2SK1610 [ETC]

;
2SK1610
型号: 2SK1610
厂家: ETC    ETC
描述:

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中文:  中文翻译
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Power F-MOS FETs  
2SK1610  
Silicon N-Channel Power F-MOS FET  
Features  
High avalanche energy capacity  
VGSS: 30V guaranteed  
unit: mm  
Low RDS(on), high-speed switching characteristic  
15.0±0.5  
13.0±0.5  
10.5±0.5  
4.5±0.2  
Applications  
High-speed switching (switching power supply)  
2.0±0.1  
For high-frequency power amplification  
Absolute Maximum Ratings (TC = 25°C)  
φ3.2±0.1  
Parameter  
Symbol  
Ratings  
500  
Unit  
V
Drain to Source breakdown voltage VDSS  
2.0±0.2  
Gate to Source voltage  
DC  
Pulse  
Avalanche energy capacity  
VGSS  
ID  
±30  
V
1.4±0.3  
0.6±0.2  
1.1±0.1  
±13  
A
Drain current  
5.45±0.3  
IDP  
±26  
A
10.9±0.5  
2
EAS*  
170  
mJ  
1: Gate  
2: Drain  
3: Source  
Allowable power  
dissipation  
TC = 25°C  
Ta = 25°C  
120  
1
3
PD  
W
2.5  
EIAJ: SC-65(a)  
TOP-3 Package (a)  
Channel temperature  
Storage temperature  
Single pulse  
Tch  
150  
°C  
°C  
Tstg  
55 to +150  
*
Electrical Characteristics (TC = 25°C)  
Parameter  
Symbol  
IDSS  
Conditions  
VDS = 400V, VGS = 0  
VGS = ±30V, VDS = 0  
ID = 1mA, VGS = 0  
min  
typ  
max  
Unit  
mA  
µA  
V
Drain to Source cut-off current  
Gate to Source leakage current  
0.1  
±1  
IGSS  
Drain to Source breakdown voltage VDSS  
500  
170  
1
Avalanche energy capacity  
Gate threshold voltage  
EAS*  
Vth  
L = 2mH, ID = 13A, VDD = 50V  
VDS = 25V, ID = 1mA  
VGS = 10V, ID = 7A  
mJ  
V
5
Drain to Source ON-resistance  
Forward transfer admittance  
RDS(on)  
| Yfs |  
0.45  
8
0.6  
VDS = 25V, ID = 7A  
5
S
Input capacitance (Common Source) Ciss  
Output capacitance (Common Source) Coss  
Reverse transfer capacitance (Common Source) Crss  
1700  
300  
120  
100  
90  
pF  
pF  
pF  
ns  
VDS = 20V, VGS = 0, f = 1MHz  
Turn-on time  
ton  
VGS = 10V, ID = 7A  
Fall time  
tf  
ns  
VDD = 150V, RL = 21.4Ω  
Turn-off time (delay time)  
td(off)  
210  
ns  
*
Avalanche energy capacity test circuit  
L
ID  
Gate  
VDS  
C
VDD  
Drain  
Source  
PVS  
RGS  
1
Power F-MOS FETs  
2SK1610  
ID  
VDS  
| Yfs | ID  
RDS(on)  
ID  
32  
28  
24  
20  
16  
12  
8
12  
10  
8
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
VDS=25V  
TC=25˚C  
VGS=10V  
TC=25˚C  
TC=25˚C  
10V  
GS=15V  
V
8V  
7V  
6V  
6
4
2
PD=120W  
5V  
20  
4
0
0
0
4
8
12  
16  
24  
0
4
8
12  
16  
20  
24  
0
5
10  
15  
20  
25  
(
V
)
(
A
)
( )  
Drain current ID A  
Drain to source voltage VDS  
Drain current ID  
ID  
VGS  
Ciss, Coss, Crss  
VDS  
ton, tf, td(off)  
ID  
10000  
32  
28  
24  
20  
16  
12  
8
320  
280  
240  
200  
160  
120  
80  
VDS=25V  
TC=25˚C  
f=1MHz  
TC=25˚C  
VDD=150V  
GS=10V  
TC=25˚C  
V
3000  
1000  
Ciss  
td(off)  
300  
100  
Coss  
ton  
tf  
Crss  
30  
10  
4
40  
0
0
0
2
4
6
8
10  
0
40  
80  
120 160 200 240  
0
4
8
12 16 20 24 28 32  
(
V
)
(
V
)
( )  
Drain current ID A  
Gate to source voltage VGS  
Drain to source voltage VDS  
PD  
Ta  
Area of safe operation (ASO)  
EAS  
Tj  
160  
140  
120  
100  
80  
100  
300  
250  
200  
150  
100  
50  
Non repetitive pulse  
TC=25˚C  
ID=13A  
VDD=50V  
(1) TC=Ta  
(2) Without heat sink  
(PD=2.5W)  
IDP  
ID  
30  
10  
t=1ms  
3
1
DC  
(1)  
10ms  
60  
0.3  
0.1  
40  
20  
0.03  
0.01  
(2)  
20 40 60 80 100 120 140 160  
0
0
25  
0
1
3
10  
30  
100 300 1000  
50  
75  
100 125 150 175  
(
)
(
V
)
(
)
Ambient temperature Ta ˚C  
Drain to source voltage VDS  
Junction temperature Tj ˚C  
2

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