M12L16161A-7TIG2Q [ESMT]
Synchronous DRAM, 1MX16, 6ns, CMOS, PDSO50, 0.400 X 0.875 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-50;型号: | M12L16161A-7TIG2Q |
厂家: | ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. |
描述: | Synchronous DRAM, 1MX16, 6ns, CMOS, PDSO50, 0.400 X 0.875 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-50 动态存储器 光电二极管 内存集成电路 |
文件: | 总28页 (文件大小:706K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
SDRAM
512K x 16Bit x 2Banks
Synchronous DRAM
FEATURES
GENERAL DESCRIPTION
The M12L16161A is 16,777,216 bits synchronous high data
rate Dynamic RAM organized as 2 x 524,288 words by 16 bits,
fabricated with high performance CMOS technology.
Synchronous design allows precise cycle control with the use
of system clock I/O transactions are possible on every clock
cycle. Range of operating frequencies, programmable burst
length and programmable latencies allow the same device to
be useful for a variety of high bandwidth, high performance
memory system applications.
z
z
z
z
JEDEC standard 3.3V power supply
LVTTL compatible with multiplexed address
Dual banks operation
MRS cycle with address key programs
-
-
-
CAS Latency (2 & 3 )
Burst Length (1, 2, 4, 8 & full page)
Burst Type (Sequential & Interleave)
z
All inputs are sampled at the positive going edge of the
system clock
z
z
z
z
Burst Read Single-bit Write operation
DQM for masking
Auto & self refresh
ORDERING INFORMATION
32ms refresh period (2K cycle)
Product ID
Max Freq.
Package
Comments
M12L16161A-5TIG2Q
M12L16161A-7TIG2Q
TSOP(II)
TSOP(II)
Pb-free
Pb-free
200MHz
143MHz
PIN CONFIGURATION (TOP VIEW)
(TSOPII 50L, 400milX825mil Body, 0.8mm Pin Pitch )
VDD
DQ0
DQ1
VSSQ
DQ2
DQ3
VDDQ
DQ4
DQ5
VSSQ
DQ6
DQ7
VDDQ
LDQM
WE
1
VSS
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
2
DQ15
DQ14
VSSQ
DQ13
DQ12
VDDQ
DQ11
DQ10
VSSQ
DQ9
DQ8
VDDQ
N.C/RFU
UDQM
CLK
CKE
N.C
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
CAS
RAS
CS
BA
A9
A10/AP
A0
A8
A7
A1
A6
A2
A5
A3
A4
VDD
VSS
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 1/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
FUNCTIONAL BLOCK DIAGRAM
LWE
Bank Select
Data Input Register
LDQM
512K x 16
512K x 16
DQi
CLK
ADD
Column Decoder
Latency & Burst Length
LCKE
Programming Register
LWCBR
LRAS LCBR
LWE
LDQM
LCAS
Timing Register
CKE
CLK
L(U)DQM
RAS
CAS
WE
CS
PIN FUNCTION DESCRIPTION
Pin
Name
System Clock
Input Function
CLK
CS
Active on the positive going edge to sample all inputs.
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and L(U)DQM.
Chip Select
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
CKE
Clock Enable
Row / column addresses are multiplexed on the same pins.
Row address : RA0 ~ RA10, column address : CA0 ~ CA7
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
A0 ~ A10/AP
BA
Address
Bank Select Address
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK with
Row Address Strobe
RAS
CAS
Column Address Strobe
CAS low.
Enables column access.
Enables write operation and row precharge.
Write Enable
WE
Latches data in starting from CAS , WE active.
Makes data output Hi-Z, tSHZ after the clock and masks the output.
Blocks data input when L(U)DQM active.
L(U)DQM
Data Input / Output Mask
DQ0 ~ 15
VDD/VSS
Data Input / Output
Power Supply/Ground
Data inputs/outputs are multiplexed on the same pins.
Power and ground for the input buffers and the core logic.
Isolated power supply and ground for the output buffers to provide improved
noise immunity.
VDDQ/VSSQ Data Output Power/Ground
No Connection/
N.C/RFU
This pin is recommended to be left No Connection on the device.
