AF16GSSEL-10P [ETC]
ATP Industrial Grade SlimSATA Embedded Module; ATP工业级SlimSATA嵌入式模块
| 型号： | AF16GSSEL-10P |
| 厂家： | 
ETC |
| 描述： | ATP Industrial Grade SlimSATA Embedded Module |
| 文件： | 总20页 (文件大小：412K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Version 2.0
ATP Industrial Grade SlimSATA Embedded Module Specification
ATP Industrial Grade SlimSATA Embedded Module
Version 2.0
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ATP Confidential &Proprietary
Version 2.0
ATP Industrial Grade SlimSATA Embedded Module Specification
Disclaimer
ATP Electronics Inc. shall not be liable for any errors or omissions that may appear in this document, and
disclaims responsibility for any consequences resulting from the use of the information set forth herein.
The information in this manual is subject to change without notice.
ATP general policy does not recommend the use of its products in life support applications where in a failure or
malfunction of the product may directly threaten life or injury.
All parts of the ATP documentation are protected by copyright law and all rights are reserved. This
documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any
electronic medium or machine-readable form without prior consent, in writing, from ATP Corporation.
The information set forth in this document is considered to be “Proprietary” and “Confidential” property
owned by ATP.
Revision History
Date
Version
Changes compared to previous issue
- First release
Nov. 17th, 2011
2.0
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Table of Contents
1
INTRODUCTION...................................................................................................... 5
1.1 Product Overview...................................................................................................... 5
1.2 Main Features............................................................................................................ 5
2
PRODUCT SPECIFICATION ................................................................................. 6
2.1 Product Image ........................................................................................................... 6
2.2 Product Capacities..................................................................................................... 6
2.3 Block Diagram .......................................................................................................... 7
2.4 Performance .............................................................................................................. 8
2.4.1
2.4.2
IOPS .....................................................................................................................................8
Read/Write Performance ......................................................................................................8
2.5 Electriacal Characteristics......................................................................................... 8
2.5.1
2.5.2
Supply Voltage .....................................................................................................................8
System Power Requirement..................................................................................................9
2.6 Environment Specifications ...................................................................................... 9
2.6.1
2.6.2
2.6.3
Temperature and Humidity...................................................................................................9
Vibration and Shock.............................................................................................................9
Altitude.................................................................................................................................9
2.7 MTBF...................................................................................................................... 10
2.8 Write/Erase Endurance............................................................................................ 10
2.9 Certification ............................................................................................................ 11
3
SATA EMBEDDED MODULE PIN ASSIGNMENT .......................................... 12
3.1 Pin Location ............................................................................................................ 12
3.2 Pin Assignments...................................................................................................... 13
4
COMMAND SETS................................................................................................... 14
4.1 ATA Command Set................................................................................................. 14
4.2 Identify Device Data ............................................................................................... 15
4.3 SMART Information............................................................................................... 17
4.3.1
4.3.2
4.3.3
SMART subcommand sets.................................................................................................17
SMART Read Data (subcommand D0h)............................................................................17
ATP SMART Tool.............................................................................................................19
5
MECHANICAL INFORMATION......................................................................... 20
5.1 Physical Dimension Specifications......................................................................... 20
5.2 Mechanical Form Factor ......................................................................................... 20
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1 Introduction
1.1 Product Overview
The ATP Industrial Grade SlimSATA Embedded Module is a high performance and high capacity mass
storage solution in Slim form factor. Utilizing SLC (Single Level Cell) NAND flash components
provides outstanding performance and proven reliability for products operating.
ATP Industrial Grade SlimSATA Embedded Module is perfect for in thin devices, especially
networking, thin clients and embedded appliance and also suit for industrial applications such as
transportation, industrial PC, healthcare, telecommunications, and other harsh environments where data
integrity and consistent performance is mission critical.
