74VCXH16244MTDX [ETC]

BUFFER/DRIVER|QUAD|4-BIT|VCX-CMOS|TSSOP|48PIN|PLASTIC ;
74VCXH16244MTDX
型号: 74VCXH16244MTDX
厂家: ETC    ETC
描述:

BUFFER/DRIVER|QUAD|4-BIT|VCX-CMOS|TSSOP|48PIN|PLASTIC

逻辑集成电路 光电二极管 驱动
文件: 总10页 (文件大小:143K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
November 1999  
Revised March 2002  
74VCXH16244  
Low Voltage 16-Bit Buffer/Line Driver with Bushold  
General Description  
The VCXH16244 contains sixteen non-inverting buffers  
with 3-STATE outputs to be employed as a memory and  
Features  
1.4V to 3.6V VCC supply operation  
address driver, clock driver, or bus oriented transmitter/  
receiver. The device is nibble (4-bit) controlled. Each nibble  
has separate 3-STATE control inputs which can be shorted  
together for full 16-bit operation.  
3.6V tolerant control inputs and outputs  
Bushold on data inputs eliminating the need for external  
pull-up/pull-down resistors  
The VCXH16244 data inputs include active bushold cir-  
cuitry, eliminating the need for external pull-up resistors to  
hold unused or floating data inputs at a valid logic level.  
tPD  
2.5 ns max for 3.0V to 3.6V VCC  
The 74VCXH16244 is designed for low voltage (1.4V to  
3.6V) VCC applications with output capability up to 3.6V.  
Static Drive (IOH/IOL  
)
±24 mA @ 3.0V VCC  
The 74VCXH16244 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing low CMOS power dissipation.  
Uses patented noise/EMI reduction circuitry  
Latch-up performance exceeds 300 mA  
ESD performance:  
Human body model > 2000V  
Machine model > 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74VCXH16244GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74VCXH16244MTD  
(Note 2)  
MTD48  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Logic Symbol  
© 2002 Fairchild Semiconductor Corporation  
DS500230  
www.fairchildsemi.com  
Connection Diagrams  
Pin Descriptions  
Pin Assignment for TSSOP  
Pin Names  
Description  
OEn  
Output Enable Input (Active LOW)  
Bushold Inputs  
I0I15  
O0O15  
NC  
Outputs  
No Connect  
FBGA Pin Assignments  
1
2
3
4
5
6
A
B
C
D
E
F
O0  
O2  
NC  
O1  
OE1  
NC  
OE2  
NC  
NC  
I1  
I0  
I2  
O4  
O3  
VCC  
GND  
GND  
GND  
VCC  
NC  
VCC  
GND  
GND  
GND  
VCC  
NC  
I3  
I4  
O6  
O5  
I5  
I6  
O8  
O7  
I7  
I8  
O10  
O12  
O14  
O9  
I9  
I10  
I12  
I14  
G
H
O11  
O13  
I11  
I13  
J
O15  
NC  
OE4  
OE3  
NC  
I15  
Truth Tables  
Inputs  
OE1  
Outputs  
O0–O3  
I0–I3  
L
L
L
H
X
L
H
Z
Pin Assignment for FBGA  
H
Inputs  
OE2  
Outputs  
O4-O7  
I4-I7  
L
L
L
H
X
L
H
Z
H
Inputs  
OE3  
Outputs  
O8–O11  
I8-I11  
(Top Thru View)  
L
L
L
H
X
L
H
Z
H
Inputs  
OE4  
Outputs  
O12-O15  
I12-I15  
L
L
L
H
X
L
H
Z
H
H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Immaterial (HIGH or LOW, inputs may not float)  
Z = High Impedance  
www.fairchildsemi.com  
2
Functional Description  
The 74VCXH16244 contains sixteen non-inverting buffers  
with 3-STATE outputs. The device is nibble (4 bits) con-  
trolled with each nibble functioning identically, but indepen-  
dent of each other. The control pins may be shorted  
together to obtain full 16-bit operation.The 3-STATE out-  
puts are controlled by an Output Enable (OEn) input. When  
OEn is LOW, the outputs are in the 2-state mode. When  
OEn is HIGH, the standard outputs are in the high imped-  
ance mode but this does not interfere with entering new  
data into the inputs.  
