2723CXXX [ETC]
Telecomm/Datacomm ; 电信/数据通信\n
| 型号： | 2723CXXX |
| 厂家： | 
ETC |
| 描述： | Telecomm/Datacomm
|
| 文件： | 总11页 (文件大小：246K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Applications
■ Digital high-speed telecommunications:
— SONET: OC-1 through OC-192
— SDH: STM-16, STM-64
— Undersea communications
■ Internet data communications
Description
The D2525P family of DFB laser modules is
designed to be used with a lithium-niobate external
modulator (see Table 5). The laser module features a
polarization-maintaining fiber (PMF) pigtail, enabling
it to be directly connected to the modulator via a fiber
splice. The module contains a multiquantum-well
(MQW), distributed-feedback (DFB) laser. This
device nominally has an output power of 10 mW. The
wavelength of the laser can be temperature-tuned for
more precise wavelength selection by adjusting the
temperature of the internal thermoelectric cooler. The
laser module is fabricated in a 14-pin, hermetic,
metal/ceramic butterfly package that incorporates a
bias tee that separates the dc-bias path from the RF
input. The RF input has a nominal 25 Ω impedance.
The high-power 10 Gbits/s modulated source features a DFB
CW laser spliced to a 10 Gbit/s, dual-drive lithium-niobate
modulator, 2723Cxxx.
Features
■ ITU wavelengths available from
1529.55 nm—1610.06 nm
■ Integrated optical isolator
■ Industry-standard, 14-pin butterfly package
■ Narrow linewidth
The 10 Gbits/s 2623W dual-drive modulator uses an
integrated Mach-Zehnder configuration to convert
single-polarization CW light from a semiconductor
(DFB) laser into a time-varying optical output signal.
The patented dual-drive configuration and Ti-diffu-
sion process is a standard feature on this modulator.
■ Patented dual-drive technology with GPO connec-
tors
■ Minimum bandwidths of 8.5 GHz
■ Tunable, zero-chirp operation
■ Use of IC chip due to low drive voltages
■ PMF fiber splice
■ High reliability and hermetic packages
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Description (continued)
Pin Information
Table 1. Pin Descriptions
Pin
With this design configuration, tunable chirp transmis-
sion for maximum reach can be achieved. Also, bal-
anced drive voltages can produce zero-chirp operation.
Low drive voltages enable the use of IC chip drivers
such as the Agere Systems TMOD0110G, which sup-
ports a small and low-cost driver solution.
Name
1
2
Thermistor
Thermistor
3
Laser dc Bias (Cathode) (–)
4
5
6
7
8
9
10
11
12
13
14
15
16
Back-facet Monitor Anode (–)
Back-facet Monitor Cathode (+)
Thermoelectric Cooler (+)1
Thermoelectric Cooler (–)1
Case Ground
Controlled Feedback (D2625P)
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, fiber-optic
systems. Light reflected back to the laser is attenuated
a minimum of 30 dB.
Case Ground
Case Ground
Laser Anode (+)2
Controlled Temperature (D2525P)
RF Laser Input Cathode (–)
Laser Anode (+)2
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating
and cooling of the laser chip to maintain a temperature
of 25 °C for case temperatures from –40 °C to +70 °C.
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
Case Ground
RF/dc Input Data or Data
RF/dc Input Data or Data
1. A positive current through the thermoelectric heat pump cools the
laser.
2. For optimum performance, both leads should be grounded.
Controlled Power (D2525P)
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the fiber. Normally, this configuration is
used in a feedback arrangement to maintain consistent
laser output power.
7
6
5
4
3
2
1
–
+
+
–
–
L1
160 nH
TH
10 kΩ
15 16
TEC
43
43
Ω
Ω
0.2
0.2
2623W
µF
µ
F
ISOLATOR
R1
20 Ω
PACKAGE
GROUNDS
+
–
+
8
Top view.