1.2 Main Features
Capacities: 2GB to 32GB
SLC NAND flash memory
Operating temperature: -40℃ to 85℃
Power consumption on idle mode is 0.4W/Operational mode is 1.3W
Maximum performance: Sequential read up to 112MB/s, sequential write up to 91MB/s
JEDEC standard: MO-297A (SlimSATA) compliant
Slim form factor for design in thin devices, especially networking, thin clients and embedded
appliance.
Extensive application for storage
Standard 7 + 15 pin SATA interface as the SSD I/O, can be a small density SSD replacement
Compliant with Serial ATA Revision 2.6.
Support PIO mode 0~4, MDMA mode 0~2,UDMA mode 0~6
Compatible with SATA 1.5Gbps and SATA 3.0Gbps interface rates
SMART function support by ATA CMD
ATP SMART tool for Windows 2000/XP/Vista/7 and Linux.
Support TRIM command, Off-line TRIM utility available for Windows XP/2000/2003/Vista/7
Enhanced endurance by Global wear-leveling
Power Protector, data integrity protection during abnormal power outage.
Data integrity under power-cycling
RoHS compliant
CE, FCC certification
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2 Product Specification
2.1 Product Image
2.2 Product Capacities
Table 2-1
ATP P/N
ATP EXTERNAL P/N
CAPACITY
AF2GSSEL-10P
AF4GSSEL-10P
AF8GSSEL-10P
AF16GSSEL-10P
AF32GSSEL-10P
AF2GSSEL-BABXP
AF4GSSEL-BABXP
AF8GSSEL-BABXP
AF16GSSEL-BABXP
AF32GSSEL-BAAXP
2GB
4GB
8GB
16GB
32GB
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2.3 Block Diagram
ATP Industrial Grade SlimSATA Embedded Module consists of below functional blocks. The
advanced architecture is optimized to provide highest data reliability and transfer performance.
Figure 2
ATP SATA Embedded Module
SRAM
ECC Engine
SATA II
controller
High
Performance
Processor
Core
SATA
Host
ROM
SLC
Device
NAND Flash
Memory
Flash
Controller
Voltage
Regulator (5V to
3.3V/ 1.8V)
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Performance
2.3.1 IOPS
Table 2-2
Type
Random Read IOPS2
Value
4KB Random Read: 2,250 IOPS
Notes: IOPS: Input/Output Operations per Second
2.3.2 Read/Write Performance
Table 2-3
Type
Value
Host Interface Speed
SATA 1.5Gb/s and SATA 3.0 Gb/s
Sequential Read: up to 112MB/s
Sequential Write: up to 91MB/s
Data Transfer Rate1
Notes: The performance may vary according to different product capacity.
2.4 Electrical Characteristics
2.4.1 Supply Voltage
Table 2-4
Parameter
Supply voltage
Symbol Min Typ Max
VCC 4.75 5.0 5.25
Unit
Remark
V
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2.4.2 System Power Requirement
Table 2-5
Parameter
Symbol Min Typ Max
Unit
Remark
Sustained write power
Sustained read power
Idle power
PW
PR
PS
-
-
-
1.30
1.00
0.40
-
-
-
W
W
W
RMS value
RMS value
RMS value
2.5 Environment Specifications
2.5.1 Temperature and Humidity
Table 2-6
Type
Value
Operating
-40℃ to 85℃
Temperature
Humidity
Non-Operating
Operating
-45oC to 85oC
25oC，8% to 95%, noncondensing
40oC，8% to 93%, noncondensing
Non-Operating
2.5.2 Vibration and Shock
Type
Table 2-7
Value
Vibration
Shock
Operating
Operating
sine 16.4G, 10~2000Hz
Half sine 1500G/0.5ms
2.5.3 Altitude
Table 2-8
Type
Value
Operating
Non-Operating
80,000 feet Max.
80,000 feet Max.
Altitude
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2.6 MTBF
Table 2-9
Type
Value
2GB: 1,090,000 hours
4GB: 1,080,000 hours
8GB: 1,060,000 hours
16GB: 1,030,000 hours
32GB: 1,000,000 hours
MTBF (@ 25oC) 1
Notes:
The Mean Time Between Failures (MTBF) is calculated using a prediction methodology, Telcordia SR-332, which
based on reliability data of the individual components in the SlimSATA embedded module. It assumes nominal voltage, with
all other parameters within specified range.