Reserved for Future Use
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0
2/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on any pin relative to VSS
Voltage on VDD supply relative to VSS
Storage temperature
Symbol
VIN,VOUT
VDD,VDDQ
TSTG
Value
-1.0 ~ 4.6
-1.0 ~ 4.6
-55 ~ + 150
0.7
Unit
V
V
°C
W
Power dissipation
PD
Short circuit current
IOS
50
mA
Note: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS
°C
Recommended operating conditions (Voltage referenced to VSS = 0V, TA=-40 to 85
)
Parameter
Supply voltage
Symbol
VDD,VDDQ
VIH
Min
3.0
2.0
-0.3
2.4
-
Typ
Max
Unit
V
Note
3.3
3.6
Input logic high voltage
Input logic low voltage
Output logic high voltage
Output logic low voltage
Input leakage current
Output leakage current
3.0
VDD+0.3
V
1
VIL
0
-
0.8
-
V
2
VOH
V
IOH =-2mA
VOL
-
0.4
5
V
IOL = 2mA
IIL
-5
-
uA
uA
3
4
IOL
-5
-
5
Note: 1. VIH (max) = 4.6V AC for pulse width ≤ 10ns acceptable.
2. VIL (min) = -1.5V AC for pulse width ≤ 10ns acceptable.
3. Any input 0V ≤ VIN ≤ VDD, all other pins are not under test = 0V.
4. Dout is disabled, 0V ≤ VOUT ≤ VDD
.
°C
CAPACITANCE (VDD = 3.3V, TA = 25
, f = 1MHz)
Pin
Symbol
Min
Max
Unit
CLOCK
CCLK
2.5
4.0
pF
RAS , CAS , WE , CS , CKE, LDQM,
CIN
2.5
5.0
pF
UDQM
ADDRESS
DQ0 ~DQ15
CADD
COUT
2.5
4.0
5.0
6.5
pF
pF
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 3/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
DC CHARACTERISTICS
°C
(Recommended operating condition unless otherwise noted, TA = -40 to 85
VIH(min)/VIL(max)=2.0V/0.8V)
CAS
Latency
Version
Parameter
Symbol
Test Condition
Unit Note
-5
-7
Burst Length = 1
tRC ≥ tRC (min), tCC ≥ tCC (min), IOL= 0mA
Operating Current
(One Bank Active)
ICC1
100
80
mA
mA
1
Precharge Standby
Current in power-down
mode
ICC2P
2
2
CKE ≤ VIL(max), tCC =15ns
ICC2PS
CKE ≤ VIL(max), CLK ≤ VIL(max), tCC = ∞
CKE ≥ VIH(min), CS ≥ VIH(min), tCC =15ns
25
10
mA
mA
mA
ICC2N
Precharge Standby
Current in non
power-down mode
Input signals are changed one time during 30ns
CKE ≥ VIH(min), CLK ≤ VIL(max), tCC = ∞
Input signals are stable
ICC2NS
ICC3P
10
10
CKE ≤ VIL(max), tCC =15ns
Active Standby Current
in power-down mode
ICC3PS
CKE ≤ VIL(max), CLK ≤ VIL(max), tCC = ∞
CKE ≥ VIH(min), CS ≥ VIH(min), tCC=15ns
Input signals are changed one time during 2clks
All other pins ≥ VDD-0.2V or ≤ 0.2V
Active Standby Current
in non power-down
mode
25
10
mA
mA
ICC3N
(One Bank Active)
CKE ≥ VIH (min), CLK ≤ VIL(max), tCC= ∞
Input signals are stable
ICC3NS
100
100
100
80
80
80
3
Operating Current
(Burst Mode)
IOL= 0mA, Page Burst
ICC4
mA
1
2
All Band Activated, tCCD = tCCD (min)
2
Refresh Current
ICC5
ICC6
tRFC ≥ tRFC(min)
CKE ≤ 0.2V
mA
mA
Self Refresh Current
1
Note: 1.Measured with outputs open. Addresses are changed only one time during tCC(min).
2.Refresh period is 32ms. Addresses are changed only one time during tCC(min).