9
10
11
D2525P
12
13
14
1-567
Figure 1. Circuit Schematic
2
Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Symbol
Min
Max
Unit
D2525P
Tstg
Storage Case Temperature Range*
Operating Case Temperature Range
Laser Reverse Voltage
dc Forward Current
Photodiode Reverse Voltage
Photodiode Forward Current
–40
–40
—
—
—
70
70
2
225
10
2
°C
°C
V
mA
V
TC
VRLMAX
IFLMAX
VRPDMAX
IFPDMAX
2623W
Tstg
TOP
PIN
VRF
VdcRF
—
mA
Storage Temperature
–40
0
—
—
–20
85
70
30
10
20
°C
°C
mW
V
Operating Temperature
Optical Input Power at 1.5 µm
RF Voltage (peak to peak)
dc Voltage (RF input)
V
* Does not apply to shipping container.
3
Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Mounting Instructions
Handling Precautions
Power Sequencing
The minimum fiber bend radius is 1.0 in. (25.4 mm).
To avoid degradation in performance, mount the mod-
ules on the board as follows:
To avoid the possibility of damage to the laser module
from power supply switching transients, follow this
turn-on sequence:
1. Place the bottom flange of the laser module on a flat
heat sink at least 0.5 in. x 1.180 in. (12.7 mm x
30 mm) in size. The surface finish of the heat sink
should be better than 32 µin. (0.8 µm), and the sur-
face flatness must be better than 0.001 in. (25.4 µm).
Using thermal conductive grease is optional; how-
ever, thermal performance can be improved by up to
5% if conductive grease is applied between the bot-
tom flange and the heat sink.
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw hole locations (see Out-
line Diagram). The Fillister head diameter must not
exceed 0.140 in. (3.55 mm). Do not apply more than
1 in.-lb. of torque to the screws.
Electrostatic Discharge
CAUTION: This laser device is susceptible to dam-
age as a result of electrostatic dis-
charge. Take proper precautions during
both handling and testing. Follow guide-
lines such as JEDEC Publication No.
108-A (Dec. 1988).
3. For the modulator, mount a minimum of two #4-40
screws into the two center screw holes located on
the bottom of the package (see Outline Diagram).
Do not apply more than 5.2 in.-lb. of torque to the
screws.
Agere Systems employs a human-body model (HBM)
for ESD-susceptibility testing and protection-design
evaluation. ESD voltage thresholds are dependent on
the critical parameters used to define the model. A
standard HBM (resistance = 1.5 kΩ, capacitance =
100 pF) is widely used and, therefore, can be used for
comparison purposes. The HBM ESD threshold show
here was obtained using these circuit parameters:
Parameter
Value
Unit
Human-body Model
>400
V
4
Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Characteristics
Table 2. Electrical Characteristics, D2525P (at 25 °C laser temperature)
Parameter
Threshold Current
Symbol
ITH
Test Conditions
Min
—
—
—
20
3
0.2
—
—
10
9.1
9.5
—
Typ
15
—
1.3
—
Max
35
110
1.8
30
10
—
0.1
—
100
10.1
10.5
1.0
2.0
50
Unit
mA
mA
V
°C
V
mA
µA
Ω
—
Drive Current Above Threshold
Laser Forward Voltage
Laser Submount Temperature
Monitor Reverse-bias Voltage*
Monitor Current
—
VLF
TLASER
VRMON
IRMON
ID
ZIN
ITC
—
RTH
ITEC
VTEC
∆T
LF = 10 mW
LF = 10 mW (CW)
—
—
PO = 10 mW (CW)
IF = 0, VRMON = 5 V
—
5
—
Monitor Dark Current
Input Impedance
0.01
25
—
9.6
—
—
—
—
Thermistor Current
—
—
µA
—
kΩ
A
V
°C
Resistance Ratio†
Thermistor Resistance
TEC Current
TEC Voltage
TL = 25 °C
TL = 25 °C, TC = 70 °C
TL = 25 °C, TC = 70 °C
TC = 70 °C
—
—
TEC Capacity
* Standard operating condition is 5.0 V reverse bias.
† Ratio of thermistor resistance at 0 °C to thermistor resistance at 50 °C
Table 3. Optical Characteristics, D2525P (at 25 °C laser temperature)
Parameter
Peak Optical Output Power
Symbol
PP
Test Conditions
Min
10.0
Typ
—
Max
—
Unit
mW
—
Center Wavelength*
λC
TL = 25 °C
1529.55
—
1610.06
nm
(See Table 4.)