2.7 Write/Erase Endurance
Table 2-10
Type
Value
Enhanced Global Wear Leveling algorithm
SLC flash block: 100,000 program/erase cycles
Endurance Technology
2GB:
4GB:
8GB:
80 terabyte random write
160 terabyte random write
320 terabyte random write
SlimSATA Endurance
16GB: 640 terabyte random write
32GB: 1,280 terabyte random write
Note:
Endurance for the SlimSATA can be predicted based on the usage conditions applied to the device, the internal NAND
component cycles, the write amplification factor, and the wear leveling efficiency of the drive.
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2.8 Certification
Table 2-11
Mark/Approval
Documentation
Compliant
The CE marking (also known as CE mark) is a mandatory conformance mark on many
products placed on the single market in the European Economic Area (EEA). The CE
marking certifies that a product has met EU consumer safety, health or environmental
requirements. CE stands for Conformité Européenne, "European conformity" in French.
Yes
FCC Part 15 Class B was used for Evolution of United States (US) Emission Standards for
Commercial Electronic Products, The United States (US) covers all types of unintentional
radiators under Subparts A and B (Sections 15.1 through 15.199) of FCC 47 CFR Part 15,
usually called just FCC Part 15
Yes
Yes
RoHS is the acronym for Restriction of Hazardous Substances. RoHS, also known as
Directive 2002/95/EC, originated in the European Union and restricts the use of specific
hazardous materials found in electrical and electronic products. All applicable products in
the EU market after July 1, 2006 must pass RoHS compliance. For the complete directive,
see Directive 2002/95/EC of the European Parliament.
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3 SATA Embedded Module Pin Assignment
3.1 Pin Location
The following figure shows the pin location of the SlimSATA embedded module, the connector is
with both signal and power segments
Figure 3
P1
S1
Power
Segment
Signal
Segment
S7
P15
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3.2 Pin Assignments
There are total of 7 pins in the signal segment and 15 pins in the power segment. The pin
definitions are shown in Table 3-1
Table 3-1
Group
Pin No.1
Function
Description
Ground
S1
S2
S3
S4
S5
S6
S7
GND
A+
Differential signal pair A
Ground
A-
Signal
Segment
GND
B-
Differential signal pair B
B+
GND
Ground
Key & Spacing
P1
P2
NC/V33
NC/V33
NC/V33
GND
GND
GND
V5
3.3V power (Not used)
3.3V power (Not used)
3.3V power (Not used)
Ground
P3
P4
P5
Ground
P6
Ground
P7
5V power, pre-charge
5V power
Power
P8
V5
Segment
P9
V5
5V power
P10
P11
P12
P13
P14
P15
GND
DAS
Ground
Device Activity Signal
Ground
GND
NC/V12
NC/V12
NC/V12
12V power (Not used)
12V power (Not used)
12V power (Not used)
Notes:
