AT27BV512-70JC [ETC]

x8 EPROM ; X8 EPROM\n
AT27BV512-70JC
型号: AT27BV512-70JC
厂家: ETC    ETC
描述:

x8 EPROM
X8 EPROM\n

可编程只读存储器 电动程控只读存储器
文件: 总12页 (文件大小:160K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Fast Read Access Time - 70 ns  
Dual Voltage Range Operation  
– Unregulated Battery Power Supply Range, 2.7V to 3.6V  
or Standard 5V ± 10% Supply Range  
Pin Compatible with JEDEC Standard AT27C512R  
Low Power CMOS Operation  
– 20 µA max. (less than 1 µA typical) Standby for VCC = 3.6V  
– 29 mW max. Active at 5 MHz for VCC = 3.6V  
JEDEC Standard Surface Mount Packages  
– 32-Lead PLCC  
– 28-Lead 330-mil SOIC  
– 28-Lead TSOP  
High Reliability CMOS Technology  
– 2,000V ESD Protection  
512K (64K x 8)  
Unregulated  
Battery-Voltage™  
High Speed OTP  
EPROM  
– 200 mA Latchup Immunity  
Rapid™ Programming Algorithm - 100 µs/byte (typical)  
CMOS and TTL Compatible Inputs and Outputs  
– JEDEC Standard for LVTTL and LVBO  
Integrated Product Identification Code  
Commercial and Industrial Temperature Ranges  
Description  
AT27BV512  
The AT27BV512 is a high performance, low power, low voltage 524,288-bit one-time  
programmable read only memory (OTP EPROM) organized as 64K by 8 bits. It  
requires only one supply in the range of 2.7V to 3.6V in normal read mode operation,  
making it ideal for fast, portable systems using either regulated or unregulated battery  
power.  
(continued)  
Pin Configurations  
SOIC Top View  
Pin Name  
A0 - A15  
O0 - O7  
CE  
Function  
Addresses  
Outputs  
A15  
A12  
A7  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
VCC  
A14  
A13  
A8  
2
3
A6  
4
A5  
5
A9  
A4  
6
A11  
Chip Enable  
A3  
7
OE/VPP  
A10  
CE  
A2  
8
Output Enable/  
Program Supply  
A1  
9
OE/VPP  
NC  
A0  
10  
11  
12  
13  
14  
O7  
O0  
O1  
O2  
GND  
O6  
O5  
No Connect  
O4  
O3  
PLCC Top View  
TSOP Top View  
Type 1  
OE/VPP  
A11  
A9  
22  
23  
24  
25  
26  
27  
28  
1
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
A10  
CE  
O7  
O6  
O5  
O4  
O3  
GND  
O2  
O1  
O0  
A0  
A6  
A5  
A4  
A3  
A2  
5
6
7
8
9
29 A8  
28 A9  
27 A11  
26 NC  
25 OE/VPP  
24 A10  
23 CE  
22 O7  
21 O6  
A8  
A13  
A14  
VCC  
A15  
A12  
A7  
A1 10  
A0 11  
NC 12  
O0 13  
2
3
A6  
4
A5  
5
A4  
6
A1  
Rev. 0602B–10/98  
A3  
7
8
A2  
Note: PLCC package pins 1 and 17 are  
DON’T CONNECT.  
1
Atmel’s innovative design techniques provide fast speeds  
that rival 5V parts while keeping the low power consump-  
tion of a 3V supply. At VCC = 2.7V, any byte can be  
accessed in less than 70 ns. With a typical power con-  
sumption of only 18 mW at 5 MHz and VCC = 3V, the  
AT27BV512 consumes less than one fifth the power of a  
standard 5V EPROM.  
ming Algorithm reduces the time required to program the  
part and guarantees reliable programming. Programming  
time is typically only 100 µs/byte. The Integrated Product  
Identification Code electronically identifies the device and  
manufacturer. This feature is used by industry standard  
programming equipment to select the proper programming  
algorithms and voltages. The AT27BV512 programs  
exactly the same way as a standard 5V AT27C512R and  
uses the same programming equipment.  
Standby mode supply current is typically less than 1 µA at  
3V. The AT27BV512 simplifies system design and  
stretches battery lifetime even further by eliminating the  
need for power supply regulation.  
System Considerations  
The AT27BV512 is available in industry standard JEDEC-  
approved one-time programmable (OTP) plastic PLCC,  
SOIC, and TSOP packages. All devices feature two-line  
control (CE, OE) to give designers the flexibility to prevent  
bus contention.  
