AF16GSSHI-OAAXP [ETC]
ATP Industrial Grade mSATA Embedded Module Specification; ATP工业级的mSATA嵌入式模块规格
| 型号： | AF16GSSHI-OAAXP |
| 厂家： | 
ETC |
| 描述： | ATP Industrial Grade mSATA Embedded Module Specification |
| 文件： | 总21页 (文件大小：405K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Version 1.2
ATP Industrial Grade mSATA Embedded Module Specification
ATP Industrial Grade mSATA Embedded Module Specification
Version 1.2
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Version 1.2
ATP Industrial Grade mSATA Embedded Module Specification
Disclaimer
ATP Electronics Inc. shall not be liable for any errors or omissions that may appear in this document, and
disclaims responsibility for any consequences resulting from the use of the information set forth herein.
The information in this manual is subject to change without notice.
ATP general policy does not recommend the use of its products in life support applications where in a failure or
malfunction of the product may directly threaten life or injury.
All parts of the ATP documentation are protected by copyright law and all rights are reserved. This
documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any
electronic medium or machine-readable form without prior consent, in writing, from ATP Corporation.
The information set forth in this document is considered to be “Proprietary” and “Confidential” property
owned by ATP.
Revision History
Date
Version
1.0
Changes compared to previous issue
- First release
- Updated SSD endurance data
Dec. 15th, 2011
Jan. 12th, 2012
Aug. 6th, 2012
1.1
1.2
- Added Static Data Refresh feature
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Table of Contents
1
INTRODUCTION...................................................................................................... 5
1.1 Product Overview ..................................................................................................... 5
1.2 Main Features............................................................................................................ 5
2
PRODUCT SPECIFICATION ................................................................................. 6
2.1 Product Image ........................................................................................................... 6
2.2 Product Capacities..................................................................................................... 6
2.3 Block Diagram .......................................................................................................... 7
2.4 Performance .............................................................................................................. 8
2.4.1
2.4.2
IOPS .....................................................................................................................................8
Read/Write Performance ......................................................................................................8
2.5 Electriacal Characteristics......................................................................................... 8
2.5.1
2.5.2
Supply Voltage .....................................................................................................................8
System Power Requirement..................................................................................................9
2.6 Environment Specifications...................................................................................... 9
2.6.1
2.6.2
2.6.3
Temperature and Humidity...................................................................................................9
Vibration and Shock.............................................................................................................9
Altitude.................................................................................................................................9
2.7 MTBF...................................................................................................................... 10
2.8 Write/Erase Endurance ........................................................................................... 10
2.9 Certification ............................................................................................................ 11
3
SATA EMBEDDED MODULE PIN ASSIGNMENT .......................................... 12
3.1 Pin Location ............................................................................................................ 12
3.2 Pin Assignments...................................................................................................... 13
4
COMMAND SETS................................................................................................... 15
4.1 ATA Command Set................................................................................................. 15
4.2 Identify Device Data ............................................................................................... 16
4.3 SMART Information............................................................................................... 18
4.3.1
4.3.2
4.3.3
SMART subcommand sets.................................................................................................18
SMART Read Data ............................................................................................................18
ATP SMART Tool.............................................................................................................20
5
MECHANICAL INFORMATION......................................................................... 21
5.1 Physical Dimension Specifications......................................................................... 21
5.2 Mechanical Form Factor ......................................................................................... 21
6
APPENDIX ............................................................................................................... 21
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1 Introduction
1.1 Product Overview
The ATP industrial grade mSATA Embedded Module is a high performance and high capacity mass
storage solution. It provides outstanding performance and proven reliability for products operating.
ATP industrial grade mSATA Embedded Module is perfect for thin devices, especially networking,
thin clients and embedded appliance and also suit for enterprise storage systems with outstanding
sequential read and write performance to relieve performance bottlenecks associated with traditional
rotating media HDD storage.
1.2 Main Features
Capacities: 4GB to 64GB
SLC (Single Level Cell) NAND flash memory
Operating temperature: -40℃ to 85℃
Maximum performance: Sequential read up to 258MB/s, sequential write up to 220MB/s
JEDEC standard: MO-300A (mSATA)
Slim form factor for design in thin devices, especially networking, thin clients and embedded
appliance.