1. All pins are in a single row, with a 1.27 mm (0.050”) pitch.
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4 Command Sets
4.1 ATA Command Set
ATP SlimSATA Embedded module support the commands show in the following table
Table 4-1
Command
Code
Protocol
General Feature Set
Execute Drive Diagnostic
Flush Cache
90h
Device diagnostic
Non-data
E7h
Identify Device
ECh
C8h
C4h
20h
PIO data-in
DMA
Read DMA
Read Multiple
PIO data-in
PIO data-in
Non-data
Read Sector(s)
Read Verify Sector(s)
Set Feature
40h or 41h
EFh
C6h
CAh
C5h
30h
Non-data
Set Multiple Mode
Write DMA
Non-data
DMA
Write Multiple
PIO data-out
PIO data-out
Non-data
Write Sector(s)
NOP
00h
Read Buffer
E4h
PIO data-in
PIO data-out
Write Buffer
E8h
Power Management Feature Set
Check Power Mode
Idle
E5h or 98h
E3h or 97h
E1h or 95h
E6h or 99h
E2h or 96h
E0h or 94h
Non-data
Non-data
Non-data
Non-data
Non-data
Non-data
Idle Immediate
Sleep
Standby
Standby Immediate
Security Mode Feature Set
Security Set Password
Security Unlock
F1h
F2h
F3h
F4h
F5h
F6h
PIO data-out
PIO data-out
Non-data
Security Erase Prepare
Security Erase Unit
Security Freeze Lock
Security Disable Password
SMART Feature Set
SMART Disable Operation
SMART Enable/Disable Autosave
SMART Enable Operations
SMART Return Status
SMART Execute Off-Line Immediate
PIO data-out
Non-data
PIO data-out
B0h
B0h
B0h
B0h
B0h
Non-data
Non-data
Non-data
Non-data
Non-data
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Command
Code
Protocol
SMART Read Data
B0h
PIO data-in
Host Protected Area Feature Set
Read Native Max Address
Set Max Address
F8h
F9h
F9h
F9h
F9h
F9h
Non-data
Non-data
Set Max Set Password
Set Max Lock
PIO data-out
Non-data
Set Max Freeze Lock
Set Max Unlock
Non-data
PIO data-out
4.2 Identify Device Data
Table 4-2
Word
Default Value Total
Bytes
Data Field Type lnformation
Address
0
2
General Configuration
044Ah
1
2
2
Default number of cylinders
XXXXh
2
Reserved
0000h
3
2
Default number of heads
00XXh
4
2
Obsolete
0000h
5
2
Obsolete
0240h
6
2
Default number of sectors per track
XXXXh
7-8
9
4
Number of sectors per card (Word 7 = MSW, Word 8 = LSW)
XXXXh
2
Obsolete
0000h
10-19
20
20
Serial number in ASCII (Right justified)
XXXXh
2
Obsolete
0002h
21
2
Obsolete
0002h
22
2
Obsolete
0000h
23-26
27-46
8
Firmware revision in ASCII. Big Endian Byte Order in Word
XXXXh
40
Model number in ASCII (Left justified) Big Endian Byte Order in
Word
XXXXh
47
48
2
Maximum number of sectors on Read/Write Multiple command
8001h
2
Reserved
0000h
49
2
Capabilities
0F00h
50
2
Capabilities
4000h
51
2
PIO data transfer cycle timing mode
Obsolete
0200h
52
2
0000h
53
2
Field validity
0007h
54
2
Current numbers of cylinders
Current numbers of heads
Current sectors per track
XXXXh
55
2
XXXXh
56
2
XXXXh
57-58
4
Current capacity in sectors (LBAs)
(Word57=LSW, Word58=MSW)
XXXXh
59
2
0100h
Multiple sector setting
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Word
Default Value
Total
Data Field Type lnformation
Address
Bytes
60-61
Total number of sectors addressable in LBA Mode
(Word60=LSW, Word61=MSW)
XXXXh
0000h
0007h
0003h
0078h
0078h
0078h
0078h
0000h
4
2
62
63
Reserved
2
Multiword DMA transfer
64
2
Advanced PIO modes supported
65
2
Minimum Multiword DMA transfer cycle time per word
Recommended Multiword DMA transfer cycle time
Minimum PIO transfer cycle time without flow control
Minimum PIO transfer cycle time with lORDY flow control
66
2
67
2
68
2
69~75
20
Reserved
Serial ATA capabilities
Support Serial ATA Gen1
Support Serial ATA Gen2
76
77~79
80
0060h
0000h
0080h
0000h
742Bh
5500h
4002h
XXXXh
007Fh
0003h
0000h
0000h
FFFEh
0000h
0001h
0000h
0000h
0000h
0000h
0000h
0000h
0000h
0000h
0100h
0000h
2
6
Reserved
2
Major version number (ATAPI-7)
Minor version number
81
2
82
2
Command sets supported 0
Command sets supported 1
Command sets supported 2
Command set/feature enabled
Ultra DMA supported and selected
Time required for Security erase unit completion
Time required for Enhanced security erase unit completion
Current Advanced power management value
Master Pasword Revision Code
Reserved
83
2
84
2
85~87
88
6
2
89
2
90
2
91
2
92
2
93~127
128
70
2
Security status
129~159
160
62
2
Vendor unique bytes
Power requirement description
Reserved
161
2
162
2
Key management schemes supported
CFA True lDE Timing Mode Capability and Setting
Reserved
163
2
164
2
165~175
176~216
217
22
82
2
Reserved
Reserved
Non-rotating media(SSD)
Reserved
218~255
76
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4.3 SMART Information
ATP Industrial Grade SlimSATA Embedded Module Support S.M.A.R.T. ATA feature set in IDE
mode, not support in RAID mode and AHCI mode.