Switching between active and standby conditions via the  
Chip Enable pin may produce transient voltage excursions.  
Unless accommodated by the system design, these tran-  
sients may exceed data sheet limits, resulting in device  
non-conformance. At a minimum, a 0.1 µF high frequency,  
low inherent inductance, ceramic capacitor should be uti-  
lized for each device. This capacitor should be connected  
between the VCC and Ground terminals of the device, as  
close to the device as possible. Additionally, to stabilize the  
supply voltage level on printed circuit boards with large  
EPROM arrays, a 4.7 µF bulk electrolytic capacitor should  
be utilized, again connected between the VCC and Ground  
terminals. This capacitor should be positioned as close as  
possible to the point where the power supply is connected  
to the array.  
The AT27BV512 operating with VCC at 3.0V produces TTL  
level outputs that are compatible with standard TTL logic  
devices operating at VCC = 5.0V. At VCC = 2.7V, the part is  
compatible with JEDEC approved low voltage battery oper-  
ation (LVBO) interface specifications. The device is also  
capable of standard 5-volt operation making it ideally suited  
for dual supply range systems or card products that are  
pluggable in both 3-volt and 5-volt hosts.  
Atmel’s AT27BV512 has additional features to ensure high  
quality and efficient production use. The Rapid™ Program-  
Block Diagram  
AT27BV512  
2
AT27BV512  
Absolute Maximum Ratings*  
*NOTICE:  
Stresses beyond those listed under “Absolute  
Maximum Ratings” may cause permanent dam-  
age to the device. This is a stress rating only and  
functional operation of the device at these or any  
other conditions beyond those indicated in the  
operational sections of this specification is not  
implied. Exposure to absolute maximum rating  
conditions for extended periods may affect  
device reliability  
Temperature Under Bias.................................. -40°C to +85°C  
Storage Temperature..................................... -65°C to +125°C  
Voltage on Any Pin with  
Respect to Ground .........................................-2.0V to +7.0V(1)  
Voltage on A9 with  
Respect to Ground ......................................-2.0V to +14.0V(1)  
VPP Supply Voltage with  
Respect to Ground .......................................-2.0V to +14.0V(1)  
Note:  
1. Minimum voltage is -0.6V dc which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is  
VCC + 0.75V dc which may be exceeded if certain precautions are observed (consult application notes) and which may  
overshoot to +7.0V for pulses of less than 20 ns.  
Operating Modes  
Mode \ Pin  
CE  
VIL  
VIL  
VIH  
VIL  
VIL  
VIH  
OE/VPP  
VIL  
Ai  
VCC  
Outputs  
DOUT  
Read(2)  
Ai  
VCC  
VCC  
VCC  
VCC  
VCC  
VCC  
(2)  
Output Disable(2)  
Standby(2)  
VIH  
X(1)  
High Z  
High Z  
DIN  
(2)  
(2)  
(3)  
(3)  
(3)  
X
X
Rapid Program(3)  
PGM Verify(3)  
PGM Inhibit(3)  
VPP  
VIL  
Ai  
Ai  
DOUT  
VPP  
X
High Z  
(4)  
A9 = VH  
Product Identification(3)(5)  
VIL  
VIL  
A0 = VIH or VIL  
A1 - A15 = VIL  
VCC  
Identification Code  
(3)  
Notes: 1. X can be VIL or VIH.  
2. Read, output disable, and standby modes require, 2.7V VCC 3.6V, or 4.5V VCC 5.5V.  
3. Refer to Programming Characteristics. Programming modes require VCC = 6.5V.  
4. VH = 12.0 ± 0.5V.  
5. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled low  
(VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.  
3
DC and AC Operating Conditions for Read Operation  
AT27BV512  
-70  
-90  
-12  
-15  
Com.  
Ind.  