CW wavelength
Line Width (3 dB full width)
Relative Intensity Noise
∆λ
CW, PF = 10.0 mW
—
—
2
—
10
–135
MHz
dB/Hz
RIN
CW, PF = 10.0 mW,
200 MHz < f < 10 GHz
Side-mode Suppression Ratio
Optical Isolation
SMSR
—
—
CW
TC = 0 °C to 75 °C
0 °C to 75 °C
35
30
20
45
—
—
—
—
—
±0.1
±1
dB
dB
dB
nm
pm/°C
Optical Polarization Extinction Ratio†
Wavelength Drift (EOL)
∆λ
Tested over 25 yr. lifetime
—
Wavelength Drift vs. Case Temperature
—
—
—
* Custom wavelengths available.
† The ST ferrule key is not aligned to slow axis of fiber. Connector is intended for testing purposes only.
5
Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Characteristics (continued)
Table 4. Optical/Electrical Characteristics, 2623W
Parameter
Operating Wavelength
Insertion Loss
Min
1525
—
Typ
—
—
Max
1620
6.0
Unit
nm
dB
Combined Module Output Power (under operat-
–4
—
—
dBm
ing current and modulation voltage)
Extinction Ratio at dc
Extinction Ratio at RF
S11 Optical Return Loss
Bandwidth*
Drive Voltage (Vπ) at 1 GHz
S11 Electrical Return Loss (0.3 MHz—5 GHz)
S11 Electrical Return Loss (5 GHz—10 GHz)
S11 Electrical Return Loss (10 GHz—18 GHz)
20
12
—
8
2.0
—
—
—
—
—
—
—
2.4
—
—
—
—
—
–30
—
2.6
–13
–10
–6
dB
dB
dB
GHz
V/side
dB
dB
dB
* Bandwidth stated is electrical-optical-electrical as determined by the frequency response of the received RF electrical power (after the photo-
diode) and measured relative to the RF electrical power used to drive the modulator. This response is referenced to the value at 130 MHz.
2623W Characteristic Curves
CH1 E/O
W/A
LOG MAG
3 dB/ REF –56.49 dB 1: –55.832 dB
0.130 000 000 GHz
PKG ID 01499051
(OPT A, RF A [5%])
2: –56.491 dB
.9248 GHz
dBe
3: –59.491 dB
9.3335 GHz
COR
1
AVG
4: –62.491 dB
4
9.3804 GHz
SMA
2
HID
3
4
START 0.130 000 000 GHz
STOP 20.000 000 000 GHz
Figure 2. Magnitude of Electro-Optic Response,
0.130 MHz—20 GHz
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Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Characteristics (continued)
CH1 S11
LOG MAG
5 dB/ REF 0 dB 1: –18.545 dB
0.924 000 000 GHz
PKG ID 010199069
(RF A )
2: –18.88 dB
3.8099 GHz
dBe
3: –11.186 dB
9.3695 GHz
COR
4: –7.0697 dB
6.3240 GHz
HID
3
4
1
2
START 0.130 000 000 GHz
STOP 20.000 000 000 GHz
Figure 3. S11 Electrical Return Loss
0
–10
–20
–30
–40
–50
PKG ID 011499051
–20
–10
0
10
20
MODULATOR dc BIAS VOLTAGE (V)
Figure 4. Output Power vs. Bias Voltage
7
Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Outline Diagrams
Dimensions are in inches and (millimeters). Tolerances are ±0.005 in. (±0.127 mm).
D2525P
1.025 (26.04)
PIN 1
0.10 ± 0.002
0.500 (12.70)
0.020 (0.51) TYP
MIN
(2.54 ± 0.051)
TRADEMARK, CODE, LASER SERIAL NUMBER,
AND DATE CODE IN APPROX. AREA SHOWN
STRAIN
RELIEF
0.036
(0.91)
~
0.500
(12.70)
0.200
(5.08)
0.605
0.350
(8.89)
(15.37)
MAX
0.078 (1.98)
0.105 (2.67) DIA
TYP (4) PLACES
PIN 14
0.213 (5.40) TYP
0.100 (2.54) TYP
2.03 (51.6)
0.180 (4.56)
0.056 (1.42)
0.820 (20.83)
0.700 (17.78)
0.863 (21.91)
0.260 (6.60)
0.575 (14.61)
0.10
(2.5)
0.365
(9.27)
MAX
0.215
0.030 (0.75)
1.180 (29.97)
(5.47)
REF
HEAT SINK
0.215 (5.45)
8
Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Outline Diagrams (continued)
Dimensions are in inches and (millimeters).