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 4/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
AC OPERATING TEST CONDITIONS (VDD=3.3V ± 0.3V, TA= -40 to 85°C )
Parameter
Value
2.4 / 0.4
1.4
tr / tf = 1 / 1
1.4
Unit
V
V
ns
V
Input levels (Vih/Vil)
Input timing measurement reference level
Input rise and fall time
Output timing measurement reference level
Output load condition
See Fig.2
3.3V
Vtt =1.4V
1200 Ω
50
Ω
Output
VOH(DC) = 2.4V, IOH = -2mA
VOL(DC) = 0.4V, IOL = 2mA
Output
Z0=50
Ω
30 pF
870 Ω
30 pF
(Fig.2) AC Output Load Circuit
(Fig.1) DC Output Load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Version
Parameter
Symbol
Unit
Note
-5
-7
Row active to row active delay
tRRD(min)
tRCD(min)
10
14
ns
ns
1
1
15
21
RAS to CAS delay
Row precharge time
tRP(min)
tRAS(min)
15
30
21
42
ns
ns
1
1
Row active time
tRAS(max)
tRC(min)
100
us
@ Operating
@ Auto refresh
45
55
63
63
ns
1
1, 5
2
Row cycle time
tRFC(min)
ns
Last data in to new col. Address delay
Last data in to row precharge
Last data in to burst stop
tCDL(min)
1
2
1
1
2
1
CLK
CLK
CLK
CLK
tRDL(min)
2
tBDL(min)
2
Col. Address to col. Address delay
tCCD(min)
3
CAS Latency=3
CAS Latency=2
Number of valid output data
ea
4
Note: 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and
then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
The earliest a precharge command can be issued after a Read command without the loss of data is CL+BL-2 clocks.
5. A new command may be given tRFC after self refresh exit.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 5/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
AC CHARACTERISTICS (AC operating conditions unless otherwise noted)
-5
-7
Parameter
Symbol
Unit
Note
Min
Max
Min
Max
CAS Latency =3
5
7
-
7
8.6
-
CLK cycle time
tCC
1000
1000
ns
ns
1
1
CAS Latency =2
CAS Latency =3
CAS Latency =2
4.5
5
6
6
CLK to valid
output delay
tSAC
-
-
Output data hold time
CLK high pulse width
CLK low pulse width
Input setup time
tOH
tCH
tCL
ns
ns
ns
ns
ns
ns
2
3
3
3
3
2
2
2
2
2
1
2
2
2
2
1
1
-
tSS
tSH
tSLZ
Input hold time
CLK to output in Low-Z
1
-
4.5
5
CAS Latency =3
6
6
CLK to output in
Hi-Z
tSHZ
ns
-
CAS Latency =2
-
*All AC parameters are measured from half to half.
Note: 1.Parameters depend on programmed CAS latency.
2.If clock rising time is longer than 1ns,(tr/2-0.5)ns should be added to the parameter.
3.Assumed input rise and fall time (tr & tf)=1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered, i.e., [(tr+ tf)/2-1]ns should be added to the
parameter.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 6/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Mode Register
BA A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0
0
0
0
1
JEDEC Standard Test Set (refresh counter test)
BA A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
LTMODE WT BL
X
x
1
0
0
Burst Read and Single Write (for Write
Through Cache)
BA A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1
0
Use in future
BA A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
X
x
x
1
1
v
v
v
v
v
v
v
Vender Specific
v =Valid
BA A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
LTMODE WT BL
0
0
0
0
0
Mode Register Set
x =Don’t care
Bit2-0
000
001
010
011
WT=0
1
2
4
WT=1
1
2
4
8
Burst length
8
100
101
110
R
R
R
R
R
R
R
111
Full page
0
1
Sequential
Interleave
Wrap type
Bits6-4
CASLatency
000
001
010
011
100
101
110
111
R
R
2
Latency mode
3
R
R
R
R
Remark R: Reserved
Mode Register Write Timing
CLOCK
CKE
CS
RAS
CAS
WE
A0-A10, BA
Mode Register Write
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 7/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Burst Length and Sequence
(Burst of Two)
Starting Address
(column address A0 binary)
Sequential Addressing
Sequence (decimal)
Interleave Addressing
Sequence (decimal)
0
1
0,1
1,0
0,1
1,0
(Burst of Four)
Starting Address
(column address A1-A0, binary)
Sequential Addressing
Sequence (decimal)
Interleave Addressing
Sequence (decimal)
00
01
10
11
0,1,2,3
1,2,3,0
2,3,0,1
3,0,1,2
0,1,2,3
1,0,3,2
2,3,0,1
3,2,1,0
(Burst of Eight)
Starting Address
(column address A2-A0, binary)
Sequential Addressing
Sequence (decimal)
Interleave Addressing
Sequence (decimal)
000
001
010
011
100
101
110
111
0,1,2,3,4,5,6,7
1,2,3,4,5,6,7,0
2,3,4,5,6,7,0,1
3,4,5,6,7,0,1,2
4,5,6,7,0,1,2,3
5,6,7,0,1,2,3,4
6,7,0,1,2,3,4,5
7,0,1,2,3,4,5,6
0,1,2,3,4,5,6,7
1,0,3,2,5,4,7,6
2,3,0,1,6,7,4,5
3,2,1,0,7,6,5,4
4,5,6,7,0,1,2,3
5,4,7,6,1,0,3,2
6,7,4,5,2,3,0,1
7,6,5,4,3,2,1,0
Full page burst is an extension of the above tables of Sequential Addressing, with the length being 256 for 1Mx16 device.
