(surge)
Pulse Width = 10 µs
Total Power Dissipation, One Diode Loaded
P
D
200
1.6
mW
CASE 419–04, STYLE 2
SC–70/SOT–323
T = 25°C
A
Derate above 25°C
mW/°C
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
Operating and Storage Junction
Temperature Range
T , T
–55 to +150
°C
J
stg
THERMAL CHARACTERISTICS
Characteristic
3
CATHODE
1
ANODE
Symbol
Max
Unit
Thermal Resistance, Junction to Ambient
One Diode Loaded
R
0.625
°C/mW
θ
JA
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
DEVICE MARKING
BAS16WT1 = A6
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Max
Unit
Forward Voltage
V
F
mV
(I = 1.0 mA)
—
—
—
—
715
866
1000
1250
F
(I = 10 mA)
F
(I = 50 mA)
F
(I = 150 mA)
F
Reverse Current
I
R
µA
(V = 75 V)
—
—
—
1.0
50
30
R
(V = 75 V, T = 150°C)
R
J
(V = 25 V, T = 150°C)
R
J
Capacitance
(V = 0, f = 1.0 MHz)
R
C
—
—
—
—
2.0
6.0
45
pF
ns
PC
V
D
Reverse Recovery Time
t
rr
(I = I = 10 mA, R = 50 Ω) (Figure 1)
F
R
L
Stored Charge
(I = 10 mA to V = 6.0 V, R = 500 Ω) (Figure 2)
QS
F
R
L
Forward Recovery Voltage
(I = 10 mA, t = 20 ns) (Figure 3)
V
FR
1.75
F
r
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
Semiconductor Components Industries, LLC, 2001
1
Publication Order Number:
March, 2001 – Rev. 2
BAS16WT1/D
BAS16WT1
1 ns MAX
DUT
500 Ω
t
t
rr
10%
t
if
50 Ω
DUTY CYCLE = 2%
90%
V
F
I
rr
100 ns
Figure 1. Reverse Recovery Time Equivalent Test Circuit
OSCILLOSCOPE
R . 10 MW
C 3 7 pF
DUT
BAW62
243 pF
V
C
500 Ω
V
CM
20 ns MAX
D1
100 KΩ
t
10%
Qa
C
V
CM
+
DUTY CYCLE = 2%
t
90%
V
f
400 ns
Figure 2. Recovery Charge Equivalent Test Circuit
V
120 ns
1 KΩ
450 Ω
V
90%
DUT
50 Ω
V
fr
t
10%
DUTY CYCLE = 2%
2 ns MAX
Figure 3. Forward Recovery Voltage Equivalent Test Circuit
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2
BAS16WT1
10
100
10
T = 150°C
A
T = 125°C
A
1.0
T = 85°C
A
T = 85°C
A
0.1
0.01
T = 25°C
A
T = 55°C
1.0
0.1
A
T = -ā40°C
A
T = 25°C
A
0.001
50
0.2
0.4
0.6
0.8
1.0
1.2
0
10
20
30
40
V , FORWARD VOLTAGE (VOLTS)
F
V , REVERSE VOLTAGE (VOLTS)
R
Figure 4. Forward Voltage
Figure 5. Leakage Current
0.68
0.64
0.60
0.56
0.52
0
2
4
6
8
V , REVERSE VOLTAGE (VOLTS)
R
Figure 6. Capacitance
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3
BAS16WT1
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.025
0.65
0.025
0.65
0.075
1.9
0.035
0.9
0.028
0.7
inches
mm
SC–70/SOT–323 POWER DISSIPATION
The power dissipation of the SC–70/SOT–323 is a
function of the collector pad size. This can vary from the
minimum pad size for soldering to the pad size given for
maximum power dissipation. Power dissipation for a
the equation for an ambient temperature T of 25°C, one can
calculate the power dissipation of the device which in this
case is 200 milliwatts.
A
150°C – 25°C
0.625°C/W
PD =
= 200 milliwatts
surface mount device is determined by T
, the
J(max)
maximum rated junction temperature of the die, R , the
θJA
thermal resistance from the device junction to ambient; and
The 0.625°C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 200 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad . Using a board material such
as Thermal Clad, a power dissipation of 300 milliwatts can
be achieved using the same footprint.
the operating temperature, T . Using the values provided on
A
the data sheet, P can be calculated as follows.
D
T
J(max) – TA
Rθ
PD =
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• The soldering temperature and time should not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
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4
BAS16WT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can affect
the profile include the type of soldering system in use,
density and types of components on the board, type of solder
used, and the type of board or substrate material being used.
This profile shows temperature versus time. The line on the
graph shows the actual temperature that might be
experienced on the surface of a test board at or near a central
solder joint. The two profiles are based on a high density and
a
low density board. The Vitronics SMD310
convection/infrared reflow soldering system was used to
generate this profile. The type of solder used was 62/36/2
Tin Lead Silver with a melting point between 177–189°C.
When this type of furnace is used for solder reflow work, the
circuit boards and solder joints tend to heat first. The
components on the board are then heated by conduction. The
circuit board, because it has a large surface area, absorbs the
thermal energy more efficiently, then distributes this energy
to the components. Because of this effect, the main body of
a component may be up to 30 degrees cooler than the
adjacent solder joints.
STEP 5
HEATING
ZONES 4 & 7
SPIKE"
STEP 6 STEP 7
VENT COOLING
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
STEP 3
HEATING
STEP 4
HEATING
ZONES 3 & 6
SOAK"
SOAK" ZONES 2 & 5
RAMP"
205° TO 219°C
PEAK AT
SOLDER JOINT
200°C
150°C
170°C
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
140°C
100°C
MASS OF ASSEMBLY)
100°C
50°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 7. Typical Solder Heating Profile
PACKAGE DIMENSIONS
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5
BAS16WT1
SC–70 (SOT–323)
CASE 419–04
ISSUE L
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3
B
S
INCHES
DIM MIN MAX
MILLIMETERS
1
2
MIN
1.80
1.15
0.80
0.30
1.20
0.00
0.10
MAX
2.20
1.35
1.00
0.40
1.40
0.10
0.25
A
B
C
D
G
H
J
0.071
0.045
0.032
0.012
0.047
0.000
0.004
0.087
0.053
0.040
0.016
0.055
0.004
0.010
D
G
K
L
0.017 REF
0.026 BSC
0.028 REF
0.425 REF
0.650 BSC
0.700 REF
J
N
C
N
S
0.079
0.095
2.00
2.40
0.05 (0.002)
K
H
STYLE 2:
PIN 1. ANODE
2. N.C.
3. CATHODE
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BAS16WT1
Notes
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BAS16WT1
Thermal Clad is a trademark of the Bergquist Company
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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BAS16WT1/D
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