2SK1612 [ETC]

;
2SK1612
型号: 2SK1612
厂家: ETC    ETC
描述:

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中文:  中文翻译
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Power F-MOS FETs  
2SK1612  
Silicon N-Channel Power F-MOS FET  
Features  
High avalanche energy capacity  
VGSS: 30V guaranteed  
unit: mm  
Low RDS(on), high-speed switching characteristic  
10.0±0.2  
5.5±0.2  
4.2±0.2  
2.7±0.2  
Applications  
High-speed switching (switching power supply)  
For high-frequency power amplification  
φ3.1±0.1  
Absolute Maximum Ratings (TC = 25°C)  
Parameter  
Symbol  
Ratings  
Unit  
V
1.3±0.2  
Drain to Source breakdown voltage VDSS  
800  
1.4±0.1  
Gate to Source voltage  
DC  
Pulse  
Avalanche energy capacity  
VGSS  
ID  
±30  
V
+0.2  
–0.1  
0.5  
0.8±0.1  
±3  
A
Drain current  
IDP  
±6  
A
2.54±0.25  
EAS*  
20  
mJ  
5.08±0.5  
1: Gate  
2: Drain  
3: Source  
EIAJ: SC-67  
1
2
3
Allowable power  
dissipation  
TC = 25°C  
Ta = 25°C  
50  
PD  
W
2
Channel temperature  
Storage temperature  
Single pulse  
Tch  
150  
°C  
°C  
TO-220 Full Pack Package (a)  
Tstg  
55 to +150  
*
Electrical Characteristics (TC = 25°C)  
Parameter  
Symbol  
IDSS  
Conditions  
VDS = 720V, VGS = 0  
VGS = ±30V, VDS = 0  
ID = 1mA, VGS = 0  
min  
typ  
max  
0.1  
Unit  
mA  
µA  
V
Drain to Source cut-off current  
Gate to Source leakage current  
IGSS  
±1  
Drain to Source breakdown voltage VDSS  
900  
15  
1
Avalanche energy capacity  
Gate threshold voltage  
EAS*  
Vth  
L = 3.4mH, ID = 3A, VDD = 50V  
VDS = 25V, ID = 1mA  
VGS = 10V, ID = 2A  
mJ  
V
5
5
Drain to Source ON-resistance  
Forward transfer admittance  
RDS(on)  
| Yfs |  
3.8  
2.2  
730  
90  
VDS = 25V, ID = 2A  
1.5  
S
Input capacitance (Common Source) Ciss  
Output capacitance (Common Source) Coss  
Reverse transfer capacitance (Common Source) Crss  
pF  
pF  
pF  
ns  
VDS = 20V, VGS = 0, f = 1MHz  
40  
Turn-on time  
ton  
40  
VGS = 10V, ID = 2A  
Fall time  
tf  
35  
ns  
VDD = 200V, RL = 100Ω  
Turn-off time (delay time)  
td(off)  
105  
ns  
*
Avalanche energy capacity test circuit  
L
ID  
Gate  
VDS  
C
VDD  
Drain  
Source  
PVS  
RGS  
1
Power F-MOS FETs  
2SK1612  
ID  
VDS  
| Yfs | ID  
RDS(on)  
ID  
6
5
4
3
2
1
0
3.2  
2.8  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0
10  
8
VDS=25V  
TC=25˚C  
TC=25˚C  
7V  
TC=25˚C  
10V  
VGS=15V  
6
V
GS=10V  
6V  
5V  
4
15V  
2
PD=50W  
4V  
50  
0
0
10  
20  
30  
40  
60  
0
1
2
3
4
5
0
1
2
3
4
5
6
( )  
V
(
A
)
( )  
Drain current ID A  
Drain to source voltage VDS  
Drain current ID  
ID  
VGS  
Ciss, Coss, Crss  
VDS  
ton, tf, td(off)  
ID  
10000  
6
5
4
3
2
1
0
160  
140  
120  
100  
80  
f=1MHz  
TC=25˚C  
VDS=25V  
TC=25V  
VDD=200V  
GS=10V  
TC=25˚C  
V
3000  
1000  
td(off)  
Ciss  
300  
100  
60  
ton  
tf  
40  
Crss  
Coss  
30  
10  
20  
0
0
2
4
6
8
10  
0
40  
80  
120 160 200 240  
0
1
2
3
4
5
6
( )  
V
(
V
)
( )  
Drain current ID A  
Gate to source voltage VGS  
Drain to source voltage VDS  
PD  
Ta  
Area of safe operation (ASO)  
EAS  
Tj  
60  
50  
40  
30  
20  
10  
0
100  
30  
25  
20  
15  
10  
5
(1) TC=Ta  
(2) Without heat sink  
(PD=2W)  
Non repetitive pulse  
TC=25˚C  
ID=3A  
VDD=50V  
30  
10  
IDP  
ID  
t=1ms  
3
1
(1)  
DC  
0.3  
0.1  
10ms  
0.03  
0.01  
(2)  
0
25  
0
20 40 60 80 100 120 140 160  
1
3
10  
30  
100 300 1000  
50  
75  
100 125 150 175  
(
)
( )  
V
(
)
Ambient temperature Ta ˚C  
Drain to source voltage VDS  
Junction temperature Tj ˚C  
2

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