POWER UP SEQUENCE
1.Apply power and start clock, attempt to maintain CKE= “H”, L(U)DQM = “H” and the other pin are NOP condition at the inputs.
2.Maintain stable power, stable clock and NOP input condition for a minimum of 200us.
3.Issue precharge commands for all banks of the devices.
4.Issue 2 or more auto-refresh commands.
5.Issue mode register set command to initialize the mode register.
Cf.)Sequence of 4 & 5 is regardless of the order.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 8/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
SIMPLIFIED TRUTH TABLE
COMMAND
CKEn-1 CKEn
DQM BA A10/AP A9~A0 Note
CS RAS CAS
WE
Register
Refresh
Mode Register Set
Auto Refresh
H
H
X
H
L
L
L
L
L
X
X
OP CODE
X
1,2
3
L
L
L
H
Entry
3
Self Refresh
L
H
L
H
X
L
H
X
H
H
X
H
3
Exit
L
H
X
X
X
X
3
Bank Active & Row Addr.
H
V
V
Row Address
Column
Address
(A0~A7)
Auto Precharge Disable
Auto Precharge Enable
Auto Precharge Disable
Auto Precharge Enable
L
H
L
4
Read &
Column Address
H
H
X
X
L
L
H
H
L
L
H
L
X
X
4,5
4
Column
Address
(A0~A7)
Write & Column
Address
V
H
4,5
Burst Stop
Precharge
H
H
X
X
L
L
H
L
H
H
L
L
X
X
X
6
4
4
Bank Selection
Both Banks
V
X
L
X
H
H
L
X
H
X
X
H
X
H
X
H
X
X
H
X
H
X
H
X
X
H
X
H
Entry
H
L
L
H
L
X
X
X
Clock Suspend or
X
X
Active Power Down Mode
Exit
X
H
L
Entry
H
Precharge Power Down Mode
H
L
Exit
L
H
X
X
V
X
DQM
H
H
H
X
X
X
7
H
L
X
H
X
H
X
H
No Operation Command
(V= Valid, X= Don’t Care, H= Logic High, L = Logic Low)
Note:
1. OP Code: Operation Code
A0~ A10/AP, BA: Program keys.(@MRS)
2. MRS can be issued only at both banks precharge state.
A new command can be issued after 2 clock cycle of MRS.
3. Auto refresh functions are as same as CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by “Auto”.
Auto / self refresh can be issued only at both banks idle state.
4. BA: Bank select address.
If “Low”: at read, write, row active and precharge, bank A is selected.
If “High”: at read, write, row active and precharge, bank B is selected.
If A10/AP is “High” at row precharge, BA ignored and both banks are selected.
5. During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read /write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
6. Burst stop command is valid at every burst length.
7. DQM sampled at positive going edge of a CLK masks the data-in at the very CLK (Write DQM latency is 0), but
makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 9/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Single Bit Read-Write-Read Cycle (Same Page) @ CAS Latency=3, Burst Length=1
tC H
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
C L O C K
tC L
tC C
H I G H
tS H
C K E
C S
tR A S
tR C
*Note1
tR P
tR C D
tS S
tS H
tS S
R A S
C A S
tC C D
t S H
tS S
tS S
tS H
A D D R
R a
R b
C a
C b
C c
tS H
tS S
*Note2
*Note2,3
*Note2,3
*Note2,3
*Note4
*Note2
BS
BA
BS
BS
BS
BS
BS
*Note 3
*Note 3
*Note 3
*Note4
R b
R a
A10/AP
t R A C
tS A C
tS H
D Q
Qc
D b
Qa
tS L Z
tS S
tO H
tS H
tS S
W E
tS S
tS H
D Q M
Row A c t i ve
Read
W r i t e
Row A c t i ve
Read
Pr echa rg e
: D o n ' t C a r e
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 10/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
*Note: 1. All inputs expect CKE & DQM can be don’t care when CS is high at the CLK high going edge.