Logic Diagram  
3
www.fairchildsemi.com  
Absolute Maximum Ratings(Note 3)  
Recommended Operating  
Conditions (Note 5)  
Supply Voltage (VCC  
)
0.5V to +4.6V  
0.5V to +4.6V  
DC Input Voltage (VI)  
Power Supply  
Output Voltage (VO)  
Operating  
1.4V to 3.6V  
Outputs 3-STATED  
0.5V to +4.6V  
0.5V to VCC +0.5V  
50 mA  
Input Voltage  
0.3V to +3.6V  
Outputs Active (Note 4)  
DC Input Diode Current (IIK) VI < 0V  
Output Voltage (VO)  
Output in Active States  
Output in 3-STATE  
Output Current in IOH/IOL  
0V to VCC  
DC Output Diode Current (IOK  
)
0.0V to 3.6V  
V
V
O < 0V  
50 mA  
+50 mA  
O > VCC  
V
V
V
V
CC = 3.0V to 3.6V  
CC = 2.3V to 2.7V  
CC = 1.65V to 2.3V  
CC = 1.4V to 1.6V  
±24 mA  
±18 mA  
DC Output Source/Sink Current  
(IOH/IOL  
)
±50 mA  
±6 mA  
DC VCC or GND Current per  
Supply Pin (ICC or GND)  
±2 mA  
±100 mA  
Free Air Operating Temperature (TA)  
40°C to +85°C  
Storage Temperature Range (TSTG  
)
65°C to +150°C  
Minimum Input Edge Rate (t/V)  
V
IN = 0.8V to 2.0V, VCC = 3.0V  
10 ns/V  
Note 3: The Absolute Maximum Ratings are those values beyond which  
the safety of the device cannot be guaranteed. The device should not be  
operated at these limits. The parametric values defined in the Electrical  
Characteristics tables are not guaranteed at the Absolute Maximum Rat-  
ings. The Recommended Operating Conditionstable will define the condi-  
tions for actual device operation.  
Note 4: IO Absolute Maximum Rating must be observed.  
Note 5: Floating or unused control inputs must be held HIGH or LOW.  
DC Electrical Characteristics  
VCC  
Symbol  
VIH  
Parameter  
HIGH Level Input Voltage  
Conditions  
Min  
Max  
Units  
(V)  
2.7 - 3.6  
2.3 - 2.7  
2.0  
1.6  
V
1.65 - 2.3 0.65 x VCC  
1.4 - 1.6  
2.7 - 3.6  
2.3 - 2.7  
1.65 - 2.3  
1.4 - 1.6  
2.7 - 3.6  
2.7  
0.65 x VCC  
VIL  
LOW Level Input Voltage  
HIGH Level Output Voltage  
0.8  
0.7  
V
0.35 x VCC  
0.35 x VCC  
VOH  
I
OH = −100 µA  
OH = −12 mA  
OH = −18 mA  
OH = −24 mA  
OH = −100 µA  
OH = −6 mA  
OH = −12 mA  
OH = −18 mA  
OH = −100 µA  
OH = −6 mA  
OH = −100 µA  
OH = −2 mA  
VCC - 0.2  
2.2  
I
I
3.0  
2.4  
I
3.0  
2.2  
I
2.3 - 2.7  
2.3  
VCC - 0.2  
2.0  
I
V
I
2.3  
1.8  
I
2.3  
1.7  
I
1.65 - 2.3  
1.65  
VCC - 0.2  
1.25  
I
I
1.4 - 1.6  
1.4  
VCC - 0.2  
1.05  
I
www.fairchildsemi.com  
4
DC Electrical Characteristics (Continued)  
VCC  
Symbol  
VOL  
Parameter  
Conditions  
OL = 100 µA  
Min  
Max  
Units  
(V)  
2.7 - 3.6  