0°C - 70°C  
-40°C - 85°C  
2.7V to 3.6V  
5V ± 10%  
0°C - 70°C  
0°C - 70°C  
-40°C - 85°C  
2.7V to 3.6V  
5V ± 10%  
0°C - 70°C  
-40°C - 85°C  
2.7V to 3.6V  
5V ± 10%  
Operating Temperature  
(Case)  
-40°C - 85°C  
2.7V to 3.6V  
5V ± 10%  
VCC Power Supply  
DC and Operating Characteristics for Read Operation  
Symbol  
Parameter  
Condition  
Min  
Max  
Units  
VCC = 2.7V to 3.6V  
ILI  
Input Load Current  
VIN = 0V to VCC  
VOUT = 0V to VCC  
VPP = VCC  
±1  
±5  
µA  
µA  
µA  
µA  
µA  
mA  
V
ILO  
Output Leakage Current  
VPP(1) Read/Standby Current  
(2)  
IPP1  
10  
ISB1 (CMOS), CE = VCC ± 0.3V  
20  
ISB  
ICC  
VIL  
VCC(1) Standby Current  
VCC Active Current  
Input Low Voltage  
ISB2 (TTL), CE = 2.0 to VCC + 0.5V  
100  
f = 5 MHz, IOUT = 0 mA, CE = VIL, VCC = 3.6V  
8
V
CC = 3.0 to 3.6V  
CC = 2.7 to 3.6V  
-0.6  
-0.6  
0.8  
V
0.2 x VCC  
VCC + 0.5  
VCC + 0.5  
0.4  
V
VCC = 3.0 to 3.6V  
CC = 2.7 to 3.6V  
IOL = 2.0 mA  
2.0  
V
VIH  
Input High Voltage  
Output Low Voltage  
V
0.7 x VCC  
V
V
VOL  
I
OL = 100 µA  
OL = 20 µA  
0.2  
V
I
0.1  
V
IOH = -2.0 mA  
2.4  
V
VOH  
Output High Voltage  
I
OH = -100 µA  
OH = -20 µA  
VCC - 0.2  
VCC - 0.1  
V
I
V
VCC = 4.5V to 5.5V  
ILI  
Input Load Current  
VIN = 0V to VCC  
±1  
±5  
µA  
µA  
µA  
µA  
mA  
mA  
V
ILO  
Output Leakage Current  
VOUT = 0V to VCC  
VPP = VCC  
(2)  
IPP1  
VPP(1) Read/Standby Current  
10  
ISB1 (CMOS), CE = VCC ± 0.3V  
100  
1
ISB  
VCC(1) Standby Current  
ISB2 (TTL), CE = 2.0 to VCC + 0.5V  
ICC  
VIL  
VIH  
VOL  
VCC Active Current  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
Output High Voltage  
f = 5 MHz, IOUT = 0 mA, CE = VIL  
20  
-0.6  
2.0  
0.8  
VCC + 0.5  
0.4  
V
IOL = 2.1 mA  
V
VOH  
IOH = -400 µA  
2.4  
V
Notes: 1. VCC must be applied simultaneously with or before OE/VPP, and removed simultaneously with or after OE/VPP.  
2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.  
AT27BV512  
4
AT27BV512  
AC Characteristics for Read Operation  
VCC = 2.7V to 3.6V and 4.5V to 5.5V  
AT27BV512  
-90 -12  
-70  
-15  
Symbol  
Parameter  
Condition  
Min  
Max  
70  
Min  
Max  
90  
Min  
Max  
120  
120  
50  
Min  
Max  
150  
150  
60  
Units  
ns  
(3)  
tACC  
Address to Output Delay  
CE to Output Delay  
OE/VPP to Output Delay  
CE = OE/VPP = VIL  
OE/VPP = VIL  
CE = VIL  
(2)  
tCE  
70  
90  
ns  
(2)(3)  
tOE  
50  
50  
ns  
OE/VPP or CE High to  
Output Float, whichever  
occurred first  
(4)(5)  
tDF  
40  
40  
40  
50  
ns  
ns  
Output Hold from  
Address, CE or OE/VPP,  
whichever occurred first  
tOH  
0
0
0
0
AC Waveforms for Read Operation(1)  
Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified.  
2. OE/VPP may be delayed up to tCE-tOE after the falling edge of CE without impact on tCE  
3. OE/VPP may be delayed up to tACC-tOE after the address is valid without impact on tACC  
.
.
4. This parameter is only sampled and is not 100% tested.  
5. Output float is defined as the point when data is no longer driven.  
6. When reading a 27BV256, a 0.1 µF capacitor is required across VCC and ground to suppress spurious voltage transients.  
5
Input Test Waveform and  
Measurement Level  
Output Test Load  
tR, tF < 20 ns (10% to 90%)  
Note: CL = 100 pF  
including jig capacitance.  