2. Bank active & read/write are controlled by BA.
BA
0
Active & Read/Write
Bank A
1
Bank B
3.Enable and disable auto precharge function are controlled by A10/AP in read/write command.
A10/AP
BA
0
Operation
Disable auto precharge, leave bank A active at end of burst.
Disable auto precharge, leave bank B active at end of burst.
Enable auto precharge, precharge bank A at end of burst.
Enable auto precharge, precharge bank B at end of burst.
0
1
0
1
1
4.A10/AP and BA control bank precharge when precharge command is asserted.
A10/AP BA
precharge
Bank A
0
0
1
0
1
X
Bank B
Both Banks
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 11/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Power Up Sequence
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
C L O C K
C K E
H i g h l e v e l i s n e c e s s a r y
CS
t
R F C
t
R F C
t
R P
RAS
CAS
A D D R
R A a
K e y
BA
A10 /AP
D Q
K e y
K e y
R A a
H i g h - Z
WE
D Q M
H i g h l e v e l i s n e c e s s a r y
M o d e R e g i s t e r S e t
P r e c h a r g e
A l l B a n k s
A u t o R e f r e s h
A u t o R e f r e s h
( A - B a n k )
R o w A c t i v e
:
D o n ' t c a r e
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0
12/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Read & Write Cycle at Same Bank @ Burst Length = 4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
CKE
HIGH
*Note1
t
RC
CS
t
RCD
RAS
CAS
*Note2
ADDR
Ra
Rb
Cb0
Ca0
BA
A10/AP
Ra
Rb
t
OH
CL=2
CL=3
Qa2
Qa1
Qa3
Qa2
Db2
Db2
Db3
Db3
Qa0
Db0
Db0
Db1
t
RAC
t
SHZ
QC
*Note4
t
SAC
*Note3
t
RDL
t
OH
Qa1
Qa3
Qa0
Db1
t
RAC
t
SHZ
*Note4
t
SAC
*Note3
t
RDL
WE
DQM
Precharge
(A-Bank)
Row Active
(A-Bank)
Row Active
(A-Bank)
Precharge
(A-Bank)
Read
(A-Bank)
Write
(A-Bank)
: Don't care
*Note: 1.Minimum row cycle times is required to complete internal DRAM operation.
2.Row precharge can interrupt burst on any cycle. [CAS Latency-1] number of valid output data is available after Row
precharge. Last valid output will be Hi-Z(tSHZ) after the clock.
3.Access time from Row active command. tcc*(tRCD +CAS latency-1)+tSAC
4.Output will be Hi-Z after the end of burst.(1,2,4,8 bit burst)
Burst can’t end in Full Page Mode.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 13/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Page Read & Write Cycle at Same Bank @ Burst Length=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
CKE
HIGH
CS
tRCD
RAS
*Note2
CAS
ADDR
BA
Ra
Cb0
Ca0
Cc0
Cd0
A10/AP
Ra
tRDL
CL=2
Qa0
Qb0
Qb1
Qb0
Dc0
Dc0
Dc1
Dd1
Qb2
Qb1
Qa1
Qa0
Dd0
DQ
Qa1
Dc1 Dd0
Dd2
CL=3
tCDL
WE
*Note3
*Note1
DQM
Read
(A-Bank)
Write
(A-Bank)
Read
(A-Bank)
Write
(A-Bank)
Precharge
(A-Bank)
Row Active
(A-Bank)
: Don't care
*Note: 1.To write data before burst read ends, DQM should be asserted three cycles prior to write command to avoid bus
contention.
2.Row precharge will interrupt writing. Last data input, tRDL before Row precharge, will be written.
3.DQM should mask invalid input data on precharge command cycle when asserting precharge before end of burst.