Secure erase drive protection.
Extensive application for storage
Compliant with Serial ATA Revision 2.6.
Support PIO mode 0~4, MDMA mode 0~2,UDMA mode 0~6
Compatible with SATA 1.5Gbps and SATA 3.0Gbps interface rates
SMART function support by ATA CMD
ATP SMART tool for Windows 2000/XP/Vista/7 and Linux.
Support TRIM command (Windows 7 and up, latest Linux Kernel), Off-line TRIM utility available
for Windows XP/2000/2003/Vista
Enhanced endurance by Global wear-leveling
Static data refresh feature
PowerProtector, data integrity under power-cycling
RoHS compliant
CE , FCC certification
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2 Product Specification
2.1 Product Image
2.2 Product Capacities
Table 2-1
ATP P/N
CAPACITY
AF4GSSHI-OAAXP
AF8GSSHI-OAAXP
AF16GSSHI-OAAXP
AF32GSSHI-OAAXP
AF64GSSHI-OAAXP
4GB
8GB
16GB
32GB
64GB
Notes:
1GB = 1,000,000,000 Byte
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2.3 Block Diagram
ATP industrial grade mSATA Embedded Module consists of below functional blocks. The advanced
architecture is optimized to provide highest data reliability and transfer performance.
Figure 2
ATP mSATA Embedded Module
SRAM
ECC Engine
SATA II
controller
High
Performance
Processor
Core
Mini-
PCIE
Host
ROM
SLC
NAND Flash
Memory
Flash
Controller
Device
DRAM Buffer
Voltage
Regulator (3.3V
to 1.2V)
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2.4 Performance
2.4.1 IOPS
Table 2-2
Type
Value
4K Random Read IOPS
4,700 IOPS
Notes: IOPS: Input/Output Operations per Second
2.4.2 Read/Write Performance
Table 2-3
Type
Value
Host Interface Speed
SATA 1.5Gb/s and SATA 3.0 Gb/s
Sequential Read: up to 258MB/s
Sequential Write: up to 220MB/s
Data Transfer Rate1
Notes:
The performance may vary according to different product capacity.
2.5 Electrical Characteristics
2.5.1 Supply Voltage
Table 2-4
Parameter
Supply voltage
Symbol Min Typ Max
VCC 3.15 3.3 3.45
Unit
Remark
V
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2.5.2 System Power Requirement
Table 2-5
Parameter
Symbol Min Typ Max
Unit
Remark
Sustained write power
Sustained read power
Idle power
PW
PR
PS
-
-
-
1.40
1.00
0.45
-
-
-
W
W
W
RMS value
RMS value
RMS value
2.6 Environment Specifications
2.6.1 Temperature and Humidity
Table 2-6
Type
Value
Operating
Non-Operating
Operating
-40oC to 85oC
Temperature
Humidity
-45oC to 85oC
25oC，8% to 95%, noncondensing
40oC，8% to 93%, noncondensing
Non-Operating
2.6.2 Vibration and Shock
Type
Table 2-7
Value
Vibration
Shock
Operating
Operating
sine 16.4G, 10~2000Hz
Half sine 1500G/0.5ms
2.6.3 Altitude
Table 2-8
Type
Value
Operating
Non-Operating
80,000 feet Max.
80,000 feet Max.
Altitude
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2.7 MTBF
Table 2-9
Type
MTBF (@ 25oC) 1
Value
4GB: 1,080,000 hours
8GB: 1,060,000 hours
16GB: 1,030,000 hours
32GB: 1,000,000 hours
64GB: 1,000,000 hours
Notes:
The Mean Time between Failures (MTBF) is calculated using a prediction methodology, Telcordia SR-332, which
based on reliability data of the individual components in the mSATA. It assumes nominal voltage, with all other parameters
within specified range.
2.8 Write/Erase Endurance
Table 2-10
Type
Value
Enhanced global dynamic and static wear-leveling
algorithm
Endurance Technology
SLC flash block: 100,000 program/erase cycles
4GB: 40 terabyte random write
80 terabyte sequential write
8GB: 80 terabyte random write
160 terabyte sequential write
16GB: 160 terabyte random write
320 terabyte sequential write
32GB: 320 terabyte random write
640 terabyte sequential write
64GB: 640 terabyte random write
1,280 terabyte sequential write
SSD Endurance
Note:
Endurance for the mSATA module can be predicted based on the usage conditions applied to the device, the internal
NAND component cycles, the write amplification factor, and the wear leveling efficiency of the drive.