2.7  
LOW Level Output Voltage  
I
I
I
I
I
I
I
I
I
I
I
0.2  
0.4  
OL = 12 mA  
OL = 18 mA  
OL = 24 mA  
OL = 100 µA  
OL = 12 mA  
OL = 18 mA  
OL = 100 µA  
OL = 6 mA  
3.0  
0.4  
3.0  
0.55  
0.2  
2.3 - 2.7  
2.3  
0.4  
V
2.3  
0.6  
1.65 - 2.3  
1.65  
1.4 - 1.6  
1.4  
0.2  
0.3  
OL = 100 µA  
OL = 2 mA  
0.2  
0.35  
±5.0  
±5.0  
II  
Input Leakage Current  
Control Pins  
Data Pins  
0 VI 3.6V  
1.4 - 3.6  
1.4 - 3.6  
3.0  
µA  
µA  
VI = VCC or GND  
II(HOLD)  
Bushold Input Minimum  
Drive Hold Current  
VIN = 0.8V  
VIN = 2.0V  
VIN = 0.7V  
VIN = 1.6V  
VIN = 0.57V  
VIN = 1.07V  
75  
75  
45  
3.0  
2.3  
µA  
2.3  
45  
25  
1.65  
1.65  
3.6  
25  
450  
450  
300  
300  
200  
200  
II(OD)  
Bushold Input Over-Drive  
Current to Change State  
(Note 6)  
(Note 7)  
3.6  
(Note 6)  
2.7  
µA  
µA  
(Note 7)  
2.7  
(Note 6)  
1.95  
1.95  
(Note 7)  
IOZ  
3-STATE Output Leakage  
0 VO 3.6V  
VI = VIH or VIL  
0 (VO) 3.6V  
VI = VCC or GND  
2.7 - 3.6  
±10  
IOFF  
ICC  
Power-OFF Leakage Current  
Quiescent Supply Current  
0
10  
20  
µA  
µA  
µA  
µA  
2.7 - 3.6  
2.7 - 3.6  
2.7 - 3.6  
V
CC (VO) 3.6V (Note 8)  
IH = VCC 0.6V  
±20  
750  
ICC  
Increase in ICC per Input  
V
Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH.  
Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW.  
Note 8: Outputs disabled or 3-STATE only.  
5
www.fairchildsemi.com  
AC Electrical Characteristics (Note 9)  
VCC  
TA = −40°C to +85°C  
Figure  
Symbol  
Parameter  
Propagation Delay  
Conditions  
Units  
(V)  
Min  
0.8  
1.0  
1.5  
Max  
2.5  
Number  
tPHL  
C
L = 30 pF, RL = 500Ω  
3.3 ± 0.3  
2.5 ± 0.2  
1.8 ± 0.15  
Figures  
1, 2  
tPLH  
3.0  
ns  
6.0  
Figures  
5, 6  
C
L = 15 pF, RL = 2 kΩ  
L = 30 pF, RL = 500Ω  
1.5 ± 0.1  
1.0  
12.0  
tPZL  
tPZH  
Output Enable Time  
Output Disable Time  
C
3.3 ± 0.3  
2.5 ± 0.2  
1.8 ± 0.15  
0.8  
1.0  
1.5  
3.5  
4.1  
8.2  
Figures  
1, 3, 4  
ns  
Figures  
5, 7, 8  
C
L = 15 pF, RL = 2 kΩ  
L = 30 pF, RL = 500Ω  
1.5 ± 0.1  
1.0  
16.4  
tPLZ  
tPHZ  
C
3.3 ± 0.3  
2.5 ± 0.2  
1.8 ± 0.15  
0.8  
1.0  
1.5  
3.5  
3.8  
6.8  
Figures  
1, 3, 4  
ns  
ns  
Figures  
5, 7, 8  
C
L = 15 pF, RL = 2 kΩ  
L = 30 pF, RL = 500Ω  
1.5 ± 0.1  
1.0  
13.6  
tOSHL  
tOSLH  
Output to Output Skew  
(Note 10)  
C
3.3 ± 0.3  
2.5 ± 0.2  
1.8 ± 0.15  
1.5 ± 0.1  
0.5  
0.5  
0.75  
1.5  
CL = 15 pF, RL = 2 kΩ  
Note 9: For CL = 50PF, add approximately 300 ps to the AC maximum specification.  