2623W
INPUT
Model
S/N
2623W
AGERE ELECTRO-OPTIC DEVICE
XXXX
BEND LIMITER
2 PLACES
LC CONNECTOR
31 ± 1 (787 ± 25.4)
MAXIMUM
LOOSE TUBE
0.60 (15.2)
4.64 (117.86)
JACKETED FIBER
0.20
(5.11)
014097001
0.30
(7.62)
0.39
(9.91)
6X #4-40 UNC-2B
0.15 (3.81) MIN
DEPTH
0.32 (8.13)
2.00 (50.8)
2.00 (50.8)
0.09 (2.29)
0.43
(10.92)
0.21 (5.33)
1.08
(27.43)
Spliced Assembly
Agere
2623W
2.25 (57.15)
20 ± 2 (508 ± 50.8)
44 ± 2 (1117.6 ± 50.8)
9
Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Class IIIb Laser Product
FDA/CDRH Class IIIb laser product. All versions are Class IIIb laser products per CDRH, 21 CFR 1040 Laser
Safety requirements. The device has been classified with the FDA under accession number 8720010.
This product complies with 21 CFR 1040.10 and 1040.11.
8 µm/125 µm ± 3 µm single-mode fiber with 900 µm loose-tube jacketed fiber and connector
Wavelength = 1.5 µm
Maximum power = 40 mW
Because of size constraints, laser safety labeling (including an FDA Class IIIb label) is not affixed to the module but
attached to the outside of the shipping carton.
Product is not shipped with power supply.
Caution: Use of controls, adjustments, and procedures other than those specified herein may result in
hazardous laser radiation exposure.
DANGER
INVISIBLE LASER RADIATION
IS EMITTED FROM THE END
OF FIBER OR CONNECTOR
Avoid direct exposure to beam
Do not view beam directly with
optical instruments
INVISIBLE LASER RADIATION EMITTED FROM END OF FIBER OR CONNECTOR
Avoid exposure to beam
Class IIIb Laser Product FDA/CDRH, 21 CFR 1040 Max. Output: 40 mW Wavelength: 1.5 µm
10
Agere Systems Inc.
Data Sheet
May 2002
High-Power 10 Gbit/s Modulated Source
Ordering Information
Table 5. Ordering Information
Device Code
ITU Frequency (THz)
Wavelength (nm)
Comcode
2723Cxxx
186.2—196.0
1529.55—1610.06
Contact your local sales
representative
* IEC is a registered trademark of The International Electrotechnical Commission.
For additional information, contact your Agere Systems Account Manager or the following:
INTERNET:
E-MAIL:
http://www.agere.com
docmaster@agere.com
N. AMERICA: Agere Systems Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18109-3286
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA:
Agere Systems Hong Kong Ltd., Suites 3201 & 3210-12, 32/F, Tower 2, The Gateway, Harbour City, Kowloon
Tel. (852) 3129-2000, FAX (852) 3129-2020
CHINA: (86) 21-5047-1212 (Shanghai), (86) 10-6522-5566 (Beijing), (86) 755-695-7224 (Shenzhen)
JAPAN: (81) 3-5421-1600 (Tokyo), KOREA: (82) 2-767-1850 (Seoul), SINGAPORE: (65) 6778-8833, TAIWAN: (886) 2-2725-5858 (Taipei)
Tel. (44) 7000 624624, FAX (44) 1344 488 045
EUROPE:
Agere Systems Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. Agere,
Agere Systems, and the Agere logo are trademarks of Agere Systems Inc.
Copyright © 2002 Agere Systems Inc.
All Rights Reserved
May 2002
DS02-258OCN
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