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2.9 Certification
Table 2-11
Mark/Approval
Documentation
Compliant
The CE marking (also known as CE mark) is a mandatory conformance mark on many
products placed on the single market in the European Economic Area (EEA). The CE
marking certifies that a product has met EU consumer safety, health or environmental
requirements. CE stands for Conformité Européenne, "European conformity" in French.
Yes
FCC Part 15 Class B was used for Evolution of United States (US) Emission Standards for
Commercial Electronic Products, The United States (US) covers all types of unintentional
radiators under Subparts A and B (Sections 15.1 through 15.199) of FCC 47 CFR Part 15,
usually called just FCC Part 15
Yes
Yes
RoHS is the acronym for Restriction of Hazardous Substances. RoHS, also known as
Directive 2002/95/EC, originated in the European Union and restricts the use of specific
hazardous materials found in electrical and electronic products. All applicable products in
the EU market after July 1, 2006 must pass RoHS compliance. For the complete directive,
see Directive 2002/95/EC of the European Parliament.
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3 SATA Embedded Module Pin Assignment
3.1 Pin Location
The following figure shows the pin location of the mSATA embedded module, the connector is
with both signal and power segments
Figure 3
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3.2 Pin Assignments
There are total of 52 pins, the pin definitions are shown in Table 3-1
Table 3-1
Pin No.
Function
Description
P1
Reserved
+3.3V
No Connect
3.3V Source
P2
P3
Reserved
GND
No Connect
P4
Return Current Path
No Connect
P5
Reserved
+1.5V
P6
Not used in ATP design
No Connect
P7
Reserved
Reserved
GND
P8
No Connect
P9
Return Current Path
No Connect
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P30
P31
P32
P33
P34
P35
P36
P37
P38
Reserved
Reserved
Reserved
Reserved
Reserved
GND
No Connect
No Connect
No Connect
No Connect
Return Current Path
No Connect
Reserved
Reserved
GND
No Connect
Return Current Path
No Connect
Reserved
Reserved
GND
No Connect
Return Current Path
No Connect
Reserved
+B
Host Receiver Differential Signal Pair
3.3V Source
+3.3V
-B
Host Receiver Differential Signal Pair
Return Current Path
Return Current Path
Not used in ATP design
Return Current Path
Two Wire interface Clock3
Host Transmitter Differential Signal Pair
Two Wire interface Data3
Host Transmitter Differential Signal Pair
Return Current Path
Return Current Path
No Connect
GND
GND
+1.5V
GND
Two Wire Interface
+A
Two Wire Interface
-A
GND
GND
Reserved
GND
Return Current Path
No Connect
Reserved
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Pin No.
Function
Description
P39
P40
P41
P42
P43
P44
P45
P46
P47
P48
P49
P50
P51
P52
+3.3V
GND
3.3V Source
Return Current Path
+3.3V
3.3V Source
Reserved
GND
No Connect
Return Current Path
Reserved
Vender
No Connect
Not used in ATP design 2
Reserved
Vender
No Connect
Not used in ATP design 2
Not used in ATP design
Device Activity Signal / Disable Staggered Spin-up
Return Current Path
+1.5V
DA/DSS
GND
Presence Detection
+3.3V
Shall be pulled to GND by device1
3.3V Source
Notes:
1. Presence detection pin provided for tamper proof functionality
2. No connect on the host side.
3. Pins 30 and 32 are intended for use as a two wire interface to read a memory device to determine device information (an
example of this would be for use as SMB bus pins). These pins are not designed to be active in conjunction with the SATA
signal differential pairs. Not used in ATP design.