Pin Capacitance  
f = 1 MHz, T = 25°C(1)  
Symbol  
CIN  
Typ  
4
Max  
6
Units  
Conditions  
VIN = 0V  
pF  
pF  
COUT  
8
12  
VOUT = 0V  
Note:  
1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.  
AT27BV512  
6
AT27BV512  
Programming Waveforms(1)  
Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.  
2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer.  
3. When programming the AT27BV512, a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage  
transients.  
DC Programming Characteristics  
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, OE/VPP = 13.0 ± 0.25V  
Limits  
Symbol  
ILI  
Parameter  
Test Conditions  
Min  
Max  
±10  
Units  
µA  
V
Input Load Current  
VIN = VIL, VIH  
VIL  
Input Low Level  
-0.6  
2.0  
0.8  
VIH  
Input High Level  
VCC + 0.5  
0.4  
V
VOL  
VOH  
ICC2  
IPP2  
VID  
Output Low Voltage  
Output High Voltage  
VCC Supply Current (Program and Verify)  
OE/VPP Current  
IOL = 2.1 mA  
V
IOH = -400 µA  
2.4  
V
25  
25  
mA  
mA  
V
CE = VIL  
A9 Product Identification Voltage  
11.5  
12.5  
7
AC Programming Characteristics  
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, OE/VPP = 13.0 ± 0.25V  
Limits  
Symbol  
tAS  
Parameter  
Test Conditions(1)  
Min  
2
Max  
Units  
µs  
Address Setup Time  
OE/VPP Setup Time  
OE/VPP Hold Time  
Data Setup Time  
tOES  
tOEH  
tDS  
2
µs  
Input Rise and Fall Times:  
2
µs  
(10% to 90) 20 ns  
2
µs  
tAH  
Address Hold Time  
Data Hold Time  
0
µs  
Input Pulse Levels:  
tDH  
2
µs  
0.45V to 2.4V  
tDFP  
tVCS  
tPW  
CE High to Output Float Delay(2)  
0
130  
ns  
Input Timing Reference Level:  
0.8V to 2.0V  
VCC Setup Time  
2
µs  
CE Program Pulse Width(3)  
Data Valid from CE(2)  
OE/VPP Recovery Time  
95  
105  
1
µs  
Output Timing Reference Level:  
0.8V to 2.0V  
tDV  
µs  
tVR  
2
µs  
OE/VPP Pulse Rise Time During  
Programming  
tPRT  
50  
ns  
Notes: 1. VCC must be applied simultaneously or before OE/VPP and removed simultaneously or after OE/VPP.  
2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven—  
see timing diagram.  
3. Program Pulse width tolerance is 100 µsec ± 5%.  
Atmel’s 27BV512 Integrated Product Identification Code(1)  
Pins  
Hex  
Codes  
A0  
0
O7  
0
O6  
0
O5  
0
O4  
1
O3  
1
O2  
1
O1  
1
O0  
0
Data  
Manufacturer  
Device Type  
1E  
1
0
0
0
0
1
1
0
1
0D  
Note:  
1. The AT27BV512 has the same Product Identification Code as the AT27C512R. Both are programming compatible.  
AT27BV512  
8
AT27BV512  
RapidProgramming Algorithm  
A 100 µs CE pulse width is used to program. The address  
is set to the first location. VCC is raised to 6.5V and OE/VPP  
is raised to 13.0V. Each address is first programmed with  
one 100 µs CE pulse without verification. Then a verifica-  
tion / reprogramming loop is executed for each address. In  
the event a byte fails to pass verification, up to 10 succes-  
sive 100 µs pulses are applied with a verification after each  
pulse. If the byte fails to verify after 10 pulses have been  
applied, the part is considered failed. After the byte verifies  
properly, the next address is selected until all have been  
checked. OE/VPP is then lowered to VIL and VCC to 5.0V. All  
bytes are read again and compared with the original data to  
determine if the device passes or fails.  