Input data after Row precharge cycle will be masked internally.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 14/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Page Read Cycle at Different Bank @ Burst Length=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
CKE
HIGH
*Note1
CS
RAS
CAS
ADDR
BA
*Note2
RAa
CAc
CAa
CBd
RBb
CBb
CAe
RAa
A10/AP
CL=2
RBb
QAa0 QAa1
QAa3
QAa2
QBb1
QBb0
QAa2
QBb0
QAa3
QBb2
QBb1
QBb3 QAc0
QBd1 QAe0
QAc1 QBd0
QAe1
DQ
CL=3
QAa0 QAa1
QBb2
QBb3 QAc0
QBd1 QAe0
QAc1 QBd0
QAe1
WE
DQM
Read
(B-Bank)
Read
(B-Bank)
Row Active
(A-Bank)
Read
(A-Bank)
Precharge
(A-Bank)
Read
(A-Bank)
Read
(A-Bank)
Row Active
(B-Bank)
: Don't care
*Note: 1. CS can be don’t cared when RAS , CAS and WE are high at the clock high going edge.
2.To interrupt a burst read by row precharge, both the read and the precharge banks must be the same.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 15/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Page Write Cycle at Different Bank @ Burst Length = 4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
CLOCK
CKE
HIGH
CS
RAS
CAS
*Note2
CAa
ADDR
BA
CBb
CAc
RBb
CBd
RAa
A10/AP
DQ
RAa
RBb
DBb3 DAc0 DAc1
DBb2
DAa1 DAa2
DBb0 DBb1
DBd0
DAa0
DAa3
DBd1
tCDL
tRDL
WE
*Note1
DQM
Precharge
(Both Banks)
Row Active
(A-Bank)
Write
(B-Bank)
Row Active
(B-Bank)
Write
(A-Bank)
Write
(A-Bank)
Write
(B-Bank)
: Don't care
*Note: 1.To interrupt burst write by Row precharge, DQM should be asserted to mask invalid input data.
2.To interrupt burst write by row precharge, both the write and the precharge banks must be the same.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 16/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Read & Write Cycle at Different Bank @ Burst Length = 4
*Note: 1.tCDL should be met to complete write.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0
17/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Read & Write Cycle with auto Precharge @ Burst Length =4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
C L O C K
C K E
H I G H
C S
RA S
C A S
A D D R
C b
R a
R b
C a
BA
A10/AP
R a
R b
CL= 2
D Q
Qa1 Qa2
Qa3
Qa2
Qa0
Db0
Db0
Db1
Db2
Db3
Db3
CL= 3
Qa1
Qa3
Qa0
Db1 Db2
W E
D Q M
Row Active
( A - Bank )
Read with
Auto Precharge
( A - Bank )
Auto Precharge
Start Point
( A - Bank)
W r i t e wi t h
Auto Pr echarge
( B- Bank )
Aut o Pr echarge
Star t Poin t
( B- Bank )
Row Active
( B - Bank )
: D o n ' t C a r e
*Note: 1.tCDL should be controlled to meet minimum tRAS before internal precharge start
(In the case of Burst Length=1 & 2 and BRSW mode)
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 18/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Clock Suspension & DQM Operation Cycle @ CAS Latency=2, Burst Length=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
C L O C K
C K E
C S
RA S
CA S
A D D R
BA
R a
C a
C b
C c
R a
A10 /AP
D Q
Qb0
Qa0
Qa1
Qa2
Qa3
tS H Z
Dc 2
Qb1
tS H Z
Dc 0
W E
* N o t e 1
D Q M
Cl oc k
Suspension
W r i t e
D Q M
Row A c t i ve
Read
Read
W r i t e
D Q M
Cl oc k
Suspension
Read D Q M
W r i t e
:D on' t C ar e
*Note: 1.DQM is needed to prevent bus contention.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 19/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Read Interrupted by Precharge Command & Read Burst Stop Cycle @ Burst Length=Full page
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
C L O C K
C K E
H I G H
CS
RAS
CAS
A D D R
BA
CA a
CA b
RA a
A10/AP
RA a
*Note2
1
QAa3 QAa4
1
QAa2
QAa1
QAb0
QAb1
QAb0
QAb5
QAb3 QAb4
QAa0
CL = 2
QAa1
QAa0
QAb2
D Q
2
2
QAa2 QAa3 QAa4
CL = 3
WE
QAb4
QAb3
QAb1 QAb2
QAb5
D Q M
Read
( A - Ba n k )
Bu rst Sto p
Pre cha rge
( A- B an k )
Read
( A - Ba n k )
Row A c t i ve
( A- B an k )
:D o n' t C ar e
*Note: 1.Burst can’t end in full page mode, so auto precharge can’t issue.