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4 Command Sets
4.1 ATA Command Set
ATP industrial grade mSATA Embedded module support the commands show in the following table
Table 4-1
Command
Code
Protocol
General Feature Set
Execute Drive Diagnostic
Flush Cache
90h
Device diagnostic
Non-data
E7h
Identify Device
ECh
C8h
C4h
20h
PIO data-in
DMA
Read DMA
Read Multiple
PIO data-in
PIO data-in
Non-data
Read Sector(s)
Read Verify Sector(s)
Set Feature
40h or 41h
EFh
C6h
CAh
C5h
30h
Non-data
Set Multiple Mode
Write DMA
Non-data
DMA
Write Multiple
PIO data-out
PIO data-out
Non-data
Write Sector(s)
NOP
00h
Read Buffer
E4h
PIO data-in
PIO data-out
Write Buffer
E8h
Power Management Feature Set
Check Power Mode
Idle
E5h or 98h
E3h or 97h
E1h or 95h
E6h or 99h
E2h or 96h
E0h or 94h
Non-data
Non-data
Non-data
Non-data
Non-data
Non-data
Idle Immediate
Sleep
Standby
Standby Immediate
Security Mode Feature Set
Security Set Password
Security Unlock
F1h
F2h
F3h
F4h
F5h
F6h
PIO data-out
PIO data-out
Non-data
Security Erase Prepare
Security Erase Unit
Security Freeze Lock
Security Disable Password
SMART Feature Set
SMART Disable Operation
SMART Enable/Disable Autosave
SMART Enable Operations
SMART Return Status
SMART Execute Off-Line Immediate
PIO data-out
Non-data
PIO data-out
B0h
B0h
B0h
B0h
B0h
Non-data
Non-data
Non-data
Non-data
Non-data
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Command
Code
Protocol
SMART Read Data
B0h
PIO data-in
Host Protected Area Feature Set
Read Native Max Address
Set Max Address
F8h
F9h
F9h
F9h
F9h
F9h
Non-data
Non-data
Set Max Set Password
Set Max Lock
PIO data-out
Non-data
Set Max Freeze Lock
Set Max Unlock
Non-data
PIO data-out
4.2 Identify Device Data
Table 4-2
Word
Default Value Total
Bytes
Data Field Type lnformation
Address
0
2
General Configuration
044Ah
1
2
2
Default number of cylinders
XXXXh
2
Reserved
0000h
3
2
Default number of heads
00XXh
4
2
Obsolete
0000h
5
2
Obsolete
0240h
6
2
Default number of sectors per track
XXXXh
7-8
9
4
Number of sectors per card (Word 7 = MSW, Word 8 = LSW)
XXXXh
2
Obsolete
0000h
10-19
20
20
Serial number in ASCII (Right justified)
XXXXh
2
Obsolete
0002h
21
2
Obsolete
0002h
22
2
Obsolete
0000h
23-26
27-46
8
Firmware revision in ASCII. Big Endian Byte Order in Word
XXXXh
40
Model number in ASCII (Left justified) Big Endian Byte Order in
Word
XXXXh
47
48
2
Maximum number of sectors on Read/Write Multiple command
8001h
2
Reserved
0000h
49
2
Capabilities
0F00h
50
2
Capabilities
4000h
51
2
PIO data transfer cycle timing mode
Obsolete
0200h
52
2
0000h
53
2
Field validity
0007h
54
2
Current numbers of cylinders
Current numbers of heads
Current sectors per track
XXXXh
55
2
XXXXh
56
2
XXXXh
57-58
4
Current capacity in sectors (LBAs)
(Word57=LSW, Word58=MSW)
XXXXh
59
2
0100h
Multiple sector setting
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Word
Default Value
Total
Data Field Type lnformation
Address
Bytes
60-61
Total number of sectors addressable in LBA Mode
(Word60=LSW, Word61=MSW)
XXXXh
0000h
0007h
0003h
0078h
0078h
0078h
0078h
0000h
4
2
62
63
Reserved
2
Multiword DMA transfer
64
2
Advanced PIO modes supported
65
2
Minimum Multiword DMA transfer cycle time per word
Recommended Multiword DMA transfer cycle time
Minimum PIO transfer cycle time without flow control
Minimum PIO transfer cycle time with lORDY flow control
66
2
67
2
68
2
69~75
20
Reserved
Serial ATA capabilities
Support Serial ATA Gen1
Support Serial ATA Gen2
76
77~79
80
0060h
0000h
0080h
0000h
742Bh
5500h
4002h
XXXXh
007Fh
0003h
0000h
0000h
FFFEh
0000h
0001h
0000h
0000h
0000h
0000h
0000h
0000h
0000h
0000h
0100h
0000h
2
6
Reserved
2
Major version number (ATAPI-7)
Minor version number
81
2
82
2
Command sets supported 0
Command sets supported 1
Command sets supported 2
Command set/feature enabled
Ultra DMA supported and selected
Time required for Security erase unit completion
Time required for Enhanced security erase unit completion
Current Advanced power management value
Master Pasword Revision Code
Reserved
83
2
84
2
85~87
88
6
2
89
2
90
2
91
2
92
2
93~127
128
70
2
Security status
129~159
160
62
2
Vendor unique bytes
Power requirement description
Reserved
161
2
162
2
Key management schemes supported
CFA True lDE Timing Mode Capability and Setting
Reserved
163
2
164
2
165~175
176~216
217
22
82
2
Reserved
Reserved
Non-rotating media(SSD)
Reserved
218~255
76
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4.3 SMART Information
ATP industrial grade mSATA Embedded Module Support S.M.A.R.T. ATA feature set in IDE mode,
not support in RAID mode and AHCI mode
4.3.1 SMART subcommand sets
In order to select a subcommand the host must write the subcommand code to the device's Features
Register before issuing the SMART Function Set command. The subcommands are listed below.