9
Ordering Information  
I
CC (mA)  
tACC  
(ns)  
Active  
Standby  
Ordering Code  
Package  
Operation Range  
70  
8
0.02  
AT27BV512-70JC  
AT27BV512-70RC  
AT27BV512-70TC  
32J  
28R  
28T  
Commercial  
(0°C to 70°C)  
8
8
8
8
8
8
8
0.02  
0.02  
0.02  
0.02  
0.02  
0.02  
0.02  
AT27BV512-70JI  
AT27BV512-70RI  
AT27BV512-70TI  
32J  
28R  
28T  
Industrial  
(-40°C to 85°C)  
90  
AT27BV512-90JC  
AT27BV512-90RC  
AT27BV512-90TC  
32J  
28R  
28T  
Commercial  
(0°C to 70°C)  
AT27BV512-90JI  
AT27BV512-90RI  
AT27BV512-90TI  
32J  
28R  
28T  
Industrial  
(-40°C to 85°C)  
120  
150  
AT27BV512-12JC  
AT27BV512-12RC  
AT27BV512-12TC  
32J  
28R  
28T  
Commercial  
(0°C to 70°C)  
AT27BV512-12JI  
AT27BV512-12RI  
AT27BV512-12TI  
32J  
28R  
28T  
Industrial  
(-40°C to 85°C)  
AT27BV512-15JC  
AT27BV512-15RC  
AT27BV512-15TC  
32J  
28R  
28T  
Commercial  
(0°C to 70°C)  
AT27BV512-15JI  
AT27BV512-15RI  
AT27BV512-15TI  
32J  
28R  
28T  
Industrial  
(-40°C to 85°C)  
Package Type  
32-Lead, Plastic J-Leaded Chip Carrier (PLCC)  
32J  
28R  
28T  
28-Lead, 0.330" Wide, Plastic Gull Wing Small Package (SOIC)  
28-Lead, Plastic Thin Small Outline Package (TSOP)  
AT27BV512  
10  
AT27BV512  
Packaging Information  
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)  
Dimensions in Inches and (Millimeters)  
JEDEC STANDARD MS-016 AE  
28R, 28-Lead, 0.330" Wide, Plastic Gull Wing Small  
Outline (SOIC)  
Dimensions in Inches and (Millimeters)  
.025(.635) X 30˚ - 45˚  
.045(1.14) X 45˚ PIN NO. 1  
.012(.305)  
IDENTIFY  
.008(.203)  
.530(13.5)  
.553(14.0)  
.490(12.4)  
.547(13.9)  
.032(.813)  
.021(.533)  
.013(.330)  
.595(15.1)  
.026(.660)  
.585(14.9)  
.030(.762)  
.015(.381)  
.095(2.41)  
.060(1.52)  
.140(3.56)  
.120(3.05)  
.050(1.27) TYP  
.300(7.62) REF  
.430(10.9)  
.390(9.90)  
AT CONTACT  
POINTS  
.022(.559) X 45˚ MAX (3X)  
.453(11.5)  
.447(11.4)  
.495(12.6)  
.485(12.3)  
28T, 28-Lead, Plastic Thin Small Outline Package  
(TSOP)  
Dimensions in Millimeters and (Inches)*  
INDEX  
MARK  
AREA  
13.7 (0.539)  
13.1 (0.516)  
11.9 (0.469)  
11.7 (0.461)  
0.27 (0.011)  
0.18 (0.007)  
0.55 (0.022)  
BSC  
7.15 (0.281)  
REF  
8.10 (0.319)  
7.90 (0.311)  
1.25 (0.049)  
1.05 (0.041)  
0.20 (0.008)  
0.10 (0.004)  
0
REF  
5
0.20 (0.008)  
0.15 (0.006)  
0.70 (0.028)  
0.30 (0.012)  
*Controlling dimension: millimeters  
11  
Atmel Headquarters  
Atmel Operations  
Corporate Headquarters  
2325 Orchard Parkway  
San Jose, CA 95131  
TEL (408) 441-0311  
FAX (408) 487-2600  
Atmel Colorado Springs  
1150 E. Cheyenne Mtn. Blvd.  
Colorado Springs, CO 80906  
TEL (719) 576-3300  
FAX (719) 540-1759  
Europe  
Atmel U.K., Ltd.  
Atmel Rousset  
Zone Industrielle  
Coliseum Business Centre  
Riverside Way  
Camberley, Surrey GU15 3YL  
England  
13106 Rousset Cedex, France  
TEL (33) 4 42 53 60 00  
FAX (33) 4 42 53 60 01  
TEL (44) 1276-686677  
FAX (44) 1276-686697  
Asia  
Atmel Asia, Ltd.  
Room 1219  
Chinachem Golden Plaza  
77 Mody Road  
Tsimshatsui East  
Kowloon, Hong Kong  
TEL (852) 27219778  
FAX (852) 27221369  
Japan  
Atmel Japan K.K.  
Tonetsu Shinkawa Bldg., 9F  
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