2.About the valid DQs after burst stop, it is same as the case of RAS interrupt.
Both cases are illustrated above timing diagram. See the label 1,2 on them.
But at burst write, burst stop and RAS interrupt should be compared carefully.
Refer the timing diagram of “Full page write burst stop cycle”.
3.Burst stop is valid at every burst length.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 20/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Write Interrupted by Precharge Command & Write Burst stop Cycle @ Burst Length=Full page
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
C L O C K
C K E
H I G H
C S
RA S
CA S
RA a
CA a
A D D R
BA
CA b
A10 /AP
RA a
tB D L
tR D L
* N o t e 2
D Q
DAa0
DAb2 DAb3
DAb0 DAb1
DAb4
DAa1 DAa2 DAa3 DAa4
DAb5
W E
D Q M
W ri t e
( A - Ba n k )
Ro w A c t i ve
( A- B an k )
Bu rst Sto p
W ri t e
( A - Ba n k )
Pr echarg e
( A- B an k )
:D on ' t C ar e
*Note: 1. Burst can’t end in full page mode, so auto precharge can’t issue.
2.Data-in at the cycle of interrupted by precharge can not be written into the corresponding memory cell. It is defined by
AC parameter of tRDL.
DQM at write interrupted by precharge command is needed to prevent invalid write.
Input data after Row precharge cycle will be masked internally.
3.Burst stop is valid at every burst length.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 21/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Burst Read Single bit Write Cycle @ Burst Length=2
C L O C K
* N o t e 1
H I G H
C K E
C S
RA S
* N o t e 2
CA S
CA a RB b CA b
RA a
C B c
A D D R
BA
R A c
CA d
A10/AP
RA a
R A c
RB b
CL= 2
CL= 3
DAa0
QAb0 QAb1
QAd0 QAd1
DBc 0
DBc 0
D Q
QAb0 QAb1
QAd0 QAd1
DAa0
W E
D Q M
Row A c t i ve
( A- B an k )
Rea d
( A- B an k )
Row A c t i ve
( A- B an k )
Pr e ch ar g e
( A- B an k )
Row Active
(B-Bank)
W r i t e wi t h
Read with
W r i t e
Au to Pr echar g e
( B- Ba nk )
Auto Precharge
(A-Bank)
( A - Ban k )
:D o n' t C ar e
*Note: 1.BRSW modes is enabled by setting A9 “High” at MRS(Mode Register Set).
At the BRSW Mode, the burst length at write is fixed to “1” regardless of programmed burst length.
2.When BRSW write command with auto precharge is executed, keep it in mind that tRAS should not be violated.
Auto precharge is executed at the next cycle of burst-end, so in the case of BRSW write command, the precharge
command will be issued after two clock cycles.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 22/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Active/Precharge Power Down Mode @ CAS Latency=2, Burst Length=4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
C L O C K
* N o t e 2
tSS
tS S
* N o t e 1
tSS
C K E
*Not e3
C S
RA S
CA S
R a
C a
A D D R
B A
A10/AP
R a
tS H Z
Qa0
Qa2
Qa1
D Q
W E
D Q M
Pr ech ar ge
Pow er - D ow n
E ntr y
Row Active
Read
P r e c h a r g e
Precharge
Power-Down
Exit
Active
Active
Power-down
Entry
Power-down
Exit
:
D o n ' t c a r e
*Note: 1.Both banks should be in idle state prior to entering precharge power down mode.
2.CKE should be set high at least 1CLK+tss prior to Row active command.
3.Can not violate minimum refresh specification. (32ms)
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 23/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Self Refresh Entry & Exit Cycle
0
1
2
3
4
5
6
7
8
9
10
11
12
13
t
14
15
16
17
18
19
C L O C K
* N o t e 2
* N o t e 4
R F C m i n
* N o t e 6
* N o t e 1
*Note3
C K E
t
S S
* N o t e 5
C S
R A S
C A S
* N o t e 7
A D D R
B A
A10/AP
H i - Z
H i - Z
D Q
W E
D Q M
S e l f R e f r e s h E x i t
S e l f R e f r e s h E n t r y
A u t o R e f r e s h
:
D o n ' t c a r e
*Note: TO ENTER SELF REFRESH MODE
1. CS ,RAS & CAS with CKE should be low at the same clock cycle.
2. After 1 clock cycle, all the inputs including the system clock can be don’t care except for CKE.
3. The device remains in self refresh mode as long as CKE stays “Low”.
cf.) Once the device enters self refresh mode, minimum tRAS is required before exit from self refresh.