Table 4-3
Command
Command Code
SMART READ DATA
D0h
SMART SAVE ATTRIBUTE THRESHOLD
SMART ENABLE/DISABLE AUTOSAVE
SMART SAVE ATTRIBUTE VALUES
SMART EXECUTE OFF-LINE IMMIDIATE
RESERVED
D1h
D2h
D3h
D4h
D5h
D6h
D8h
D9h
DAh
RESERVED
SMART ENABLE OPERATIONS
SMART DISABLE OPERATIONS
SMART RETURN STATUS
Note:
If the reserved size is below a threshold, status can be read from the Cylinder Register using the Return
Status command (DAh)
4.3.2 SMART Read Data (subcommand D0h)
The following 512 bytes make up the device SMART data structure. Users can obtain the data using
the “Read Data” command (D0h).
Table 4-4
Byte
F/V
X
Description
0~1
Revision code
2~361
362
X
Vendor Specific
V
Off-line data collection status
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Byte
363
F/V
X
V
X
F
Description
Self-test execution status byte
364~365
366
Total time in seconds to complete off-line data collection activity
Vendor Specific
367
Off-line data collection capability
SMART capability
368~369
370
F
Error logging capability：7-1 Reserved
0 -1 = Device error logging supported
F
371
X
F
Vendor Specific
372
Short self-test routine recommended polling time(in minutes)
373
F
Extended self-test routine recommended polling time(in minutes)
374
F
Conveyance self-test routine recommended polling time(in minutes)
375~385
386~395
396~397
398~399
400~406
407~415
416
R
F
Reserved
Firmware Version/Date Code
Number of initial invalid block (396=MSB, 397=LSB)
Number of run time bad block (398=MSB, 399=LSB)
SMI2242
F
V
F
X
F
Vendor specific
Reserved
417
F
Program/write the strong page only
Number of spare block
Reserved
418~419
420
V
F
421~423
424~425
426~428
429~431
432~445
446~510
V
V
V
V
F
Average erase count
Number of child pair
Maximum erase count
Minimum erase count
Reserved
X
V
Vendor specific
511
Data structure checksum
Notes:
F=content (byte) is fixed and does not change
V=content (byte) is variable and maybe change depending on the state of the device or the command executed by the device
X= content (byte) is vendor specific and maybe fixed or variable
R=content (byte) is reserved and shall be zero
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4.3.3 ATP SMART Tool
ATP provides SMART Tool for Windows 2000/XP/Vista/7 and Linux, it can monitor the state of
mSATA Embedded module, the following picture shows SMART tool operation. This tool supports
that users read spare and bad block information. Users can thus evaluate drive health at run time and
receive an early warning before the drive life ends.
Figure 4
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5 Mechanical Information
5.1 Physical Dimension Specifications
Table 5-1
Type
Value
Length
Width
Thickness
50.80 mm +/- 0.15mm
29.85mm +/- 0.1mm
3.40mm +/- 0.1mm
mSATA Embedded
module
5.2 Mechanical Form Factor (Units in mm)
Figure 5
6 Appendix
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