4.3.1 SMART subcommand sets
In order to select a subcommand the host must write the subcommand code to the device's Features
Register before issuing the SMART Function Set command. The subcommands are listed below.
Table 4-3
Command
Command Code
SMART READ DATA
D0h
SMART SAVE ATTRIBUTE THRESHOLD
SMART ENABLE/DISABLE AUTOSAVE
SMART SAVE ATTRIBUTE VALUES
SMART EXECUTE OFF-LINE IMMIDIATE
RESERVED
D1h
D2h
D3h
D4h
D5h
D6h
D8h
D9h
DAh
RESERVED
SMART ENABLE OPERATIONS
SMART DISABLE OPERATIONS
SMART RETURN STATUS
Note:
If the reserved size is below a threshold, status can be read from the Cylinder Register using the Return
Status command (DAh)
4.3.2 SMART Read Data (subcommand D0h)
The following 512 bytes make up the device SMART data structure. Users can obtain the data using
the “Read Data” command (D0h).
Table 4-4
Byte
F/V
X
Description
0~1
2~361
Revision code
X
Vendor Specific
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362
V
Off-line data collection status
Byte
363
F/V
X
V
X
F
Description
Self-test execution status byte
364~365
366
Total time in seconds to complete off-line data collection activity
Vendor Specific
367
Off-line data collection capability
SMART capability
368~369
370
F
Error logging capability：7-1 Reserved
0 -1 = Device error logging supported
F
371
X
F
Vendor Specific
372
Short self-test routine recommended polling time(in minutes)
373
F
Extended self-test routine recommended polling time(in minutes)
374
F
Conveyance self-test routine recommended polling time(in minutes)
375~385
386~395
396~397
398~399
400~406
407~415
416
R
F
Reserved
Firmware Version/Date Code
Number of initial invalid block (396=MSB, 397=LSB)
Number of run time bad block (398=MSB, 399=LSB)
SMI2242
F
V
F
X
F
Vendor specific
Reserved
417
F
Program/write the strong page only
Number of spare block
Reserved
418~419
420
V
F
421~423
424~425
426~428
429~431
432~445
446~510
V
V
V
V
F
Average erase count
Number of child pair
Maximum erase count
Minimum erase count
Reserved
X
V
Vendor specific
511
Data structure checksum
Notes:
F=content (byte) is fixed and does not change
V=content (byte) is variable and maybe change depending on the state of the device or the command executed by the device
X= content (byte) is vendor specific and maybe fixed or variable
R=content (byte) is reserved and shall be zero
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4.3.3 ATP SMART Tool
ATP provides SMART Tool for Windows 2000/XP/Vista/7 and Linux, it can monitor the state of
SlimSATA Embedded Module, the following picture shows SMART tool operation. This tool
supports that users read spare and bad block information. Users can thus evaluate drive health at run
time and receive an early warning before the drive life ends.
Figure 4
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5 Mechanical Information
5.1 Physical Dimension Specifications
Table 5-1
Type
Value
Length
Embedded module
Width
54.0 mm +/- 0.15mm
39.0 mm +/- 0.15mm
4.0 mm +/- 0.15mm
(Without housing)
Thickness
5.2 Mechanical Form Factor (Units in mm)
Figure 5
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