Note 10: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The  
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH).  
Dynamic Switching Characteristics  
VCC  
T
A = +25°C  
Symbol  
VOLP  
Parameter  
Conditions  
Units  
(V)  
1.8  
2.5  
3.3  
1.8  
2.5  
3.3  
1.8  
2.5  
3.3  
Typical  
0.25  
0.6  
Quiet Output Dynamic Peak VOL  
C
C
C
L = 30 pF, VIH = VCC, VIL = 0V  
V
0.8  
VOLV  
Quiet Output Dynamic Valley VOL  
Quiet Output Dynamic Valley VOH  
L = 30 pF, VIH = VCC, VIL = 0V  
L = 30 pF, VIH = VCC, VIL = 0V  
0.25  
0.6  
0.8  
1.5  
V
V
VOHV  
1.9  
2.2  
Capacitance  
T
A = +25°C  
Symbol  
Parameter  
Conditions  
CC = 1.8, 2.5V or 3.3V, VI = 0V or VCC  
Units  
Typical  
CIN  
Input Capacitance  
Output Capacitance  
Power Dissipation Capacitance  
V
6
7
pF  
pF  
pF  
COUT  
CPD  
VI = 0V or VCC, VCC = 1.8V, 2.5V or 3.3V  
VI = 0V or VCC, f = 10 MHz, VCC = 1.8V, 2.5V or 3.3V  
20  
www.fairchildsemi.com  
6
AC Loading and Waveforms (V 3.3V ± 0.3V to 1.8V ± 0.15V)  
CC  
TEST  
SWITCH  
tPLH, tPHL  
Open  
tPZL, tPLZ  
6V at VCC = 3.3 ± 0.3V;  
V
CC x 2 at VCC = 2.5 ± 0.2V; 1.8V ± 0.15V  
tPZH, tPHZ  
GND  
FIGURE 1. AC Test Circuit  
FIGURE 2. Waveform for Inverting and Non-Inverting Functions  
FIGURE 3. 3-STATE Output High Enable and Disable Times for Low Voltage Logic  
FIGURE 4. 3-STATE Output Low Enable and Disable Times for Low Voltage Logic  
VCC  
Symbol  
3.3V ± 0.3V  
1.5V  
2.5V ± 0.2V  
VCC/2  
1.8V ± 0.15V  
VCC/2  
Vmi  
Vmo  
VX  
1.5V  
VCC/2  
VCC/2  
V
OL + 0.3V  
V
OL + 0.15V  
V
OL + 0.15V  
VY  
V
OH 0.3V  
V
OH 0.15V  
VOH 0.15V  
7
www.fairchildsemi.com  
AC Loading and Waveforms (V 1.5 ± 0.1V)  
CC  
TEST  
SWITCH  
tPLH, tPHL  
Open  
VCC x 2 at VCC = 1.5 ± 0.1V  
GND  
tPZL, tPLZ  
tPZH, tPHZ  
FIGURE 5. AC Test Circuit  
FIGURE 6. Waveform for Inverting and Non-Inverting Functions  
FIGURE 7. 3-STATE Output High Enable and Disable Times for Low Voltage Logic  
FIGURE 8. 3-STATE Output Low Enable and Disable Times for Low Voltage Logic  
VCC  
Symbol  
1.5V ± 0.1V  
Vmi  
Vmo  
VX  
VCC/2  
VCC/2  
V
OL + 0.1V  
VY  
VOH 0.1V  
www.fairchildsemi.com  
8
Physical Dimensions inches (millimeters) unless otherwise noted  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
Package Number BGA54A  
Preliminary  
9
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Package Number MTD48  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
10  

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