TO EXIT SELF REFRESH MODE
4. System clock restart and be stable before returning CKE high.
5. CS Starts from high.
6. Minimum tRFC is required after CKE going high to complete self refresh exit.
7. 2K cycle of burst auto refresh is required immediately before self refresh entry and immediately after self refresh
exit.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 24/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Mode Register Set Cycle
Auto Refresh Cycle
1
2
3
4
5
6
0
1
2
3
4
5
6
7
8
9
1 0
0
C L O C K
C K E
H I G H
H I G H
C S
* N o t e 2
t
R F C
R A S
*No t e 1
* No t e 3
C A S
Key
A D D R
R a
D Q
W E
H i - Z
H i - Z
D Q M
M R S
N e w C o m m a n d
A u t o R e f r e s h
N e w C o m m a n d
: D o n ' t C a r e
*Both banks precharge should be completed before Mode Register Set cycle and auto refresh cycle.
MODE REGISTER SET CYCLE
*Note: 1. CS ,RAS , CAS & WE activation at the same clock cycle with address key will set internal mode register.
2.Minimum 2 clock cycles should be met before new RAS activation.
3.Please refer to Mode Register Set table.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 25/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
PACKAGE DIMENSIONS
50-LEAD TSOP(II) SDRAM(400mil)
26
50
B
B1
WITH PLATING
BASE METAL
SECTION Y-Y
25
1
e
Y
Y
GAGE PLANE
D
Y
θ°
L
L1
SEATING PLANE
DETAIL "A"
Dimension in mm
Dimension in inch
Symbol
Min
-
Nom
Max
1.20
0.203
1.05
0.45
0.40
0.21
0.16
21.08
11.96
10.29
0.60
Min
-
Nom
Max
A
A1
A2
B
B1
C
C1
D
E
E1
L
L1
e
Y
θ
-
0.127
1.00
-
0.35
-
0.127
20.95
11.76
10.16
0.50
0.80 REF
0.80 BSC
-
-
0.005
0.039
-
0.014
-
0.047
0.008
0.041
0.018
0.016
0.008
0.006
0.830
0.471
0.405
0.024
0.051
0.95
0.30
0.30
0.12
0.10
20.82
11.56
10.03
0.40
0.002
0.037
0.012
0.012
0.005
0.004
0.820
0.455
0.394
0.016
0.005
0.825
0.463
0.400
0.020
0.031 REF
0.031 BSC
-
-
0
0.1
8
-
0
0.004
8
-
-
Controlling dimension : Millimeter
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 26/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Revision History
Revision
0.1
Date
Description
2011.05.11
2012.02.08
Original
1.0
Delete “Preliminary”
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0
27/28
ESMT
M12L16161A (2Q)
Operation Temperature Condition -40°C~85°C
Important Notice
All rights reserved.
No part of this document may be reproduced or duplicated in any form or by
any means without the prior permission of ESMT.
The contents contained in this document are believed to be accurate at the
time of publication. ESMT assumes no responsibility for any error in this
document, and reserves the right to change the products or specification in
this document without notice.
The information contained herein is presented only as a guide or examples
for the application of our products. No responsibility is assumed by ESMT for
any infringement of patents, copyrights, or other intellectual property rights of
third parties which may result from its use. No license, either express ,
implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of ESMT or others.
Any semiconductor devices may have inherently a certain rate of failure. To
minimize risks associated with customer's application, adequate design and
operating safeguards against injury, damage, or loss from such failure,
should be provided by the customer when making application designs.
ESMT's products are not authorized for use in critical applications such as,
but not limited to, life support devices or system, where failure or abnormal
operation may directly affect human lives or cause physical injury or property
damage. If products described here are to be used for such kinds of
application, purchaser must do its own quality assurance testing appropriate
to such applications.
Elite Semiconductor Memory Technology Inc.
Publication Date : Feb. 2012
Revision : 1.0 28/28
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